Hello Drivers. Here we are. Taxi Life was released about two weeks ago. First of all, we'd like to thank you for all your support and feedback to improve the game. Reading your feedback, your kind messages and your encouragement has given us a lot of fuel for this first week. We are glad to read that many of you are enjoying driving in Barcelona! Now, let's get straight to the point. We are aware that you're interested in what is going on next in Taxi Life. And in this post, we want to share with you how our first week was for the team, and what's coming in the future of Taxi Life.

Driving Wheel
The main feedback we've received is that there aren't enough steering wheels compatible with the game. During the development of Taxi Life we worked with the driving wheels that were available for us. There are a lot of models out there, and it takes a lot of time to make every single driving wheel compatible with the game. It's not an excuse, but this was our situation. We really want to expand this list, and improve some actual driving wheels. We have a step-by-step plan that we are polishing right now and should let you know in more detail soon how it will look. In parallel we need to fix other issues you're already experiencing in-game.

Sony is preparing to launch its next-generation PlayStation 5 Pro console in the Fall of 2024, right around the holidays. We previously covered a few graphics details about the console. However, today, we get more details about the CPU and the overall system, thanks to the exclusive information from Insider Gaming. Starting off, the sources indicate that PS5 Pro system memory will get a 28% bump in bandwidth, where the standard PS5 console had 448 GB/s, and the upgraded PS5 Pro will get 576 GB/s. Apparently, the memory system is more efficient, likely coming from an upgrade in memory from the GDDR6 SDRAM of the regular PS5. The next upgrade is the CPU, which has special modes for the main processor. The CPU uArch is likely the same, with clocks pushed to 3.85 GHz, resulting in a 10% frequency increase.

However, this is only achieved in the "High CPU Frequency Mode," which steals the SoC's power from the GPU and downclocks it slightly to allocate more power to the CPU in highly CPU-intense settings. The GPU we discussed here is an RDNA 3 IP with up to 45% faster graphics rendering. The ray tracing performance can be up to four times higher than the regular PS5, while the entire GPU delivers 33.5 TeraFLOPS of FP32 single-precision computing. This comes from 30 WGP running BVH8 shaders vs the 18 WGPs running BVH4 shaders on the regular PS5. There are PSSR upscalers present, and the GPU can output 8K resolution, which will come with future software updates. Last but not least, the AI front also has a custom AI accelerator capable of 300 8-bit INT8 TOPS and 67 16-bit FP16 TeraFLOPS. Audio codecs are getting some love, as well, with ACV running up to 35% faster.

Artificial intelligence isn't just driving headlines and stock valuations. It's also "pushing the boundaries of silicon technology, packaging technology, the construction of silicon, and the construction of racks and data centers," says Intel's Bob Brennan. "There is an insatiable demand," Brennan adds. Which is great timing since his job is to help satisfy that demand.

Brennan leads customer solutions engineering for Intel Foundry, which aims to make it as easy and fast as possible for the world's fabless chipmakers to fabricate and assemble their chips through Intel factories. "We are engaged from architecture to high-volume manufacturing—soup to nuts—and we present the customer with a complete solution," Brennan asserts.

Qualcomm Technologies, Inc. today announced the Snapdragon 8s Gen 3 Mobile Platform, delivering the most sought-after 8 series capabilities to more Android flagship smartphones, for extraordinary, premium experiences. Marquee features of the latest premium-tier platforms include support for powerful on-device generative AI features, an always-sensing ISP, hyper-realistic mobile gaming, breakthrough connectivity and lossless high-definition sound. The platform supports a broad array of AI models including popular large language models (LLM) such as Baichuan-7B, Llama 2, Gemini Nano and Zhipu ChatGLM.

"With capabilities including on-device generative AI and advanced photography features, Snapdragon 8s Gen 3 is designed to enhance user experiences, fostering creativity and productivity in their daily lives." said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "We're elated to introduce the latest addition to our premium Snapdragon 8-series, our most premium mobile offering, bringing a host of exceptional specially selected capabilities to more consumers."

