Following in the wake of an earthquake that struck on April 3rd, TrendForce undertook an in-depth analysis of its effects on the DRAM industry, uncovering a sector that has shown remarkable resilience and faced minimal interruptions. Despite some damage and the necessity for inspections or disposal of wafers among suppliers, the facilities' strong earthquake preparedness of the facilities has kept the overall impact to a minimum.

Leading DRAM producers, including Micron, Nanya, PSMC, and Winbond had all returned to full operational status by April 8th. In particular, Micron's progression to cutting-edge processes—specifically the 1alpha and 1beta nm technologies—is anticipated to significantly alter the landscape of DRAM bit production. In contrast, other Taiwanese DRAM manufacturers are still working with 38 and 25 nm processes, contributing less to total output. TrendForce estimates that the earthquake's effect on DRAM production for the second quarter will be limited to a manageable 1%.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched multiple products for the discerning gamer on a budget. In hopes of fulfilling the needs of PC builders of all levels, XPG has delivered a new line of entry level Gold efficiency power supply units and ARGB PWM fans. With the new XPG CORE REACTOR II VE and XPG VENTO PWM fans, upgrading your system has never been easier.

CORE REACTOR II VE
While it is always a challenge to strike a balance between cost and performance, XPG always puts the needs of end users first. Although the CORE REACTOR II VE is being sold as a Value Edition product, the specs on this PSU are anything but cheap. Inspired by the design of the award winning CORE REACTOR II, through the use of XPG's exclusive PSU topology, this power supply still delivers performance that surpasses Intel ATX 3.1 standards. Between the Gold efficiency, DC-DC circuit design, and the dedicated 12V-2x6 connector, this power supply unit is perfect for your modern gaming needs. With 650 W, 750 W, and 850 W models available, XPG CORE REACTOR II VE is the perfect foundation for a current gen build.

The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.

Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched the latest generation of the XPG XENIA 15G gaming laptop to markets around the globe. Designed to be an all-around price to performance laptop for gamers, developers, and content creators, XPG has worked tirelessly to deliver a product that will meet all your needs without breaking the bank. With XENIA 15G (2024), no obstacle is too great.

Do Anything and Everything
XENIA 15G is the culmination of many years of gaming laptop development. In that time, countless hours of research and testing have gone in to produce a cost-effective laptop for the modern user. With a 14th Gen Intel Core i7-14700HX processor, up to an NVIDIA GeForce RTX 4070 series GPU, high-speed ADATA DDR5 DRAM, and a 15.6" FHD IPS 144 Hz display, you can play anything and do everything without sacrificing performance.

ADATA's XPG department has been working on a consolidated solution for wireless gaming peripherals—and the resultant MOJO Ecosystem has been revealed to attendees at CES 2024. It is advertised as the world's most advanced wireless system for gaming mice, keyboards and headsets. Ultra-Wideband (UWB) technology has been utilized—this avoids the classic cases of narrowband signals being interfered with or jammed entirely. XPG demoed a single dongle solution alongside a lightweight MOJO Wireless Mouse (8000 Hz polling rate, with low latency), MOJO Wireless Headset and what we presume to be a MOJO Wireless TKL gaming keyboard.

XPG has devised a patented positional tracking algorithm that they reckon allows for easy setups and real time effect updates in 3D space. Their detection system is said to allow a greater number of adaptive lighting effects based on player movement. The XPG MOJO Wireless Headset is capable of controlling in-game fields of view (FOV) via tracking of head orientation, it also boasts a 5 ms response time.

ADATA has showcased a rather interesting XPG HYBRID COOLER at CES 2024 which actually integrates an AIO solution into the size of your standard air cooler, packing pump, loop, and a radiator into a single unit. The new cooler promises to be smaller and lighter than a standard AIO cooler but more efficient than an air cooler.

