News Posts matching "SoC"

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Latest Intel Roadmap Slide Leaked, Next Core X is "Cascade Lake-X"

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

Source: MyDrivers

Samsung Starts Mass Production of its 2nd Generation 10nm FinFET

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).

10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early). As this process is derived from the already proven 10LPE technology, it offers competitive advantages by greatly reducing turn-around time from development to mass production and by providing significantly higher initial manufacturing yield. SoCs designed with 10LPP process technology will be used in digital devices scheduled to launch early next year and are expected to become more widely available throughout the year.

Researchers Find Glaring Intel ME Security Flaws, Company Outs Detection Tool

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

Source: Wired

Intel NUC Based on Intel+Vega MCM Leaked

The first product based on Intel's ambitious "Kaby Lake-G" multi-chip module, which combines a quad-core "Kaby Lake-H" die with a graphics die based on AMD "Vega" architecture, will be a NUC (next unit of computing), and likely the spiritual successor to Intel's "Skull Canyon" NUC. The first picture of the motherboard of this NUC was leaked to the web, revealing a board that's only slightly smaller than the mini-ITX form-factor.

The board draws power from an external power brick, and appears to feature two distinct VRM areas for the CPU and GPU components of the "Kaby Lake-G" MCM SoC. The board feature two DDR4 SO-DIMM slots which are populated with dual-channel memory, and an M.2 NVMe slot, holding an SSD. There are two additional SATA 6 Gb/s ports, besides a plethora of other connectivity options.

Source: ChipHell

Colorful Intros Unique C.J1900A-BTC PLUS V20 Mining Motherboard

Colorful today introduced the uniquely designed C.J1900A-BTC PLUS V20 motherboard for mining rigs. This odd-ball form-factor board is designed for makeshift racks, and removes the need for PCIe riser cables. The board itself is a large PCB with nine PCI-Express x16 slots with 1-slot spacing, of which eight can be used for installing your mining graphics cards (x1 wiring), while the slot on the middle (blue), isn't really a PCI-Express slot.

The blue slot has custom wiring for the business end of the motherboard, a riser card which houses the Celeron J1900 SoC, a DDR4 SO-DIMM slot, an mSATA 6 Gb/s slot for your SSD, and the board's main connectivity, which includes two USB 2.0 ports, two gigabit Ethernet interfaces, and an HDMI display output. If you have trouble finding an mSATA SSD in 2017, there's also a standard SATA 6 Gb/s port. The riser draws power from a 4-pin ATX input. The main PCB has eight 6-pin PCIe power inputs, which wire out to 6-pin PCIe outputs near each black slot. This is more of a cable-management feature, smaller (20 cm long) male-to-male 6-pin PCIe cables connect the outputs to the graphics cards.

Broadcom Looks to Buy Qualcomm for $100B, Creating a Silicon Monster

Broadcom, makers of networking equipment, is exploring a deal to acquire mobile technology giant Qualcomm in a USD $100 billion deal, which could be the largest ever acquisition value of a chip-maker. The resulting company could be the world's largest chipmaker, combining Broadcom's IP with networking PHYs and IoT infrastructure, and Qualcomm's SoCs powering IoT devices besides smartphones, tablets, and ultra-portable notebooks. Broadcom is looking to raise a cash+stock bid consisting of shares valued at $70/share. Besides networking infrastructure equipment, Broadcom made its fortunes on the back of Apple iPhone's success, as it supplies its networking chips.

Source: Bloomberg

ASRock Rack Intros C3758D4I-4L Mini-ITX Motherboard with Atom 8-core SoC

ASRock Rack, a new division of ASRock which deals with enterprise-grade motherboards, introduced the C3758D4I-4L, a mini-ITX motherboard based on the Atom C3758 "Denverton" SoC that embeds an 8-core CPU clocked at 2.20 GHz, 16 MB of cache, and a dual-channel DDR4 integrated memory controller supporting up to 256 GB of ECC memory, topped off with a 25W TDP. These specs lend Denverton quasi-enterprise credentials. The C3758D4I-4L can be used for low-cost rack-mount web-servers, or even high-end DIY NAS or home-server builds.

The C3758D4I-4L comes with a factory-fitted fan-heatsink cooling the pre-installed Atom C3758 BGA SoC. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors (including a 4-pin connector for external 12V). The SoC is wired to four DDR4 DIMM slots, supporting up to 128 GB of dual-channel ECC memory; and a PCI-Express 3.0 x8 slot. Storage connectivity includes a staggering 13 SATA 6 Gbps ports, five on board, eight via two mini SAS connectors. An ASPeed AST2500 provides display, legacy I/O, and remote management. The board features a staggering five 1 GbE connections with teaming, PXE, and NCSI support. The company didn't reveal pricing.

