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VIA Partners with Lucid to Develop Industry-Leading VIA Edge AI 3D Developer Kit

VIA Technologies, Inc today announces that it is partnering with AI vision startup Lucid, to deliver AI-based depth sensing capabilities to more dual- and multi-camera devices in the security, retail, robotics and autonomous vehicle space. With Lucid's proprietary 3D Fusion Technology embedded into the VIA Edge AI 3D Developer Kit, security and retail cameras, robots, drones, and autonomous vehicles will now be able to easily capture accurate depth and 3D with dual- or multi-camera setups while reducing the costs, power, and space consumption of previous hardware depth solutions. As VIA builds out its long-term Edge AI solutions roadmap, Lucid is adding camera- and machine-learning based depth capabilities on top of every platform.

The AI-enhanced 3D/depth solution developed by Lucid, known as 3D Fusion Technology, is currently deployed in many devices such as 3D cameras, security cameras, robots, and mobile phones, including the RED Hydrogen One which is launching in November without any additional emission or laser-based hardware components. In the VIA Edge AI 3D Developer Kit, the AI depth solution runs on the Qualcomm APQ8096SG embedded processor, which features the Qualcomm AI Engine along with support for multiple cameras to help Lucid provide superior performance compared to other hardware depth solutions and deliver an industry-leading and unique pure machine learning-based software solution.

VIA Launches ALTA DS 3 Edge AI System Powered by Qualcomm Snapdragon 820E

VIA Technologies, Inc., today announced the launch of the VIA ALTA DS 3 Edge AI system. Powered by the Qualcomm Snapdragon 820E Embedded Platform, the system enables the rapid development and deployment of intelligent signage, kiosk, and access control devices that require real-time image and video capture, processing, and display capabilities.

The VIA ALTA DS 3 harnesses the cutting-edge compute, graphics, and AI processing capabilities of the Qualcomm Snapdragon 820E Embedded Platform to facilitate the creation of vibrant new user experiences by allowing customers to combine their own AI applications with immersive multimedia signage display content in a compact, low-power system.

VIA C3 Processors Compromised by a Simple Shell Command

VIA processors probably make up an infinitesimal amount of the desktop PC market-share, and its makers market the chip only at pre-built machines such as digital-signage kiosks, information kiosks, ticket vending machines, ATMs, etc (which don't need a lot of processing power). At the Black Hat 2018 conference, security researcher Christopher Domas discovered that getting access to root privileges in Linux on a machine powered by VIA C3 "Nehemiah" processors is laughably easy. Just key in ".byte 0x0f, 0x3f" (without quotes) in any Linux CLI in user mode, and voila! You are now the root user.

Domas calls this his own iddqd (the cheat-code for "God Mode" in "Doom"). This backdoor, probably put in place by the processor's designers themselves, completely collapses the ring-based privilege system of the operating system, and elevates users and applications from the ring-2 (and above) userspace to ring 0 (root). It is an exploitation of a shadow-core, a hidden RISC processor within C7, which manages the startup, operation, and key storage of the x86 cores. Intel and AMD too have shadow-cores with similar functions.

VIA Launches VIA Edge AI Developer Kit

VIA Technologies, Inc., today announced the launch of the VIA Edge AI Developer Kit, a highly-integrated package powered by the Qualcomm Snapdragon 820E Embedded Platform that simplifies the design, testing, and deployment of intelligent Edge AI systems and devices.

The kit combines the VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with a 13MP camera module that is optimized for intelligent real-time video capture, processing, and edge analysis. Edge AI application development is enabled by an Android 8.0 BSP, which includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of the Qualcomm Hexagon DSP, Qualcomm Adreno 530 GPU, or Qualcomm Kryo CPU to power AI applications. A Linux BSP based on Yocto 2.0.3 is set to be released in June this year.

