ADATA Technology, a leading manufacturer of highperformance DRAM modules, NAND Flash products, and mobile accessories today launchedthe updated Premier SC660H and Premier SV620H external SSDs. Based on previous designs, the new models are part of the ADATA move to 3D NAND Flash in all new SSDs and in refreshes of existing models. The SC660H and SV620H feature 3D TLC NAND instead of traditional 2D NAND to provide increased reliability, durability, and efficiency. The drives connect to host PCs via USB 3.1 Gen 1, and are presented in two distinct enclosure styles. Thanks to 3D NAND, the updated SSDs are available in 256GB and 512GB as opposed to 240GB and 480GB in the original SC660/SV620. Performance is 440 MB/s read and 430MB/s write in both models.

Remember Geil'sEVO X? If you wanted some lighting phenomena going on inside your case with those DDR4 RAM modules, you'd also have to make do with unsightly cables, adding to the clutter of your chosen component holder. ZADAK511 has done away with those additional power cables, and now allows you to "pimp" your rig without them.

These two products were designed by the ZADAK Lab team, and ZADAK has developed a piece of software they named "ZArsenal" which allows the user to regulate the colors and lighting effects of both the memory modules and SSD, with a claimed nil performance impact on either. Details on the SSD refer only to its dual interfaces (SATAIII and USB 3.1, TYPE-C Gen2, updated from their Shield [sans RGB] series), while the memory kit's details are a little more scarce - we expect them to be on par with the companies' previously announced Shield line (sans RGB), which would mean at least DDR4-3000 speeds at timings of 16-18-18-38 (with 4 GB density modules) or the companies' top-of-the-line DDR4-4266 kit. No details on pricing for either of the products were given.

OWC, a leading zero-emissions Mac and PC technology company, today introduced the OWC Mercury Elite Pro Dual with Thunderbolt 2 Technology. The new Mercury Elite Pro Dual - designed in Austin, TX by the OWC new product development team - offers speeds up to 474 MB/s, capacities up to 20TB, and RAID modes 0 and 1. A newly engineered aluminum enclosure features a larger, quieter fan and an advanced airflow design for drive health and longevity. For professionals who need the additional performance of RAID 0 (two disks working together to create one very fast volume), or the peace of mind provided by RAID 1 (two disks mirrored to create instant redundancy), Mercury Elite Pro Dual with Thunderbolt 2 Technology packs serious connectivity in a versatile package.

"The Mercury Elite Pro Dual has long been a go-to solution for creative professionals who need flexibility without sacrificing performance," said Larry O'Connor, CEO, OWC. "With the addition of Thunderbolt 2 Technology and a new, cooler, quieter design, the Mercury Elite Pro Dual is built to handle demanding workflows, providing peace of mind so you can focus on creating your next masterpiece."

AMD's December 13th "New Horizon" event is supposedly (and expectedly) a pivotal moment for the company - a celebration of sorts for the impending launch of their ZEN-based microprocessors. The event, which will be presented mainly by Gametrailers TV-based journalist Geoff Keighley, is now turning up to be a Summit Ridge celebration of sorts as well.

According to recent reports, a small number of motherboard manufacturers should also be in attendance at the event, showing-off their AM4-compatible motherboards based on the top-of-the-line X370 chipset. The X370 is the most advanced version of the Zen-compatible chipsets and is expected to provide extensive overclocking features and up to two third-generation PCIe x16 lanes for multi-GPU systems. Below the X370, the B350 and A320 take over the role of the mid-range and entry-level chipsets respectively. The new chipsets are expected to bring native M.2 NVMe & SATA Express connectivity, PCIe gen 3, DDR4 memory compatibility and USB 3.1 Gen2 to the company's high-end desktop platform for the very first time.

Finally putting the lid on all of ASUS' leaked and detailed motherboards, comes, the PRIME Z270-A, which doesn't belong to a special, bang-and-whistle-filled product line, and is just concerned with getting the job done. It clads itself in a simple and appealing white and gray color-scheme, and is expected to keep most of the important features in ASUS' more expensive product lines.

The PRIME Z270-A comes with ASUS' 8+2+2 Phase Digital power design, fed by an 8-pin connector, that features 10K black metallic capacitors, MicroFine Alloy Chokes, NexFET PW (Power) block MOSFET and DIGI+ Power Control Utility for real-time adjustment, courtesy of the new ASUS Extreme Engine Digi+ technology that improves CPU stability and overclocking. It features four DDR4 DIMM slots that can support up to 64 GB of memory with speeds of up to 3866 MHZ (O.C+), and expansion slots on the motherboard include three PCIe 3.0 x16 (x16/x8/x4 electrical), four PCIe 3.0 x1 and dual M.2 slots that deliver up to 32 GB/s transfer speeds, with the PCIe slots being armored for higher resistance.