Extropic, a pioneer in physics-based computing, this week emerged from stealth mode and announced the release of its Litepaper, which outlines the company's revolutionary approach to AI acceleration through thermodynamic computing. Founded in 2022 by Guillaume Verdon, Extropic has been developing novel chips and algorithms that leverage the natural properties of out-of-equilibrium thermodynamic systems to perform probabilistic computations for generative AI applications in a highly efficient manner. The Litepaper delves into Extropic's groundbreaking computational paradigm, which aims to address the limitations of current digital hardware in handling the complex probability distributions required for generative AI.

Today's algorithms spend around 25% of their time moving numbers around in memory, limiting the speedup achievable by accelerating specific operations. In contrast, Extropic's chips natively accelerate a broad class of probabilistic algorithms by running them physically as a rapid and energy-efficient, physics-based process in their entirety, unlocking a new regime of AI acceleration well beyond what was previously thought achievable. In coming out of stealth, the company has announced the fabrication of a superconducting prototype processor and developments surrounding room-temperature semiconductor-based devices for the broader market, with the goal of revolutionizing the field of AI acceleration and enabling new possibilities in generative AI.

Samsung Electronics is all set to discuss the future of AI, alongside Jensen Huang, at NVIDIA's upcoming GTC 2024 conference. South Korean insiders have leaked the company's intentions, only days before the event's March 18 kickoff time. Their recently unveiled 36 GB HBM3E 12H DRAM product is expected to be the main focus of official presentations—additionally, a new storage subscription service is marked down for a possible live introduction. An overall "Redefining AI Infrastructure" presentation could include—according to BusinessKorea—a planned launch of: "petabyte (PB)-level SSD solution, dubbed 'PBSSD,' along with a subscription service in the US market within the second quarter (of 2024) to address the era of ultra-high-capacity data."

A Samsung statement—likely sourced from leaked material—summarized this business model: "the subscription service will help reduce initial investment costs in storage infrastructure for our customers and cut down on maintenance expenses." Under agreed upon conditions, customers are not required to purchasing ultra-high-capacity SSD solutions outright: "enterprises using the service can flexibly utilize SSD storage without the need to build separate infrastructure, while simultaneously receiving various services from Samsung Electronics related to storage management, security, and upgrades." A special session—"The Value of Storage as a Service for AI/ML and Data Analysis"—is alleged to be on the company's GTC schedule.

An unusual memory configuration has been spotted on an HONOR MagicBook Pro 16 AI laptop—Golden Pig Upgrade (via Weibo) has shared a brief snippet of footage from a Task Manager session. It confirms that non-binary symmetrical LPDDR5(X) memory is now operating within portable Windows 11 devices, at least in China. Crucial 12 GB capacity DDR5 SODIMM products were uncovered a couple of days ago—at the time, tech enthusiasts wondered whether other options were due in the near future. Recent Geekbench Browser entries have unveiled several "HONOR DRA-XX" Intel Core Ultra-powered devices that sport 24 GB memory configurations.

Manufacturers have been deliberating over new 12 GB, 24 GB, and 48 GB standards for roughly two years—we witnessed the release of commercial desktop products last year. It has taken longer for OEM options to arrive, but HONOR seems to be pioneering a rollout within the slimline laptop segment. VideoCardz has analyzed Golden Pig Upgrade's short clip—they believe that the demoed MagicBook Pro 16 (dual-channel) has a soldered-on: "total capacity of 24 GB based on LPDDR5X technology. Instead of relying on SODIMM modules, this laptop has eight individual memory chips, each with a capacity of 3 GB, totaling 24 GB of LPDDR5X-6400 memory." Upcoming enthusiast-class portable systems—with quadruple SODIMM slot setups—could be fitted with maximum 48 GB capacities. The latest developments signal a pleasing breakaway from traditional laptop system memory limits of 16 and 32 GB.

