Thermaltake, a leading PC DIY brand for premium hardware solutions, releases the Arcus 380 TG ARGB Mid-Tower Chassis, designed to showcase high-performance hardware through its distinctive panoramic design. A one-piece curved tempered glass panel creates an expansive view of the interior, while five pre-installed Infinity ARGB PWM fans provide vibrant lighting and efficient airflow. Available in Black and Snow editions, the Arcus 380 TG ARGB also features a dual-chamber layout and support for back-connect motherboards, offering a balance of visual appeal and practical functionality.

Curved Tempered Glass for Panoramic Views
The Arcus 380 TG ARGB features a one-piece curved tempered glass panel that wraps around the front and side, providing an uninterrupted view of the internal hardware. Its dual-chamber structure separates key components from cable management areas, keeping the main compartment visually clean. With its expansive glass design, the chassis puts the focus on the hardware and lighting inside.

Cooler Master today announced the QUBE 540 Stainless Steel, combining stainless steel panels with a chassis that adapts to different hardware configurations and workspaces. The case supports ATX motherboards, graphics cards up to 415 mm long without front fans installed, and horizontal or vertical placement. QUBE 540 Stainless Steel is available now on the Cooler Master website in North America.

This special edition uses SUS304 stainless steel panels for corrosion resistance and rigidity. Custom forming tools preserve the QUBE 540's geometry, while two surface treatments serve different purposes: an 8K mirror-polished exterior creates a reflective surface, while the interior's matte hairline finish provides a subtle contrast and helps make minor handling marks less noticeable.

SAMA, a global leader in PC hardware, introduces the S32 WOOD and G650E/G850E bundle, combining a compact PC case with a 650 W or 850 W 80 Plus Gold-certified power supply. Designed to deliver excellent value, the bundles offer PC builders a convenient foundation for their next gaming system. The S32 WOOD features three pre-installed 120 mm fans, a ventilated mesh front panel, and support for graphics cards up to 405 mm and CPU air coolers up to 180 mm. Each bundle includes an ATX 3.1-ready power supply, providing reliable power delivery and support for modern hardware while remaining accessible. Both configurations are available exclusively on Amazon US and Newegg US as part of SAMA's ongoing product lineup.

S32 WOOD Case
The S32 WOOD combines a compact form factor with hardware compatibility, efficient cooling, and a distinctive natural wood accent. Its ventilated mesh front panel and three pre-installed 120 mm fans provide powerful airflow right out of the box. The chassis is compatible with microATX/Mini-ITX and microATX back-connect motherboards, while providing ample clearance for graphics cards up to 405 mm and CPU air coolers up to 180 mm.

Advantech, a leading provider of industrial edge AI and high-performance computing solutions, today introduces two new tower server chassis—the HPC-7046 Closed-Loop Liquid-Cooling Tower Chassis and HPC-5422 Desktop Workstation Chassis—designed to tackle the growing demands of enterprise AI, machine vision, robotics, and edge computing. From advanced liquid cooling for high-performance, thermally demanding AI workloads to compact desktop workstation with high-power PSU support for power-hungry GPU computing, the new chassis portfolio delivers scalable performance, expansion capabilities, and deployment flexibility, enabling modern AI computing in a compact footprint across industrial and enterprise edge, including small and medium-sized businesses (SMB) offices and server rooms, development laboratories, factory automation, and embedded industrial equipment.

HPC-7046: High-Performance Liquid Cooling for Next Generation AI Computing
Modern AI and compute-intensive workloads are driving the adoption of higher-performance CPUs with increasing thermal design power (TDP), making thermal management and acoustic critical for high-performance tower systems.

