News Posts matching "SoC"

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AMD Talks Improved Ryzen Memory Support, Ryzen 3, and Game Optimization

AMD, in an interview with Forbes, confirmed that it is working to improve DDR4 memory support of its Ryzen series processors, to enable higher memory clocks. AMD Ryzen users find it difficult to get DDR4 memory clocks to run above 3000 MHz reliably. With memory clock being linked with the chip's Infinity Fabric clock (the interconnect between two CCX units on the "Summit Ridge" silicon), the performance incentives for higher memory clocks are just that much more.

AMD confirmed that its AGESA update for May improves DDR4 memory compatibility, although it also stressed on the need for motherboard manufacturers to improve their board designs in the future, with more PCB layers and better copper traces between the DIMM slots and the SoC socket. The company assures that more updates to AGESA are in the pipeline, and would improve performance of Ryzen processors at various levels. The AGESA updates are dispensed through motherboard vendors as BIOS updates.

Shuttle Unveils XC60J IPC Powered by Intel "Apollo Lake" Celeron SoC

Shuttle Inc., the global leader in small form factor computer technology, announces the latest Intel Apollo lake platform, XC60J support with 8 COM ports to power highly interactive Kiosk, vending machine, POS and more. The XC60J is the first 3-liter model with fanless design, powered by Intel Celeron J3355. With built-in Intel HD Graphics and processor, the XC60J can support 4K/Ultra HD video playback and HEVC/H.265 high definition video playback.

With one built-in M.2 2280 Type M and one M.2 2230 Type A/E expansion slots, you can easily install an M.2 SSD, Wi-Fi module or other compatible devices. The XC60J is highly connectable with multiple I/O: USB 2.0, USB 3.0, HDMI, DisplayPort, SATA 6Gbps, COM, and Intel Dual Gigabit LAN ports. Seven RS232 and one RS232/RS422/RS485 ports which support 0V/5V/12V. Connect to barcode scanners, receipt printers, keypads, and other peripherals makes XC60J easily configured into peripheral-heavy POS, Kiosk, and Digital Signage systems.

ASUS Unveils the TinkerBoard to Rival Raspberry Pi and Intel Edison

As the world's number one PC motherboard manufacturer by volume, it would be a shame if ASUS didn't pander to the budding engineers and electronics hobbyists among you with a product that rivals the Raspberry Pi and Intel Edison. That product is the TinkerBoard, a card-sized single-board computer with a ton of I/O, including support for 4K Ultra HD displays. At the heart of this board is a Rockchip RK3288 SoC, which embeds a 32-bit quad-core ARM Cortex-A17 CPU, and a Mali T764 GPU. This chip is topped off by 2 GB of dual-channel memory. The most prominent Raspberry Pi competitor to this board is the Pi 3 Model B, with its 64-bit Broadcom BCM2837 chip, and a starting price of just $35.

Other features of the TinkerBoard include a GPIO that rivals Raspberry Pi, 4K Ultra HD H.264 video decode capability, gigabit Ethernet, SDIO 3.0, 24-bit/192 kHz HD audio, and a swappable antenna for its 802.11 b/g/n WLAN. While the specifications check out well in favor of the TinkerBoard, it all comes down to pricing. Hobbyists working on robotics projects, for example, purchase Raspberries Pi by the dozens thanks to their low price. ASUS should do well to keep that in mind when pricing this board.

AMD "Zen" Based APUs Later This Year

An AMD representative, responding to a Reddit question on AMD Ryzen branding, confirmed that the company will launch Mobile SoCs (APUs) based on the "Zen" micro-architecture later this year. The logical next-step for AMD with "Zen" beyond "Summit Ridge" has been to combine one or more quad-core "Zen" CCX (CPU complexes) with an integrated graphics core based on one of its newer GPU architectures ("Polaris" or "Vega").

The AMD representative confirmed that the company will launch mobile SoCs that combine "Zen" CPU cores with an integrated GPU, in the second half of 2017. This could hint at the availability of "Zen" powered notebooks, of all shapes and sizes by Holiday 2017. Over the year, AMD will begin launching "Zen" based products, starting off with 8-core high-end Ryzen 7 processors on March 2nd, six-core and some of the higher-end quad-core Ryzen 5 series processors in Q2-2017, and some of the lower-end quad-core Ryzen 3 parts in the second-half of 2017, now joined by mobile SoCs around the same time.