Two years ago, Intel Corporation and the Italian Government initiated negotiations over the "enabling" of a new state-of-the-art back-end manufacturing facility—a potential investment of up to 4.5 billion euros was mentioned at the time. Italy's chipmaking fund was put together in order to attract several big semiconductor firms, but Team Blue appeared to be the primary target. This week, Minister Adolfo Urso confirmed to media outlets that Intel had: "given up or postponed its investments in France and Italy, compared with others that it plans in Germany." Intel has not commented on this announcement according to a Reuters report—a spokesperson declined to make a statement.

Italy's Business Minister stated that he will welcome a continuation of negotiations, if Intel leadership chooses to diversify its construction portfolio outside of Germany: "if it decides to complete those projects, we are still here." His nation is set to receive further investments, following a recent announcement from Silicon Box—the Singapore-headquartered advanced semiconductor packaging company has signed an up to €3.2 billion deal. Their new Italian facility will: "enable next generation applications in artificial intelligence (AI), high performance computing (HPC)," and other segments. Urso reckons that "there will be others in coming months." He also added that a ministry task force had conducted talks with unnamed Taiwanese groups.

Cerebras Systems, the pioneer in accelerating generative AI, and G42, the Abu Dhabi-based leading technology holding group, today announced the build of Condor Galaxy 3 (CG-3), the third cluster of their constellation of AI supercomputers, the Condor Galaxy. Featuring 64 of Cerebras' newly announced CS-3 systems - all powered by the industry's fastest AI chip, the Wafer-Scale Engine 3 (WSE-3) - Condor Galaxy 3 will deliver 8 exaFLOPs of AI with 58 million AI-optimized cores. The Cerebras and G42 strategic partnership already delivered 8 exaFLOPs of AI supercomputing performance via Condor Galaxy 1 and Condor Galaxy 2, each amongst the largest AI supercomputers in the world. Located in Dallas, Texas, Condor Galaxy 3 brings the current total of the Condor Galaxy network to 16 exaFLOPs.

"With Condor Galaxy 3, we continue to achieve our joint vision of transforming the worldwide inventory of AI compute through the development of the world's largest and fastest AI supercomputers," said Kiril Evtimov, Group CTO of G42. "The existing Condor Galaxy network has trained some of the leading open-source models in the industry, with tens of thousands of downloads. By doubling the capacity to 16exaFLOPs, we look forward to seeing the next wave of innovation Condor Galaxy supercomputers can enable." At the heart of Condor Galaxy 3 are 64 Cerebras CS-3 Systems. Each CS-3 is powered by the new 4 trillion transistor, 900,000 AI core WSE-3. Manufactured at TSMC at the 5-nanometer node, the WSE-3 delivers twice the performance at the same power and for the same price as the previous generation part. Purpose built for training the industry's largest AI models, WSE-3 delivers an astounding 125 petaflops of peak AI performance per chip.

ZOTAC Technology Limited, a global leader in innovative technology solutions, expands its product portfolio with the GPU Server Series. The first series of products in ZOTAC's Enterprise lineup offers organizations affordable and high-performance computing solutions for a wide range of demanding applications, from core-to-edge inferencing and data visualization to model training, HPC modeling, and simulation.

The ZOTAC series of GPU Servers comes in a diverse range of form factors and configurations, featuring both Tower Workstations and Rack Mount Servers, as well as both Intel and AMD processor configurations. With support for up to 10 GPUs, modular design for easier access to internal hardware, a high space-to-performance ratio, and industry-standard features like redundant power supplies and extensive cooling options, ZOTAC's enterprise solutions can ensure optimal performance and durability, even under sustained intense workloads.

Tenstorrent and MosChip Technologies announced today that they are partnering on design for Tenstorrent's cutting-edge RISC-V solutions. In selecting MosChip Technologies, Tenstorrent stands to strongly advance both its own and its customers' development of RISC-V solutions as they work together on Physical Design, DFT, Verification, and RTL Design services.

