TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

AMD Ryzen processors with 3D Vertical Cache technology, denoted with the "X3D" brand extension on processor model numbers, are showing unexpected popularity numbers with close to a quarter of respondents to a TechPowerUp Frontpage Poll question saying that they use one. In August, we asked our readers if they use a Ryzen X3D processor. The question was "Are you using an AMD Ryzen X3D CPU with 3D V-Cache?" This was a few months into the launch of the Ryzen 7000X3D processor series that restored the gaming performance leadership for AMD against Intel's 13th Gen Core "Raptor Lake" processors.

Since the poll went live in August, we've seen 31,862 responses. From these, 14,732, or 46% say that they use a classic Ryzen processor (one without 3D V-cache). followed by 9,780 or 31% saying they use an Intel processor; an impressive 4,316 or 14% saying they use a Socket AM4 Ryzen 5000X3D series processor (5800X3D or 5600X3D); followed by 3,034 or 10% saying they use the latest 7000X3D series "Zen 4" processors. The X3D series together make 7,350 votes, or 23%.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

ASUS Republic of Gamers (ROG) today announced the new ROG Strix SCAR 17 X3D, the perfect fusion of cutting-edge silicon and ROG engineering. Featuring the AMD Ryzen 9 7945HX3D mobile processor equipped with AMD 3D V-Cache technology for the very first time, the Strix SCAR 17 X3D takes performance to a whole new level. By doubling the L3 cache of the mighty Ryzen 9 7945HX processor, the Ryzen 9 7945HX3D gives users a boost in games that are hungry for this onboard ultrafast memory. Paired with a 240 Hz QHD display, Conductonaut Extreme liquid metal on the GPU, and a vapor chamber, the Strix SCAR 17 X3D is ready to dominate the leaderboards.

Making great processors even better
While the original 2023 ROG Strix SCAR 17 came equipped with AMD Ryzen 7000 Series processors, the AMD Ryzen 9 7945HX3D is truly in a league of its own. It leverages the power of AMD 3D V-Cache technology, a stacking of extra ultra-high-speed L3 cache vertically on top of one of the two core compute dies (CCD). This extra cache enables the eight cores to perform certain calculations quickly and efficiently, notably in gaming. For situations where increasing CPU frequency simply doesn't show significant performance gains, 3D V-Cache technology holds the potential to unlock extra compute power.

Tipsters have noticed that ASUS is preparing a new high-end laptop with an unannounced AMD processor—the upcoming ROG Strix SCAR 17-inch model (G733PYV-LL046W,) will apparently sport a Ryzen 9 7945HX3D APU (with 128 MB of L3 cache). The inclusion of "X3D" in the processor's name has generated a lot of interest, given that Team Red's 3D V-Cache technology has existed mainly within mainstream desktop-oriented Ryzen 7000 and 5000 processor lineups. This leaked dual-CCD APU is probably being lined up to take on upper-echelon Intel Raptor Lake-HX processors, as well as refreshed variants.

The leak indicates that this APU will likely sit at the top of the Zen 4-based Dragon Range-H lineup—being a 5.4 GHz max. boost clock, 16-core/32-thread CPU, with a configurable TDP (between 55 W and 75 W) and Radeon 610M iGPU. The host ASUS ROG Strix SCAR 17 laptop is no slouch thanks to some very generous hardware specifications, including a mobile NVIDIA RTX 4090 GPU, 32 GB of DDR5 memory, 2 TB SSD, and a 17.3" 240 Hz IPS display. Listed at 5599 AUD (~$3800) on Computer Alliance, or £3904.79 (~$5000) chez Lamba-Tek, you would expect the best possible performance for those prices. The two online retailers have not confirmed any concrete release dates for the high-end ASUS laptop.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

ASRock Rack, the leading innovative server company, today announced its support of 4th Gen AMD EPYC processors with AMD "Zen 4c" architecture and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, as well as the expansion of their new products ranging from high-density storage, GPU, multi-nodes servers all for the new AMD processors.

"4th Gen AMD EPYC processors offer the highest core density of any x86 processor in the world and will deliver outstanding performance and efficiency for cloud-native workloads," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "Our latest family of data center processors allow customers to balance workload growth and flexibility with critical infrastructure consolidation mandates, enabling our customers to do more work, with more energy efficiency at a time when cloud native computing is transforming the data center."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced support for the latest 4th Gen AMD EPYC processors. The new processors, based on "Zen 4c" architecture and featuring AMD 3D V-Cache technology, enhance Giga Computing's enterprise solutions, enabling superior performance and scalability for cloud native computing and technical computing applications in GIGABYTE enterprise solutions. To date, more than thirty unique GIGABYTE systems and platforms support the latest generation of AMD EPYC 9004 processors. As time goes on Giga Computing will roll out more new GIGABYTE models for this platform, including more SKUs for immersion-ready servers and direct liquid cooling systems.