Zalman has launched two new mid-tower cases, the S6 Black and S6 V2 Black, with identical dimensions of 412 x 215 x 486 mm and the same core specifications. The only difference between them is that the V2 Black includes two additional 120 mm RGB fans mounted at the top. Both PC cases support ATX, microATX, and Mini-ITX motherboards, feature seven PCIe slots, up to 345 mm GPU clearance, and CPU cooler height up to 165 mm. For storage, there is one 3.5-inch HDD bay, three 2.5-inch SSD bays, and one combo bay. Fan support is generous, up to three 120/140 mm at the front, two 120/140 mm at the top, two 120 mm at the bottom, and one 120 mm at the rear. The S6 Black ships with three fixed-RGB 140 mm front fans and one fixed-RGB 120 mm rear fan. As already stated, the S6 V2 Black adds two fixed-RGB 120 mm fans at the top. Radiator support goes up to 360 mm at the front, 240 mm at the top, and 120 mm at the rear.

Both cases feature a mesh front panel, tempered glass side panel, magnetic top dust filter, and additional filters at the front and bottom. For cable management users gets 22 mm of clearance behind the motherboard tray. Front I/O includes USB-C, one USB 3.0, two USB 2.0, HD audio, and separate power and RGB buttons. The S6 Black is listed at $79.99 on Zalman USA. The S6 V2 Black doesn't have an official price yet, though the small difference in included fans suggests something around $89.

Thermaltake, a leading PC DIY brand for premium hardware solutions, introduces the Stage 500 TG ARGB Mid Tower Chassis, designed to bring PC hardware and personal collections together in one showcase. Available in Black and Snow editions, the Stage 500 TG ARGB features a one-piece curved tempered glass panel, a dedicated display stage, a wooden base, and an integrated bottom light strip, creating a distinctive presentation that blends modern PC hardware with personalized aesthetics.

Curved Tempered Glass Creates Panoramic Views
The Stage 500 TG ARGB features a one-piece curved tempered glass panel that extends across the front and side, providing an uninterrupted panoramic view of the hardware and display area inside. The curved design minimizes visual separation and puts every detail of the build on display.

Gigabyte launched the B760M AORUS Ari WiFi6E DDR4 microATX motherboard for the Intel LGA1700 platform, adding PCIe 5.0 support and its AORUS anime theme. The board relies on DDR4 memory instead of DDR5, a choice made possible by the B760 chipset that supports both technologies. With DDR5 reaching record prices and limited availability, the still considerably cheaper DDR4 memory came as a logical option nowadays. The layout is almost identical to last year's B760M AORUS Elite WIFI6E GEN5, with DDR5 replaced by DDR4 and the Ari anime theme added to the board. It supports Intel's 12th, 13th, and 14th Gen processors and implements a 12+1+1 phase hybrid VRM. As part of Gigabyte VRM Thermal Armor feature, dedicated heatsinks are placed on the VRM, PCH and M.2 slots. The four DDR4 DIMM slots support up to 128 GB DDR4-5333 via XMP profiles or manual overclocking. The primary PCIe 5.0 x16 slot features a quick-release design with a second PCIe 4.0 x4 slot from the chipset. For storage, the motherboard offers two PCIe 4.0 x4 M.2 slots with screwless installation, alongside four SATA ports.

The board has 2.5 GbE LAN and Intel Wi-Fi 6E AX210 connectivity with a Wi-Fi Compass feature that automatically detects the best antenna position. Rear I/O panel includes USB-C ports at 20 Gbps, DisplayPort, and HDMI 2.1 with 4K output. The front USB-C header runs at 10 Gbps, while for audio we have a Realtek ALC1220 codec. Other features include Q-Flash Plus for BIOS updates without a CPU installed and Smart Fan 6 for fan control. The B760M AORUS Ari WiFi6E DDR4 is available in Japan for ¥26,800, around $170.

MSI quietly added three new B550 motherboards to its AM4 lineup, one microATX model and two ATX boards. The new models are the PRO B550M WIFI6E, PRO B550-S, and B550-S WIFI6E, all targeting AMD's Ryzen 3000, 4000G and 5000 processors. The PRO B550M WIFI6E is the microATX model measuring 243.84 x 210 mm. MSI opted for a spartan layout with only a tiny radiator on top of the AMD B550 chipset. The motherboard has two DDR4 DIMM slots supporting memory up to 4600+ MT/s (OC). For expansion, there is one PCIe 4.0 x16 slot and two PCIe 3.0 x1 slots, with one M.2 slot and four SATA 6 Gb/s ports for storage. The M.2 slot runs at PCIe 4.0 x4, while the wireless connectivity is provided by a pre-installed Wi-Fi 6E module.

