Friday, June 26th 2026
Intel "Nova Lake-S" 52-Core OC SKU to Draw 474 W in PL2 Mode
Intel's next-generation "Nova Lake" CPU microarchitecture is shaping up to be quite power-hungry. According to the latest leak, confirmed by well-known Intel leaker Jaykihn, Intel's top-end, overclocking-focused, dual compute die "Nova Lake-S" CPU with 52 cores will feature a PL2 mode with a power level of 474 W. This is an unprecedented number for an Intel consumer desktop platform, typically expected from a high-end desktop (HEDT) design. However, since this is a 52-core design that can be overclocked, it represents the newest high CPU PL2 setting that Intel will be shipping with "Nova Lake-S." Previous rumors suggested that the Intel Z990 platform would be a power-hungry consumer design, but now we understand just how power-hungry it is.
Reportedly, Intel's reference Z990 motherboard design, which it provides to partners like ASUS, MSI, GIGABYTE, ASRock, and others, now includes the possibility of three 8-pin CPU power connectors. This is an intriguing design choice, considering that most enthusiast boards typically ship with two 8-pin EPS CPU connectors. The three 8-pin connectors are mainly intended for the highest-end overclocking designs, rather than being required to run the dual compute die designs. Motherboards equipped with either two or three EPS connectors are still expected to support Intel's upcoming high-end 44-core and 52-core processors on the 175 W platform, meaning that only the overclocking-focused models will feature three connectors for additional overclocking headroom.According to current information, Intel is introducing a tiled approach to having more compute enabled across "Nova Lake-S" SKUs. Perhaps the most interesting news is the introduction of dual-die processors. These are SKUs with two compute tiles connected to the SoC tile, allowing Intel to achieve extremely high CPU core counts. Since this is essentially the same approach to high core counts as AMD, both compute tiles have equal access to memory and PCIe. A single compute tile SKU can yield a maximum of 28 cores, while a dual-compute SKU will carry up to 52 cores.
Source:
via Jaykihn on X
Reportedly, Intel's reference Z990 motherboard design, which it provides to partners like ASUS, MSI, GIGABYTE, ASRock, and others, now includes the possibility of three 8-pin CPU power connectors. This is an intriguing design choice, considering that most enthusiast boards typically ship with two 8-pin EPS CPU connectors. The three 8-pin connectors are mainly intended for the highest-end overclocking designs, rather than being required to run the dual compute die designs. Motherboards equipped with either two or three EPS connectors are still expected to support Intel's upcoming high-end 44-core and 52-core processors on the 175 W platform, meaning that only the overclocking-focused models will feature three connectors for additional overclocking headroom.According to current information, Intel is introducing a tiled approach to having more compute enabled across "Nova Lake-S" SKUs. Perhaps the most interesting news is the introduction of dual-die processors. These are SKUs with two compute tiles connected to the SoC tile, allowing Intel to achieve extremely high CPU core counts. Since this is essentially the same approach to high core counts as AMD, both compute tiles have equal access to memory and PCIe. A single compute tile SKU can yield a maximum of 28 cores, while a dual-compute SKU will carry up to 52 cores.


292 Comments on Intel "Nova Lake-S" 52-Core OC SKU to Draw 474 W in PL2 Mode
If somebody needs so many cores, they probably want as well to utilise the potential.
Yet, as TPU has shown for a few generations now, you can safely shave 20-30% off Intel's defaults losing virtually no performance in the process. Which is also what most sane users do. But at the end of the day, Intel still gets labeled as power hungry and difficult to cool in the process.
That's an issue I've had with my 5800X; due to the size and position of the compute die, most coolers can't effectively pull heat away from it, and even with my U14S, an undervolt, and a 95W power limit, it still sits right at the thermal limit I set (80C) when I hit it with a sustained load.
Compare that to my 12700, which has a low-profile Thermalright cooler that can keep its temps under control better even at 250W, presumably because of the monolithic die having a larger area to dissipate heat from.
double jeopardy..........
The home insurance policies will go up. Anyone buying shares from insurance companies these days?
Especially after seeing ES boards with 3 eps sockets.
I fully expect the Zen6 24 core flagship to use over 300w so we in for some warm ass computers lol.
And a top notch water cooling set-up might be nice too !
Sounds like those 2000W & 2500W PSU's that were announced earlier this week will be needed sooner than later, especially if a 5xxx/6xxx series GPU is paired with this CPU :(
And if someone's buying a 52-core CPU that may be likely to hit the four digit price tag, then they can also afford to invest some money on a good power supply, a good motherboard and proper cooling.
Someone already mentioned this, but I doubt this is within the capabilities of any air-cooling. Actually I take that back; just make one with a 10-lb heatsink that takes up most of your case... :laugh: