AMD's Ryzen 9 9950X3D processor with 16 cores, 32 threads, and 3D V-Cache is an exceptional content creation and gaming workload machine. However, MSI's proprietary BIOS features reportedly enable substantial performance headroom beyond stock settings. MSI's latest internal testing confirms that specific firmware configurations can deliver up to 14.5% performance improvements in demanding titles like Monster Hunter Wilds. The performance uplift hinges on firmware update, with MSI recommending the installation of chipset driver v7.01.08.129 or higher, which includes the critical AMD Application Compatibility Database driver. Users who update to BIOS versions featuring AGESA 1.2.0.3 or newer may encounter an "Unknown Device" in Device Manager, which can be resolved by installing the AMD Application Compatibility Database driver included in the latest chipset package. When paired with AGESA 1.2.0.3+ BIOS implementations, this configuration yields measurable framerate improvements of approximately 10% in Metro Exodus and 8% in Far Cry 6 at 1080p resolution compared to legacy firmware.

MSI's BIOS feature suite provides several optimization pathways. Memory Try It! delivers pre-configured memory timing profiles, while High-Efficiency Mode optimizes graduated memory bandwidth across four performance tiers. The X3D Gaming Mode modifies core and SMT configurations and provides additional gaming-specific enhancements, though potentially at the expense of multi-threaded application performance. Benchmark data from MSI demonstrates that implementing DDR5-8000 CL38 Memory Try It! profiles alongside "Tighter" High-Efficiency Mode settings and X3D Gaming Mode activation delivers a 14.5% performance uplift in Monster Hunter Wilds compared to baseline DDR5-4800 configurations, and approximately 8% over XMP DDR5-7200 settings. Titles like Shadow of the Tomb Raider and Far Cry 6 both recorded approximately 6% performance gains under similar test conditions. MSI cautions that memory overclocking implementations may impact system stability, while X3D Gaming Mode's thread management modifications could reduce performance in heavily multi-threaded workloads. Performance benefits will necessarily vary based on GPU capabilities and system configuration.

AMD's next-generation Zen 6-based "Medusa Point" mobile APUs will not feature RDNA 4 graphics as previously speculated, according to recent code discoveries in AMD GPUOpen Drivers on GitHub. The Device ID "GfxIp12" associated with RDNA 4 architecture has been reserved only for discrete GPUs, confirming that the current Radeon RX 9000 series will exclusively implement AMD's latest graphics architecture. Current technical documentation indicates AMD will instead extend RDNA 3.5 implementation beyond the Zen 5 portfolio while potentially positioning UDNA as the successor technology for integrated graphics.

The chiplet-based Medusa Point design will reportedly pair a single 12-core Zen 6 CCD manufactured on TSMC's 3 nm-class node with a mobile client I/O die likely built on N4P. This arrangement is significantly different from current monolithic mobile solutions. Earlier speculation indicates the Medusa Point platform may support 3D V-Cache variants, leveraging the same vertical stacking methodology employed in current Zen 5 implementations. The mobile processor's memory controllers and neural processing unit are expected to receive substantial updates. However, compatibility limitations with AMD's latest graphics features, like FSR 4 technology, remain a concern due to the absence of RDNA 4 silicon. The Zen 6-powered Medusa Point processor family is scheduled for release in 2026, targeting premium mobile computing applications with a performance profile that builds upon AMD's current Strix Halo positioning.

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

AMD has confirmed pricing and launch for its newest Ryzen 9000X3D series processors, with the flagship 9950X3D priced at approximately 5599 RMB and the 9900X3D at 4599 RMB, according to preliminary Chinese store JD listings. Both processors will hit retail channels on March 12, with review embargoes reportedly lifting one day prior, as noted by VideoCardz. The Ryzen 9 9950X3D delivers 16 Zen 5 cores with boost frequencies reaching 5.7 GHz and operates within a 170 W TDP envelope. Its unique feature is 144 MB of combined cache memory (L2, L3, and stacked 3D V-Cache).

The 9900X3D scales back to 12 cores with 5.5 GHz peak frequencies and 140 MB total cache while reducing power consumption to 120 W TDP. These processors represent AMD's implementation of vertical cache stacking technology on its 12+ core Zen 5 setup, completing its Q1 2025 desktop portfolio expansion following earlier standard Ryzen 9000 series launches and the eight-core Ryzen 7 9800X3D. The 3D V-Cache technology could help with many workloads, with gaming performance expected to show the most significant gains and productivity expected to follow. We have to wait for official reviews to bring further conclusions, but we hope to hear official confirmation on availability soon.