The PRO B550-S and B550-S WIFI6E are full-size ATX boards measuring 243.84 x 304.8 mm. MSI opted for a more robust cooling package with dedicated heatsinks for the VRM, chipset and M.2 slot. Both feature four DDR4 DIMM slots with support for up to 128 GB and up to 4800+ MT/s (OC). The boards have two PCIe x16 slots, one PCIe x1, two M.2 slots, and four SATA ports. The first M.2 slot supports PCIe 4.0 x4, while the second runs at PCIe 3.0 x4. There are USB 5 Gbps Type-A and Type-C ports, along with 10 Gbps Type-A and Type-C ports on the rear I/O. The B550-S WIFI6E adds a pre-installed Wi-Fi 6E module. All three boards use the Realtek ALC897 7.1-channel audio codec and Realtek RTL8111H Gigabit Ethernet. MSI has not yet announced pricing or international availability.

Maxsun has launched three new B850 microATX motherboards for the AM5 platform supporting AMD Ryzen series processors: MS-B850M I-CAFE, B850M-P WIFI and B850M-B WIFI. The Maxsun MS-B850M I-CAFE measures 245 x 210 mm and features two DDR5 DIMM slots supporting up to 128 GB at DDR5-8000 OC. It has one PCIe 5.0 x16 and one PCIe 4.0 x4 slot, two M.2 slots (PCIe 5.0 and PCIe 4.0), two SATA ports, 2.5 GbE, and HDMI 1.4 for integrated graphics. The board has no Wi-Fi but includes four USB 5 Gbps and two USB 2.0 Type-A ports at the rear. The two Challenger models share most of their specs. Both have PCIe 5.0 x16 and PCIe 4.0 x4 expansion slots, two M.2 slots, two SATA ports, Wi-Fi 6 and Bluetooth 5.2 via MediaTek MT7902, 2.5 GbE, a USB-C 20 Gbps front header, and four USB 5 Gbps plus four USB 2.0 on the rear. The main difference is memory support and size: the B850M-P WIFI is the larger motherboard at 245 x 245 mm and supports four DIMM slots for up to 256 GB of DDR5. The B850M-B WIFI is more compact at 245 x 215 mm with two slots supporting 128 GB. Both motherboards feature HDMI 2.0 and dual DisplayPort 4K at 60 Hz for integrated graphics output.

All three motherboards use a Realtek ALC897 audio codec. Pricing and availability for the full lineup have not been officially announced, though the MS-Challenger B850M-P WIFI has appeared listed on the Chinese market at CNY 799 (around $119) at the time of writing.

AAEON (Stock Code: 6579), today announced the release of two new microATX industrial motherboards featuring Intel Core Ultra 200S Series Processors (formerly Arrow Lake-S), the MAX-Q870A and MAX-H810A.

The two boards are compatible with a range of Arrow Lake-S CPUs, with the MAX-Q870A supporting up to 125W SKUs and the MAX-H810A supporting up to 65 W SKUs. This difference reflects the market positioning of the two boards, with the former marketed for advanced AI and machine vision use and the latter for more cost-efficient industrial automation and HMI applications.

ASRock has silently expanded its Pro-A motherboard lineup with the B550M Pro-A WiFi 6E, a microATX board for the AMD AM4 platform. The new model is essentially the existing B550M Pro-A with the addition of a Wi-Fi 6E module. The launch comes as the AM4 platform is seeing something of a second life, with other major motherboard manufacturers recently adding new models, or increasing production, for the socket first introduced nearly a decade ago. Needless to say that this trend is mostly driven by the current memory pricing situation. The motherboard supports Ryzen 3000, 4000G, 5000 and 5000G series processors, or, if you like the "resurrection" idea, AMD CPUs (Vermeer, Matisse) and APUs (Cezanne, Renoir, Picasso) series.