The new HYBRID COOLER is a patented dual-fan CPU cooler that can cool CPUs with TDP of up to 280 W. It will support both standard as well as Intel Xeon and AMD Ryzen Threadripper PRO sockets, and uses two high-performance 120 mm VENTO PRO PWM fans by Nidec. The entire unit is slightly taller than a 120 mm fan and looks pretty neat, but unfortunately, it is still just a concept and ADATA did not have it running inside a system. Hopefully, we'll see it officially launched soon and to see how well it compares to standard AIOs and standard air coolers.

ADATA Industrial, the world's leading brand for industrial-grade embedded storage, officially released today its SATA 31D series of industrial-grade solid-state drives including 2.5-inch ISSS31D, M.2 2280 IM2S31D8, and M.2 2242 IM2S31D4, designed for retail terminals and embedded systems.

The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC. The 31D series also offers a variety of ultra-thin and compact mainstream specifications such as SATA 2.5-inch, M.2 2280, M.2 2242, and various capacity options from 128 GB to 2 TB. 112-layer 3D NAND (BiCS5) 31D series SSDs all support thermal throttling technology, which reduces SSD transmission performance in stages to effectively mitigate the risk of data damage due to overheating. Furthermore, a LDPC ECC error correction mechanism and End-to-End Data Protection technology ensure reliable data transfer and improve data integrity. The 31D series is eminently suitable for POS systems, information kiosks, digital signage, and embedded equipment.

ADATA Technology, the world's leading memory brand, has launched its latest SD810 external solid state drive, featuring triple IP68 waterproof, dustproof, and MIL-STD shockproof protection. The drive is equipped with a USB 3.2 Gen 2 x2 transmission interface with a read/write speed of up to 2000 MB/s and adopts the mainstream Type-C interface. In addition to supporting the latest series of iPhone 15 smartphones, it is also perfect for photographers or video creators who work outdoors on a regular basis. The SD810 external SSD delivers fast transfer and backup of large audio and video files while guarding against accidents and allaying the challenges of harsh working environments to perfectly protect your precious files.

The SD810 external SSD supports the USB 3.2 Gen 2 x2 high-speed transmission interface with read/write speeds up to 2000 MB/s. In order to prevent the high temperatures generated by high-speed transfer from affecting performance and stability, the body of the SD810 is constructed from aluminium alloy and its unique structure improves heat dissipation to maintain stable transfer performance even during continuous operation. Users can also edit and access large files directly on the SD810, increasing work efficiency. In addition, the SD810's elegant aluminium body is smaller than a credit card, making it lightweight, space-saving, and very convenient to carry whether you are working or traveling.

TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.

The top three SSD shipment leaders of 2022 were Kingston, ADATA, and Lexar, with Kingston and ADATA maintaining solid advantages and experiencing growth in market share over 2021. Lexar's growth was attributed to an aggressive push for revenue in anticipation of going public. Kimtigo, in 2022, made significant strides in expanding into industrial control and OEM markets, which in turn boosted its shipment volume and market share. Netac maintained its competitive edge in the SSD market alongside securing several government orders in the enterprise SSD sector, keeping its market share and ranking consistent with the previous year.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts, today launched the XPG INVADER X Mid-Tower chassis to markets around the globe. Among the many cases from XPG, this model, more than any other to date, focuses on the aesthetic side of PC building. With panoramic viewing in mind, this chassis offers numerous features that make it easier to build a system that you'll feel compelled to show off. INVADER X is not a case you hide away under your desk rarely to be seen. In fact, it might be more appropriate to call this chassis a "showcase."

XPG's Exoskeleton design language has always focused on maximizing function without sacrificing form. INVADER X stays true to this calling, delivering a case that allows the form of your system to shine from any angle. With the frameless 3 mm tempered glass front and side panels, you can appreciate your system in all its RGB glory from any angle. Think of this case as an aquarium for your PC. With the highly convenient and easy-to-clean magnetic dust filters, maintaining the beauty of your system is never a problem. With INVADER X, you're not just building a machine, you're building a gaming ecosystem.

