Thursday, March 3rd 2016

Thermalright Announces the Macho 120SBM CPU Cooler

Introducing the Macho 120 SBM. A new cooler joins the Macho Family: With the Macho 120 SBM Thermalright added a compact version of its popular Macho 120 Rev. A to its portfolio. Its narrower design makes it the ideal candidate for Mini-ITX or Micro-ATX systems, where it can score with its maximum compatibility. With dimension of 130 x 101 x 150 mm the Macho 120 SBM is noticeably thinner than its "big brother." Thus it can easily fit in cases for which the Macho 120 Rev. A was too big. The newly designed TY 127 PWM fan provides the necessary airflow and guarantees the cooler an outstanding cooling performance.

The concept of the heatsink aligned to the rear that is used for all the coolers of the Macho family is also part of the design of the Macho 120 SBM, which eliminates the possibility of interference with RAM-coolers almost completely. Five 6 mm heatpipes, in conjunction with the 30 aluminum cooling fins in the typical Macho design ensure that the cooler offers a superior heat dissipation. The fins offer a particularly low air resistance and have been optimized for low-rpm fans.

Visually, the Macho 120 SBM is clearly a member of its family. The heatpipes are nickel plated and offer in combination with the black anodized top fin an elegant appearance.

The first 120 mm model in the well-known TY-design offers a wide control range between 300 and 1,300 rpm, which results in an air flow of 21.9 - 94.8 m³/h. Thus the fan offers a higher airflow when compared to the 120 mm fan of the Macho 120 Rev. A.

The cooler is now available in stores. The MSRP is 42.99 Euro, incl. 19% VAT.
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14 Comments on Thermalright Announces the Macho 120SBM CPU Cooler

#1
RejZoR
It seems like heatpipe towers reached its design peak. If they could figure out a way to transfer heat faster through heatpipes using some special sauce and heatpipe structure. But I don't think there is much they can do that hasn't already been done.
Posted on Reply
#2
ZoneDymo
RejZoR said:
It seems like heatpipe towers reached its design peak. If they could figure out a way to transfer heat faster through heatpipes using some special sauce and heatpipe structure. But I don't think there is much they can do that hasn't already been done.
could still invest in trying to make peltier systems actually work (better).
Posted on Reply
#3
RejZoR
But most likely not with heatpipe based cooler. But combining AiO and peltier, that might be viable I think.
Posted on Reply
#4
uuuaaaaaa
RejZoR said:
It seems like heatpipe towers reached its design peak. If they could figure out a way to transfer heat faster through heatpipes using some special sauce and heatpipe structure. But I don't think there is much they can do that hasn't already been done.
I keep my hope high for the sandia cooler!
Posted on Reply
#5
Ferrum Master
Nah... they just need to make a special cooler paired with a case, that has a large area of fins. Some sort of bridge system. Some special HTPC uses such design.

It asks for precise standards (a bridge for each motherboard) and a lot of expenses, bulky(altough I like that), but the thermal capability of such system would be superb... there is no lack surface in a case, it could be the cover itself actually.

Peltier is for special tasks like laser head cooling, it consumes way too much current and is inefficient. Never a mainstream thing.
Posted on Reply
#6
RejZoR
They've been talking about it for ages and still nothing. I've seen an actual working sample on Linus Tech Tips once, it was from some expo, but it looked more like a server solution there than for consumers.
Posted on Reply
#7
RejZoR
I think biggest innovation would be a way to make flexible heatpipes so you could use entire case sides/frame as a heatsink. But with rigid heatpipes, it's nearly impossible to accomodate different sockets, motherboards and stuff.
Posted on Reply
#8
de.das.dude
Pro Indian Modder
uuuaaaaaa said:
I keep my hope high for the sandia cooler!
ahahahahahahaha good times. That was like 5 years ago now!
Posted on Reply
#9
Ferrum Master
RejZoR said:
I think biggest innovation would be a way to make flexible heatpipes
Nah, we have to wait for hybrid carbon nano fiber materials with better conductivity... that's all.
Posted on Reply
#11
mikka1986
RejZoR said:
It seems like heatpipe towers reached its design peak. If they could figure out a way to transfer heat faster through heatpipes using some special sauce and heatpipe structure. But I don't think there is much they can do that hasn't already been done.
Heat pipe is excellent in heat transfer itself, spreading heat to the cooling fins is the problem. I've seen some wild concept design but all lead to expensive manufacturing process.
They really are running out of idea on how to make a cheap and high performance heatsink.
Posted on Reply
#13
buildzoid
Ferrum Master said:
Nah, we have to wait for hybrid carbon nano fiber materials with better conductivity... that's all.
I wonder how well that will actually work considering that heatpipes don't rely on the conductivity of the material their made from but on evaporating sub atmospheric water. I could see carbon nano material coatings be applied to fins to improve their ability to spread heat. Heat pipes either need to find a liquid with very low viscosity and a boiling point of about 50-60C. Maybe try a mix of different heat pipes with various boiling points to get better performance at lower temperatures too. Also finding a way to cram more heatpipes would help.
Posted on Reply
#14
Arrakis+9
RejZoR said:
It seems like heatpipe towers reached its design peak. If they could figure out a way to transfer heat faster through heatpipes using some special sauce and heatpipe structure. But I don't think there is much they can do that hasn't already been done.
vapor chamber + heat pipes should in theory work better

check out the masterair maker 8 by cooler master
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