Silverstone Argon AR03 Review 2

Silverstone Argon AR03 Review

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From the Silverstone website:
Here at SilverStone Technology, we continue to pride ourselves in providing the highest standards in designing and manufacturing computer enclosures, power supplies, and accessories. Our pursuit for first class aesthetic appeal is relentless; our teams of devoted engineers are constantly searching for the most suitable technologies that meet end-users with different needs and make our products as technologically sound as they are beautiful.

When it comes to the PC-enthusiast space, Silverstone has earned a large following through their many exceptional products. The company's policy of perfect quality, outstanding design, and customer satisfaction has made them a top choice of enthusiasts the world over. This policy, paired with their outstanding cases, coolers, fans, power supplies, and more, also made them a world leader of PC hardware and accessories.

Silverstone can trace their success to many products; however, a few do stand out. The unique layout of the original Raven case, for example, made it a smash hit. Each version of the Temjin- and Sugo series of cases continues to offer top quality and exceptional design. Their Heligon HE01 CPU cooler I reviewed earlier also shows their desire to offer outstanding designs. Silverstone simply continues to deliver fantastic products to the ever-evolving PC market.

The cooler I will review today is the Silverstone Argon AR03: a single-fan tower cooler that comes with a slight twist while, on the surface, looking to be similar to what you may have seen before. Three version of this cooler are available: the Argon 01, Argon 02, and the one I have here today, the Argon AR03. Each one is made to handle different situations, but all of them make use of Heatpipe Direct Contact (HDC) technology. The Argon AR03 has six heatpipes that are arranged to maximize the contact area on a CPU with a large IHS, such as on Intel's LGA1366 and LGA2011 processors.

SOCKET SUPPORT:Intel: LGA775, LGA1150, LGA1155, LGA1156, LGA1366, LGA2011
AMD: AM2, AM2+, AM3, AM3+, FM1, FM2
HEATSINK:Material: Aluminum (Fins) & Copper (Heatpipes)
Dimensions: 140 mm x 50 mm x 159 mm (w/o Fan)
Heatpipes: Ø6 mm - 6pcs
Weight: 560 g (w/o Fan)
FANS:Model: AS1225H12
Dimensions: 120 mm x 120 mm x 25 mm
Fan Speed: 1000 - 2200 RPM (w/ PWM)
Fan Airflow: 37.2 - 81.4 CFM
Fan Noise: 16 - 33 dBA
FEATURES:Six Ø6 mm heatpipes
Anti-vibration fan mounts
Heatpipe Direct Contact (HDC) technology
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