Toshiba-OCZ Announce XS700 Series Portable SSDs

Toshiba subsidiary OCZ rolled out the XS700 series portable SSDs. Measuring 95 mm x 75 mm x 11 mm, the drive is only slightly bigger than an internal 2.5-inch drive, and features an aluminium body with diamond-cut edges. The drive features USB 3.1 Gen 2 (10 Gbps) interface, with backwards compatibility to older USB generations. A single cable plugging into the drive's type-C connector provides both power and host connectivity.

Under the hood, the OCZ XS700 features Toshiba-made 3D BiCS TLC NAND flash memory. It comes in only a 240 GB capacity for now, which offers sequential reads of up to 530 MB/s, and sequential write speeds of up to 480 MB/s. The drive appears to feature two components, a Phison S11 DRAM-less controller wired to the NAND flash, connected over SATA 6 Gbps to a VIA Labs VL715 chip that connects it to the USB 3.1 Gen 2 interface. You also get USB-attached SCSI protocol (UASP) support, to speed things up. The drive is backed by a 3-year warranty, and is expected to be priced around $200, when it hits the shelves later this month.

VIA Making a Comeback to x86 CPU Market with Zhaoxin R&D Monies

The only other active x86 architecture licensee than AMD, VIA Technologies, is planning a comeback to the x86 processor market, bolstered by R&D investment by Shanghai Zhaoxin Semiconductor. VIA and Zhaoxin have been co-developing the ZX family of x86 processors for rollout in 2018, and at least on paper, the chips appear to have the chops to take on Intel's "Gemini Lake" SoCs. The new VIA-Zhaoxin combine CPU family begins with the KX-5000 "Wudaoku" SoCs launched late-2017. These are full-fledged SoCs, which completely integrate the chipset (including the southrbidge).

The KX-5000 chips feature 4 or 8 CPU cores without SMT, 2.00-2.20 GHz nominal CPU clock, 2.40 GHz boost clock, a dual-channel DDR4 IMC, a PCI-Express gen 3.0 root complex, an integrated graphics core, and platform I/O that includes SATA 6 Gbps, and USB 3.1 gen 2. This chip debuted on only one product from a major OEM, the Lenovo M6200 desktop model launched in China. 2018 could see a broader launch of VIA-Zhaoxin chips, with the KX-6000. While the older chips were built on the 28 nm process, the KX-6000 series will be built on the newer 16 nm process, feature 4 or 8 CPU cores clocked at speeds of up to 3.00 GHz, while retaining the feature-set of the KX-5000 series. These chips could realistically be touted as low-cost alternatives to Intel "Gemini Lake" SoCs, although Zhaoxin is making bold claims about its performance nearing that of AMD Ryzen processors.

VIA Announces VIA ARTiGO A630 Enterprise IoT Gateway System

VIA Technologies, Inc., today announced the launch of the VIA ARTiGO A630, an ultra-slim fanless gateway system with flexible customization options for a broad spectrum of commercial M2M and IoT applications. Featuring a high-performance 1.0GHz VIA Cortex-A9 dual-core SoC, multiple network connectivity options, and a rich combination of I/O, the VIA ARTiGO A630 adds a cost-effective solution to the growing range of VIA Enterprise IoT gateway devices designed to manage the connection and control for a wide spectrum of connected HMI and automation applications.

"The VIA ARTiGO A630 bolsters our already diverse range of ARTiGO Series M2M and IoT gateway systems," said Richard Brown, VP International Marketing, VIA Technologies, Inc. "Providing a rich mix of connectivity and performance in an ultra-compact design that can be rapidly customized, will help customers speed time-to-market and unlock the full potential of their IoT deployments."

VIA Labs VL820 becomes the World's First USB-IF Certified USB 3.1 Gen 2 Hub

VIA Labs, Inc., a leading supplier of SuperSpeed USB and USB Power Delivery Controllers, today announced that the VIA Labs VL820 USB 3.1 Gen 2 Hub Controller has achieved SuperSpeed USB 10 Gbps certification from the USB Implementers Forum (USB-IF). The VIA Labs VL820 is the world's first USB-IF Certified USB 3.1 Gen 2 Hub.