Tesla Motors Develops Semi-custom AI Chip with AMD

Tesla Motors, which arguably brought electric vehicles to the luxury-mainstream, is investing big in self-driving cars. Despite its leader Elon Musk's fears and reservations on just how much one must allow artificial intelligence (AI) to develop, the company realized that a true self-driving car cannot be made without giving the car a degree of machine learning and AI, so it can learn its surroundings in real-time, and maneuver itself with some agility. To that extent, Tesla is designing its own AI processor. This SoC (system on chip) will be a semi-custom development, in collaboration with the reigning king of semi-custom chips, AMD.

AMD has with it a clear GPGPU performance advantage over NVIDIA, despite the latter's heavy investments in deep-learning. AMD is probably also banking on good pricing, greater freedom over the IP thanks to open standards, and a vast semi-custom track-record, having developed semi-custom chips with technology giants such as Sony and Microsoft. Musk confirmed that the first car in which you can simply get in, fall asleep, and wake up at your destination, will roll out within two years, hinting at a 2019 rollout. This would mean a bulk of the chip's development is done.

Source: CNBC

Intel "Coffee Lake" Platform Detailed - 24 PCIe Lanes from the Chipset

Intel seems to be addressing key platform limitations with its 8th generation Core "Coffee Lake" mainstream desktop platform. The first Core i7 and Core i5 "Coffee Lake" processors will launch later this year, alongside motherboards based on the Intel Z370 Express chipset. Leaked company slides detailing this chipset make an interesting revelation, that the chipset itself puts out 24 PCI-Express gen 3.0 lanes, that's not counting the 16 lanes the processor puts out for up to two PEG (PCI-Express Graphics) slots.

The PCI-Express lane budget of "Coffee Lake" platform is a huge step-up from the 8-12 general purpose lanes put out by previous-generation Intel chipsets, and will enable motherboard designers to cram their products with multiple M.2 and U.2 storage options, besides bandwidth-heavy onboard devices such as additional USB 3.1 and Thunderbolt controllers. The chipset itself integrates a multitude of bandwidth-hungry connectivity options. It integrates a 10-port USB 3.1 controller, from which six ports run at 10 Gbps, and four at 5 Gbps.

MSI Intros the B350M/A320M Pro-VD Motherboards

MSI introduced the B350M Pro-VD and A320M Pro-VD socket AM4 motherboards. Built in the slim micro-ATX form-factor, the two boards are nearly identical, and differ only with the chipset (AMD B350 and A320). The boards draw power from a combination of 24-pin ATX and 8-pin EPS power connectors; conditioning it for the AM4 SoC with a 6-phase VRM. The APU socket is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel DDR4 memory; a PCI-Express 3.0 x16 slot, and both of the boards' PCIe x1 slots. Two of the four SATA 6 Gbps ports on the boards come from the AM4 SoC. Display outputs include DVI and D-Sub. Gigabit Ethernet and 6-channel HD audio make for the rest of them. The only feature the B350M Pro-VD offers over its A320-based twin is support for CPU overclocking. The two could feature sub-$80 price-points.

GIGABYTE Intros MZ30-AR0 Motherboard for AMD EPYC

GIGABYTE introduced the MZ30-AR0 motherboard for single-socket AMD EPYC processor-powered servers and workstations. The motherboard is built in the E-ATX form-factor, and features a single SP3r2 socket, for AMD EPYC 7000-series processors. Given that EPYC is a full-fledged SoC, the board has no chipset. An ASpeed AST2500 remote-management chip puts out basic display and IPMI features. The board draws power from two 8-pin EPS connectors, besides the 24-pin ATX. The CPU socket is flanked by 16 DDR4 DIMM slots, which support up to 512 GB of octa-channel DDR4 memory.

Expansion slots include four PCI-Express 3.0 x16 with full-time x16 wiring, one x16 with x8 wiring, and two x8 slots. Storage connectivity includes four slimSAS 12 Gb/s ports, which put out sixteen SATA 6 Gb/s ports, and a 32 Gb/s M.2 slot. Networking is care of two 10 GbE ports driven by a Broadcom BCM57810S processor, and a single GbE port. There's no onboard audio or even USB 3.1 ports.

Intel "Gemini Lake" SoC Detailed

Intel is giving final touches to its next-generation "Gemini Lake" SoC, which will be sold under the Celeron and Pentium brands, and will succeed the current-generation "Apollo Lake" SoC. Built on a refined 14 nm process, the chip features a TDP of just 6W for the mobile variant, and 10W for the SFF desktop, but boasts of improved performance-per-Watt than its predecessor, translating into direct performance gains.