Consumer demand for transferring large high-quality files has increased significantly due to trends in AI computing. In compliance with EU regulations, USB4 is set to become the transmission standard for a new generation of devices. Quick and convenient file transfer between various devices has undoubtedly focused consumers' attention and the time for a new generation USB4 interface to unify market specifications has arrived. ADATA, the world's leading memory brand, has launched its first USB4 SE920 external SSD, which supports Thunderbolt 3 & 4 and is backward compatible with USB 3.2 and USB 2.0. Performance can reach up to 3,800 MB/s per second. In addition, it is equipped with a mainstream Type-C interface, making it easy to transfer large multimedia files across devices or quickly export videos shot on mobile phones. The SE920 external SSD features a patented spring-loaded chassis and built-in fan to provide consumers with the ultimate in high-speed performance.

USB4 supports transmission speeds up to 40 Gbps but high speeds inevitably generate high temperatures which can became a problematic issue for users. The SE920 USB4 external SSD adopts a proprietary patented active dissipation design and a built-in micro fan. Push on the telescoping casing to activate the fan and extends the chassis to increase interior space for air circulation and quickly discharge heat. Compared with fanless products with the same specifications, this patented mechanism can significantly reduce temperatures by 10% and maintain stable data transmission. Press the casing again to retract the chassis. When retracted, the SE920 is lightweight and easy to carry. This unique and ingenious design makesthe SE920 USB4 external SSD an amazing addition to anyone's everyday carry kit.

TrendForce reports that consumer appetite for electronic products took a hit from high inflation, with global DRAM module sales in 2022 reaching US$17.3 billion—a 4.6% YoY decline. Revenue performance varied significantly among module makers due to the different domains they supply.

TrendForce's data indicated that the top five memory suppliers in 2022 accounted for 90% of total sales, with the top ten collectively capturing 96% of global market revenue. Kingston maintained its dominant market share of 78%. Even with a slight revenue dip, it held steadfast to its position as the global leader. Despite poor end-market demand, Kingston's robust brand scale, along with its comprehensive product supply chain, limited its revenue decline to a modest 5.3%, keeping it firmly at the top of market share rankings.

ADATA, the world's leading brand for memory modules and flash memory and Intel recommended partner, in conjunction with its e-sports brand XPG (Xtreme Performance Gear), announces that XPG's complete range of DDR5 memory modules and ADATA Gen 5 SSDs fully support the latest Intel Core processor (14th gen) platform. The recent launch of this latest 14th Gen desktop processor platform emphasized its placing as the fastest processor in the world. Not only does this processor multi-task gaming and heavy workloads, but it also delivers amazing across-the-board performance, in line with the brand appeal fostered by ADATA and XPG. Together, we are committed to providing e-sports enthusiasts and creators with the fastest and most reliable experience available.

XPG DDR5 memory and ADATA PCIe 5.0 SSDs fully support Intel's latest desktop platform
ADATA has partnered with Intel and the world's foremost motherboard brands to conduct compatibility testing on XPG DDR5 memory modules and ADATA PCIe 5.0 SSDs in preparation for Intel Core processors (14th gen). Although the most common clock speed in the DDR5 market is currently 5600MT/s, XPG LANCER DDR5 memory modules successfully achieved an ultra-high clock speed of 8,000MT/s during testing and also support Intel XMP Ready to successfully overclock from 8,400MT/s to 9,900MT/s. The ADATA LEGEND 970 PCIe 5.0 SSD was tested at up to an ultra-high 10,000 MB/s sequential read and write speed with 4K random write speed reaching up to 1,400K, delivering a smooth and ultra-efficient desktop experience to gamers and creators alike.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched the XPG BATTLECRUISER II Super Mid-Tower chassis to markets around the globe. Building upon the success of the first generation premium XPG chassis, this E-ATX case features a long list of improvements based on feedback from the community, social listening from multiple platforms, media review recommendations, and key upcoming trends in both chassis design and cooling offerings and improvements.