Source: Reddit

Intel Unveils Compute Card, a Credit Card-Sized Compute Platform

Today, Intel is announcing a new modular compute platform called the Intel Compute Card along with a range of partners who will be working with Intel to help accelerate the ecosystem of solutions based on the Intel Compute Card. Intel has been a leader in delivering technology to help realize the benefits of the Internet of Things and enable more smart and connected devices. The Intel Compute Card is being developed with that in mind, to transform the way compute and connectivity can be integrated and used in future devices.

ECS Readies Liva Z Mini-PC with Intel "Apollo Lake" SoC

ECS is giving final touches to a the new Liva Z mini-PC featuring Intel "Apollo Lake" Pentium and Celeron SoCs. The desktop could come with Pentium J4205, Celeron J3455, and Celeron J3355 options. The J4205 and J3455 feature quad-core "Goldmont" CPUs running at 1.50 GHz, but differ with integrated GPUs and Turbo Boost frequencies. The J4205 features 18 execution units (EUs), maximum iGPU clocks of 800 MHz, and 2.60 GHz maximum CPU Turbo Boost; while the J3455 features 12 EUs, 750 MHz maximum iGPU clock, and 2.30 GHz maximum CPU Turbo Boost frequency. The J3355 features a dual-core "Goldmont" CPU running at 2.00 GHz with 2.50 GHz Turbo Boost, and an iGPU with 12 EUs, with 700 MHz maximum clocks.

The upcoming ECS Liva Z "Apollo Lake" also comes with two DDR3 SO-DIMM slots supporting up to 8 GB of memory, integrated eMMC storage options of 32 GB and 64 GB (for the OS), and an M.2-2280 slot for internal storage expansion. Display outputs include mini-DisplayPort and HDMI. Network connectivity includes two gigabit Ethernet interfaces, and a WLAN controller with 802.11ac and Bluetooth 4.0 support. The rest of its connectivity includes three USB 3.1 type-A ports, and one USB 3.1 type-C port. The company didn't reveal pricing or availability.

Source: FanlessTech

FinalWire Announces AIDA64 v5.80

Today FinalWire released a new stable update to the desktop editions of its popular system information software. AIDA64 v5.80 supports the latest Windows 10 builds and the most recent hardware components, including the AMD RX 400 series and NVIDIA's GTX 1050 GPUs.

As a new feature, it now allows users to define global hotkeys with which they can enable or disable the AIDA64 hardware monitoring panels or switch between multiple hardware information pages on external displays, even when AIDA64 is running in the background. Using these customized key combinations, PC enthusiasts can also start and stop saving temperature, voltage and power measurements as well as fan RPM readouts to a CSV or HTML log file. The developers have made AIDA64 v5.80 DPI aware so that all elements of its graphical user interface scale properly when the DPI zoom is active in Windows. In practice, this means that users will see no more blurry or incorrectly sized graphics or text on high-resolution screens as AIDA64 now looks crisp even on 4K and 8K LCD and OLED displays.

DOWNLOAD: FinalWire AIDA64 v5.80 Installer | FinalWire AIDA64 v5.80 ZIP Package

AMD's Q3 2016 Earnings Call - Revenue is Up, Debt is Down

AMD today released their earnings call for 3Q 2016, giving us some interesting tidbits in regards to their financial robustness. The balance of AMD's economics seems to be pending towards better execution, and, coeteris paribus, a much better outlook for the coming quarters, after the monumental missteps in the past that almost threw AMD under the proverbial bus. Reception for the results seems to be a tangled mess, however, with some sides claiming that AMD beat expectations, while others prefer to draw attention to AMD's 2% stock decline since the report was outed.

AMD posted revenue of $1,307 million, up 27% sequentially and 23% year-over-year. This revenue was distributed unevenly through AMD's divisions, though. "Computing and Graphics" segment revenue was $472 million, up 9% from Q2 2016, primarily due to increased GPU sales (where Polaris picked up the grunt of the work, being responsible for 50% of AMD's GPU revenue), offset by lower sales of client desktop processors and chipsets; whereas "Enterprise, Embedded and Semi-Custom" segment revenue was $835 million, up 41% sequentially, primarily due to record semi-custom SoC sales (such as those found in Microsoft's XBOX One and Sony's PS4 and upcoming PS4 Pro).