"MosChip Technologies is special in that they have unparalleled tape out expertise in design services, with more than 200 multi-million gate ASICs under their belt", said David Bennett, CCO of Tenstorrent. "Partnering with MosChip enables us to design the strongest RISC-V solution we can to serve ourselves, our partners, and our customers alike."

Director Hideaki Itsuno and Producer Yoshiaki Hirabayashi were on hand to explain some exciting announcements surrounding the release of their upcoming title, Dragon's Dogma 2. Players will be able to party up with as many as three AI-driven "Pawn" characters; the decisions the player makes throughout the game will impact the relationships between their own Arisen and other characters, as well as the interactions and dynamics between those AI characters.

How one tackles quest objectives and interactions with other characters is what drives these systems, and sometimes hinges on the player's ability to employ creative solutions to avoid physical altercations (think: bribery, counterfeiting objects, etc). In a world comprised of over 1000 unique characters, the player's choices will have a dramatic ripple effect on the interpersonal dynamics among them.

IBM applauds the EU Parliament's decision to adopt the EU AI Act, a significant milestone in establishing responsible AI regulation in the European Union. The EU AI Act provides a much-needed framework for ensuring transparency, accountability, and human oversight in developing and deploying AI technologies. While important work must be done to ensure the Act is successfully implemented, IBM believes the regulation will foster trust and confidence in AI systems while promoting innovation and competitiveness.

"I commend the EU for its leadership in passing comprehensive, smart AI legislation. The risk-based approach aligns with IBM's commitment to ethical AI practices and will contribute to building open and trustworthy AI ecosystems," said Christina Montgomery, Vice President and Chief Privacy & Trust Officer at IBM. "IBM stands ready to lend our technology and expertise - including our watsonx.governance product - to help our clients and other stakeholders comply with the EU AI Act and upcoming legislation worldwide so we can all unlock the incredible potential of responsible AI." For more information, visit watsonx.governance and ibm.com/consulting/ai-governance.

TrendForce highlights the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3. NVIDIA's upcoming B100 or H200 models will incorporate advanced HBM3e, signaling the next step in memory technology. The challenge, however, is the supply bottleneck caused by both CoWoS packaging constraints and the inherently long production cycle of HBM—extending the timeline from wafer initiation to the final product beyond two quarters.

The current HBM3 supply for NVIDIA's H100 solution is primarily met by SK hynix, leading to a supply shortfall in meeting burgeoning AI market demands. Samsung's entry into NVIDIA's supply chain with its 1Znm HBM3 products in late 2023, though initially minor, signifies its breakthrough in this segment.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

As the IT sector continues to seek answers for scaling data processing performance while simultaneously improving efficiency - in terms of performance and density per watt, per system, per rack, and per dollar of CapEx and OpEx - ScaleFlux is answering the call with innovative design choices in its SSD controllers. The SFX 5016 promises to set new standards both for performance and for power efficiency.

In addition to carrying forward the transparent compression feature that ScaleFlux first released in 2020 in upgraded in 2022 with the SFX 3016 computational storage drive controller, the new SFX 5016 SOC processor includes a number of design advances.

Qualcomm Snapdragon X Elite is about to make landfall in the ultraportable notebook segment, powering a new wave of Windows 11 devices powered by Arm, capable of running even legacy Windows applications. The Snapdragon X Elite SoC in particular has been designed to rival the Apple M3 chip powering the 2024 MacBook Air, and some of the "entry-level" variants of the 2023 MacBook Pros. These chips threaten the 15 W U-segment and even 28 W P-segment of x86-64 processors from Intel, such as the Core Ultra "Meteor Lake," and Ryzen 8040 "Hawk Point." Erdi Özüağ, prominent tech journalist from Türkiye, has access to a Qualcomm-reference notebook powered by the Snapdragon X Elite X1E80100 28 W SoC. He compared its performance to an off-the-shelf notebook powered by a 28 W Intel Core Ultra 7 155H "Meteor Lake" processor.