"For every new generation of AMD EPYC processors, GIGABYTE has been there, offering diverse platform options for all workloads and users," said Vincent Wang, Sales VP at Giga Computing. "And with the recent announcement of new AMD EPYC 9004 processors for technical computing and cloud native computing, we are also ready to support them at this time on our current AMD EPYC 9004 Series platforms."

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of high-performance server platforms supporting 4th Gen AMD EPYC processor for growing cloud native environments and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology for technical computing applications.

"Data centers prioritize sustainability, offering an opportunity to improve efficiency and meet goals," said Eric Kuo, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's server platforms, powered by 4th Gen AMD EPYC processors, contribute to environmental sustainability through power-efficient, high-performance solutions. Our leading workload performance enables efficient scale-out cloud-native workloads, achieving more with less power consumption."

Barron's Magazine has been on a technology industry kick this week and published their interview with AMD CEO Dr. Lisa Su on May 3. The interviewer asks Su about her views on Moore's Law and it becomes apparent that she remains a believer of Gordon Moore's (more than half-century old) prediction - Moore, an Intel co-founder passed away in late March. Su explains that her company's engineers will need to innovate in order to carry on with that legacy: "I would certainly say I don't think Moore's Law is dead. I think Moore's Law has slowed down. We have to do different things to continue to get that performance and that energy efficiency. We've done chiplets - that's been one big step. We've now done 3-D packaging. We think there are a number of other innovations, as well." Expertise in other areas is also key in hitting technological goals: "Software and algorithms are also quite important. I think you need all of these pieces for us to continue this performance trajectory that we've all been on."

When asked about the challenges involved in advancing CPU designs within limitations, Su responds with: "Yes. The transistor costs and the amount of improvement you're getting from density and overall energy reduction is less from each generation. But we're still moving (forward) generation to generation. We're doing plenty of work in 3 nanometer today, and we're looking beyond that to 2 nm as well. But we'll continue to use chiplets and these type of constructions to try to get around some of the Moore's Law challenges." AMD and Intel continue to hold firm with Moore's Law, even though slightly younger upstarts disagree (see NVIDIA). Dr. Lisa Su's latest thoughts stay consistent with her colleague's past statements - AMD CTO Mark Papermaster reckoned that the theory is pertinent for another six to eight years, although it could be a costly endeavor for AMD - the company believes that it cannot double transistor density every 18 to 24 months without incurring extra expenses.

Earlier this month, AMD wrapped up the launch of its incredible Ryzen 7000X3D processor series, which storms the company's gaming performance competitiveness against Intel back to the top, setting it up for the crucial Spring-Summer season, when PC gamers tend to upgrade and play the latest games. The 3D Vertical Cache memory deployed on the Ryzen 9 7950X3D, 7900X3D, and Ryzen 7 7800X3D, supercharges the gaming performance of these processors, and our testing has shown that the 7800X3D is all that an elite gaming PC build needs if all you're doing is playing games with some domestic productivity on the side; whereas the 7950X3D is for those into heavy content creation and application workloads besides gaming, which means AMD levels up to Intel on both fronts.

We have extensively covered the technical aspects of what 3D Vertical Cache is, and how it works, in our reviews of the 7950X3D and 7800X3D. It is a fast 64 MB slice of SRAM cache stacked on top of the 32 MB on-die L3 cache of "Zen 4" chiplets, which extends the L3 cache size to 96 MB. This has a profound impact on gaming workloads, as the CPU cores have more amount of game data at much lower latency than DRAM. As part of our coverage of the Ryzen 7000X3D processor series, we had the opportunity to interview AMD on some of the technical aspects of Ryzen 7000X3D processor series. We also took the opportunity to ask a few general questions about the Ryzen 7000 desktop processor series itself. You can also catch our interview with Robert Hallock, the former technical marketing head, for some additional questions that you may find relevant.

Leading global motherboard manufacturer ASRock proudly announces its new series of AMD A620 motherboards. The latest AMD A620 platform aims at a more budget-friendly market while still offering a wide variety of features, such as DDR5 memory support, multiple M.2 slots for NVMe storage devices, and WiFi 6E for daily tasks as well as gaming.