AMD's Ryzen 9000HX lineup of "Fire Range" Zen 5 mobile processors is due for release within a vague March to April window, with the upcoming 3D V-Cache-equipped Ryzen 9 9955HX3D SKU touted to become a top choice for manufacturers of ultra high-end gaming laptops. The latest version of CPU-Z is ready (in advance) with support for Team Red's incoming product line; CPUID's patch notes (published on February 8) have revealed previously unannounced models. AMD's official introduction of Ryzen 9000HX series CPUs included an opening salvo of Ryzen 9 9955HX3D (16-core), 9955HX (16-core) and 9850HX (12-core) models.

According to CPU-Z version 2.14, three additional "Fire Range" SKUs are seemingly on the way. Starting off with the Ryzen 9 9950HX3D—a (presumably) slightly less potent 3D V-Cache-sporting model—its nomenclature suggests that it will sit just below the series flagship. The 9950HX model is expected to slot just under the already announced 9955HX chip. The newly revealed 9845HX SKU could become the lowest 12-core offering within AMD's "Fire Range" product stack.

One of AMD's key announcements at its 2025 International CES keynote was the Ryzen 9000HX line of processors, codenamed "Fire Range." A successor to the 7000HX "Dragon Range," this is essentially a BGA package of the "Granite Ridge" MCM, which combines one or two "Zen 5" CCDs with a client I/O die. The processor lacks an NPU and has a basic iGPU, but is meant for enthusiast segment gaming notebooks and portable workstations, as it's meant to be paired with discrete GPUs, taking advantage of the package's lavish 28 PCIe Gen 5 lanes. The Ryzen 9 9955HX3D stands out in the series as the only model with 3D V-Cache, making it possibly the fastest mobile processor for gaming notebooks—faster than even the "Arrow Lake-HX," given how the desktop 9800X3D compares to the Core Ultra 9 285K at gaming.

Notebook OEM Dream Machines put out a press release which specifies that the first notebooks powered by the 9955HX3D will ship either toward the end of March, or early-April 2025. "Fire Range" is known to have scored design wins from several popular notebook OEMs, which means the chips could have a good run at the markets this generation. Notebooks powered by the 9955HX3D and discrete GPU options that include the GeForce RTX 5090 Laptop GPU and the RTX 5070 Ti Laptop GPU, are expected to be priced around €2,530 and €3,860, respectively.

While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

AMD today announced the Ryzen 9 9000HX and 9000HX3D line of mobile processors targeting enthusiast-segment gaming notebooks and portable workstations. These chips compete in the same market-segment as the Intel Core Ultra 200HX series. Codenamed "Fire Range," and powered by the "Zen 5" microarchitecture, the chip succeeds the "Zen 4" based "Dragon Range." This is essentially a thin BGA package of the desktop "Granite Ridge" chiplet-based processor, just the way "Dragon Range" relates to "Raphael." The chip has two "Zen 5" CCDs with full-sized "Zen 5" cores that are geared for high clock speeds, and have the full hardware FP implementation for AVX512, unlike the "Zen 5" cores on the "Strix Point" mobile processor.

AMD has, curiously, skipped single-CCD variants of "Fire Range," there are no Ryzen 7 9000HX models being announced today. There are just three processor-models—the Ryzen 9 9955HX3D, the Ryzen 9 9955HX, and the Ryzen 9 9850HX. The 9955HX3D is AMD's flagship mobile processor for gaming notebooks. It features a 16-core/32-thread configuration, and features 3D V-Cache memory on one of the two CCDs. The chip hence comes with 144 MB of "total cache" (L2 + L3). It ticks at 2.50 GHz base frequency, and can boost up to 5.40 GHz for the CCD with 3D V-Cache. It comes with a configurable TDP range of 55 W and 75 W. There is no NPU, but the client I/O die puts out a boatload of I/O that includes 28 PCIe Gen 5 lane, from which 24 are usable, so the discrete GPU has a PCI-Express 5.0 x16 connection, besides two M.2 NVMe Gen 5 connections directly from the processor.

