The Professional Gamers League (PGL) showcased its newly upgraded tournament rig specification prior to the kick-off of their (still ongoing) CS2 Major Copenhagen 2024 esports event. As reported, over a week ago, competitors have been treated to modern systems decked out with AMD's popular gaming-oriented Ryzen 7 7800X3D CPU and NVIDIA GeForce RTX 4080 graphics cards, while BenQ's ZOWIE XL2566K 24.5" 360 Hz gaming monitor delivers a superfast visual feed. A hefty chunk of change has been spent on new hardware, but expensive cutting-edge tech can falter. Virtus.pro team member—Jame—experienced a major software crash during a match against rival group, G2.

PCGamesN noted that this frustrating incident ended the affected team's chance to grab a substantial cash reward. Their report put a spotlight on this unfortunate moment: "in the second round of a best of three, Virtus Pro were a few rounds away from qualifying for the playoffs, only for their aspirations to be squashed through no fault of their own...Jame experiences a graphics card driver crash that irrecoverably steers the round in G2's favor, culminating in Virtus Pro losing the match 11-13. Virtus Pro would then go on to lose the subsequent tie-break match as the round was not replayed. In effect, the graphics card driver crash partly cost the team their chance at winning an eventual $1.25 million prize pool." PGL revealed, via a social media post, that officials are doing some detective work: "we wish to clarify the situation involving Jame during the second map, Inferno, in the series against G2. A technical malfunction occurred due to an NVIDIA driver crash, resulting in a game crash. We are continuing our investigation into the matter." The new tournament rigs were "meticulously optimized" and tested in the weeks leading up to CS2 Major Copenhagen 2024—it is believed that the driver crash was a random anomaly. PGL and NVIDIA are currently working on a way to "identify and fix the issue."

Introspect Technology, a JEDEC member and a leading manufacturer of test and measurement instruments, announced today that it has shipped the M5512 GDDR7 Memory Test System, the world's first commercial solution for testing JEDEC's newly minted JESD239 Graphics Double Data Rate (GDDR7) SGRAM specification. This category-creating solution enables graphics memory engineers, GPU design engineers, product engineers in both memory and GPU spaces, and system integrators to rapidly bring up new GDDR7 memory devices, debug protocol errors, characterize signal integrity, and perform detailed memory read/write functional stress testing without requiring any other tool.

The GDDR7 specification is the latest industry standard that is aimed at the creation of high-bandwidth and high-capacity memory implementations for graphics processing, artificial intelligence (AI), and AI-intensive networking. Featuring pulse-amplitude modulation (PAM) and an improved signal to noise ratio compared to other PAM4 standards used in networking, the GDDR7 PAM3 modulation technology achieves greater power-efficiency while significantly increasing data transmission bandwidth over constrained electrical channels.

Samsung debuted its Mach-1 generation of AI processors during a recent shareholder meeting—the South Korean megacorp anticipates an early 2025 launch window. Their application-specific integrated circuit (ASIC) design is expected to "excel in edge computing applications," with a focus on low power and efficiency-oriented operating environments. Naver Corporation was a key NVIDIA high-end AI customer in South Korea (and Japan), but the leading search platform firm and creator of HyperCLOVA X LLM (reportedly) deliberated on an adoption alternative hardware last October. The Korea Economic Daily believes that Naver's relationship with Samsung is set to grow, courtesy of a proposed $752 million investment: "the world's top memory chipmaker, will supply its next-generation Mach-1 artificial intelligence chips to Naver Corp. by the end of this year."

Reports from last December indicated that the two companies were deep into the process of co-designing power-efficient AI accelerators—Naver's main goal is to finalize a product that will offer eight times more energy efficiency than NVIDIA's H100 AI accelerator. Naver's alleged bulk order—of roughly 150,000 to 200,000 Samsung Mach-1 AI chips—appears to be a stopgap. Industry insiders reckon that Samsung's first-gen AI accelerator is much cheaper when compared to NVIDIA H100 GPU price points—a per-unit figure of $3756 is mentioned in the KED Global article. Samsung is speculated to be shopping its fledgling AI tech to Microsoft and Meta.