The ASRock B550M Pro-A WiFi 6E features an 8-phase power design and four DDR4 DIMM slots that can support up to DDR4-4733+ memory modules via overclocking. The motherboard has one PCIe 4.0 x16 slot, one PCIe 3.0 x16 and two PCIe 3.0 x1 slots. It also has two M.2 slots, the primary offering PCIe 4.0 x4 support, and four SATA 6 Gb/s ports. The features are completed by Gigabit Ethernet, Wi-Fi 6E, HDMI, two USB 3.2 Gen 1 Type-C ports and nine USB 3.2 Gen 1 ports. Two RGB and two ARGB headers are also included for those who want a bit of color. The board is expected to be priced around $90, however ASRock has not yet announced an MSRP.

Akasa, a leading provider of computer hardware and PC accessories, has launched the M.2 NVMe SSD to PCIe adapter card with removable tray (AK-PCCM2P-06), enabling IT administrators, system integrators and PC builders to install an M.2 NVMe SSD into a free PCIe slot on a desktop, workstation or server. The adapter card delivers data transfer rates of up to 64 Gbps on a PCIe 4.0 x4 interface, and houses the drive in a lockable, removable tray built for environments where drives are added, swapped or secured on a regular basis.

Delivering data transfer rates of up to 64 Gbps over a PCIe 4.0 x4 interface and is backward compatible with PCIe 3.0 x4 at up to 32 Gbps. Its removable drive tray allows the M.2 SSD to be installed or replaced without removing the adapter card from the PCIe slot, minimizing downtime during maintenance or drive swaps. The adapter card fits PCIe x4, x8 and x16 slots, ensuring broad compatibility across desktop, workstation and server motherboards.

Gigabyte has launched two new B450 microATX motherboards for the veteran AMD AM4 socket and yes, no mistake here, the boards use the B450 chipset that was launched way back in 2018. The B450M D3HP and B450M D3HP WIFI6E are aimed at budget builds and AM4 platform upgrades, offering support for AMD Ryzen 3000, 4000, and 5000 processors, four DDR4 slots and up to 128 GB of memory. For a motherboard built on eight-year-old silicon, the features are reasonable. There are two M.2 slots, one PCIe 3.0 x4 connected directly to the CPU and one PCIe 2.0 x2 via the chipset. Alongside, we have four SATA 6 Gb/s ports, one DisplayPort 1.2 and two HDMI 2.0b ports, a 5 Gbps USB-C front panel header and three addressable RGB headers. A Q-Flash Plus button on the rear I/O allows BIOS updates without a compatible CPU installed, which is useful for anyone looking to buy a new Ryzen processor. Both boards use a 4+2 phase power delivery and Gigabit Ethernet. The WIFI6E variant adds Wi-Fi 6E and Bluetooth 5.3.

However, the limitations are real, there is no PCIe 4.0, no DDR5 (obviously), and the second M.2 slot only runs at PCIe 2.0 x2. But for someone already having a Ryzen 5000 chip and DDR4 memory, or anyone putting together the cheapest possible functional PC, those trade-offs might not matter much. Surprisingly, though, AM4 refuses to die, and apparently Gigabyte is still willing to make use of it considering that a few weeks ago they released new AM4 motherboards using the B550 chipset launched six years ago. No pricing or exact availability was announced for either board.

Geometric Future, an innovative PC components and peripherals brand, expands its performance lineup with the launch of the Model 3 case, an updated Eskimo Plus 36 AIO, and Squama 3003-12 fans. Designed for users who want optimal cooling in a compact and visually refined build, the 27L microATX Model 3 combines an isolated front-mounted PSU layout with support for GPUs up to 435 mm, up to eight 120 mm fans, a 360 mm radiator, and five pre-installed Squama 3003-12 ARGB PWM fans. The Eskimo Plus 36 refreshes the Eskimo Pro 36 platform with pre-installed Eskimo 3003 ARGB fans, a 1.5 L/min pump, a diffused ARGB CPU block, and a large 55.8 x 55.8 mm copper coldplate. Also launching, the Squama 3003-12 brings a thicker 30 mm frame, high-pressure 9-blade design, dual-sided ARGB lighting, and standard or reverse-blade orientations for more flexible airflow setups.