XPG BATTLECRUISER II prioritizes convenience in the building and maintenance process, delivering an improved PCDIY experience. In addition to the 4 glass panels, there are 3 easy-to-clean magnetic dust filters, an adjustable GPU holder, and an improved Smart Cable Management design. It's everything you loved about the original award-winning XPG BATTLECRUISER with an updated touch. For more demanding builders, there's even a higher end version that comes paired with XPG PRIME BOX, for unlimited lighting customization options and thermal design control via XPG PRIME ecosystem management software.

ADATA Technology Co., Ltd., the world's leading memory brand, announced a theme of "Dazzling Tomorrow" for its annual creator event " You Are a Rising Star," held from today until October 13th. Use creative techniques such as graphic design, 3D rendering, and video to weave your own moving story. Share your pieces publically on Instagram and you will have an opportunity to win excellent prizes valued at more than USD$5,700.

With the generational change of processors and chipsets, DDR5 memory entering the mainstream, the rapid rise of Gen 4 SSDs and a migration to the Gen 5 era, coupled with the rise of generative AI tools, creator software and hardware must also improve in leaps and bounds. ADATA's online creator contest officially enters its fourth year and continues to provide a platform for talent in the fields of "graphic design," "video creation," "animation," and "photography" to unleash their creativity. This year, we continue our commitment to the spirit of "Build to Create" to produce better solutions for content creators, including major international award winning high-end and comprehensive products such as the LEGEND 970 Gen 5 SSD, ACE series memory module, SE920 USB4 external SSD, and other devices to inspire creativity.

XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.

By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.

As processors and chipsets move into a new generation, many motherboard manufacturers have launched latest-generation motherboards that have allowed the consumer market to embrace a new generation of PCIe 5.0 Solid-State Drives (SSD). ADATA Technology Co., Ltd., the world's leading memory brand, today launched its LEGEND 970 SSD. The LEGEND 970 can reach maximum sequential read/write speeds of 10,000/10,000 MB per second. Its most unique feature is a double-layer aluminium alloy heatsink with built-in micro-fan and surface crystallization that forms a patented active air-cooling system. The surface crystallization improves thermal conductivity, significantly reducing temperatures by 10% compared with fanless heatsinks to maintain stable performance during extended high-speed operation. The LEGEND 970's R&D, design, and superior cooling mechanism will be the benchmark of a new generation of storage products and it is expected to become the most influential PCIe Gen 5 storage solution in the consumer market.

ADATA ushers in a new era with its patented heat dissipation solution! From market consensus, it has become commonly accepted that active cooling is required for timely heat dissipation during high-speed PCIe 5.0 data transmission to ensure high temperatures do not affect reading and writing or slow down the system. The LEGEND 970 adopts a double-layer extruded aluminium heatsink design which features dense air ducts to divert hot and cold air. When heat is conducted upward, the rotation of the built-in micro fan circulates the confluence of hot and cold air and quickly expels exhaust heat from both ends of the extruded aluminium fins. At the same time, the LEGEND 970 increases heat dissipation through the addition of "surface crystallization " on the aluminium heatsink surface, increasing overall air contact area and maximizing the heat dissipation efficiency of its air cooling system. This unique "active heat dissipation" design significantly reduces temperatures by 10% compared to fanless heatsinks. More importantly, it can withstand high temperature stress tests and maintain stable performance even after long-term high-speed operation.

In keeping with Framework's philosophy, the Framework Laptop 16 has socketed memory and storage, making it easy for you to choose what you need on day one and upgrade to more any time later. Our pre-built configurations have set combinations of memory and storage, while on DIY Edition, you can choose any of the modules we offer in the Marketplace or bring your own if you prefer. We've taken both memory and storage to the next level on Framework Laptop 16. For memory, we've created new semi-custom Framework-branded DDR5-5600 modules. For storage, we have two M.2 slots, as well as the ability to add two more in the Expansion Bay for colossal storage capacity.

