Thursday, August 11th 2016

Apple's Next-Gen MacBook Pro to Feature a Major Design Overhaul

Apple is preparing its first major design overhaul for the MacBook Pro in four years. The next-generation premium notebook from Apple, reportedly features a thinner form, a touchscreen strip in place of function keys, acting as a second display; and an upscaling of the USB type-C based universal connector concept introduced with the new MacBook.

Apple's Touch ID feature could be ported to the Mac ecosystem with the new MacBook Pro, which could feature a fingerprint reader. Under the hood, the new MacBook Pro could be the launchpad for the company's next MacOS "Sierra" software, which brings Siri to the Mac platform, and deeper iCloud integration. Its processor supplier is unclear at this point, but its graphics processing could be care of an AMD "Polaris" GPU.
Source: Bloomberg
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13 Comments on Apple's Next-Gen MacBook Pro to Feature a Major Design Overhaul

#1
Bansaku
"Its processor supplier is unclear at this point,"
I don't think Apple is anywhere ready to roll out their own CPUs for use with their notebooks (and desktops), therefore it is safe to assume Intel.

:toast:
Posted on Reply
#2
arbiter
btarunrApple is preparing its first major design overhaul for the MacBook Pro in four years.
Let me guess, everything is soddered in to the board so nothing is replaceable without replacing pretty much the main board in the thing? O wait isn't that case already?
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#3
arterius2
arbiterLet me guess, everything is soddered in to the board so nothing is replaceable without replacing pretty much the main board in the thing? O wait isn't that case already?
yes pretty much like all laptops these days.
Posted on Reply
#4
Octavean
arterius2yes pretty much like all laptops these days.
No, no,...

Apple has improved on that. Now with the new MacBook, the motherboard is not removable from the case so you have to throw the whole thing out,...

Just kidding,.... :)
Posted on Reply
#5
NC37
99% chance it'll be a Polaris 11 and extremely underclocked...because...Apple.
Posted on Reply
#6
arbiter
arterius2yes pretty much like all laptops these days.
Um lets see in MY laptop, i can replace the drive, ram and battery very easy. Its 1 screw and massive panel comes out
Posted on Reply
#7
Frick
Fishfaced Nincompoop
arbiterUm lets see in MY laptop, i can replace the drive, ram and battery very easy. Its 1 screw and massive panel comes out
I'm betting yours is thicker though.
NC3799% chance it'll be a Polaris 11 and extremely underclocked...because...Apple.
Nah, because mobile.
Posted on Reply
#8
Caring1
arbiterUm lets see in MY laptop, i can replace the drive, ram and battery very easy. Its 1 screw and massive panel comes out
Tried replacing a screen on an Apple, a massive hammer came out....
Stupid design to work on.
Posted on Reply
#9
Steevo
NC3799% chance it'll be a Polaris 11 and extremely underclocked...because...Apple.
Lets not forget that AMD is using GloFlo and TSMC, and TSMC is producing much lower powered silicon, like is featured in the XboneS and upcoming Scorpio, so the fact that they may be able to shave 10-20% off the power draw with TSMC chips could mean that a new Zen/Polaris chip could be inside the new Apples.
Posted on Reply
#10
fusionblu
SSD is probably built into the Logic Board like the MB 12" Retinas so if any part of the Logic Board fails (RAM, GPU, CPU, Wireless for Wifi and Bluetooth) you also lose all your data. User's fault for not having a Time Machine back up.
Posted on Reply
#11
AsRock
TPU addict
q
SteevoLets not forget that AMD is using GloFlo and TSMC, and TSMC is producing much lower powered silicon, like is featured in the XboneS and upcoming Scorpio, so the fact that they may be able to shave 10-20% off the power draw with TSMC chips could mean that a new Zen/Polaris chip could be inside the new Apples.
Maybe apple have not decided yet, and lets face it putting a possible cheaper CPU and charging same same crazy prices sounds like apple.
Posted on Reply
#12
Killer_Rubber_Ducky
I doubt AMD will use TSMC for their Zen chips since as I understand it, TSMC does not make CPUs. They make GPUs. I would recommend AMD get help from the following companies: IBM, Samsung, Red Hat (Software), and Sony. IBM does wonders with their own chip designs. Word is that IBM is at 7nm now. IBM beat intel to the punch. Samsung can produce chips for AMD's Zen and since AMD wants to get into the ARM market, something Samsung is already into, they can team up and get those AMD Zen/ARM chips going that they tried in the past. Red Hat is simply amazing in software design and we all know AMD needs help with that. Especially on the Linux side of the market. Plus, Red Hat has some good capital to work with and the AMD Zen based Opterons could be a good platform for Red Hat to work with if they helped with the drivers. Sony is also a hardware manufacturer and has good marketing skills and capital to work with.
Posted on Reply
#13
Steevo
Killer_Rubber_DuckyI doubt AMD will use TSMC for their Zen chips since as I understand it, TSMC does not make CPUs. They make GPUs. I would recommend AMD get help from the following companies: IBM, Samsung, Red Hat (Software), and Sony. IBM does wonders with their own chip designs. Word is that IBM is at 7nm now. IBM beat intel to the punch. Samsung can produce chips for AMD's Zen and since AMD wants to get into the ARM market, something Samsung is already into, they can team up and get those AMD Zen/ARM chips going that they tried in the past. Red Hat is simply amazing in software design and we all know AMD needs help with that. Especially on the Linux side of the market. Plus, Red Hat has some good capital to work with and the AMD Zen based Opterons could be a good platform for Red Hat to work with if they helped with the drivers. Sony is also a hardware manufacturer and has good marketing skills and capital to work with.
They are already making the chips in the XboneS that are CPU/GPU (APU) chips. They are also supposedly making the Scorpio chips, and the new PS4 upgrade chips.

www.eurogamer.net/articles/digitalfoundry-2016-inside-xbox-one-s-tech-interview

"
Albert Penello: Correct! The SoC in the Xbox One S is designed in the 16nm Fin FET process, which results in a die that is 240mm2; 33 per cent smaller and consumes less power than the 28nm SoC in the original Xbox One.

Digital Foundry: If you are at 16nmFinFET for the new SoC, does that confirm you're using TSMC [Taiwan Semiconductor Manufacturing Company - currently producing Nvidia's new Pascal chips] to fabricate the processor as per Xbox One?

Albert Penello: Yes, for the Xbox One S consoles shipping this year the SoC is fabricated at TSMC."
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