Samsung Begins Mass-production of First SoC on 10-nanometer FinFET Node

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry. Following the successful mass production of the industry's first FinFET mobile application processor (AP) in January, 2015, Samsung extends its leadership in delivering leading-edge process technology to the mass market with the latest offering.

"The industry's first mass production of 10 nm FinFET technology demonstrates our leadership in advanced process technology," said Jong Shik Yoon, Executive Vice President, Head of Foundry Business at Samsung Electronics. "We will continue our efforts to innovate scaling technologies and provide differentiated total solutions to our customers."

NVIDIA Announces Xavier, Volta-based Autonomous Transportation SoC

At its inaugural European edition of the Graphics Technology Conference (GTC), NVIDIA announced Xavier, an "AI supercomputer for the future of autonomous transportation." An evolution of its Drive PX2 board that leverages a pair of "Maxwell" GPUs with some custom logic and an ARM CPU, to provide cars with the compute power necessary to deep-learn the surroundings and self-drive, or assist-drive; Xavier is a refinement over Drive PX2 in that it merges three chips - two GPUs and one control logic into an SoC.

You'd think that NVIDIA refined its deep-learning tech enough to not need a pair of "Maxwell" SoCs, but Xavier is more than that. The 7 billion-transistor chip built on 16 nm FinFET process, offers more raw compute performance thanks to leveraging NVIDIA's next-generation "Volta" architecture, one more advanced than even its current "Pascal" architecture. The chip features a "Volta" GPU with 512 CUDA cores. The CVA makes up the vehicle I/O, while an image processor that's capable of 8K HDR video streams feeds the chip with visual inputs from various cameras around the vehicle. An 8-core ARM CPU performs general-purpose compute. NVIDIA hopes to get the first engineering samples of Xavier out to interested car-makers by Q4-2017.

GIGABYTE AMD B350 Socket AM4 Motherboard Pictured

Here are some of the first pictures of a socket AM4 motherboard by GIGABYTE. Positioned as an entry-mainstream offering by the company to launch with AMD's 7th generation A-series "Bristol Ridge" APUs, while being ready for upcoming "ZEN" based CPUs and APUs, this board appears to be based on AMD B350 chipset, the company's mid-tier socket AM4 chipset alongside the entry-level A320 and enthusiast-segment X370. This board appears to feature a rectangular CPU cooler retention-module like older AMD sockets. Could the "square" bolt-type RM we spotted on OEM boards, as well as AMD's own platform demonstrator board not make it to the DIY segment?

This unnamed (label not clearly pictured) motherboard is built in the micro-ATX form-factor, drawing power from 24-pin ATX and 8-pin EPS power connectors. It uses a 7-phase CPU VRM. AMD appears to have introduced new voltage domains with AM4, probably because these are full-fledged SoCs, with core-logic completely integrated. The board features four DDR4 DIMM slots, and PCI-Express gen 3.0 slots. The B350 chipset wires to the SoC over PCI-Express gen 3.0, and puts out additional downstream general-purpose PCIe gen 3.0 lanes, besides additional SATA 6 Gb/s and USB 3.1 ports.

Source: Eteknix

GLOBALFOUNDRIES Announces its 7 nm FinFET Technology

GLOBALFOUNDRIES today announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology that will offer the ultimate in performance for the next era of computing applications. This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

GLOBALFOUNDRIES' new 7nm FinFET technology is expected to deliver more than twice the logic density and a 30 percent performance boost compared to today's 16/14nm foundry FinFET offerings. The platform is based on an industry-standard FinFET transistor architecture and optical lithography, with EUV compatibility at key levels. This approach will accelerate the production ramp through significant re-use of tools and processes from the company's 14nm FinFET technology, which is currently in volume production at its Fab 8 campus in Saratoga County, N.Y. GLOBALFOUNDRIES plans to make an additional mutli-billion dollar investment in Fab 8 to enable development and production for 7nm FinFET.