Moving on from the Strix series, ASUS' TUF Z270 Mark 1 has also been detailed. Designed around so-called military standards purported to ensure longer stability and extreme durability, the new TUF Z270 motherboards incorporates features such as Tough Inside, Thermal Armor, TUF Networking, TUF Audio, Ultimate Cooling, 24/7 Durability and high speed transfer. This motherboard is one of ASUS' most premium and feature-packed products, so you should expect to pay a pretty, pretty penny for it, if history - and pricing history in particular - is anything to go by (and it usually is).

The LGA 1151 socket supports the latest 6th and 7th generation Intel Core processors, with the MARK 1 sporting an aggressive heatsink design that features ASUS' AURA RGB technology and a full cover TUF Thermal Armor and Fortifier shield. The chassis of the board houses a 40mm fan that offers significant cooling performance to the VRMs.

Continuing the trend of revealing ASUS' ROG lineup of motherboards based on the Z270 chipset, and zipping down the product line, comes the ROG STRIX Z270F Gaming, which also sports the standard ATX form factor. The motherboard features an all around solid design with an impressive metallic black / silver color scheme. The LGA 1151 socket supports the latest 6th and 7th generation Intel Core processors. ASUS went with an aggressive heatsink design that features their AURA RGB technology for a full LED illuminated color showcase. In terms of features, the ROG STRIX Z270F Gaming continues the trend of intelligent cost-cutting so as to achieve a product with an (expectedly) lower price-point. Compared to the ROG STRIX Z270E, this mobo cuts on the 2×2 MU-MIMO 802.11ac WI-FI on the back I/O, and the USB front header is downgraded to a 2.0 solution.

The ASUS ROG Strix Z270F comes with a 8+2+1 Phase Digital power design that features 10K black metallic capacitors, MicroFine Alloy Chokes, NexFET PW (Power) block MOSFET and DIGI+ Power Control Utility for real-time adjustment. All of these components are part of the new ASUS Extreme Engine Digi+ technology that improves CPU stability and overclocking. Power is fed through a single 8-Pin connector.

With the ever-closer release of Intel's Kaby Lake family of CPUs, details and leaks are becoming more and more difficult to stem. Continuing the trend, we are now detailing the ROG STRIX Z270E Gaming is yet another ATX form factor motherboard by Asus, featuring an impressive metallic black / silver color scheme on the LGA 1151 socket. ASUS went with an aggressive heatsink design that features their AURA RGB technology for a full LED illuminated color showcase. The STRIX line inherits much of the other features of the Maximus line of motherboards, though they universally do away with the black and red color scheme.

ASUS' ROG Maximus IX Code, the company's step-down product from the already detailed Maximus IX Formula, has also been leaked. Like the Formula, it's in the ATX form factor with the red and black colors of the ROG line; the difference between thie Maximus IX Hero and the Code stands in that the Hero is absent from the Code's PCB front shielding, the 2×2 MU-MIMO 802.11 AC WI-FI capabilities, as well as the and USB 2.0 (2+4) front panel connectors, putting it in an even lower tier in product placement, and, we expect, pricing (though, being part of the ROG line, that doesn't mean it will be cheap).

ASUS' ROG Maximus IX Code, the company's step-down product from the already detailed Maximus IX Formula, has also been leaked. Like the Formula, it's in the ATX form factor with the red and black colors of the ROG line; the difference between the ROG Maximus IX Code and the IX Formula stands in that the Code is absent from the Formula's integrated water-cooling solution, which puts it in a somewhat lower tier in product placement, and, we expect, pricing.

With the ever-closer release of Intel's Kaby Lake family of CPUs, details and leaks are becoming more and more difficult to stem. As such, the ASUS ROG Maximus IX Formula, ASUS's high-end offering for the Z270 chipset and LGA 1151 socket, has been detailed.

The board features the ATX form factor, with the solid red and black colors that are ROG's identity, with red LEDs spread throughout the board - part of the new Aura RGB lightning which offers 3+2 independent on-board LED areas that can be customized by users. The board comes with a 8+2+2 Phase Digital power design that features 10K black metallic capacitors, MicroFine Alloy Chokes, NexFET PW (Power) block MOSFET and DIGI+ Power Control Utility for real-time adjustments. All of these components are part of the new ASUS Extreme Engine Digi+ technology that improves CPU stability and overclocking, with power being fed through a single 8-Pin connector.

