LiteOn today introduced the MUX line of "entry-level" M.2 PCI-Express SSDs in the M.2-2280 form-factor. Available in 128 GB and 256 GB capacities, the drives feature PCI-Express 3.0 x2 host interface, and take advantage of the NVMe protocol. They combine Phison PS5008-E8 controllers with Toshiba BiCS3 3D-TLC NAND flash memory.

The 128 GB variant offers sequential transfer rates of up to 1500 MB/s reads, with up to 450 MB/s writes; up to 91,000 IOPS 4K random reads, and up to 110,000 IOPS 4K random writes; while the 256 GB variant is slightly faster, offering up to 1600 MB/s sequential reads, up to 850 MB/s sequential writes, up to 145,000 IOPS 4K random reads, and up to 140,000 IOPS 4K random writes. Both variants are backed by 3-year warranties.

Toshiba has announced they will begin commercializing HDDs based on Showa Denko K.K.'s (SDK) 9th generation perpendicular magnetic recording (PMR) platter technology. This latest technology brings about improved storage areal densities in both the 2.5" and 3.5" platters, increasing storage capacities without having to resort to Shingled Magnetic Recording 8SMR), which typically reduces performance. The increased areal density of the new generation technology enables 1 TB 2.5" platters and up to 1.8 TB 3.5" platters, opening the door for PMR HDDs with up to 14 TB capacity sometime in 2018.

The first Toshiba drive to make use of this technology is aimed at ultra-portable laptops that require lots of storage space: the MQ04ABF Series features 5,400 RPM spindle speeds, 1TB of data storage capacity in an ultra-compact 2.5-inch 7.0 mm height form factor. This news is particularly interesting for enterprise-class solutions, however. Today's top-of-the-range enterprise-class 3.5" HDDs can store up to 12 TB of data (14 TB solutions have to make use of SMR). These 12 TB HDDs are based on 8x 8th generation PMR platters featuring ~1.5 TB capacities. With the arrival of the 9th gen PMR platters in 2018, hard drive makers will be able to increase capacities of 8x platter models to 14 TB, while designs with 7x platters can go up to 12 TB.

Following up on its CA3 NVMe SSD series launch from earlier this month, LiteOn introduced the new CV6 line of value SSDs featuring the SATA 6 Gbps interface. The drives come in 7 mm-thick 2.5-inch, and M.2-2280 form-factors (M-key), taking advantage of SATA 6 Gbps interface. The drives combine a Marvell 88SS1074 controller with Toshiba-made 3D TLC NAND flash memory. The controller features LDPC gen 3 error correction, and SLC caching, a feature with which it treats a small portion of the TLC NAND flash as SLC, juggling hot data in and out of it for more performance.

The 2.5-inch CV6 series is available in 128 GB, 256 GB, and 512 GB capacities, while the M.2 variant comes in 128 GB and 256 GB. All variants offer sequential transfer rates of up to 520 MB/s reads, with up to 450 MB/s writes. The 256 GB and 512 GB variants offer 4K random read performance of up to 85,000 IOPS, while the 128 GB variant offers 58,000 IOPS. 4K random write performance is rated at 28,000 IOPS for the 2.5-inch 128 GB variant, 30,000 IOPS for the M.2 128 GB variant; and up to 45,000 IOPS for both the 256 GB and 512 GB variants. The company didn't reveal pricing.

LiteOn rolled out the CA3 line of NVMe SSDs in the M.2-2280 form-factor. Available in 256 GB, 512 GB, and 1 TB capacities, the drives combine a Marvell 88SS1092 controller with Toshiba-made TLC NAND flash memory. The drive takes advantage of PCI-Express 3.0 x4 and the NVMe protocol, to put of sequential read speeds of up to 2100 MB/s for the 256 GB variant, and 2900 MB/s for the 512 GB and 1 TB variants; and sequential write speeds of up to 600 MB/s, 1200 MB/s, and 1700 MB/s for the three variants, respectively.