The Model 3 is a compact 27L microATX case designed to deliver strong hardware support and cooling performance in a clean, compact layout. Its isolated front-mounted PSU design helps maximize internal efficiency, while dual tempered glass panels provide an unobstructed view of the build. Despite its compact size, the Model 3 supports microATX motherboards, graphics cards up to 435 mm in length with an integrated anti-sag bracket, and cooling configurations of up to eight 120 mm fans, with a 360 mm radiator at the top. The Model 3 also features a removable platform that can be used for decorative accessories while helping guide airflow within the chassis. The case is available in four color options (black/yellow, black/gray, black/green, and all white) and can be purchased with five pre-installed Squama 3003-12 ARGB PWM fans or without.

SilverStone showcased the ALTA T2 case prototype at Computex earlier this year and is now getting a proper introduction as a super tower built specifically for multi-GPU workstations and high-density AI compute setups. The chassis is constructed from 3 to 8 mm thick aluminium, measuring 260 x 732 x 660 mm and 125.6 liters volume. Motherboard support is extensive, covering XL-ATX, SSI-EEB, SSI-CEB, E-ATX, ATX, microATX, and Mini-ITX formats with no less than eleven PCIe expansion slots for multi-GPU configurations. GPU clearance goes up to 411 mm, and the case includes a graphics cardholder to keep heavy cards in place. SilverStone ALTA T2 cooling features are impressive, using a vertical chimney airflow layout with up to three 420 mm radiators, two large 180 mm intake fans, and multiple additional fan positions. A distro plate mounting bracket is also included for custom loop builds.

For storage, the case supports 5.25-inch, 3.5-inch, and 2.5-inch devices, with a drive cage that includes a fan mounting system. Power delivery is handled by a dual-PSU setup, with an ATX or 2U CRPS as the primary and a standard ATX as the secondary, useful for kilowatt-class systems that need headroom beyond what a single PSU can provide. Front I/O features two USB Type-C ports, two USB 3.0 ports, and a combo audio jack. No pricing has been announced yet for the ALTA T2.

Akasa, a leading provider of thermal solutions, has expanded its Kepler fanless case series with the Kepler R, a 2U rack-mountable fanless case for microATX and Mini-ITX motherboards. Building on the Kepler design, the Kepler R introduces a 120 W redundant, hot-swappable ATX power supply unit (PSU), allowing system integrators to keep their systems running even if one PSU module fails. This makes it ideal for critical applications, including enterprise servers, embedded computing, industrial control systems, audiovisual equipment, and medical devices that require silent operation, 24/7 reliability and zero downtime.

The chassis is compatible with microATX and Mini-ITX motherboards with Intel LGA1851 and LGA1700 sockets, supporting Intel Core (12th/13th/14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP. Built with a fully fanless design, it uses a high-performance aluminium thermal module and dual copper heatpipes to transfer heat efficiently from the CPU to the external aluminium fins, increasing surface area for rapid dissipation into the surrounding air without any moving parts.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today unveiled its highly anticipated AORUS B550 X Series motherboards. Engineered to be the most powerful refresh of the AM4 platform motherboard, the B550 X Series is built as the perfect match for the legendary AMD Ryzen 7 5800X3D processor, giving gamers and builders a smarter path to elite performance without the cost premium of next-generation platforms.

The GIGABYTE B550 X Series was purpose-engineered around one of the most celebrated processors in PC gaming: the Ryzen 7 5800X3D, widely regarded as the best cost-to-performance processor on the market. The board is built to sustain the 5800X3D's 8 cores and 16 threads under extreme throughput while comfortably taming its massive 96 MB of L3 cache. The pairing delivers the kind of gaming performance that keeps frame rates high and total build cost low—a value proposition further strengthened by DDR4 memory compatible.