Qualcomm claimed that most Windows games will run (via emulation) on its upcoming series of ARM-based Snapdragon X Elite processors—during a "Windows on Snapdragon, a Platform Ready for your PC Games" presentation at the recently concluded GDC 2024 event. Issam Khalil (principal engineer) did not mention specific titles, but divulged that the Snapdragon Studios division has spent time working through "top games" on Steam. Qualcomm laptop-oriented Adreno GPU design is being hyped up as demonstrating an "80% performance uplift versus AMD's Radeon 780M iGPU," but the overall Snapdragon X Elite package is often compared to Apple's M3 chipsets (also ARM-based).

Reference laptops—running early Snapdragon X Elite silicon—have been distributed to favored partners. A semi-public showcase—recorded by Devin Arthur—revealed some promising gaming performance credentials on one of these devices. The self-proclaimed "Snapdragon Insider" was invited to the company's San Diego, California headquarters—Arthur happily reported that a red "23 W Snapdragon X Elite model" was demoing: "Baldur's Gate 3 running at 1080p hovering around 30 FPS, which is perfectly playable!" Specific visual settings were not listed in Arthur's substack article, or showcased during his brief video recording—but Qualcomm's claims about the Adreno GPU beating Team Red's best iGPU could be valid. Windows Central reckons that Control and Redout 2 have been demoed on Snapdragon X Elite devices.

Phoronix has taken a short break away from monitoring the latest goings-on at AMD's software department—the site's editor-in-chief, Michael Larabel, took a moment to investigate patch notes relating to Intel's Xe and i915 Linux kernel graphics drivers. Earlier today, he noticed that "two additional PCI IDs" have been added to Team Blue's DG2/Alchemist family. This discovery prompted further sleuthing—after: "some searching and turning up hits within the Intel Compute Runtime code, 0x56BE is for an Intel Arc Graphics A750E variant and 0x56BF is for an Intel Arc Graphics A580E."

The aforementioned GPU identification codes seem to exist in gray area—the patch notes do not reveal whether these new variants are destined for desktop or mobile platforms. VideoCardz cited a remark made by "Bionic_Squash"—the reputable leaker reckons that the: "IDs are linked to Intel's Arc Embedded series. This family is tailored for industrial, business, and commercial applications, ranging from edge systems to powering large interactive screens." It is highly likely that Intel is paving the way for embedded/low-power variants of its existing Arc A750 and A580 GPUs. Tom's Hardware proposes that Team Blue is clearing out its inventory of remaining Alchemist silicon ahead of a successive generation's rollout—Battlemage is a major priority in 2024.

SPARKLE unveiled its low-profile series around mid-January—this lineup included an Intel Arc A380 GENIE dual-fan/dual-slot model and an Arc A310 ECO (single-slot, single-fan config) card. Compact device expert/YouTuber, ETA Prime, has uploaded a fascinating video that covers a modification project that involved a hybridization of SPARKLE's latest low-profile graphics cards and a Minisforum MS-01 test system. SPARKLE has released various models based on Intel's "Alchemist" Arc A380 6 GB GPU, but their PCB design is shared across a range of cooling options. ETA Prime could not source an aftermarket lower-profile cooler for his SPARKLE A380 GENIE, so he resorted to cannibalizing the A310 ECO model for relevant parts.

The ECO's single-slot cooling solution was not well proportioned enough to make contact with the SPARKLE A380 GENIE's VRM, so ETA Prime had to "add an aftermarket heatsink." He sold the remaining unneeded pieces—A310 board and GENIE cooler—to a friend for $60. The resultant hybrid—the "world's first-ever single-slot Intel Arc A380"—was bunged into the SFF Minisforum MS-01 test system. Notable specs included the Intel Core i9-13900H CPU and 32 GB of DDR5-5200 RAM. ETA Prime utilized Acer's Predator BiFrost graphics card utility to "trick" in a stable 54 W power limit. 60-ish FPS performance results—with low-to-medium settings at 1080p across a selection of games—were promising, especially for a restrictive small form factor build. ETA Prime hopes that SPARKLE will launch a smaller A380 model in the future—alternatively a specialist firm could produce a nice aftermarket copper part.