Random access speeds of the LiteOn CA3 series drives are up to 150K/150K IOPS (read/write) for the 256 GB variant; up to 260K/260K IOPS for the 512 GB variant, and up to 380K/260K IOPS for the 1 TB variant. The controller supports 3rd generation LPDC error correction, NVMe deallocate, TCG-OPAL 2.0 native encryption, and 256-bit AES native encryption. The company didn't put out endurance numbers, but stated that its MTBF is rated at 1.5 million hours. The drives are backed by 3-year warranties. The company didn't reveal pricing.

Toshiba Corporation today held an extraordinary shareholders' meeting where Toshiba's shareholders approved the Share Purchase Agreement (SPA) previously entered into with K.K. Pangea (Pangea), a special purpose acquisition company formed by the consortium led by Bain Capital Private Equity, LP (including affiliates of Bain), for the sale of all shares of Toshiba's wholly-owned subsidiary Toshiba Memory Corporation (TMC).

SanDisk LLC, a wholly owned subsidiary of Western Digital Corporation, and certain of its subsidiaries have filed for arbitration before the International Chamber of Commerce (ICC) International Court of Arbitration regarding the sale. Despite SanDisk and Western Digital's opposition, Toshiba remains fully determined to resolving the issue through the arbitration process, and looks forward to receiving the arbitrators' decision.

Since signing of the SPA on September 28, 2017, Toshiba and Pangea have been jointly working towards the closing of the transaction by the end of March 2018. Today's approval of the SPA by Toshiba's shareholders is an important step towards closing.

Toshiba Corporation (TOKYO:6502) today announced that its board of directors has approved a further investment by Toshiba Memory Corporation (TMC), a wholly-owned subsidiary that manufactures Flash memory, in manufacturing equipment for the Fab 6 clean room under construction at Yokkaichi Operations. TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

Production at Fab 6 will be entirely devoted to BiCS FLASH, Toshiba's innovative 3D Flash memory. As Toshiba announced in its August 3, 2017 release "Update on Toshiba Memory Corporation's Investment in Production Equipment for Fab 6 at Yokkaichi Operations", TMC has previously invested approximately 195 billion yen in Fab 6 as its first investment covering the installation of manufacturing equipment in the Phase-1 clean room and the construction of the Phase-2 clean room.

Demand for TMC's next generation 3D Flash memory devices is expected to increase significantly due to growing demand for enterprise SSDs in datacenters, SSDs for PCs, and memory for smartphones; TMC expects this strong market growth to continue in 2018. TMC's investment timing will position it to capture this growth and expand its business.

Toshiba today announced that it has signed an agreement with a consortium led by Bain Capital to sell its memory business for JPY 2 trillion (approximately USD $18 billion). The consortium includes Korean memory giant SK Hynix, which contributed JPY 395 billion (nearly 20 percent) of the consortium's investment toward acquisition of Toshiba Memory Corp. Apple and Dell are the other members of the consortium.

Toshiba Corporation (erstwhile parent of Toshiba Memory Corp.) continues to hold a 40.2 percent stake, which along with another Japanese company, Hoya Corporation, holding a 9.9 percent stake, ensure that Japanese firms hold 50.1 percent of the business, keeping Japanese regulators happy. The Bain Capital-led consortium will hold a 49.9 percent stake, ensuring that Toshiba Memory Corp. stays afloat, and away from rival Western Digital, which has dragged Toshiba to a multitude of international courts and arbitrators. Apart from SK Hynix, the Bain Capital-led consortium includes Apple and Dell, who feared they would lose DRAM and NAND flash price bargaining power if Toshiba Memory fell in the hands of Western Digital, which owns SanDisk.

Toshiba Electronic Devices & Storage Corporation today announced the addition of an 10-terabyte (TB) SATA model to its MG06 series of 3.5-inch, enterprise capacity class hard disk drives (HDD). Shipments start from today. The continuing progress of digitization, most recently the quickening expansion of IoT and the increasing reliance on cloud services means that more information is being generated and stored than ever before, and that the rate of its creation only continues to increase. The data centers and cloud-based services that use this data constantly require higher-capacity, higher-performance HDDs.