There are three tests that highlight the performance of the key components of the SoCs—CPU, iGPU, and NPU. A Microsoft Visual Studio code compile test sees the Snapdragon X Elite with its 12-core Oryon CPU finish the test in 37 seconds; compared to 54 seconds by the Core Ultra 7 155H with its 6P+8E+2LP CPU. In the 3DMark test, the Adreno 750 iGPU posts identical performance numbers to the Arc Graphics Xe-LPG of the 155H. Where the Snapdragon X Elite dominates the Intel chip is AI inferencing. The UL Procyon test sees the 45 TOPS NPU of the Snapdragon X Elite score 1720 points compared to 476 points by the 10 TOPS AI Boost NPU of the Core Ultra. The Intel machine is using OpenVINO, while the Snapdragon is using Qualcomm SNPE SDK for the test. Don't forget to check out the video review by Erdi Özüağ in the source link below.

Stability AI, the developers behind the popular Stable Diffusion generative AI model, have run some first-party performance benchmarks for Stable Diffusion 3 using popular data-center AI GPUs, including the NVIDIA H100 "Hopper" 80 GB, A100 "Ampere" 80 GB, and Intel's Gaudi2 96 GB accelerator. Unlike the H100, which is a super-scalar CUDA+Tensor core GPU; the Gaudi2 is purpose-built to accelerate generative AI and LLMs. Stability AI published its performance findings in a blog post, which reveals that the Intel Gaudi2 96 GB is posting a roughly 56% higher performance than the H100 80 GB.

With 2 nodes, 16 accelerators, and a constant batch size of 16 per accelerator (256 in all), the Intel Gaudi2 array is able to generate 927 images per second, compared to 595 images for the H100 array, and 381 images per second for the A100 array, keeping accelerator and node counts constant. Scaling things up a notch to 32 nodes, and 256 accelerators or a batch size of 16 per accelerator (total batch size of 4,096), the Gaudi2 array is posting 12,654 images per second; or 49.4 images per-second per-device; compared to 3,992 images per second or 15.6 images per-second per-device for the older-gen A100 "Ampere" array.

The ecosystem around NVIDIA's technologies has always been verdant—but this is absurd. After a stunning premiere at the World Economic Forum in Davos, immersive artworks based on Refit Anadol Studio's Large Nature Model will come to the U.S. for the first time at NVIDIA GTC. Offering a deep dive into the synergy between AI and the natural world, Anadol's multisensory work, "Large Nature Model: A Living Archive," will be situated prominently on the main concourse of the San Jose Convention Center, where the global AI event is taking place, from March 18-21.

Fueled by NVIDIA's advanced AI technology, including powerful DGX A100 stations and high-performance GPUs, the exhibit offers a captivating journey through our planet's ecosystems with stunning visuals, sounds and scents. These scenes are rendered in breathtaking clarity across screens with a total output of 12.5 million pixels, immersing attendees in an unprecedented digital portrayal of Earth's ecosystems. Refik Anadol, recognized by The Economist as "the artist of the moment," has emerged as a key figure in AI art. His work, notable for its use of data and machine learning, places him at the forefront of a generation pushing the boundaries between technology, interdisciplinary research and aesthetics. Anadol's influence reflects a wider movement in the art world towards embracing digital innovation, setting new precedents in how art is created and experienced.

SMIC, China's largest semiconductor manufacturer, is reportedly assembling a dedicated team to develop 3 nm semiconductor node technology, following reports of the company setting up 5 nm chip production for Huawei later this year. This move is part of SMIC's efforts to achieve independence from foreign companies and reduce its reliance on US technology. According to a report from Joongang, SMIC's initial goal is to commence operations of its 5 nm production line, which will mass-produce Huawei chipsets for various products, including AI silicon. However, SMIC is already looking beyond the 5 nm node. The company has assembled an internal research and development team to begin work on the next-generation 3 nm node.