Graphics card enthusiasts with a thing for earthy green hues, will likely appreciate Manli's latest products—its Gallardo graphics card range has expanded with two new models. The Asian and European market-focused manufacturer has already unleashed "refreshed" models that utilize NVIDIA's GeForce RTX 40-series SUPER GPUs, but the newest entries sport a revised signature green flagship "Gallardo" design. VideoCardz has pored over the small details—it turns out that Manli has produced a slimmer profile: "perhaps something that is not obvious is that Manli has introduced the RTX 4070 Ti SUPER Gallardo already. The new version marks a second revision, featuring an entirely different aesthetic compared to its predecessor. The most important change is that it no longer occupies a 3.5-slot space." Manli has evidently put together a "much slimmer 2-slot version" under a "M3604+N693" moniker.

The non-Ti model is likely coming out soon, but Manli has not yet announced official pricing or launch date details for their newly redesigned Gallardo Ada Lovelace cards—official product pages were created last week. Despite flagship status, VideoCardz notes that Manli has not implemented any factory overclocking—the Gallardo range is often associated with: "system integrators like Sycom for further customization." The spec sheet advertises integrated LED lighting with seven available color cycles, four 6 mm copper heat pipes with segmented heatsinks, and a metal backplate for reinforcement and protective purposes.

Intel is quietly working on second generation Arc GPUs—we have not heard much about Xe2 "Battlemage" since CES 2024. Back in January, Tom "TAP" Petersen—an Intel fellow and marketing guru—casually revealed during an interview conducted by PC World: "I'd say about 30% of our engineers are working on Battlemage, mostly on the software side because our hardware team is on the next thing (Celestial)...Battlemage has already has its first silicon in the labs which is very exciting and there's more good news coming which I can't talk about right now." Intel appears to be targeting a loose late 2024 launch window; Petersen stated that he would like to see second generation products arrive at retail before CES 2025's commencement. The SiSoftware Sandra database was updated around mid-March with two very intriguing new Intel GPU entries—test systems (built on an ASUS PRIME Z790-P WIFI mainboard) were spotted running graphics solutions "equipped with 20 Xe-Core (160 EU) and 24 Xe-Cores (160 EU)."

Michael/miktdt commented on the freshly discovered database entries: "some smaller versions are on Sisoft...I guess they are coming. Single-float GP Compute looks quite good for just 160 VE/192 VE. Doesn't tell much about the release though, I guess anything between Q4 2024 and Q2 2025 is a possibility." Both models seem to sport 11.6 GB VRAM capacities—likely 12 GB—and 8 MB of L2 cache. Wccftech has guesstimated potential 192-bit memory bandwidth for these speculative lower-level GPUs. Team Blue has a bit more tweaking to do—based on leaked figures—but time is on their side: "the performance per core for Alchemist currently sits an average of 16% faster than the alleged Battlemage GPU which isn't a big deal since driver-level optimizations and final silicon can give a huge boost when the retail products come out."

Vastarmor is a relatively young graphics card manufacturer and AMD board partner (since the RDNA 2 days)—their Alloy product range was updated with new Radeon RX 7800 XT and RX 7700 XT triple-fan "PRO" models last September. VideoCardz has discovered a new dual-fan "non-PRO" white variant—the Vastarmor RX 7700 XT Alloy White 12 GB. TPU's GPU database entry lists a release date of August 25—according to the VideoCardz report, Vastarmor has not settled on final pricing or an official launch date. The standard black (with small red accents) RX 7700 XT Alloy model did reach Chinese retailers last year—the pale variant is predicted to cost about the same, or demand a slight premium over the black version.