Toshiba's MG06 series HDDs meet industry requirements by deploying an improved magnetic recording head and disk magnetic layer, and now deliver up to 10TB of capacity with air-based HDDs, a 25% increase over the maximum capacity of the earlier MG05 series. The HDDs achieve a sustained transfer rate of 237 MiB/s, and a 25% improvement in operating life that boosts MTTF to 2,500,000 hours. These improvements in capacity, speed and reliability can contribute to the lower system TCO (total cost of ownership).

Western Digital Corporation's subsidiary SanDisk LLC (SanDisk) and certain of its subsidiaries, through their attorneys, have notified Toshiba Corporation (TOKYO:6502)(Toshiba) and Toshiba Memory Corporation (TMC), a wholly owned subsidiary of Toshiba, that they have initiated arbitration regarding TMC's planned investments for additional BiCS capacity at TMC's Yokkaichi Operations, including at its Fab 6 building. Although Toshiba has not yet received a formal copy of the arbitration request, and is therefore not in a position to comment regarding its substance, Toshiba is disappointed by Western Digital's initiation of additional arbitration at this important time for the parties' collaboration.

As previously announced, production at Fab 6 will be entirely devoted to BiCS FLASH, Toshiba's premiere 3D Flash memory product. Phase-1 of the fab is scheduled for completion in summer 2018, and will be a unilateral investment by Toshiba following SanDisk's unwillingness to agree to reasonable commercial terms.

The light is being seen at the end of the tunnel for one of the tech world's most recent debacles. A series of questionable investments and accounting scandals saw Toshiba facing losses in the billions of dollars and see its stock pricing plummet by more than 40%. As such, to staunch the bleeding, the company was looking to only spin-off a 20% stake in its memory business; however, as its finances continued to take a turn to the worse, it then decided on selling a majority, 60% stake to the highest bidder. That would seemingly still not be enough, however, as the company will now sell 100% of its memory semiconductor business to investment consortium Bain Capital.

Western Digital Corp. (NASDAQ: WDC) today announced that several of its SanDisk subsidiaries have filed an additional Request for Arbitration with the ICC International Court of Arbitration related to three NAND flash-memory joint ventures ("JVs") operated with Toshiba Corporation ("Toshiba").

On Aug. 3, 2017, Toshiba announced that it would unilaterally invest in manufacturing equipment for the Fab 6 clean room at the JV operations in Yokkaichi, Japan. The arbitration demand seeks, among other things, a permanent injunction preventing Toshiba from making unilateral investments in manufacturing equipment for Fab 6 without first giving SanDisk the opportunity to make a comparable investment in expansions and conversions of JV capacity for BiCS 3D NAND flash memory.

Western Digital commented: It is unfortunate that SanDisk is forced to initiate binding arbitration to remedy Toshiba's retaliatory breach of the JV agreement entered into by both SanDisk and Toshiba.

Toshiba Corporation (TOKYO:6502) (Toshiba) has entered into a memorandum of understanding (MOU) with Bain Capital Private Equity LP (Bain), the lead member of a consortium currently bidding to acquire Toshiba Memory Corporation (TMC), memorializing the parties' intent to negotiate a mutually satisfactory definitive agreement for the sale of TMC by the end of this month. The decision to enter into the MOU was made by Toshiba's Board of Directors at its meeting today.

As Toshiba stated in its August 31 announcement, "Update on the Sale of Toshiba Memory Corporation," Toshiba has been in continuing negotiations with three consortia of potential purchasers of TMC: a consortium that includes the Innovation Network Corporation of Japan, Bain and Development Bank of Japan; a consortium that includes Western Digital; and a consortium that includes Hon Hai. In the course of these negotiations Bain has come forward with a new proposal. Toshiba's Board of Directors has determined to continue negotiations with the Bain-led consortium on the basis of this new proposal, and the company will work to expedite the conclusion of a stock purchase agreement by the end of September. Toshiba hereby announces that it has accordingly entered into a non-binding MOU with Bain. The signing of this MOU does not eliminate the possibility of negotiations with other consortia.