"The industry is converging on 7nm FinFET as the next long-lived node, which represents a unique opportunity for GLOBALFOUNDRIES to compete at the leading edge," said GLOBALFOUNDRIES CEO Sanjay Jha. "We are well positioned to deliver a differentiated 7nm FinFET technology by tapping our years of experience manufacturing high-performance chips, the talent and know-how of our former IBM Microelectronics colleagues and the world-class R&D pipeline from our research alliance. No other foundry can match this legacy of manufacturing high-performance chips."

Sony Launches AMD "Polaris" Powered PlayStation 4 Pro

Sony today announced an addition to its PlayStation family of entertainment systems, with the new PlayStation 4 Pro (PS4 Pro). The PS4 Pro isn't meant to succeed the PS4, and is still a "current generation" console, in that all of its games are compatible with the PS4, and there won't be PS4 Pro-exclusive games. What sets it apart is higher-resolution game rendering that looks best on 4K Ultra HD TVs. This doesn't necessarily mean that the games are being rendered at 3840 x 2160 pixels. They could be rendered at resolutions higher than 1080p, and using just the right upscaling algorithms, made to look significantly better than 1080p. Another key visual component is hardware HDR. The PS4 Pro falls in line with Sony's big push for 4K HDR TVs this holiday shopping season.

Under the hood, the PlayStation 4 Pro features an all new semi-custom SoC designed by Sony and AMD. The CPU component sticks to the "Jaguar/Puma" architecture, with 8 cores, but features higher CPU clock speeds. The 8 GB GDDR5 memory is said to run at higher clocks, too, and is bolstered by new lossless memory compression tech by AMD. The GPU component is where the action is. The GPU features over double the shading power of the PS4, and is based on the "Polaris" GPU architecture. The PS4 Pro also ships with a bigger 1 TB hard drive. There is seamless interplayability between PS4 and PS4 Pro. PS4 games you already own are being added with higher-resolution content meant for PS4 Pro. The console also has the muscle for PS-VR. For those still holding on to 1080p HDTVs, the PS4 Pro rewards with higher visual detail, more geometric complexity, and better effects, at that resolution. The PS4 Pro starts at $399.

SoftBank Completes Acquisition of ARM

SoftBank today announced that it has concluded the acquisition of British chipmaker ARM, in a USD $31 billion purchase. The acquisition was first announced in July 2016. Following this, ARM will be de-listed from the London Stock Exchange from the 6th of September 2016. Although ARM is a CPU architecture designer with a mere $1.5 billion in revenue last fiscal, and licenses the architecture to other SoC makers such as Qualcomm, Samsung, Apple, Huawei, etc., SoftBank is betting on ARM CPU architecture's emergence as the prime-mover of the IoT (Internet of things) revolution. This is SoftBank's largest tech acquisition following the $20 billion acquisition of American cellular network Sprint, and a $15 billion investment in Vodafone Japan.

Source: The Verge

Intel to Contract-manufacture ARM Processors at its Fabs

Intel is opening up its silicon manufacturing facilities to fabless chip-makers, beginning with the manufacture of ARM SoCs. The company entered a licensing deal with ARM that allows ARM SoC designers such as Qualcomm, Apple, and Samsung, to manufacture their SoCs at Intel fabs. Intel is among the first fabs with a working 14 nm node, and is on-track for sub-10 nm node development.

Intel had a crack at the market segments typically addressed by ARM SoCs, with its own x86 chips, which failed to see the kind of volumes ARM chipmakers were pushing. The company has now changed tactics to open its fabs up to those ARM SoC makers, letting them manufacture their designs on proven silicon-fabrication tech, in geographically important locations. Intel has its cutting-edge fabs located in Costa Rica and Malaysia.

Source: Bloomberg

SoC Powering Xbox One S Leverages 16 nm FinFET from TSMC

Microsoft's new slim Xbox One S console achieves its slimness - including its inbuilt power-supply, by significantly reducing thermal load of its key components. This begins at the heart of the console, its SoC. A semi-custom chip by Microsoft and AMD, the SoC powering the Xbox One S is built on the 16 nm FinFET process at TSMC. The chip powering the original Xbox One was built on the same foundry's 28 nm node.