One core challenge we aimed to solve for memory on the Framework Laptop 16 was being able to offer the same modules for pre-built systems, DIY Edition, and the Framework Marketplace. Historically, we needed to source separate "OEM" modules from Samsung, SK Hynix, and Micron for use in our factory, and "Retail" modules from Crucial to offer in DIY Edition and the Marketplace. Instead, we worked with memory maker ADATA to create custom-label modules that we can use across all areas. Currently, we're leveraging SK Hynix DDR5-5600 memory chips for these modules, but may use other chips that meet the performance bar in the future as well.

ADATA and XPG, its gamer focused sub-brand, unveiled a plethora of memory and storage products at the 2023 Computex. We begin with PC memory, and we see the company showing off its upcoming models of the XPG DDR5 memory targeting enthusiasts. These include the XPG Caster RGB DDR5, which is capable of DDR5-9000, the XPG Lancer RGB ROG edition, capable of DDR5-7200, and the company's overclocking-capable DDR5-6400 R-DIMM targeting Xeon W workstations. The company also showed us "Project NeonStorm." This is an innovative new SSD cooling system that uses a self-contained liquid cooler.

The way this liquid cooler works is that a high conductivity heat spreader transfers heat to a chamber containing a coolant fluid. This coolant heats up an aluminium alloy tube via convection. The inner wall of this tube serves as an airflow channel for a 20 mm fan. ADATA claims that this solution offers "over 20% better heat dissipation compared to SSDs without water cooling." This is also one of the very first SSDs we've seen that utilize Silicon Motion SM2508 PCIe Gen 5 NVMe controller. ADATA claims sequential reads of up to 14 GB/s, with up to 12 GB/s sequential writes. The drive comes in capacity-based models of up to 8 TB (could include 2 TB, 4 TB, and 8 TB). ADATA also showed off the Legend 970 PCIe Gen 5 NVMe SSD that uses a Phison E26-series controller, and comes in capacities of 1 TB and 2 TB. This drive belts out up to 10 GB/s reads, with up to 10 GB/s writes.

ADATA Technology Co., Ltd., the world's leading memory brand, is committed to exploring breakthroughs that lead to extreme performance. PCIe Gen 5 SSDs are extremely fast but this powerful performance generates a corresponding degree of heat. In order to enhance stability and prolong product lifespan as well as maintain optimal speeds, innovative cooling solutions are a must for these latest-generation SSDs. During Computex 2023, the company will announce the launch of a number of patented SSD cooling solutions, not only speeding past the competition but also taking the lead in heat dissipation. Project NeonStorm Gen 5 solid-state drive (SSD) is the first in the industry to introduce a liquid and fan-cooled heat dissipation design on an M.2 SSD.

It uses coolant to absorb and then dual fans to dissipate heat, creating a perfect convection ecosystem. The LEGEND 970 Gen 5 SSD adopts a dual-layer aluminium alloy heatsink and fan to create active air cooling and a surface crystallization coating to improve thermal conductivity. The SE920 USB4 external SSD has a built-in micro fan to quickly discharge heat which is activated by extending the retractable casing. The structural R&D and excellent heat-dissipating characteristics of these designs are expected to become the most influential benchmark for extreme storage in the consumer market.

ADATA, the world's leading memory module and flash memory brand, in association with its subsidiary gaming performance brand, XPG, will take part in the world's largest computer trade show in Taipei from May 30 to June 2, 2023- Computex Taipei. As an industry leader, ADATA continues to implement the company's brand philosophy of "Innovating the Future" through its businesses. In addition to providing new technological products and solutions, ADATA is also committed to promoting the sustainable development of corporations in order to lead the future.

To realize this year's theme of "The Xtreme Future Leader - Infinite Innovation," ADATA has leveraged emerging technologies to launch new products that are sustainable and extraordinarily innovative including the most powerful Gen 5 SSD, industry-leading CXL (Compute Express Link) memory module, CAMM (Compression Attached Memory Module), XPG titanium power supply (XPG FUSION 1600 W), and professional industrial solutions. Be sure to visit Computex to experience a full range of new products!