Specifications remain consistent across both—according to VideoCardz: "Vastarmor has verified that the card maintains a base clock of 1784 MHz, a game clock of 2276 MHz, and a boost clock that reaches up to 2600 MHz (an overclock of 2.2% for boost). Despite its compact size, measuring at 26.3 x 13.2 cm, the card demands three slots due to its thickness of 5.6 cm. Power-wise, it relies on standard 8-pin power connectors, installed in pairs." The factory-set overclocks are identical to the numbers designated to Vastarmor's RX 7700 XT Alloy PRO model, although their triple-fan design is slightly slimmer. The longer design accommodates a 90 mm fan, positioned between two 100 mm units.

NVIDIA completed its last round of GeForce NVIDIA RTX 40-series GPU refreshes at the very end of January—new evidence suggests that another wave is scheduled for imminent release. MEGAsizeGPU has acquired and shared a tabulated list of new Ada Lovelace GPU variants—the trusted leaker's post presents a timetable that was supposed to kick off within the second half of this month. First up is the GeForce RTX 4070 GPU, with a current designation of AD104-251—the leaked table suggests that a new variant, AD103-175-KX, is due very soon (or overdue). Wccftech pointed out that the new ID was previously linked to NVIDIA's GeForce RTX 4070 SUPER SKU. Moving into April, next up is the GeForce RTX 4060 Ti—jumping from the current AD106-351 die to a new unit; AD104-150-KX. The third adjustment (allegedly) affects the GeForce RTX 4060—going from AD107-400 to AD106-255, also timetabled for next month. MEGAsizeGPU reckons that Team Green will be swapping chips, but not rolling out broadly adjusted specifications—a best case scenario could include higher CUDA, RT, and Tensor core counts. According to VideoCardz, the new die designations have popped up in freshly released official driver notes—it is inferred that the variants are getting an "under the radar" launch treatment.

EMTEK products rarely pop up on TPU's news section, but the GPU database contains a smattering of the South Korean manufacturer's Ampere-based GeForce RTX graphics card. VideoCardz has discovered an updated MIRACLE X3 White model—EMTEK's latest release is a GeForce RTX 4070 SUPER 12 GB card. The triple-fan model seems to stick with NVIDIA's reference specifications—VideoCardz also noticed a physical similarity: "under the cooler shroud, the card boasts a non-standard U-shaped PCB, reminiscent of Team Green's Founders Edition. However, it remains uncertain whether EMTEK utilizes the same PCB as NVIDIA." The asking price—of ₩919,990—converts to around $680, when factoring in regional taxes. EMTEK's MIRACLE X3 cooling solution seems to be fairly robust—featuring four 6 mm heat pipes—so an adherence to stock clocks is a slight surprise. The company's GAMING PRO line includes a couple of factory overclocked options.

One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.

According to the news report from the technology-focused media DIGITIMES Asia, during his keynote at GTC on March 18, Huang underscored his company's partnerships with TSMC, as well as the supply chain in Taiwan. Speaking to the press later, Huang said Nvidia will have a very strong demand for CoWoS, the advanced packaging services TSMC offers.

Jensen Huang has been talking to media outlets following the conclusion of his keynote presentation at NVIDIA's GTC 2024 conference—an NBC TV "exclusive" interview with the Team Green boss has caused a stir in tech circles. Jim Cramer's long-running "Squawk on the Street" trade segment hosted Huang for just under five minutes—NBC's presenter labelled the latest edition of GTC the "Woodstock of AI." NVIDIA's leader reckoned that around $1 trillion of industry was in attendance at this year's event—folks turned up to witness the unveiling of "Blackwell" B200 and GB200 AI GPUs. In the interview, Huang estimated that his company had invested around $10 billion into the research and development of its latest architecture: "we had to invent some new technology to make it possible."

Industry watchdogs have seized on a major revelation—as disclosed during the televised NBC report—Huang revealed that his next-gen AI GPUs "will cost between $30,000 and $40,000 per unit." NVIDIA (and its rivals) are not known to publicly announce price ranges for AI and HPC chips—leaks from hardware partners and individuals within industry supply chains are the "usual" sources. An investment banking company has already delved into alleged Blackwell production costs—as shared by Tae Kim/firstadopter: "Raymond James estimates it will cost NVIDIA more than $6000 to make a B200 and they will price the GPU at a 50-60% premium to H100...(the bank) estimates it costs NVIDIA $3320 to make the H100, which is then sold to customers for $25,000 to $30,000." Huang's disclosure should be treated as an approximation, since his company (normally) deals with the supply of basic building blocks.