The VIA Labs VL820 features one upstream port and four downstream ports, each capable of supporting SuperSpeed USB 10Gbps devices, while providing backward compatibility for previous generation USB devices. The VIA Labs VL820 was designed with USB-C in mind, integrating an optionally configurable USB Billboard Device for Alternate Mode applications such as Thunderbolt 3 peripherals or DisplayPort over USB-C multi-function dongles.

VIA Announces First USB 3.1 to SATA Single-chip Bridge with USB-IF Certification

VIA Labs, Inc., a leading supplier of SuperSpeed USB and Power Delivery Controllers, today announced that the VIA Labs VL716 USB 3.1 to SATA III Bridge Controller with native USB Type-C support has achieved SuperSpeed USB 10 Gbps certification from the USB Implementers Forum (USB-IF). Optimized for the latest USB Type-C external storage applications such as USB Type-C optical drives, SSD's, and HDD's, the VL716 single-chip USB 3.1 Gen 2 to SATA III Bridge Controller offers blazing data transfer rates up to 10 Gbps and is fully backwards compatible with USB 3.1 Gen 1, USB High-Speed, and USB Full-Speed modes. With native USB Type-C support built-in, the VL716 offers advanced features such as USB-C connector orientation detection and USB Mux to enable the reversibility feature without additional components or cost.

"Integrating SuperSpeed USB 10 Gbps and USB Type-C support minimizes the need for multiple components and reduces cost for developers," said Jeff Ravencraft, USB-IF President and COO. "Companies like VIA Labs are growing the USB ecosystem by developing compliant solutions and submitting products for USB-IF compliance testing."

VIA to Unveil its Latest SSD Controllers at FMS 2016

VIA Technologies, Inc, today announced that it be will demonstrating its latest VIA NVMe PCIe Gen III & SATA III SSD controllers in Booth#818 of the 2016 Flash Memory Summit being held from August 9th to 11th in the Santa Clara Convention Center, California, USA. Featuring the VIA LDPC PLUS ECC decoding engine with Gear-Shifting technology, the second generation VIA SSD controllers offer best-in-class error correction capability and ensure high-throughput performance without overheating issues.

"VIA Gear-Shifting technology leverages our unique dual hardware decoding architecture to maximize data integrity and longevity," said Richard Brown, VP International Marketing, VIA Technologies, Inc. "Our second generation VIA SSD controllers are the ideal choice for computing devices that require superior SSD performance with high cost-efficiency."

VIA Launches Ruggedized VIA AMOS-3005 Industrial Fanless PC

VIA Technologies, Inc, today announced the VIA AMOS-3005, the latest addition to its market-leading range of rugged and reliable VIA AMOS Series industrial fanless PCs. Combining a sleek ultra-ruggedized chassis with rich internal I/O and wireless connectivity options, the VIA AMOS-3005 is ideally suited for a wide variety of IoT, machine-to-machine, and HMI applications including industrial automation and transportation. The system supports wide operating temperature ranges from -10°C to 60°C as well as a flexible input voltage range of 9V-36V, creating a versatile and highly-reliable solution for even the harshest environments.

"The VIA AMOS 3005 provides the total package of high performance, low power, and rich I/O connectivity required for the most demanding industrial computing usage scenarios," said Richard Brown, VP of International Marketing, VIA Technologies, Inc. "With its support for wide operating temperature and voltage ranges it delivers rock-solid reliability in a highly-robust ultra-compact form factor that had been engineered to withstand the toughest operating conditions."

VIA Readying New 64-bit x86 Processor to Take on Intel Bay Trail and AMD Kabini

Only the third active licencee of Intel's x86 machine architecture, VIA Technology, is readying its first x86 processor in years, codenamed Isaiah II. This chip is based on a brand new 64-bit x86 core design by VIA and the engineering team it acquired from Centaur Technology, another erstwhile x86 licencee, and features modern instruction sets such as AVX 2.0. VIA began sampling a quad-core processor based on Isaiah II, which was put to live test by the company, at its InfoComm 2014 booth. It was compared to Intel's "Bay Trail" Atom and AMD's "Kabini" Athlon chips. It turns out that the Isaiah II is pretty good, if it comes out soon enough.