Already more than 3 years ago, back in summer 2013, Club 3D did open up a new era by introducing the first Multi Stream Transport Hubs (MST-Hubs) to the worldwide IT market. With the introduction of the DisplayPort 1.2 standard in the beginning of this decade, the Multi Stream Transport Technology was established. The concept of MST was already available before Club 3D developed the solution and was first to bring a MST Hub into the mainstream market. In 2014 we could already introduce the second generation MST-Hubs and create a line of products for Dual-, Triple- and Quad-Monitor usage and even one version with HDMI outputs. The full line up you can find here.

In IT the development never stands still and therefore Club 3D is proud to be ahead in the market again by introducing the first product of the next generation of MST-Hubs today. MST Hub goes Type C it can be called. The Club 3D SenseVision MST Hub USB 3.1 Gen1 Type C to DisplayPort 1.2 Dual Monitor is named CSV-1545. It takes advantage of the very new Type C plug but offers the technology that users are used to from our existing line up of MST Hubs.

Plextor today announced that it revised the warranty policy of its recently announced EX1 portable solid-state drive to be effective for 5 years, from its existing 3 years. This change is applicable to all products already sold and with retailers as unsold inventory. The EX1 is a series of portable SSDs with 10 Gb/s USB 3.1 host interface, with a single cable handling both power and host connectivity. The drives combine Silicon Motion-made controllers with SK Hynix 16 nm TLC NAND flash memory, and come in capacities of 128 GB, 256 GB, 512 GB, priced at 79€, 119€, and 213€, respectively.

Early 2017, a new wave of socket LGA1151 motherboards based on Intel 200-series chipset will launch, alongside the company's 7th generation Core "Kaby Lake" processors. The lineup will be led by the Z270 Express, targeting performance desktops, and H270 Express, targeting premium commercial desktops. The question on your mind probably is what sets these chipsets apart from the current 100-series Z170 and H170 chipsets. Here are some pointers.

To begin with, motherboards based on Z270 and H270 chipsets are assured to support Core "Kaby Lake" processors, out of the box. The 100-series chipset motherboards inventory with retailers may require BIOS updates, although some of the newer production batches could ship with the latest BIOS that support "Kaby Lake." Secondly, the Z270 and H270 support Intel Optane technology, a new breed of bleeding-edge performance SSDs based on the company's 3D X-point non-volatile memory, which is the very latest in sold-state storage, and purported to be the fastest. The chipets also support Rapid Storage Technology v15.

ASRock updated its Beebox-S line of mini-PC desktops with 7th generation Core "Kaby Lake" processors. These 110 mm x 46 mm x 118.5 mm (WxHxL) desktops come with two new processor options, Core i5-7200U, and Core i3-7100U. Both are dual-core chips, with the i5-7200U offering 2.50-3.10 GHz clock speeds (core/Turbo Boost), 3 MB L3 cache, and Intel HD 620 graphics; while the i3-7100U offers 2.40 GHz clocks (no Turbo Boost), 3 MB L3 cache, and HD 620 graphics.

Other internal features of the Beebox-S include two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel DDR4-2133 memory; one 32 Gb/s M.2-2280 slot with NVMe boot support, and one 9 mm-thick 2.5-inch drive bay with SATA 6 Gb/s interface. Network connectivity includes 802.11ac WLAN, Bluetooth 4.0, Infrared, and gigabit Ethernet. Display outputs include one each of HDMI 2.0 (supports 4K @ 60 Hz), HDMI 1.4, and DisplayPort 1.2a. Other features include two USB 3.0 ports, two USB 3.1 ports (of which one is type-C), and an infrared media remote. ASRock didn't reveal pricing.

Introducing the CoolForce 1. Next week, in addition to the recently introduced CoolForce 2 Rev. B, the second model of our CoolForce case series, the new CoolForce 1, will become available in Europe. The CoolForce 1 features a spacious interior that offers unexpectedly much space for high-end hardware and water cooling systems, despite relatively compact dimensions.

Many of the improvements we implemented due to customer feedback have been included in the new CoolForce 1 as well. For example, the case also features a split front design with a separate I/O panel to ensure that the dust filter and the front fan can be accessed without much effort. The I/O-panel is the same as that of the CoolForce 2 Rev. B, featuring a True USB 3.1 Type C, two USB 3.0, as well as HD audio connectors and a 3-step fan control. The LED On/Off button for the two pre-installed Rigid LED bars in the front is located in the I/O-panel, as well as the Power- and Reset-Button.