Western Digital Corp. (NASDAQ: WDC) today commented on Toshiba Corporation's ("Toshiba") statement regarding the transfer of its interests in its NAND flash-memory joint ventures operated with Western Digital's SanDisk subsidiaries ("JVs"):

"We are disappointed that Toshiba would take this action despite Western Digital's tireless efforts to reach a resolution that is in the best interests of all stakeholders. Throughout our ongoing dialogue with Toshiba, we have been flexible, constructive and have submitted numerous proposals to specifically address Toshiba's stated concerns. Our goal has been - and remains - to reach a mutually beneficial outcome that satisfies the needs of Toshiba and its stakeholders, and most importantly, ensures the longevity and continued success of the JVs.

Furthermore, it is surprising that Toshiba would continue to pursue a transaction with a consortium led by Korea-based SK Hynix Inc. and Bain Capital Japan without SanDisk's consent, as the language in the relevant JV agreements is unambiguous, and multiple courts have ruled in favor of protecting SanDisk's contractual rights. We remain confident in our ability to protect our JV interests and consent rights."

It's been an interesting time if you're an avid reader of memory-related news pieces. Between increasing prices, Toshiba's debacle and subsequent spin-off of their memory division, to Toshiba and Western Digital butting heads regarding acquisition of said spin-off, and today's news, little was left to thread. Now, reports are surfacing that place Western Digital's consortium as being the (as of yet unofficial) winner in the bid for Toshiba's partial spin-off of their memory division. The deal is being valued at $18.3 billion, Japanese news outlet Nikkan Kogyo says, with Toshiba planning to make a formal decision on Wednesday, with the signing of an agreement to come on Sept. 20.

Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces its new MQ04 Series 1 TB HDD, which is compatible with notebook PCs, game systems, all-in-one slim-line desktop systems, set-top box appliances, and other applications requiring high capacity and durability storage.

The MQ04 Series single-disk model delivers 1 TB of data storage capacity in an ultra-compact 2.5-inch, 7mm height form factor. The drive's 6 Gbit/s SATA interface and 5,400 rotational speed combined with a large 128 MiB buffer and consistent seek performance, result in a 34 percent higher internal transfer rate performance when compared to the previous 1TB MQ01 Series models. The new model is also quieter and weighs less than prior generations.

Toshiba has announced immediate availability of their new 8 TB solution for you storage-mongers out there. The TX 300 brings an 8 TB, 7200 RPM HDD to an interesting $260 price-point. Yes, we know everyone would love to have that amount of storage even in a good, old SATA III SSD for about the same price - but now is not the time to daydream. For the foreseeable future, the best option for cheap storage in such quantities lies with our old and (somewhat) trusty platter-based storage tech.

Storage options are available at 4 TB, 5 TB, 6 TB and 8 TB with 128 MB cache. These drives feature perpendicular magnetic recording (PMR), which allows for higher areal density than traditional (now seldom used) longitudinal recording. Additional security and reliability features have been baked in on these particular models - the motors are attached to both the top and bottom of the unit and there is an increased attention to shock and vibration dampening. These drives are available now, and the 8 TB option will set you back the aforementioned $260. I'll save you from whipping up the old calculator, because at this storage capacity and pricing, price per GB stands at a mere $0.0318.

The partial spin-off of Toshiba's memory production business, which should see the company shed around 20% of its memory business production stake, still has a lot of water to run under the bridge. Reports said that Toshiba would be suing Western Digital, which Toshiba said tried to continuously interfere with the bidding process, it seems that Western Digital isn't looking to back down any time soon. Reuters is reporting that Western digital is now looking to Apple to bolster its bidding position by another 50 billion Yen (around $464 million) to increase the likelihood of acceptance.