The Isaiah II based quad-core chip, featuring 2.00 GHz clock speeds, and 2 MB of L2 cache, was put through SANDRA. The BGA chip was running on a VIA-made motherboard, with its own VIA VX11H chipset. It was compared to AMD Athlon 5350 (quad-core "Jaguar" with 2.05 GHz clocks), and Intel Atom Z3770 (quad-core "Silvermont" with 2.40 GHz clocks). The results are tabulated below. At 2.00 GHz, armed with the latest multimedia and cryptography instruction-sets, VIA's chip is faster than Intel's in most tests, despite lower clocks. It trades blows - and wins - against AMD's chip, in most tests. VIA is expected to launch the first chips based on Isaiah II in late-August, 2014. VIA is hedging its bets with efficient compact PCs, kiosks, and digital signage, with its new chip.

VIA Announces AMOS-3003 Fanless System

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3003, a compact embedded IoT system designed around the tiny VIA EPIA-P910 Pico-ITX board. Combining low power, rich connectivity and high performance 64-bit computing in a ruggedized design, the VIA AMOS-3003 delivers all the latest features and digital media standards required in data collection terminals for in-vehicle control as well as machine to machine controllers in a host of industrial automation applications.

Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.

VIA Announces Partnership with Mozilla

VIA announced an official partnership with Mozilla for support and development of Firefox OS for new device form factors. Firefox OS running on APC Paper and Rock has been released with complete, buildable source codes available to developers on GitHub. In order to continue to encourage community support, free APCs will be rewarded to developers that fix a known issue. A full list of issues is available here.

"Firefox OS puts the power of the Web to the people. This partnership with APC presents an exciting opportunity to help redefine user experiences on desktops around the world," said Dr. Li Gong, Senior Vice President of mobile devices and, President of Asia Operations. "Mozilla will keep working on new features and enhancements of Firefox OS, and also provide knowledge sharing and technical support for Firefox OS and Marketplace."

"We are excited to announce this partnership with Mozilla and their enthusiastic support to speed development of Firefox OS on APC," said Richard Brown, VP of International Marketing, VIA Technologies Inc. "Mozilla's mission to promote openness, innovation and opportunity on the web, aligns with our vision for APC, creating the perfect combination to deliver the best of the web to desktops everywhere. We couldn't be more excited about the future."

VIA Sues ASUS Group Companies and Executives for Damages

Following the decision by the Taiwan Prosecutor to pursue criminal proceedings against a subsidiary of Asustek Computer, Inc. (TSE: 2357) and four of that subsidiary's employees for the alleged misappropriation of trade secrets from VIA Technologies, Inc. (TSE: 2388), VIA today announced that it has filed a civil suit in the Taipei District Court seeking damages of at least NT$4.137 billion (US$138 million) from Asustek Computer, Inc and its subsidiary Asmedia Technology.

The lawsuit is being filed to recover the losses incurred as a result of the alleged misappropriation of VIA intellectual property related to USB technology. Also named in the suit are Asmedia Chairman Jerry Shen, Asmedia President Lin Chewei, and other Asmedia employees involved in the case.

"As a long-time leader in IC design and technology innovation, VIA strongly believes in the importance of protecting intellectual property rights," commented Wenchi Chen, CEO of VIA Technologies, Inc. "In addition to protecting interests of VIA and our shareholders, the aim of this suit is to ensure our industry operates in a healthy market environment that fosters innovation and promotes fair competition."

AMD Inching Towards an Increasingly ARM-based Future with "Seattle"

AMD is inching toward a possible post-x86 future for itself, beginning with its enterprise product stack. In a blog-post, the company outlined a landmark product bearing its enterprise Opteron branding, codenamed "Seattle," which will be designed for scalar data-centers. Based on the 64-bit ARMv8 architecture by ARM, the chip will feature either four or eight cores based on AMD's own implementation of ARMv8, and a high-bandwidth integrated memory controller with support for up to 128 GB of system memory with ECC.