The new SoC isn't merely an optical shrink of the original 28 nm chip down to 16 nm FinFET, Microsoft added a few components to the chip, including an HEVC hardware decoder, hardware CODECs for Blu-ray UHD with HDR; and a revamped display controller with HDMI 2.0 and HDCP 2.2. The chip also performs 1080p to 4K UHD upscaling, with a native upscaling algorithm. The eSRAM memory bandwidth is increased slightly from 204 GB/s from 219 GB/s.

Source: Eurogamer

Giada Announces N60E-O Intel Xeon-D Motherboards

Giada Technology, the industry leader in embedded systems and expert in server technology, today officially announces the N60E-O compact server for warm cloud storage applications powered by Intel Xeon-D processors which offer scalable performance on a tiny form factor.

Balancing value, performance and integration, the Giada N60E-O features an onboard Broadwell-DE based Xeon-D processor which is intended for entry-level enterprise storage applications particularly warm data storage. The Xeon D-1540 features 8-cores with 16 threads with an impressive TDP rating of 45W offering a great balance of performance and power draw making for a highly efficient setup.

Noctua Unveils Prototype Large Socket Heatsink for Xeon and Opteron Chips

Noctua unveiled a prototype fin-stack heatsink for very large CPU socket types, such as Intel Socket P (LGA3647) and AMD SP3, powering chips such as Intel Xeon Phi "Knights Landing," and upcoming AMD Opteron SP3 32-core SoCs. There will be 3U and 4U versions of this heatsink, supporting NF-A9 (92 mm) and NF-F12 (120 mm) fans. The heatsink is just a very large aluminium fin-stack, to which heat drawn from the base is fed by seven 8 mm thick nickel-plated copper heat pipes.

AMD "Summit Ridge" Die Pictured?

At its 2016 Annual Shareholders Meeting website, AMD reportedly posted a wafer shot of its upcoming 14 nm "Summit Ridge" CPU die. The "Summit Ridge" silicon is rumored to drive a number of performance-thru-enthusiast processor SKUs for AMD. The die pictured features eight CPU cores based on the "Zen" micro-architecture, a dual-channel DDR4 memory controller, 512 KB of L2 cache per core, and 16 MB of shared L3 cache split between two blocks of four CPU cores, each.

"Summit Ridge," much like the "Bristol Ridge" APU silicon, will be a true SoC, in that it integrates the southbridge on the processor die. With "Summit Ridge," AMD is also introducing a new inter-socket interconnect replacing its ageing HyperTransport technology. The new Global Memory Interconnect (GMI) bus provides a 100 GB/s path between two sockets. The "Summit Ridge" die features two such interconnect ports.

Source: SemiAccurate

BIOSTAR Announces New Motherboards with "Braswell" Refresh Processors

BIOSTAR proudly announces a new line up of motherboards featuring the new 14nm Intel Braswell Refresh SoC processors that feature many improvements from its older 22nm counterpart Baytrail SoC. The new 14nm processors offer a more efficient yet powerful experience than its predecessor whilst consuming less power and producing less heat. The various improvements also introduce new performance enhancements for both CPU and GPU guaranteeing a more refined visual experience.

With the new processor architecture comes new enhancements over the older-generation of processors. Besides improvements in processing speed, Braswell Refresh boasts a new 14nm fabrication process which gives the SoC a smaller die that needs less power (6w) and produces less heat. A heavily improved 8th-gen Intel HD Graphics processor with 12 Execution Units (EUs) is baked into the SoC compared to the 4 EUs of the older gen model. Connectivity is also improved with native support for DDR3L-1600 speeds, SATAIII and up to 4 USB3.0 devices.

JEDEC Updates Universal Flash Storage (UFS) and Related Standards

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of several key updates to the Universal Flash Storage (UFS) family of standards. These include JESD220C UFS version 2.1, JESD223C UFSHCI version 2.1, JESD220-1A UFS UME version 1.1 and JESD223-1A UFSHCI UME version 1.1.

Developed for mobile applications and computing systems requiring high performance with low power consumption, the new UFS updates offer key improvements over earlier versions which will provide data security through the use of inline cryptography between the SoC and UFS Storage device. All four updated standards are available for free download from the JEDEC website.

AMD Announces the A10-7890K and Athlon X4 880K Processors

AMD today announced new additions to its 2016 Desktop processor family, offering increasingly powerful processor options available for anyone seeking outstanding gameplay and power efficiency for their desktop PC. Setting a new APU Standard, the new AMD A10-7890K is the fastest AMD desktop APU released to date, with 1.0 TFLOPS of theoretical compute performance. This new processor has been paired with the top-of-the-line AMD Wraith Cooler to deliver a high-performance combination, enabling best-in-class online gaming, while offering near silent operation for a premium experience.

Gamers will be able to enjoy playing the most popular online and eSports games right out of the box on high settings with the new AMD A10-7890K APU, which is capable of providing smooth frame rates in some of the most popular online games like League of Legends, DOTA2, and Counter Strike: Global Offensive. AMD APUs combine the power of AMD processors with the performance of discrete Radeon R7 class graphics in one convenient SoC, and support DirectX 12, OpenGL, Vulkan, and FreeSync in addition to Microsoft Xbox One game streaming on Windows 10.

AMD Expands Low-Power G-Series Processor Family

At Embedded World today, AMD announced its 3rd Generation AMD Embedded G-Series SoCs and the Embedded G-Series LX SoC, providing customers a broadened portfolio of performance options. The latest offerings expand developers' ability to scale x86 platforms, starting with the entry-level AMD Embedded G-Series LX SoC, which is pin compatible to the previous generation G-Series SoC devices. Also announced today are two new, higher performing 3rd Generation AMD Embedded G-Series SoCs, codenamed "Prairie Falcon" and "Brown Falcon," which introduce for the first time pin compatibility for G-Series processors with the higher performance AMD Embedded R-Series SoC.

The new products expand upon the low power capabilities of the award-winning AMD Embedded G-Series SoC platform, bringing scalable performance, power, and price across the CPU, GPU, multimedia, and I/O controller hardware, helping to lower development costs for AMD customers. Together, the new G-Series processors deliver immersive, graphically rich experiences across a broad range of platforms, from entry-level to mainstream gaming, digital signage, imaging, and industrial control.

Intel Gets Sixteen "Broadwell" Cores to Run at 45W TDP

The latest Intel Xeon D-1571 SoC, designed for high-density data-centers and micro-servers, sets a new benchmark for energy efficiency. If the fact that it's an SoC (a combination of CPU and chipset) wasn't enough, the chip also crams in 16 CPU cores based on the "Broadwell" architecture, with HyperThreading enabling 32 logical CPUs, running at 1.30 GHz clock speed, a dual-channel DDR4 memory controller that supports up to 128 GB ECC DDR4 memory, and 24 MB of shared L3 cache; all at a TDP rated at just 45W. On most high-density server boards, such as the X10SDV-series by Supermicro (pictured below), the chip will cooled by just a small fan-heatsink. Such specs won't come cheap. Server board vendors will buy the Xeon D-1571 at $1,222 a piece in 1000-unit quantities.

Source: CPU World

Jim Keller to Lead Autopilot Hardware Team at Tesla Motors

Elon Musk handed over the reins of one of Tesla Motors' most important research and development divisions, autopilot, to chip whiz Jim Keller. Keller joined Tesla Motors as Vice President of Autopilot Hardware Engineering. With Tesla being at the very frontier of automobile development, and self-driving cars being the next big thing for the industry, Keller holds an enviable, albeit challenging position.

Jim Keller led teams that designed some of AMD's most commercially successful processors, before a stint at Apple, where he helped it gain hardware self-reliance with the company's Ax series SoCs; and returning to AMD, and leading the team that designed the company's upcoming "Zen" and K-12 micro-architectures. Tesla cars are currently driven by electronics powered by NVIDIA Tegra SoCs. With NVIDIA's immeasurable investments in deep-learning tech that forms the foundation of self-driving car hardware, and Tesla Motors yet choosing a CPU designer to lead its autopilot division, it's easy to speculate that Musk's company is seeking the same kind of hardware self-reliance that Apple did, as its iOS devices were taking off.

Source: Electrek
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