To maximize the affordability of the AMD A620 platform, ASRock offers four models, including both 4 and 2 DIMMs motherboard layout options. If 4 DDR5 memory is a must for your next build, the A620M Pro RS will definitely be the number one choice. It offers a luxurious amount of USBs including Type-C for both front and rear panels, 3 M.2 Key-M onboard and 2 of which support PCIe Gen 4 x4 to give multiple storage options. With a 6-layer PCB and Dr.MOS for Vcore design, A620M Pro RS can fully support the latest AMD Ryzen 7000 Series Processors. A620M Pro RS also comes with a WiFi 6E variant the A620M Pro RS WiFi, an all-rounder choice for wireless environments.

AMD's EPYC lineup already features the new Zen 4 core designed for better performance and efficiency. However, since the release of EPYC Milan-X processors with 3D V-cache integrated into server offerings, we wondered if AMD will continue to make such SKUs for upcoming generations. According to the report from Wccftech, we have a leaked table of specifications that showcase what some seemingly top-end Genoa-X SKUs will look like. The two SKUs listed here are the "100-000000892-04" coded engineering sample and the "100-000000892-06" coded retail sample. With support for the same SP5 platform, these CPUs should be easily integrated with the existing offerings from OEM.

As far as specifications, this processor features 384 MBs of L3 cache coming from CCDs, 768 MBs of L3 cache from the 3D V-Cache stacks, and 96 MBs of L2 cache for a total of 1248 MBs in the usable cache. A 3 MB stack of L1 cache is also dedicated to instructions and primary CPU data. Compared to the regular Genoa design, this is a 260% increase in cache sizes, and compared to Milan-X, the Genoa-X design also progresses with 56% more cache. With a TDP of up to 400 Watts, configurable to 320 Watts, this CPU can boost up to 3.7 GHz. AMD EPYC Genoa-X CPUs are expected to hit the shelves in the middle of 2023.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

ASRock has released new BIOS to support the latest AMD Ryzen 7000 Series Processors with AMD 3D V-Cache Technology, with new BIOS on ASRock X670E/B650E/B650 motherboards, you may enjoy the enhanced gaming performance powered by AMD Ryzen 7000X3D series processors. The latest BIOS is already available to download on ASRock website, be sure to update to the latest BIOS to enjoy the ultimate gaming experience with AMD 3D V-Cache Technology.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce a list of compatible motherboards for AMD's newly announced AMD Ryzen 7000X3D processors. AMD Ryzen 7000X3D processors, which include the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D, promise unparalleled gaming and compute performance thanks to their groundbreaking 3D V-Cache technology. Expected to provide top-of-the-line performance for demanding users, BIOSTAR announces that their AMD-AM5 motherboards are ready to support these new processors.

Flagship tier X670E VALKYRIE, RACING series B650EGTQ, and B650M-SILVER motherboards are the first batch of compatible BIOSTAR motherboards, ready to take on the shiny new AMD Ryzen 7000X3D processors. They are engineered with cutting-edge technology to ensure smooth and efficient performance for high-end gaming and professional applications.

AMD's Ryzen 7000-series CPUs with 3D V-Cache are set to launch next week and alongside the launch, there will obviously be reviews of the upcoming CPUs. As with many other companies, AMD prepared a reviewers guide for the media, to give them some guidance, as well as expected benchmark numbers based on the test hardware AMD used in-house. Parts of that reviewers guide has now appeared online, courtesy of a site called HD Tecnologia. For those that can't wait until next week's reviews, this gives a glimpse of what to expect, at least based on the games tested by AMD.

AMD put the Ryzen 9 7950X3D up against Intel's Core i9 13900K, both systems were equipped with 32 GB of DDR5-6000 memory and liquid cooling. Tests were done with both AMD's own Radeon RX 7900 XTX and an NVIDIA GeForce RTX 4090 graphics card. We won't go into details of the various benchmarks here, as you can find those below, but according to AMD's figures, AMD came out on top with a 5.6 percent win over the Intel CPU, at 1080p using the Radeon RX 7900 XTX and by 6 percent using the GeForce RTX 4090. This was across 22 different games, with Horizon Zero Dawn and F1 2021 being the games favouring the AMD CPU the most and Far Cry 6 and the CPU test in Ashes of the Singularity being the games favouring the AMD CPU the least. TechPowerUp will of course have a review ready for your perusing by the time the new CPUs launches next week, so you'll have to wait until then to see if AMD's own figures hold true or not.