AMD today expanded its Ryzen 9000X3D line of Socket AM5 desktop processors that combine the "Zen 5" microarchitecture with 3D V-Cache technology, with the introduction of two high core-count models, the Ryzen 9 9950X3D and the Ryzen 9 9900X3D. The 9950X3D is a 16-core/32-thread chip, while the 9900X3D is 12-core/24-thread. These are dual-CCD processors, and much like the Ryzen 9 7000X3D, the 3D V-Cache is only present on one of the two CCDs, while the other is a regular CCD with just the 32 MB on-die L3 cache. There is one key difference, though. Since AMD has redesigned 3D V-Cache for "Zen 5" to be below the CCD and not above, the CCD with it has the same clock speed boosting characteristics as the CCD without 3D V-Cache; and AMD has worked to refine its software-based OS scheduler optimization such that productivity applications favor either of the CCDs, while games stick to the one with 3D V-Cache.

The Ryzen 9 9950X3D comes with a base frequency of 4.30 GHz, and boosts up to 5.70 GHz, with a 170 W TDP. This is much higher than the 5.20 GHz maximum boost frequency of the Ryzen 7 9800X3D, which makes the 9950X3D the company's fastest gaming desktop processor. The Ryzen 9 9900X3D is similarly interesting—you get a base frequency of 4.40 GHz, and 5.50 GHz maximum boost frequency, which is higher than that of the 9800X3D, although the CCD with the 3D V-Cache only has 6 cores. The 9950X3D should hence end up beating the 9800X3D in gaming workloads, while the 9900X3D should be either on par or slightly slower than the 9800X3D at gaming, although faster than any chip from the non-X3D Ryzen 9000 series.

AMD is at the 2025 International CES, and we join them for a brisk run of what they have in store for us through the year. We expect some important announcements, such as the next-gen Radeon RX gaming GPUs powered by RDNA 4, a new flagship desktop processor powered by 3D V-Cache technology, HX-segment Ryzen 9000 series processors for gaming notebooks and portable workstations, the fabled "Strix Halo" chip AMD plans to surprise Apple with; and a fleshing out of its mobile processor portfolio.19:02 UTC: The show is underway.19:02 UTC: Jack Huynh takes centerstage.

Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, matching non-X3D variants. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. Early leaks indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.

The AMD Ryzen 7 9800X3D launched this November remains the fastest processor for PC gaming, but with just an 8-core/16-thread configuration, its performance in multithreaded productivity pales in comparison to the alternatives, including from AMD's own camp, such as the Ryzen 9 7950X3D. The company is planning to expand the Zen 5 X3D line of desktop processors in Q1-2025, with the introduction of its high core-count Ryzen 9 series SKUs, the Ryzen 9 9950X3D, and the Ryzen 9 9900X3D. HXL, a reliable source with hardware leaks, says that the Ryzen 9 X3D SKUs will lack the kind of "frequency debuff" we've seen with the older generation Ryzen 9 X3D chips such as the 7950X3D and 7900X3D.

On the 7950X3D, only one of the two 8-core CCDs comes with 3D V-Cache, the other is a regular CCD with 32 MB on-die L3 cache. The CCD with the 3D V-Cache has its frequency "debuffed" compared to the other CCD, mainly to deal with the thermal limitations of the way the 3D V-Cache is stacked on top of the CCD. With the Ryzen 9000 X3D generation, AMD has redesigned this CCD + L3D stacking such that the CCD is now above, directly interfacing with the STIM and IHS; with no conductive structural silicon along the way. This means that the CCD now thermally behaves like a regular Zen 5 CCD; and for this reason, not only will the CCD with 3D V-Cache on the 9950X3D/9900X3D have the same clock speeds and boosting behavior as the one without 3D V-Cache; but also the 9950X3D and 9900X3D are expected to ship with similar, if not identical clock speeds to the 9950X and 9900X.

During the prestigious IEDM 2024 conference, NVIDIA presented its vision for the future AI accelerator design, which the company plans to chase after in future accelerator iterations. Currently, the limits of chip packaging and silicon innovation are being stretched. However, future AI accelerators might need some additional verticals to gain the required performance improvement. The proposed design at IEDM 24 introduces silicon photonics (SiPh) at the center stage. NVIDIA's architecture calls for 12 SiPh connections for intrachip and interchip connections, with three connections per GPU tile across four GPU tiles per tier. This marks a significant departure from traditional interconnect technologies, which in the past have been limited by the natural properties of copper.

