News Posts matching #Sandia National Laboratories

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LLNL's New 'Ruby' Supercomputer Taps Intel for COVID-19 Research

Intel today announced that Lawrence Livermore National Laboratory (LLNL) will leverage Intel Xeon Scalable processors in "Ruby," its latest high performance computing cluster. The Ruby system will be used for unclassified programmatic work in support of the National Nuclear Security Administration's (NNSA) stockpile stewardship mission, for researching therapeutic drugs and designer antibodies against SARS-CoV-2, the virus that causes COVID-19, and for other open science work at LLNL.

Ruby was built in collaboration with Intel, LLNL, Supermicro and Cornelis Networks. The system consists of more than 1,500 nodes, each outfitted with Intel Xeon Scalable processors, and features 192 gigabytes of memory. Ruby will deliver 6 petaflops of peak performance and is expected to rank among the world's top 100 most powerful supercomputers.

Intel and Sandia National Labs Collaborate on Neuromorphic Computing

Today, Intel Federal LLC announced a three-year agreement with Sandia National Laboratories (Sandia) to explore the value of neuromorphic computing for scaled-up computational problems. Sandia will kick off its research using a 50-million neuron Loihi-based system that was delivered to its facility in Albuquerque, New Mexico. This work with Loihi will lay the foundation for the later phase of the collaboration, which is expected to include continued large-scale neuromorphic research on Intel's upcoming next-generation neuromorphic architecture and the delivery of Intel's largest neuromorphic research system to date, which could exceed more than 1 billion neurons in computational capacity.

"By applying the high-speed, high-efficiency and adaptive capabilities of neuromorphic computing architecture, Sandia National Labs will explore the acceleration of high-demand and frequently evolving workloads that are increasingly important for our national security. We look forward to a productive collaboration leading to the next generation of neuromorphic tools, algorithms, and systems that can scale to the billion neuron level and beyond," said Mike Davies, director of Intel's Neuromorphic Computing Lab.

Los Alamos National Laboratory Announces new Intel-based Supercomputer Called Crossroads

The Alliance for Computing at Extreme Scale (ACES), a partnership between Los Alamos National Laboratory and Sandia National Laboratories, announced the details of a $105 million contract awarded to Hewlett Packard Enterprise (HPE) to deliver Crossroads, a next-generation supercomputer to be sited at Los Alamos.

"This machine will advance our ability to study the most complex physical systems for science and national security. We look forward to its arrival and deployment," said Jason Pruet, Los Alamos' Program Director for the Advanced Simulating and Computing (ASC) Program.

Thermaltake Intros Engine 17 "All Metal" Low-profile CPU Cooler

Back in 2011, a team of engineers with the Sandia National Laboratories in New Mexico, proposed an audacious new chip air-cooling concept called simply the Sandia CPU cooler. Its design involved a chunky metallic fan not just ventilating the cooler, but also dissipating heat by itself, conveyed through a thin layer of conductive lubricant between the fan and the static heatsink below it. The concept itself never made it to commercial production, but Thermaltake brought something closely resembling it to the market in 2016, with the Engine 27. The company is giving this cooler an even smaller sibling, with the new Engine 17. The number in the model name refers to its Z-height of just 17 mm, making it comfortable for 1U builds.

Besides its reduced Z-height, the design is practically unchanged from the Engine 27 - a round, nickel-plated copper base-plate draws heat from the CPU, which is mated with a 60 mm diameter metallic fan that not just dissipates heat by itself, but also passes air through a ring of aluminium fin channels projecting radially. The reduced height means that this cooler can only handle thermal loads of up to 35W TDP. It only supports Intel LGA115x sockets. Despite its weight, the fan spins between 1,500 to 2,500 RPM, pushing about 9 CFM of air, with a noise output ranging between 11 to 23 dBA. Measuring 91.5 mm x 91.5 mm x 17 mm, it weighs 205 g. The company didn't reveal pricing.

China Pulls Ahead of U.S. in Latest TOP500 List

The fiftieth TOP500 list of the fastest supercomputers in the world has China overtaking the US in the total number of ranked systems by a margin of 202 to 143. It is the largest number of supercomputers China has ever claimed on the TOP500 ranking, with the US presence shrinking to its lowest level since the list's inception 25 years ago.

Just six months ago, the US led with 169 systems, with China coming in at 160. Despite the reversal of fortunes, the 143 systems claimed by the US gives them a solid second place finish, with Japan in third place with 35, followed by Germany with 20, France with 18, and the UK with 15.

Intel Reveals Details for Future HPC System Building Blocks

Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel Xeon Phi processor, code-named Knights Hill, and new architectural and performance details for Intel Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware. Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

AMD Hires John Gustafson as Chief Graphics Product Architect

AMD announced today that the visionary behind Gustafson's Law, John Gustafson, has joined the company as senior fellow and chief product architect, Graphics Business Unit. In this role, Gustafson will set the technical vision for the AMD graphics business unit, driving the technology roadmap and platform for the AMD Radeon and AMD FirePro product lines as well as new technology planning and execution of business objectives. Gustafson will be based in Sunnyvale and will help evangelize AMD graphics leadership internally and externally.

"Our industry-leading graphics technology predicates that we consistently deliver the most differentiated and superior graphics processor unit (GPU) architectures and products -- without compromise," said Matt Skynner, corporate vice president and general manager, AMD Graphics. "With the growing importance of parallel compute in defining the computing experience, John brings the full package of industry experience and knowledge needed to help us expand and execute our AMD Radeon and AMD FirePro graphics technology programs, and will help forge an aggressive long-term roadmap that allows AMD to continue to lead and win with our gaming and virtualization technologies."
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