AMD is preparing to release the latest version of its Chipset software. Version 5.01.29.2026 WHQL should be of particular interest for users planning to buy an upcoming Ryzen 7000X3D series processor. The chipset driver includes the "3D V-Cache Performance Optimizer driver" component, version 1.0.0.7. This gives Windows a degree of awareness of the asymmetric nature of 3DV cache on the 16-core 7950X3D and 12-core 7900X3D, where only one of the two CCDs (chiplets) has the 3DV cache memory, while the other is a regular "Zen 4" CCD with 32 MB on-die L3 cache. This awareness should in theory improve performance in less-parallelized workloads (such as games). The AMD website doesn't yet list this driver, but it should appear as we head closer to the market-availability date of the 7950X3D and 7900X3D (February 28). From the looks of it, the optimization works for both Windows 11 and Windows 10, so those on the older operating system for reasons, can keep rocking it.

AMD's next-generation Ryzen 7000-series "Phoenix" mobile processors are all the rage these days. Bound for 2023, these chips feature a powerful iGPU based on the RDNA3 graphics architecture, with performance allegedly rivaling that of a GeForce RTX 3060 Laptop GPU—a popular performance-segment discrete GPU. What's more, AMD is also taking a swing at Intel in the CPU core-count game, by giving "Phoenix" a large number of "Zen 4" CPU cores. The secret ingredient pushing this combo, however, is a large cache.

AMD has used large caches to good effect both on its "Zen 3" processors, such as the Ryzen 7 5800X3D, where they're called 3D Vertical Cache (3D V-cache); as well as its Radeon RX 6000 discrete GPUs, where they're called Infinity Cache. The only known difference between the two is that the latter is fully on-die, while the former is stacked on top of existing silicon IP. It's being reported now, that "Phoenix" will indeed feature a stacked 3D V-cache.

An early retail unit of AMD's upcoming Ryzen 7 5800X3D has made its way to a Peruvian site called XanxoGamging, who put it through its paces in a few benchmarks, of which none so far are game related. The tests run on the upcoming CPU suggests that it's about as fast as a Ryzen 7 5700X in most single and multi-core tests. This should largely be down to the slower clock speeds of the Ryzen 7 5800X3D, which holds it back in these benchmarks compared to the older Ryzen 7 5800X.

However, it seems like some benchmarks can take advantage of the extra cache and the Ryzen 7 5800X3D is outperforming the 5800X in Blender, by a small margin. That said, the Cinebench R23 results are not overly impressive, neither are the CPU-Z or Geekbench 5 numbers. None of this is really unexpected though, especially as AMD has specifically mentioned that the 3D V-Cache doesn't bring additional performance to most software. XanxoGaming has promised more benchmarks and game tests tomorrow, but mentions that it feels strange losing performance in normal software due to the lower clocks, but that they hope the performance can be improved over time by an improved UEFI/AGESA.

Although not yet available directly from AMD, its latest chipset drivers, version 4.03.03.624, have been released by Gigabyte and possibly other motherboard partners and it contains a couple of interesting additions. The first one is support for USB4, albeit only for 64-bit versions of Windows 10 at this point in time. This part really only applies to the Zen 3+ "Rembrandt" mobile Ryzen 6000-series CPUs so far, as they're the only products from AMD that supports USB4 at this point in time.

The other interesting part is that AMD has included a 3D V-Cache Performance Optimizer Driver for both the 64-bit version of Windows 10 and Windows 11. As to what this driver does, is anyone's guess at this point in time, but it's likely to be some kind of cache scheduler, or possibly a means for AMD to allocate software that can't take advantage of the 3D V-Cache to the CPU native cache. We should be finding out in a couple of weeks time, as the Ryzen 7 5800X3D is scheduled for retail availability on the 20th of April.

The global leading motherboard manufacturer, ASRock, announces that with BIOS update, ASRock AMD X570/B550/A520/X470/B450 motherboards will support the latest AMD Ryzen 5000/4000 series processors, including Ryzen 7 5800X3D. ASRock always design ahead to get for new processors and has been working with AMD to validate the latest BIOS AGESA code. The 3D V-Cache technology of AMD Ryzen 7 5800X3D processor offers significant improvements on gaming performance, update to the latest BIOS and get ready to game with new AMD Ryzen processors.