Cougar has launched the CFV220 RGB, a mid-tower ATX case first shown at Computex 2026 back in June, as we reported here. The chassis, a slightly more compact version of the existing CVF235, measures 235 x 504 x 446 mm with three tempered glass panels and a ventilated lower intake chamber with integrated ARGB lighting. The CFV220 RGB supports Mini-ITX, microATX, ATX, and back-connector motherboards. For cooling it comes with three pre-installed 120 mm ARGB PWM fans, two in the bottom intake and one at the rear. All three fans are running up to 2200 RPM with 5 V 3-pin ARGB and 4-pin PWM headers, syncing with the motherboard RGB. Users can install up to three fans, for a total of six fans, with the top supporting three 120 mm or two 140 mm fans and a 360 mm or 240 mm radiator.

Hardware clearances cover GPUs up to 420 mm, CPU coolers up to 170 mm, and PSUs up to 160 mm. For storage the case has one 3.5-inch bay and one 2.5-inch bay, with a second 2.5-inch bay available if you convert the 3.5-inch one. As with many mid-tower cases, it sports seven expansion slots. The front I/O panel has a USB 3.2 Gen 2x2 Type-C at 20 Gbps, two USB 3.0 Type-A ports, a combo audio jack, and an RGB button. A removable sliding dust filter covers the intake section. The CFV220 RGB case is available in black and white. Cougar hasn't announced its pricing.

Thermaltake CAPO X is one of the more unusual cases we've seen at Computex this year, and now it has been officially launched. CAPO X is a full tower designed to house two completely independent microATX systems in a single enclosure. The interior of the case is split into two separate motherboard compartments. Both offer support for standard microATX boards as well as rear-connector designs such as ASUS BTF, MSI Project Zero, and Gigabyte Project Stealth. Each of those compartments gets five expansion slots, GPU clearance up to 420 mm, CPU cooler height up to 180 mm, ATX PSU support up to 250 mm and 360 mm radiator mount for independent cooling. Dedicated 2.5-inch storage mounts in each section mean both systems run completely separately, including their own operating systems.

Front I/O is also independent per system, the upper compartment's panel sits near the top-left, the lower one toward the front-bottom, each with a USB Type-C 10 Gbps port and two USB Type-A 5 Gbps ports alongside power, reset, and audio headers. The case is made from 1 mm SPCC steel, measures 691 x 305 x 448 mm and has a single 4 mm curved tempered glass side panel spanning both compartments. The use cases are fairly niche but make sense, a gaming and dedicated streaming setup, an AI inference system alongside a primary workstation, or simply saving desk space by running two systems in one chassis. Thermaltake CAPO X is available in black and white and has a price of 1270 yuan (around $187).

In Win Development Inc. (InWin), a global innovator in PC hardware design and engineering, proudly introduces the L50 BREEZE. Moving beyond the aggressive styling and vibrant RGB effects traditionally associated with gaming systems, the L50 BREEZE embraces modern home décor influences. Featuring a reeded glass front panel and AWWA PureTone ambient lighting, BREEZE redefines the PC as a seamless part of everyday living spaces.

Inspired by contemporary interior architecture, the L50 BREEZE showcases a distinctive reeded glass front panel that diffuses lighting into soft, layered reflections, adding both texture and visual depth. A tinted tempered glass side panel provides a clear view of internal components, striking a balance between elegant lifestyle aesthetics and hardware presentation. Tool-free removable panels streamline installation, upgrades, and maintenance.

LIAN LI Industrial Co. Ltd., a leading provider of PC cases, cooling, and power supplies, announces the B4-mATX, a 21.3-liter small form factor chassis co-developed with DAN Cases. Designed to deliver strong hardware compatibility in a compact layout, the B4-mATX supports microATX motherboards, GPUs up to 358 mm, and both ATX and SFX power supplies. The chassis can be positioned horizontally as a desktop unit or rotated 90 degrees into a vertical tower that occupies 30% less desk space. With multiple front-panel finishes, mesh or real wood, in black or white, the B4-mATX suits both performance and lifestyle builds.