Chinese custom chassis specialist, Xikii, has opened pre-orders for a new FF04 model—this classy ￥3599 (~$500) box has been designed to match the aesthetic theme of ASUS ProArt graphics cards. 3DCenter.org was impressed with the company's premium-priced work, following a discovery by Western readers (on Reddit). The site's social media account expressed some appreciation—the Xikii FF04 chassis set is a "9.8 liter case built around a single GPU; ASUS ProArt RTX 4070 Ti. Even the contour of the case matches the curve of the GPU shroud."

Xikii's product page includes a bunch of slick marketing shots and a promo video—all showing off a sample unit. Redditors noticed that the first batch of FF04 cases has already sold out—the company anticipates a shipping out date somewhere within an April 15 to 30 window. VideoCardz has eyeballed all available data, and surmised that several "RTX 40 ProArt models (4080, 4070 and 4060 series)" are suitably proportioned to fit in Xikii's purpose-built chassis—these: "have the same dimensions of 300x120x50 mm. This may explain why this design made any sense, you can certainly fit more than one model into this case, just keep in mind that a suitable power supply is needed for higher-end models." Xikii will offer an "external split water-cooling adapter module" as an optional item in the near future—they predict a price of 180 yuan (~$25).

Thermaltake USA, the leading PC Case, Cooling, Power, and memory solutions, proudly announces the launch of twelve innovative models in the LCGS (Liquid Cooled Gaming System) Reactor series, available exclusively at Best Buy. This launch marks a significant milestone for Thermaltake, introducing the next generation of gaming PCs, meticulously designed with the newly unveiled The Tower 300 Micro Tower Chassis. These gaming powerhouses are equipped with the latest high-performance components, including the cutting-edge Intel Core 14th Gen i9/i7 processors, NVIDIA GeForce RTX 40 Super Series/4090 graphics cards, 32 GB of DDR5 5600 MT/s memory, and expansive 2 TB NVMe M.2 SSD storage.

Each system in the LCGS Reactor series boasts a 360 mm radiator liquid cooling solution, ensuring exceptional cooling performance and stability during intense gaming sessions. The addition of vibrant color options such as Snow, Black, Hydrangea Blue, and Turquoise adds a personalized touch to these systems, catering to gamers' and content creators' diverse tastes and styles. Tailored for the most demanding gamers and creative professionals, these pre-built gaming desktop PCs are assembled and rigorously tested by Thermaltake's skilled engineers in the USA, ensuring unparalleled build quality and reliability.

NVIDIA announced today that leading AI application developers across a wide range of industries are using NVIDIA digital human technologies to create lifelike avatars for commercial applications and dynamic game characters. The results are on display at GTC, the global AI conference held this week in San Jose, Calif., and can be seen in technology demonstrations from Hippocratic AI, Inworld AI, UneeQ and more.

NVIDIA Avatar Cloud Engine (ACE) for speech and animation, NVIDIA NeMo for language, and NVIDIA RTX for ray-traced rendering are the building blocks that enable developers to create digital humans capable of AI-powered natural language interactions, making conversations more realistic and engaging.

ASUS today announced its participation at the NVIDIA GTC global AI conference, where it will showcase its solutions at booth #730. On show will be the apex of ASUS GPU server innovation, ESC NM1-E1 and ESC NM2-E1, powered by the NVIDIA MGX modular reference architecture, accelerating AI supercomputing to new heights. To help meet the increasing demands for generative AI, ASUS uses the latest technologies from NVIDIA, including the B200 Tensor Core GPU, the GB200 Grace Blackwell Superchip, and H200 NVL, to help deliver optimized AI server solutions to boost AI adoption across a wide range of industries.