The Chinese manufacturer is expected to accomplish this using existing DUV machinery, as ASML, the sole supplier of advanced EUV technology, is prohibited from providing equipment to Chinese companies due to US restrictions. It is reported that one of the biggest challenges facing SMIC is the potential for low yields and high production costs. The company is seeking substantial subsidies from the Chinese government to overcome these obstacles. Receiving government subsidies will be crucial for SMIC, especially considering that its 5 nm chips are expected to be up to 50 percent more expensive than TSMC's due to the use of older DUV equipment. The first 3 nm wafers from SMIC are not expected to roll out for several years, as the company will prioritize the commercialization of Huawei's 5 nm chips. This ambitious undertaking by SMIC represents a significant challenge for the company as it strives to reduce its dependence on foreign semiconductor technology and establish itself as an essential player in the global manufacturing industry.

During the 2024 SIEPR Economic Summit, NVIDIA CEO Jensen Huang acknowledged that the company's next-generation DGX systems, designed for AI and high-performance computing workloads, will require liquid cooling due to their immense power consumption. Huang also hinted that these new systems are set to be released in the near future. The revelation comes as no surprise, given the increasing power of GPUs needed to satisfy AI and machine learning applications. As computational requirements continue to grow, so does the need for more powerful hardware. However, with great power comes great heat generation, necessitating advanced cooling solutions to maintain optimal performance and system stability. Liquid cooling has long been a staple in high-end computing systems, offering superior thermal management compared to traditional air cooling methods.

By implementing liquid cooling in the upcoming DGX systems, NVIDIA aims to push the boundaries of performance while ensuring the hardware remains reliable and efficient. Although Huang did not provide a specific release date for the new DGX systems, his statement suggests that they are on the horizon. Whether the next generation of DGX systems uses the current NVIDIA H200 or the upcoming Blackwell B100 GPU as their primary accelerator, the performance will undoubtedly be delivered. As the AI and high-performance computing landscape continues to evolve, NVIDIA's position continues to strengthen, and liquid-cooled systems will certainly play a crucial role in shaping the future of these industries.

Lee Kang-Wook, Vice President of Research and Development at SK Hynix, has discussed the increased importance of advanced chip packaging with Bloomberg News. In an interview with the media company's business section, Lee referred to a tradition of prioritizing the design and fabrication of chips: "the first 50 years of the semiconductor industry has been about the front-end." He believes that the latter half of production processes will take precedence in the future: "...but the next 50 years is going to be all about the back-end." He outlined a "more than $1 billion" investment into South Korean facilities—his department is hoping to "improve the final steps" of chip manufacturing.

SK Hynix's Head of Packaging Development pioneered a novel method of packaging the third generation of high bandwidth technology (HBM2E)—that innovation secured NVIDIA as a high-profile and long term customer. Demand for Team Green's AI GPUs has boosted the significance of HBM technologies—Micron and Samsung are attempting to play catch up with new designs. South Korea's leading memory supplier is hoping to stay ahead in the next-gen HBM contest—supposedly 12-layer fifth generation samples have been submitted to NVIDIA for approval. SK Hynix's Vice President recently revealed that HBM production volumes for 2024 have sold out—currently company leadership is considering the next steps for market dominance in 2025. The majority of the firm's newly announced $1 billion budget will be spent on the advancement of MR-MUF and TSV technologies, according to their R&D chief.

