Here are some close-up shots we took of AMD's latest client and enterprise processors. Starting things off is the Ryzen AI Max "Strix Halo." This is a rather large chip, with a package size resembling some high-end GPUs. This chiplet-based processor is dominated by a large SoC+iGPU tile built on the TSMC N4P process, and two "Zen 5" CCDs. These are the same CCDs as "Granite Ridge," "Fire Range," and "Turin," which come with full 512-bit data paths for the FPU, and large 32 MB L3 caches per CCD. The SoC+graphics tile has the iGPU with 40 compute units. The package is large not just because of the size of the chip, but also its 256-bit wide LPDDR5X memory interface.

Next up, is the Ryzen AI 9 HX Pro mobile processor, which comes in the regular mobile processor package AMD has been using for several generations now. The chip is based on the "Strix Point" monolithic silicon built on TSMC N4P. This particular SKU has the AMD Pro feature-set, and targets commercial notebooks. Lastly, there's the Ryzen Z2 Extreme. This particular chip is built on an optimized variant of "Strix Point," with a few disabled CPU cores, but a maxed out iGPU with all 16 CU enabled. This processor targets gaming handhelds. Winding things up is the EPYC 9006 "Turin" processor with its glorious 12 "Zen 5" CCDs.