Granted, that is somewhat of a fraction of Western Digital's $17 to $18 billion bid for the chip business, but any increased amount of investment is likely to only sway the decision towards WD, who has a joint venture with Toshiba towards furthering memory semiconductor technology. Even though Toshiba has already elected a preferred bidder, nothing is closed as of yet. That Western Digital is looking towards Apple is slightly surprising, but begins to look less so the more you think about it: Apple is one of the foremost buyers of memory semiconductors in the industry; pricing for both flash and DDR memory has seen price hikes in the past due to increased production of iPhones, after all. It's in Apple's best interests to have an amenable partner in the memory production business, which is why an Apple aid for Western Digital might turn out advantageous for the company. Toshiba executives, fearing that WD might be angling to eventually take over the chip business (which isn't unreasonable), are demanding that the U.S. company promise to limit the size of its stake in the company. Toshiba's board is now aiming to reach a final agreement with the consortium by Sept. 13.

Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces the X300 3.5-inch internal hard drive in 8 TB capacity. Compared to the P300 series with capacities up to 3 TB, the X300 Series delivers extreme performance and robust capacity for creative and professional applications including graphic design, animation, photo and video editing, and PC gaming.

The new 8 TB model features Toshiba's cache technology, a self-contained cache algorithm with on-board buffer management, which optimizes cache allocation during read/write to provide high-level performance in real time. The X300 Series is offered in 4 TB, 5 TB, 6 TB and 8 TB capacities, all with a higher 128 MB cache than P300 series, ensuring fast data access. Available in a 3.5-inch form factor, the X300 performs at 7,200 RPM and a SATA connection up to 6 Gbit/s. Compatible with most major brands of Serial ATA enabled desktop computers, the Toshiba X300 high-precision head positioning supported by advanced format technology (physical 4 KB sector) and dual stage actuator technology delivers high storage density and capacity.

Toshiba Memory Corporation, the world leader in memory solutions, today announced the launch of the SG6 series, a new line-up of SATA client SSDs utilizing Toshiba Memory Corporation's cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH. Sample shipments to PC OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the fourth calendar quarter of this year.

The new SG6 series SSDs features a SATA Revision 3.3, 6.0Gbit/s interface, and delivers performance of up to 550MB/s sequential read and 535MB/s sequential write. Thanks to improved flash memory management and performance, active power consumption is cut by approximately 40% compared to previous generation products. This improvement can extend battery life, a plus for many applications including mobile computing.

Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today unveiled the development of two new flagship enterprise solid state drive (SSD) solutions, the TMC PM5 12 Gbit/s SAS series and the CM5 NVM Express (NVMe) series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC's latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH2, making it possible for today's demanding storage environments to expand the use of flash with cost-optimized 3D flash memory. With all-new, advanced features, the innovative CM5 and PM5 series raise the bar in performance capabilities and create new opportunities for businesses to leverage the power of flash storage.

Offering up to 30.72TB in a 2.5-inch form factor, the TMC PM5 series introduces a full range of endurance and capacity SAS SSDs enabling data centers to effectively address big data demands while streamlining storage deployments. With the industry's first MultiLink SAS architecture, the PM5 series is able to deliver the fastest performance the market has seen from a SAS-based SSD with up to 3,350 MB/s of sequential read and 2,720 MB/s of sequential write6 in MultiLink mode and up to 400,000 random read IOPS in narrow or MultiLink mode. The PM5 series' 4-port MultiLink design is an additional technology to achieve high performance, close to PCI EXPRESS (PCIe)8 SSDs, enabling legacy infrastructures to increase productivity without having to be re-architected from the ground up. Furthermore, PM5 SSDs support multi-stream write technology, a feature that intelligently manages and groups data types to minimize write amplification and minimize garbage collection, translating into reduced latency, improved endurance, increased performance and Quality of Service (QoS).

Toshiba's first retail SSDs to use the company's 64-layer BiCS3 3D NAND technology have been announced by Toshiba. The successors to the company's Trion 100 and Trion 150 SSDs still carry some vestiges of OCZ branding in the product logo and TR (short for Trion) moniker. This is Toshiba's first generation of mainstream, mass-market-suitable 3D NAND flash.