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced a winning trifecta of 2023 Red Dot Design Awards in the Product Design category. The three award-winning products include the XPG PCIe Gen 5 SSD, XPG LANCER DDR5 Memory Series and VALOR AIR MERA EDITION.

The XPG PCIe Gen 5 SSD supports the latest Intel PCIe 5.0 high-speed bus, allowing for sequential read and write speeds of up to 12,000 MB/s. In order to achieve a balance between efficient heat dissipation and product volume, the XPG PCIe Gen 5 SSD is the first-of-its-kind to introduce a carbon surface crystallization process in heatsink production. A built-in micro-fan and convective heatsink design effectively and quickly dissipate copious amounts of thermal energy. According to real-world test data, this combination can lower SSD controller temperature by approximately 26%. In addition, the relatively thin XPG PCIe Gen 5 SSD can be installed in the M.2 expansion slot of the PS5. In the interest of global environmental conservation, the surfacing technique of the XPG PCIe Gen 5 SSD adopts a new NIL (Nano Imprinting Lithography) manufacturing process. This eliminates a number of energy-wasting practices and does not generate a large amount of waste water, which is sustainable for the environment and protects the earth.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced its most powerful laptop to date, the XENIA 15G Gaming Laptop. This impressive laptop was designed for gamers and tech enthusiasts seeking the perfect balance between performance and value. XPG XENIA 15G comes with a 13th Gen Intel Core i7-13700H processor, up to a GeForce RTX 4070 laptop GPU, coupled with a combination of hand-picked ADATA DDR5 memory and a PCIe Gen 4 LEGEND SSD, to deliver extreme gaming experiences.

XENIA 15G takes advantage of the latest generation improvements in components on the market. At its foundation, it features a 13th Gen Intel Core i7-13700H processor with 14 cores (6 performance cores boosting up to 5 GHz, and 8 efficient cores for power saving). On the Graphics front, XENIA 15G sports an NVIDIA GeForce RTX 40-series laptop GPU based on NVIDIA Ada Lovelace architecture, a leap in computing performance with AI-powered DLSS 3, so you can enjoy higher framerates even in lifelike virtual worlds with demanding real-time ray tracing requirements.

ADATA reaffirms its commitment to a sustainable environment and reducing the carbon footprint of its products through the launch of the company's first line of green storage offerings. The HC300 ECO external hard drive (HDD) and UC310 ECO USB flash drive (UFD) represent a positive step towards renewable electronic products by featuring enclosures that consist of recycled plastic and packaged in materials certified by the FSC (Forest Stewardship Council).

The ADATA HC300 ECO and UC310 ECO are forerunners in a series of ADATA products focused on ESG concepts. The casings of these devices are made of PCR (Post-Consumer Recycled) materials, such as 5-gallon water jugs. The use of PCR materials in HC300 ECO can effectively reduce carbon emissions by 48%. Typical post-consumer materials would normally be discarded as waste having completed its consumer lifecycle. These materials are also sourced from a single location, further reducing the product's carbon footprint.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced the global release of the newest iteration of their Platinum certified, modular power supply series, XPG CYBERCORE II. Offering two models in 1000 W and 1300 W respectively, this power supply family caters to the needs of power hungry DIY enthusiasts, performance focused gamers, and ATX based workstations equipped with the latest high-end GPUs. Both versions are ATX 3.0 compliant with a PCIe 5.0 12VHPWR (12+4 Pin) connector, while still sporting a thermal solution designed in collaboration with Nidec. This series offers some of the coolest and quietest next-gen ready PSU performance currently on the market.

The XPG CYBERCORE ll Platinum power supply series fulfills all stringent Intel ATX 3.0 requirements and offers quick and convenient fully modular cable management, specifically designed for high-end graphics cards and systems with large power consumption needs. As such, it includes a 12VHPWR (12+4 Pin) connector and cable right out of the box for PCIe 5.0 applications, offering reliability and compatibility with the latest and upcoming components.