Lately Tiny Corp. CEO—George Hotz—has used his company's social media account to publicly criticize AMD Radeon RX 7900 XTX GPU firmware. The creator of Tinybox, a pre-orderable $15,000 AI compute cluster, has not selected "traditional" hardware for his systems—it is possible that AMD's Instinct MI300X accelerator is quite difficult to acquire, especially for a young startup operation. The decision to utilize gaming-oriented XFX-branded RDNA 3.0 GPUs instead of purpose-built CDNA 3.0 platforms—for local model training and AI inference—is certainly a peculiar one. Hotz and his colleagues have encountered roadblocks in the development of their Tinybox system—recently, public attention was drawn to an "LLVM spilling bug." AMD President/CEO/Chair, Dr. Lisa Su, swiftly stepped in and promised a "good solution." Earlier in the week, Tiny Corp. reported satisfaction with a delivery of fixes—courtesy of Team Red's software engineering department. They also disclosed that they would be discussing matters with AMD directly, regarding the possibility of open-sourcing Radeon GPU MES firmware.

Subsequently, Hotz documented his interactions with Team Red representatives—he expressed 70% confidence in AMD approving open-sourcing certain bits of firmware in a week's time: "Call went pretty well. We are gating the commitment to 6x Radeon RX 7900 XTX on a public release of a roadmap to get the firmware open source. (and obviously the MLPerf training bug being fixed). We aren't open source purists, it doesn't matter to us if the HDCP stuff is open for example. But we need the scheduler and the memory hierarchy management to be open. This is what it takes to push the performance of neural networks. The Groq 500 T/s mixtral demo should be possible on a tinybox, but it requires god tier software and deep integration with the scheduler. We also advised that the build process for amdgpu-dkms should be more open. While the driver itself is open, we haven't found it easy to rebuild and install. Easy REPL cycle is a key driver for community open source. We want the firmware to be easy to rebuild and install also." Prior to this week's co-operations, Tiny Corp. hinted that it could move on from utilizing Radeon RX 7900 XTX, in favor of Intel Alchemist graphics hardware—if AMD's decision making does not favor them, Hotz & Co. could pivot to builds including Acer Predator BiFrost Arc A770 16 GB OC cards.

2024 will be the year generative AI gets personal, the CEOs of NVIDIA and HP said today in a fireside chat, unveiling new laptops that can build, test and run large language models. "This is a renaissance of the personal computer," said NVIDIA founder and CEO Jensen Huang at HP Amplify, a gathering in Las Vegas of about 1,500 resellers and distributors. "The work of creators, designers and data scientists is going to be revolutionized by these new workstations."

Greater Speed and Security
"AI is the biggest thing to come to the PC in decades," said HP's Enrique Lores, in the runup to the announcement of what his company billed as "the industry's largest portfolio of AI PCs and workstations." Compared to running their AI work in the cloud, the new systems will provide increased speed and security while reducing costs and energy, Lores said in a keynote at the event. New HP ZBooks provide a portfolio of mobile AI workstations powered by a full range of NVIDIA RTX Ada Generation GPUs. Entry-level systems with the NVIDIA RTX 500 Ada Generation Laptop GPU let users run generative AI apps and tools wherever they go. High-end models pack the RTX 5000 to deliver up to 682 TOPS, so they can create and run LLMs locally, using retrieval-augmented generation (RAG) to connect to their content for results that are both personalized and private.

NVIDIA is offering a new professional certification in generative AI to enable developers to establish technical credibility in this important domain. Generative AI is revolutionizing industries worldwide, yet there's a critical skills gap and need to uplevel employees to more fully harness the technology. Available for the first time from NVIDIA, this new professional certification enables developers, career professionals, and others to validate and showcase their generative AI skills and expertise. Our new professional certification program introduces two associate-level generative AI certifications, focusing on proficiency in large language models and multimodal workflow skills.

"Generative AI has moved to center stage as governments, industries and organizations everywhere look to harness its transformative capabilities," NVIDIA founder and CEO Jensen Huang recently said. The certification will become available starting at GTC, where in-person attendees can also access recommended training to prepare for a certification exam. "Organizations in every industry need to increase their expertise in this transformative technology," said Greg Estes, VP of developer programs at NVIDIA. "Our goals are to assist in upskilling workforces, sharpen the skills of qualified professionals, and enable individuals to demonstrate their proficiency in order to gain a competitive advantage in the job market."