Since ARM-based processors are traditionally part of heavily integrated systems on chips (SoCs), "Seattle" will be an SoC, and among other things, will integrate a 10 Gb/s Ethernet controller, with support for AMD's FreedomFabric technology. Linux kernel 3.7 and above will come with ARMv8 architecture support, and Microsoft is already developing a Windows kernel with ARMv8 support that will be implemented on both its client (Windows RT, Windows Phone) product lines, and a future version of Windows Server. That said, AMD won't give up on x86. As the only active x86 licensee apart from VIA, AMD will continue to make APUs with 64-bit x86 cores for as far as the eye can see (in other words 2015). Future of its client CPU (non-APU) lineup based on the AM3+ socket, however, appears bleak.

VIA Labs USB 3.0 Host, Hub, and Device Controllers Certified for Windows 8.1

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced the Microsoft Windows 8.1 readiness of its USB 3.0 Host, Hub, and Device controllers, corresponding with the recent release of the first major update to Windows 8. The VIA Labs VL805 4-Port and VIA Labs VL806 2-Port USB 3.0 Host controllers are Windows Hardware Certification Kit (WHCK) certified and support xHCI 1.0 and Microsoft's USB Debugging Port Capability.

The VIA Labs VL811+ USB 3.0 Hub Controller, which is used in the Microsoft USB Test Tool SuperMUTT Pack, is certified along with VIA Labs VL812 4-Port USB 3.0 Hub controller. The VL812 remains one of the only USB 3.0 hubs on the market with fully-integrated voltage regulators including 5V to 1.2V Switching regulator and 5V to 3.3V Linear regulator.

VIA Launches VIA ARMTiGO A800 Pico ITX System

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMTiGO A800, the world's smallest ARM system for embedded applications, including hotel automation, digital signage and, surveillance as well as for medical and healthcare applications.

Combining an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs, the VIA ARMTiGO A800 delivers robust performance and unbelievable power efficiency, maintaining an average power consumption of a mere 3.14W TDP. With a fanless, ultra-low-profile dustproof design measuring a mere 12.0cm x 12.5cm x 3.0 cm (W x D x H), the VIA ARMTiGO A800 can fit easily into any environment, whether it is behind a monitor or on the wall with a 7.5cm x 7.5cm VESA mount or placed alongside other devices.

VIA Announces Ultra Compact VIA ARMOS-800 IPC

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications.

Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA ARMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -40°C up to 80°C, the VIA ARMOS-800 delivers a typical power consumption of a mere 3.14W TDP.

VIA Labs VL811+ USB 3.0 Hub Controller Obtains USB-IF Certification

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced that the VIA Labs VL811+ 4-port SuperSpeed USB Hub controllers has achieved SuperSpeed USB certification from the USB Implementers Forum (USB-IF). The VIA Labs VL811+ is among the first USB 3.0 hubs to achieve USB-IF certification.

"VIA Labs has been working with the USB-IF since the beginning and we've seen USB 3.0 grow from just a specification to being designed into computing platforms and peripherals that we hadn't even dreamed about," said Jay Tseng, Director, VIA Labs, Inc. "We're very pleased to offer the industry a certified SuperSpeed USB Hub and we look forward to new possibilities for innovation."

Orico Unveils Multi-Port USB 3.0 Strips

Chinese peripherals maker Orico took it upon itself to help make 2013 the year of the USB 3.0 hub. The company launched a trio of brushed aluminum USB 3.0 port strips (akin to power strips), the 4-port A3H4, the 7-port A3H7, and 10-port A3H10. The three use single upstream USB 3.0 connections, and an external DC power input to ensure at least the power spec requirements are met. Each of the downstream ports has a single link/activity LED. At the heart of the three is VIA's VLI VL811 USB 3.0 hub controller, which is awaiting USB-IF certification. The three are fabricated with 2 mm-thick aluminum sheets. The A3H4, A3H7, and A3H10 are priced at 218 RMB (US $35), 298 RMB (US $48), 398 RMB (US $64), respectively.