Perhaps the most striking aspect of NVIDIA's vision is the introduction of so-called "GPU tiers"—a novel approach that appears to stack GPU components vertically. This is complemented by an advanced 3D stacked DRAM configuration featuring six memory units per tile, enabling fine-grained memory access and substantially improved bandwidth. This stacked DRAM would have a direct electrical connection to the GPU tiles, mimicking the AMD 3D V-Cache on a larger scale. However, the timeline for implementation reflects the significant technological hurdles that must be overcome. The scale-up of silicon photonics manufacturing presents a particular challenge, with NVIDIA requiring the capacity to produce over one million SiPh connections monthly to make the design commercially viable. NVIDIA has invested in Lightmatter, which builds photonic packages for scaling the compute, so some form of its technology could end up in future NVIDIA accelerators

About a month ago, we reported about the AMD Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache that is flying off the shelves, with scalpers trying to make a profit from buying the retail inventory. The processor continues to face widespread availability issues more than a month after its launch, though the company assures consumers that relief is on the horizon. "We are working diligently to get as much supply to market as possible, with more processors being shipped every week," an AMD spokesperson told Tom's Hardware. "We expect availability to get better as shipments ramp throughout the quarter." The CPU is not only hard to find but also proves to be one of the most sought-after processors on Amazon.

The supply shortage has created opportunities for scalpers, who are listing the processor at prices reaching $1,000—more than double its retail price. Even established retailers like Walmart have listed the chip at inflated prices, approaching $800. Adding to consumers' challenges, some third-party sellers have posted fraudulent listings, making it crucial for buyers to verify seller credibility. While major retailers like Amazon, Newegg, Best Buy, and B&H Photo maintain the official $479 price point when in stock, securing a unit at this price has proven challenging for most consumers. As the holiday season is here, AMD's promised production ramp-up is much needed, as gamers have been planning their upgrade months in advance and are in dire need of pushing the performance of their systems up another notch.

AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

Unlike the Ryzen 7 9700X, which was off to a glacial start when it launched, the new Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache is flying off the shelves. This is the fastest gaming processor you can buy, and gamers want their best machines in place when the next generation of GPUs make landfall starting January 2025. As of this writing, the 9800X3D is out of stock on Newegg, Amazon, and Micro Center. The chip is, however, available through systems integrators and OEMs, who probably secured their inventory of the chip separately. A quick look over at eBay suggests that the 9800X3D is being scalped—the practice where individuals buy up inventory of the processor at retail prices, and re-sell it at a mark-up. We are seeing prices in the range of $670 to $800. There are probably limits to how high scalpers can price the 9800X3D, because at a high enough price, buyers could simply not be interested in the chip, and simply pick up a much cheaper 7800X3D, or the versatile 7950X3D, or even go Intel with the i9-14900K.

AMD Ryzen 7 9800X3D will be available to purchase from today, November 7, 2024. The 8-core/16-thread processor features 3D V-Cache technology, and is based on the "Zen 5" microarchitecture. AMD has priced the 9800X3D at $480 (MSRP). The processor was reviewed by TechPowerUp yesterday, we conclude that it is the fastest processor for a gaming PC build, posting the highest frame-rates at any resolution. It is 12% faster than Intel's flagship Core Ultra 9 285K "Arrow Lake" processor at gaming (at 1080p), although the processor falls behind in productivity workloads due to its significantly lower CPU core count than other CPUs, such as the cheaper Core i7-14700K or Core Ultra 7 265K. The 9800X3D is only around 5% faster than its predecessor, the 7800X3D, at gaming, although it is 13% faster than the 5800X3D.

You can read all about the AMD Ryzen 7 9800X3D in its TechPowerUp Review.

The latest update to CPU-Z, the popular system information and diagnostic tool, has rolled out comprehensive support for upcoming processor architectures from both AMD and Intel, along with new memory standards. Among the notable additions is support for AMD's Ryzen 7 9800X3D, which builds upon AMD's successful 3D V-Cache technology and is scheduled to launch tomorrow. The update also covers Intel's "Arrow Lake" processors, including both HX and H series variants. The Arrow Lake lineup integration spans multiple performance tiers, from the flagship Core Ultra 9 285HX down to the mainstream Core Ultra 5 series. The H-series mobile processors, including the Core Ultra 9 285H and various Ultra 7 and Ultra 5 models, are also fully supported.