To better support enterprises in establishing their own generative AI environments, ASUS offers an extensive lineup of servers, from entry-level to high-end GPU server solutions, plus a comprehensive range of liquid-cooled rack solutions, to meet diverse workloads. Additionally, by leveraging its MLPerf expertise, the ASUS team is pursuing excellence by optimizing hardware and software for large-language-model (LLM) training and inferencing and seamlessly integrating total AI solutions to meet the demanding landscape of AI supercomputing.

NVIDIA today announced its next-generation AI supercomputer—the NVIDIA DGX SuperPOD powered by NVIDIA GB200 Grace Blackwell Superchips—for processing trillion-parameter models with constant uptime for superscale generative AI training and inference workloads.

Featuring a new, highly efficient, liquid-cooled rack-scale architecture, the new DGX SuperPOD is built with NVIDIA DGX GB200 systems and provides 11.5 exaflops of AI supercomputing at FP4 precision and 240 terabytes of fast memory—scaling to more with additional racks.

Powering a new era of computing, NVIDIA today announced that the NVIDIA Blackwell platform has arrived—enabling organizations everywhere to build and run real-time generative AI on trillion-parameter large language models at up to 25x less cost and energy consumption than its predecessor.

The Blackwell GPU architecture features six transformative technologies for accelerated computing, which will help unlock breakthroughs in data processing, engineering simulation, electronic design automation, computer-aided drug design, quantum computing and generative AI—all emerging industry opportunities for NVIDIA.

NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA's computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips. TSMC, the world's leading foundry, and Synopsys, the leader in silicon to systems design solutions, have integrated NVIDIA cuLitho with their software, manufacturing processes and systems to speed chip fabrication, and in the future support the latest-generation NVIDIA Blackwell architecture GPUs.

"Computational lithography is a cornerstone of chip manufacturing," said Jensen Huang, founder and CEO of NVIDIA. "Our work on cuLitho, in partnership with TSMC and Synopsys, applies accelerated computing and generative AI to open new frontiers for semiconductor scaling." NVIDIA also introduced new generative AI algorithms that enhance cuLitho, a library for GPU-accelerated computational lithography, dramatically improving the semiconductor manufacturing process over current CPU-based methods.

GIGABYTE Technology and Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise solutions, will showcase their solutions at the GIGABYTE booth #1224 at NVIDIA GTC, a global AI developer conference running through March 21. This event will offer GIGABYTE the chance to connect with its valued partners and customers, and together explore what the future in computing holds.

The GIGABYTE booth will focus on GIGABYTE's enterprise products that demonstrate AI training and inference delivered by versatile computing platforms based on NVIDIA solutions, as well as direct liquid cooling (DLC) for improved compute density and energy efficiency. Also not to be missed at the NVIDIA booth is the MGX Pavilion, which features a rack of GIGABYTE servers for the NVIDIA GH200 Grace Hopper Superchip architecture.

MemVerge, a leader in AI-first Big Memory Software, has joined forces with Micron to unveil a groundbreaking solution that leverages intelligent tiering of CXL memory, boosting the performance of large language models (LLMs) by offloading from GPU HBM to CXL memory. This innovative collaboration is being showcased in Micron booth #1030 at GTC, where attendees can witness firsthand the transformative impact of tiered memory on AI workloads.

Charles Fan, CEO and Co-founder of MemVerge, emphasized the critical importance of overcoming the bottleneck of HBM capacity. "Scaling LLM performance cost-effectively means keeping the GPUs fed with data," stated Fan. "Our demo at GTC demonstrates that pools of tiered memory not only drive performance higher but also maximize the utilization of precious GPU resources."

Sony is preparing to launch its next-generation PlayStation 5 Pro console in the Fall of 2024, right around the holidays. We previously covered a few graphics details about the console. However, today, we get more details about the CPU and the overall system, thanks to the exclusive information from Insider Gaming. Starting off, the sources indicate that PS5 Pro system memory will get a 28% bump in bandwidth, where the standard PS5 console had 448 GB/s, and the upgraded PS5 Pro will get 576 GB/s. Apparently, the memory system is more efficient, likely coming from an upgrade in memory from the GDDR6 SDRAM of the regular PS5. The next upgrade is the CPU, which has special modes for the main processor. The CPU uArch is likely the same, with clocks pushed to 3.85 GHz, resulting in a 10% frequency increase.