ADATA Technology, a leading manufacturer of highperformance DRAM modules, NAND Flash products, and mobile accessories today unveiled the SD700 durable external hard drive. The SD700 represents the first time 3D NAND SSD has achieved IP68 dust and water proof specifications in addition to military-grade shock proofing, all thanks to a tough protective enclosure and meticulous testing. The SD700 uses USB 3.1 Gen 1 to connect with Windows, Mac OS, and Android devices at up to 440MB/s read/write. In addition to being widely compatible, the SD700 is also very light, weighing just 100g for easy mobility.

The SD700 has been designed and tested to IEC IP68 standards. That means it is completely dust-tight to prevent particulate ingress and can operate normally even after submersion in 1.5m of water for 60 minutes. ADATA has also tested the SD700 to the popular US Army MIL-STD-810G516.6 shock and drop resistance standard, ensuring a high degree of shock proofing. With its multi-layered protective enclosure and obvious lack of moving parts as an SSD, the SD700 offers extremely survivable storage for extreme activities.

The specialist for high-performance digital memory technology and Solid State Drive products (SSD), Plextor, presents its new generation of ultra-light, small form factor, high-speed external SSD with OTG support and only 30g in weight: the Plextor EX1. The Plextor EX1 specifications are designed for high speeds, with the USB Type-C interface supporting USB 3.1 Gen2 standard, and delivering a 10x higher speed compared to the USB 2.0 interface, delivering continuous read/write speeds of 550 and 500 MB/s respectively.

The strength of the EX1 series is based on the core components used, including high-quality TLC NAND flash memory manufactured using Hynix's 16nm process, as well as the latest generation of controller ICs from SMI. Plextor has also developed an advanced firmware, and includes the PlexNitro application for increased user control. The Plextor EX1 will be available in stores from the end of November in three different storage capacities with 128GB, 256GB and 512GB. The EX1 complies with Plextor's stringent quality requirements, including a 3-year warrant. Pricing will be announced at a later date.

ECS is giving final touches to a the new Liva Z mini-PC featuring Intel "Apollo Lake" Pentium and Celeron SoCs. The desktop could come with Pentium J4205, Celeron J3455, and Celeron J3355 options. The J4205 and J3455 feature quad-core "Goldmont" CPUs running at 1.50 GHz, but differ with integrated GPUs and Turbo Boost frequencies. The J4205 features 18 execution units (EUs), maximum iGPU clocks of 800 MHz, and 2.60 GHz maximum CPU Turbo Boost; while the J3455 features 12 EUs, 750 MHz maximum iGPU clock, and 2.30 GHz maximum CPU Turbo Boost frequency. The J3355 features a dual-core "Goldmont" CPU running at 2.00 GHz with 2.50 GHz Turbo Boost, and an iGPU with 12 EUs, with 700 MHz maximum clocks.

The upcoming ECS Liva Z "Apollo Lake" also comes with two DDR3 SO-DIMM slots supporting up to 8 GB of memory, integrated eMMC storage options of 32 GB and 64 GB (for the OS), and an M.2-2280 slot for internal storage expansion. Display outputs include mini-DisplayPort and HDMI. Network connectivity includes two gigabit Ethernet interfaces, and a WLAN controller with 802.11ac and Bluetooth 4.0 support. The rest of its connectivity includes three USB 3.1 type-A ports, and one USB 3.1 type-C port. The company didn't reveal pricing or availability.

ASUS has now begun selling their high-end ROG GT51 desktop. The system comes equipped with a factory-overclocked Intel Core i7 -6700K (@ 4.6 GHz) processor, The system comes equipped with two ASUS GeForce GTX 1080 graphics cards running in SLI mode, 64 GB of DDR4-2800 memory (4×16 GB), two Samsung SM951 512 GB M.2 SSDs operating in RAID 0 mode and with a 1 TB HDD (7200 RPM). The system is configurable, with the end user being able to opt for faster memory, up to five 3.5"/2.5" HDDs or SSDs, different M.2 drives and so on. The fully configured ROG GT51 system costs $4999 and marks ASUS' entry on the market of high-performance desktop PCs.