One Chassis—Two Orientations
When placed horizontally, the B4-mATX sits as a compact desktop unit. When rotated to a vertical orientation, it occupies 30% less desk space. A rotatable AC inlet adapts to both layouts—rotated outward for easier cable access, or inward in vertical mode to absorb excess cable length inside the chassis. A swiveling cable bracket below the PCIe slots keeps rear I/O and power cables flush against the case in vertical mode, with total clearance including connectors up to 52 mm tall. Front-panel options include perforated mesh for direct intake or a real wood finish (walnut or beech) for lifestyle aesthetics, with both finishes available in black or white.

[Editor's note: Our in-depth review of the Lian Li B4-mATX is now live]

SilverStone introduces the FLP03—a retro-inspired microATX chassis that brings classic PC aesthetics into a more compact and versatile form factor, combining nostalgic exterior details with support for modern storage, high-end graphics cards, and efficient cooling configurations.

The FLP03 continues SilverStone's mission to reimagine the golden age of personal computing for today's builders. With its familiar beige exterior, functional Turbo button, front 5.25" expansion bays, and secure key lock design, the FLP03 captures the spirit of classic desktop systems while offering the flexibility required for modern PC builds.

Cooler Master, a global leader in innovative thermal solutions and PC hardware today announced Q300L V3, the next generation of its popular compact microATX case platform. Designed for first-time builders, price-conscious gamers, and system integrators, the Q300L V3 delivers a more capable build experience with improved airflow, stronger structure, tempered glass, and updated front I/O connectivity.

The Q300L V3 builds on the familiar identity of the Q300L series while addressing the needs of modern compact systems. With support for Mini-ITX and microATX motherboards, CPU air coolers up to 178 mm tall, graphics cards up to 366 mm long, and up to six fans, the case gives builders more room to work while keeping the small footprint that made the series popular.

We've already covered a number of DeepCool's latest innovations at Computex 2026, from its latest CPU and AIO coolers to its new silent daisy-chain fans, but the brand has also shown off a new prototype SFF PC that flips the script on PC building. The as-yet-unnamed mini PC packs the motherboard and main hardware into a small chassis with a cutout over the CPU where one of DeepCool's new Assassin V coolers sticks out into the open air. This protruding CPU tower cooler presents two main advantages: The CPU always has unfettered access to fresh, cool air, and CPU performance is no longer constrained by the size of the cooler that can fit into the case.

Of course, there are obvious drawbacks, namely that there is a giant hole in the case, where dust will undoubtedly enter the mini PC, and that the air being forced through the tower cooler isn't filtered, so dust and debris will eventually accumulate on the CPU cooler. In addition to the CPU cooler that sticks out of the case, DeepCool's prototype mini PC has a GPU module, which is a separate compartment entirely that connects to the CPU/motherboard module with a PCIe riser cable and slots in under the base module. The compartmentalization of components would likely help with cooling, but also serves to enhance the aesthetics of the mini PC somewhat. It's unclear if and when the prototype mini PC will launch, but it will likely have to compete with the likes of the Steam Machine if it does make it to the mass market. DeepCool also didn't give any indication of what sort of internals we could expect from this prototype, but given the standard cooler compatibility and full-length PCIe riser, it seems likely that the modular mini PC is hiding an ITX or microATX motherboard.

Rosewill today announced the FBM-Z Series, a new lineup of three microATX mini tower PC cases designed to simplify the building experience without compromising on style or performance. Each model ships with a pre-installed power supply and a tempered glass side panel, giving builders a strong, display-ready foundation from the moment they open the box. The FBM-Z Series is available now at Newegg and Amazon.

All three FBM-Z cases share a compact microATX/Mini-ITX compatible chassis constructed from durable steel, featuring a tempered glass left-side panel, integrated dust filters, a pre-installed 120 mm PWM rear fan, and front-mounted power supply placement to maximize interior clearance. Builders can support up to 170 mm CPU coolers and GPUs up to 340 mm, making each case ready for a wide range of modern components.