However, this is only achieved in the "High CPU Frequency Mode," which steals the SoC's power from the GPU and downclocks it slightly to allocate more power to the CPU in highly CPU-intense settings. The GPU we discussed here is an RDNA 3 IP with up to 45% faster graphics rendering. The ray tracing performance can be up to four times higher than the regular PS5, while the entire GPU delivers 33.5 TeraFLOPS of FP32 single-precision computing. This comes from 30 WGP running BVH8 shaders vs the 18 WGPs running BVH4 shaders on the regular PS5. There are PSSR upscalers present, and the GPU can output 8K resolution, which will come with future software updates. Last but not least, the AI front also has a custom AI accelerator capable of 300 8-bit INT8 TOPS and 67 16-bit FP16 TeraFLOPS. Audio codecs are getting some love, as well, with ACV running up to 35% faster.

NVIDIA's recent launch of a "new" entry-level gaming GPU has not set pulses racing—their return visit to Ampere City arrived in the form of custom GeForce RTX 3050 6 GB graphics cards. The absence of a reference model sometimes signals a low expectation, but Team Green's partners have pushed ahead with a surprisingly diverse portfolio of options. Early last month, Galax introduced a low-profile white design—the custom GeForce RTX 3050 6 GB card's slot-powered operation presents an ideal solution for super compact low-power footprint builds. ASUS is readying its own dual-fan low-profile models—as evidenced by official product pages. The listings do not reveal release dates or recommended price points for the reference-clocked GeForce RTX 3050 LP BRK 6 GB card, and its OC sibling. ASUS believes that both models offer "big productivity in a small package."

Low-profile card enthusiasts have warmly welcomed new-ish GeForce RTX 4060 GPU-based solutions—courtesy of ASUS and GIGABYTE, but reported $300+ MSRPs have likely put off budget-conscious buyers. A sub-$200 price point is a more palatable prospect, especially for system builders who are not all bothered about cutting-edge gaming performance. A DVI-D connector ensures legacy compatibility, alongside modern port standards: HDMI 2.1 and DP 1.4a. As mentioned before, ASUS has not publicly disclosed its pricing policy for the GeForce RTX 3050 LP BRK 6 GB card (and its OC variant)—the manufacturer's Dual and Dual OC models retail in a range of $170 - $180. Graphics card watchdogs reckon that the LP BRK designs will warrant a small premium over normal-sized products.

SK Hynix believes that it leads the industry with the development and production of High Bandwidth Memory (HBM) solutions, but rival memory manufacturers are working hard on equivalent fifth generation packages. NVIDIA was expected to select SK Hynix as the main supplier of HBM3E parts for utilization on H200 "Hopper" AI GPUs, but a surprise announcement was issued by Micron's press team last month. The American firm revealed that HBM3E volume production had commenced: ""(our) 24 GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024. This milestone positions Micron at the forefront of the industry, empowering artificial intelligence (AI) solutions with HBM3E's industry-leading performance and energy efficiency."

According to a Korea JoongAng Daily report, this boast has reportedly "shocked" the likes of SK Hynix and Samsung Electronics. They believe that Micron's: "announcement was a revolt from an underdog, as the US company barely held 10 percent of the global market last year." The article also points out some behind-the-scenes legal wrangling: "the cutthroat competition became more evident when the Seoul court sided with SK Hynix on Thursday (March 7) by granting a non-compete injunction to prevent its former researcher, who specialized in HBM, from working at Micron. He would be fined 10 million won for each day in violation." SK Hynix is likely pinning its next-gen AI GPU hopes on a 12-layer DRAM stacked HBM3E product—industry insiders posit that evaluation samples were submitted to NVIDIA last month. The outlook for these units is said to be very positive—mass production could start as early as this month.