Nanoxia introduces the CoolForce 2 Rev. B chassis. Shortly a lightly revised edition of the first model of our new CoolForce series will become available: The CoolForce 2 Rev. B. In the course of our continuing product development, our design team was able to implement optimizations, which are partly based on suggestions from customers and fans. Thus we were able to improve the user-friendliness of the case and integrate the latest technologies.

The main critique from reviewers and customers focused on the dust filter, which was hard to clean, and the complicated way to access the two front fans. Here we use a two-parted front-design in the new revision, separating the I/O-panel from the rest of the case front. This allows users to simply remove the main part of the front. The dust filter is not connected to the fans, making it far easier to remove and clean it, even when the system is running. The access to the front fans and the installation of a radiator was also facilitated.

The 7th generation Core "Kaby Lake" processor, and its companion 200-series chipset are almost upon us, with the company planning to launch them this 2017 International CES (early January). It looks like the 200-series chipset is turning out to be what the 9-series chipset was to the 8-series; with a handful new features, but nothing extraordinary. Current 100-series chipset motherboards are already receiving BIOS updates from manufacturers to make them support the new processors. It looks like the succeeding 300-series chipset, which Intel plans towards the end of 2017, could stand out.

Intel is reportedly equipping the 300-series chipset with wireless networking becoming part of the feature-set. This means at least some variants of the chipset could feature native WLAN controllers (likely with external PHY for signal clarity). The company is also planning to implement native 10 Gb/s USB 3.1 (gen 2.0) controllers into the chipset. This decision could impact third-party WLAN and USB 3.1 controller manufacturers, observes DigiTimes.

ASUS signs off the AMD socket AM3+ platform with a motherboard that's built to last, the TUF Sabertooth 990FX R3.0, its third TUF series motherboard based on the AMD 990FX chipset. The board could be the ideal upgrade for AMD FX processor users wanting to hold on to their builds a few years longer, as it features cutting-edge connectivity, such as four 10 Gb/s USB 3.1 ports (including a type-C port), eight additional 5 Gb/s USB 3.0 ports (of which four are via headers), a 20 Gb/s M.2 slot with NVMe support, and the very latest VRM innovations ASUS made for the TUF series.

The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and uses a 10-phase VRM to condition it for the CPU. The board supports 220W TDP AMD FX-9000 series CPUs. The CPU socket is wired to four DDR3 DIMM slots, and the AMD 990FX northbridge. Expansion slots include four PCI-Express 2.0 x16 slots, of which three are wired to the 990FX chip, and run at x16/NC/x16 or x16/x8/x8 depending on the way they're populated; while the fourth slot is wired to the SB950 southbridge, and runs at gen 2.0 x4. Storage connectivity includes five SATA 6 Gb/s ports besides the M.2 slot. 8-channel HD audio and gigabit Ethernet (Intel i211V controller) make for the rest of it. The board is driven by UEFI BIOS, and features Windows 10 certification. The company didn't reveal pricing.

ZOTAC International, a global manufacturer of innovation, is pleased to introduce MAGNUS ERX480 as the world's first AMD powered Mini PC equipped with Polaris Architecture. The award-winning ZBOX MAGNUS Gaming Mini PC series, renowned for whisper quiet performance, brings a refreshing level of power and speed for every gamer. "We are always aiming to provide powerful solutions available to a wide audience and the MAGNUS ERX480 could be it" said Jacky Huang, Director of Mini PC.

MAGNUS is designed for gaming and entertainment. Hosting power that surpasses the requirements for experiencing virtual reality, MAGNUS is an ideal solution for both high-end gaming, premium entertainment, and much more. "The Radeon RX 480 with Polaris Architecture changes the gaming hardware dynamic with an effective cost-performance combination. We're excited to partner with ZOTAC, a well-established gaming mini PC manufacturer, to bring together the world first and most powerful AMD based gaming mini PC equipped with a Radeon RX 480" said Spencer Pan, AMD Corporate VP and President of Greater China.

ADATA Technology, a leading manufacturer of highperformance DRAM modules, NAND Flash products, and mobile accessories today announced the launch of several products designed to make USB-C adoption easier. They make the reversible USB standard compatible with connectors such as USB-A and HDMI, as well as legacy plugs like VGA (D-sub). ADATA believes USB-C represents a positive development that benefits customers. The reversible connector is more than easy to plug in - it also marks the arrival of faster data rates and higher quality signal transmission. With new adapters, cables, and hubs, users can connect devices with USB-C to various other devices so that functionality is retained. All cables and adapters use high quality materials to ensure optimized data carrying capabilities.