These drives make use of a DRAM-less controller design, and will be available in capacities ranging from 240 GB up to 960 GB. Toshiba advertises 550 MB/s read and 525 MB/s write speeds. 4K Random Read IOPS stand at 87K, while 4K Random Write IOPS go up to 87K. The endurance on the models will range from 60 to 240 TB according to capacity, and these carry the same three-year warranty as previous Trion SSDs. Pricing has not yet been announced, although the TR200 series will start shipping to retailers this fall.

Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world's first BiCS FLASH three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at the 2017 Flash Memory Summit in Santa Clara, California, United States, from August 7-10.

Devices fabricated with TSV technology have vertical electrodes and vias that pass through silicon dies to provide connections, an architecture that realizes high speed data input and output while reducing power consumption. Real-world performance has been proven previously, with the introduction of Toshiba's 2D NAND Flash memory.

Not all news coming out of Toshiba is bad or somewhat bad. The Japanese giant still is one of the biggest players in the NAND semiconductor business, no matter the recent woes. Even more recently, though, Toshiba announced they had developed quadruple level cell NAND memory, which should improve density and, therefore, reduce the price/GB ratio on future consumer products, such as SSDs. However, each increase in the number of cell levels bring concerns regarding not only performance, but especially durability, since a higher number of states per cell increases the voltage steps that are applied to it (SLC NAND dealt with two voltage states, MLC with four, TLC with eight voltage states, and QLC will handle 16 of these.) This tends to make errors more common, and the cell's longevity to be compromised due to the amount of variation in its states, which means more powerful error correction techniques must be employed.According to Toshiba, its 3D QLC NAND targets around ~1000 program/erase cycles, which is close to TLC NAND flash. This is considerably higher than the amount of P/E cycles (100 - 150) expected for QLC by the industry, which means the company has achieved what many thought difficult. Toshiba has begun sampling of its 3D QLC NAND memory devices earlier this month. everything points to mass production on late 2018, early 2019, though, which means we still have a long way to go until we see this technology implemented. This won't be the one to save us from escalating NAND prices; we'll have to look to other, more market and supply-and-demand based factors instead.

Toshiba America Electronic Components, Inc. (TAEC) today announced the latest generation of its BiCS FLASH three-dimensional (3D) flash memory. The newest BiCS FLASH device features 4-bit-per-cell, quadruple-level cell (QLC) technology and is the first 3D flash memory device to do so. Toshiba's QLC technology enables larger (768 gigabit) die capacity than the company's third-generation 512Gb 3-bit-per-cell, triple-level cell (TLC), and pushes the boundaries of flash memory technology.

Toshiba's new QLC BiCS FLASH device features a 64-layer stacked cell structure and achieves the world's largest die capacity (768Gb/96GB). QLC flash memory also enables a 1.5-terabyte (TB) device with a 16-die stacked architecture in a single package - featuring the industry's largest capacity. This is a fifty percent increase in capacity per package when compared to Toshiba's earlier announcement of a 1TB device with a 16-die stacked architecture in a single package - which also offered the largest capacity in the industry at the time.

The Japanese Toshiba have been in a sort of bad run lately, following disastrous investments into nuclear plants and a $1.2 billion "mistake" in their earnings reports, which gave the company a hard time in refinancing itself in the Tokyo Exchange. Now, in a bid to sell a 20% stake of their highly successful memory business, the company has elected a preferred buyer. And in what might not come as a surprise, they elected a US-Japan consortium led by the Japanese government itself.

Toshiba said it selected the consortium, consisting of Innovation Network Corporation of Japan (a 26-strong network which includes Sony, Canon and Toyota, among others), Bain Capital Private Equity LP (based in Boston) and the Development Bank of Japan, because it presented "the best proposal in terms of valuation and respect" to "certainty of closing, retention of employees" and I quote again, "maintenance of sensitive technology within Japan". Terms of the deal were not disclosed although analysts have previously estimated Toshiba Memory Corporation to be worth around $20 billion. In its announcement, Toshiba said it intends to reach an agreement for purchase with the consortium before its annual shareholders meeting on June 28. If all goes well, the Japanese tech giant is looking to close on the transaction by March 2018, pending regulatory approval and so forth.