VIA Enables Medical OEMs to Take Advantage of Exciting Growth Opportunities in Medica

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced tit enables medical OEMs to take advantage of the exciting growth opportunities in the medical market by offering the widest selection of low-power x86 and ARM based solutions on the market. VIA provides fully customizable application ready platforms together with extended software and firmware services which medical OEMs can leverage for a wide range of medical usage models and applications including ultrasound, diagnostics, POC (Point of Care) terminals, patient monitoring, therapeutic, as well as exercise and fitness equipment.

With a long history as a full-service medical OEM solutions provider to many of the top industry players, VIA provides a robust medical roadmap which includes a full range of COM Express, ETX and QSeven system on modules, embedded mainboards in Mini-ITX and Pico-ITX form factors, and embedded systems based on VIA AMOS and VIA ARTiGO designs, as well as a full line of medical-grade touch displays with the VIA ALMA-3000 series. VIA also offers unparalleled longevity support for increased lifecycle management, support for a wide range of software and board operating systems and support for critical medical standards including UL-60601, EN-60601 and medical QMS (Quality Management System) ISO-13485. This enables customers to deliver products with unique feature-set advantages and a faster time-to-market.

USB 3.0 Hub Controller Business Could Heat Up in 2013: Analysts

Following entry of USB 3.0 SuperSpeed specification, chip-makers such as Renesas, ASMedia, Etron, and VIA made a killing selling third-party USB 3.0 host controllers to motherboard, desktop, and notebook vendors, which ended after Intel launched its 7-series chipset featuring an integrated 4-port USB 3.0 host controller, resulting in drop in demand for third-party chips. These companies each have USB 3.0 hub controllers, and could help drive growth of the specification with USB 3.0 hubs, devices which multiply the number of USB ports available. USB 3.0 hub controllers have been slow in receiving USB-IF certification due to difficulties in conducting compatibility tests, which could ease out by 2013, since Renesas' chip already passed certification. Most peripherals and flash drive manufacturers could have USB 3.0 hubs among their product lineups.

VIA Labs Announces Next-Generation USB 3.0 to NAND Flash Controllers

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its two latest USB 3.0 device controllers, the VIA VL752 and VIA VL753 SuperSpeed USB 3.0 to NAND flash controllers. The VIA VL752 and VIA VL753 deliver enhanced performance using the latest NAND flash technologies including 19nm, 20nm and 21nm geometries and have been certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality, seamless interoperability, and effortless backwards compatibility.

The two-channel the VIA VL752 and single-channel VIA VL753 offer data transfer speeds up to 280MB/s, flexible bad block management, support for the latest 200MHz DDR NAND Flash, and a robust ECC engine for greater data integrity. The package sizes from the previous generation of VIA Superspeed USB to NAND flash controllers have been reduced to a QFN68 8 x 8mm package for the VIA VL752 and a QFN48 6 x 6mm package for the VIA VL753 to enable the smallest form-factor designs.

VIA Labs Announces Two New USB 3.0 Host Controllers, VIA VL805 and VIA VL806

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced two next generation USB 3.0 Host controllers, the four-port VIA VL805 and the two-port VIA VL806. The VIA VL805 and VIA VL806 allow a PCI Express-equipped platform to interface with multiple SuperSpeed USB peripherals devices simultaneously for blistering fast transfers rates up to 5 Gbps while retaining full backwards compatibility with USB 2.0 and 1.1 devices.

The next generation single chip VIA VL805 and VIA VL806 Host controllers include enhancements for improved performance, seamless cross compatibility and interoperability, and new features such as support for USB Battery Charging and "Charging Downstream Port" which enables both fast data sync and rapid charging with compatible devices. The VIA VL805 and VIA VL806 comply with the Universal Serial Bus 3.0 Specification for Super-Speed transfers and Intel's eXtensible Host Controller Interface (xHCI) 1.0 specification and add native inbox driver support for Windows 8. VIA VL805 and VL806 host controllers are USB-IF certified and are currently shipping.

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