Additionally, CPU-Z now recognizes Intel's complete Raptor Lake refresh, covering an extensive range of processors across different power segments. This includes the Core 7 series (160HL through 150U), Core 5 series (130HL through 120U), and Core 3 series (100HL through 100U), catering to various computing needs from high-performance to energy-efficient applications. The update extends beyond processors to support CUDIMM ((Clocked Unbuffered DIMM) DDR5 memory. CUDIMMs represent a modified DDR5 memory featuring an integrated Client Clock Driver (CKD) that generates its clock signal to minimize noise and jitter at speeds of 6400 MT/s and above, ensuring better stability and data integrity than traditional DDR5 modules.

DOWNLOAD CPU-Z 2.12 here.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

Just last week, AMD announced the arrival of its upcoming Ryzen 9000 series of CPUs with 3D V-Cache for November 7. However, we might be in for a treat, as AMD could be preparing Threadripper 9000WX/X series of CPUs with 3D V-Cache. According to VideoCardz, the ASUS Pro WS WRX90E-SAGE SE board appears to include an intriguing feature in its settings—there's a configuration option related to 3D V-Cache control, though this setting currently doesn't have any practical application with the available Threadripper 7000WX and 7000X processors. The presence of this setting hasn't been officially documented by ASUS, showing that this feature could indeed end up in future iterations of Threadripper processors, namely the 9000WX/X series.

AMD currently offers 3D V-Cache treatment in its high-end Genoa-X CPUs, with up to 96 cores and 192 threads, and 1,152 MB of L3 cache. These CPUs were praised for their capabilities in the high-performance computing sector, performing calculations at unprecedented rates thanks to the massive cache size and bandwidth. If AMD decides to opt-in for the HEDT market with 3D V-Cache, we might see an appearance with the upcoming Threadripper generation. However, right now, it is only speculation based on undocumented features in ASUS's high-end board. Even if these CPUs are planned, we are not near their launch as the priority is launching and shipping the consumer-oriented Ryzen 7 9800X3D CPU on November 7.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

AMD's upcoming Ryzen 9000X3D series of processors with 3D V-Cache have been reportedly scheduled to arrive in January 2025 and should make a debut at the CES event, a few months later than initially expected. While disappointing for eager enthusiasts, the delay could signify that AMD is taking extra precautions to ensure a smooth launch and deliver a product that meets the high-performance standards set by its previous 3D V-Cache offerings. Delaying the new product launch could also be a strategic move by AMD to avoid potential supply chain issues or to align the launch with other product announcements.

We previously reported that the series will maintain the same cache size configurations as the last generation with 3D V-Cache, and it will just be an upgrade to up the performance of the new Zen 5 design. The launch of the 9000X3D series follows a smaller six-month gap from the regular Ryzen 9000 series, where the previous Ryzen 7000X3D and 5000X3D followed seven and seventeen months after the launch of their regular SKUs, respectively.

If you're on the Socket AM4 platform, AMD is never gonna give you up, never gonna let you down, never gonna run around and desert you; never gonna make you cry, never gonna say goodbye, never gonna tell a lie, and hurt you. The company is reportedly giving finishing touches to a firecracker of a sub-$200 chip for price-conscious gamers, the Ryzen 5 5500X3D. That's right, AMD is bringing 3D V-cache technology to the mid-range, with a new 6-core processor based on the "Zen 3" microarchitecture, but enjoying the gaming performance boost from 96 MB of L3 cache on tap.

AMD already has a 6-core X3D Socket AM4 chip, the Ryzen 5 5600X3D, which joined the product stack a couple of years after AMD's original Ryzen 7 5800X3D took the gaming PC processor scene by storm, matching the then swanky new Core i9-12900K "Alder Lake" despite being based on an older-generation "Zen 3" architecture. Not much else is known about the 5500X3D, except that it could have a lower clock speed than the 5600X3D. Back in November 2023, when news of the 5700X3D first hit the scene, the 5500X3D was rumored to be a 6-core/12-thread chip with 3.00 GHz base frequency and 4.00 GHz maximum boost, compared to the 3.30 GHz base and 4.40 GHz boost frequency of the 5600X3D. Given that AMD launched the 5600X3D at $230, AMD could target a sub-$200 price point to wow gamers on AM4, such as $199.

AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.

Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.