To begin with, "Gemini Lake" will embed a dual-core or quad-core CPU based on Intel's "Goldmont Plus" micro-architecture. A Goldmont Plus core isn't physically different from the current-gen "Goldmont," but apparently doubles the L2 cache to 4 MB from the existing 2 MB, and takes advantage of process-level improvements to lower power-draw, which Intel is using to bump up the CPU clock speeds.

AMD Talks Improved Ryzen Memory Support, Ryzen 3, and Game Optimization

AMD, in an interview with Forbes, confirmed that it is working to improve DDR4 memory support of its Ryzen series processors, to enable higher memory clocks. AMD Ryzen users find it difficult to get DDR4 memory clocks to run above 3000 MHz reliably. With memory clock being linked with the chip's Infinity Fabric clock (the interconnect between two CCX units on the "Summit Ridge" silicon), the performance incentives for higher memory clocks are just that much more.

AMD confirmed that its AGESA update for May improves DDR4 memory compatibility, although it also stressed on the need for motherboard manufacturers to improve their board designs in the future, with more PCB layers and better copper traces between the DIMM slots and the SoC socket. The company assures that more updates to AGESA are in the pipeline, and would improve performance of Ryzen processors at various levels. The AGESA updates are dispensed through motherboard vendors as BIOS updates.

Shuttle Unveils XC60J IPC Powered by Intel "Apollo Lake" Celeron SoC

Shuttle Inc., the global leader in small form factor computer technology, announces the latest Intel Apollo lake platform, XC60J support with 8 COM ports to power highly interactive Kiosk, vending machine, POS and more. The XC60J is the first 3-liter model with fanless design, powered by Intel Celeron J3355. With built-in Intel HD Graphics and processor, the XC60J can support 4K/Ultra HD video playback and HEVC/H.265 high definition video playback.

With one built-in M.2 2280 Type M and one M.2 2230 Type A/E expansion slots, you can easily install an M.2 SSD, Wi-Fi module or other compatible devices. The XC60J is highly connectable with multiple I/O: USB 2.0, USB 3.0, HDMI, DisplayPort, SATA 6Gbps, COM, and Intel Dual Gigabit LAN ports. Seven RS232 and one RS232/RS422/RS485 ports which support 0V/5V/12V. Connect to barcode scanners, receipt printers, keypads, and other peripherals makes XC60J easily configured into peripheral-heavy POS, Kiosk, and Digital Signage systems.

ASUS Unveils the TinkerBoard to Rival Raspberry Pi and Intel Edison

As the world's number one PC motherboard manufacturer by volume, it would be a shame if ASUS didn't pander to the budding engineers and electronics hobbyists among you with a product that rivals the Raspberry Pi and Intel Edison. That product is the TinkerBoard, a card-sized single-board computer with a ton of I/O, including support for 4K Ultra HD displays. At the heart of this board is a Rockchip RK3288 SoC, which embeds a 32-bit quad-core ARM Cortex-A17 CPU, and a Mali T764 GPU. This chip is topped off by 2 GB of dual-channel memory. The most prominent Raspberry Pi competitor to this board is the Pi 3 Model B, with its 64-bit Broadcom BCM2837 chip, and a starting price of just $35.

Other features of the TinkerBoard include a GPIO that rivals Raspberry Pi, 4K Ultra HD H.264 video decode capability, gigabit Ethernet, SDIO 3.0, 24-bit/192 kHz HD audio, and a swappable antenna for its 802.11 b/g/n WLAN. While the specifications check out well in favor of the TinkerBoard, it all comes down to pricing. Hobbyists working on robotics projects, for example, purchase Raspberries Pi by the dozens thanks to their low price. ASUS should do well to keep that in mind when pricing this board.

AMD "Zen" Based APUs Later This Year

An AMD representative, responding to a Reddit question on AMD Ryzen branding, confirmed that the company will launch Mobile SoCs (APUs) based on the "Zen" micro-architecture later this year. The logical next-step for AMD with "Zen" beyond "Summit Ridge" has been to combine one or more quad-core "Zen" CCX (CPU complexes) with an integrated graphics core based on one of its newer GPU architectures ("Polaris" or "Vega").

The AMD representative confirmed that the company will launch mobile SoCs that combine "Zen" CPU cores with an integrated GPU, in the second half of 2017. This could hint at the availability of "Zen" powered notebooks, of all shapes and sizes by Holiday 2017. Over the year, AMD will begin launching "Zen" based products, starting off with 8-core high-end Ryzen 7 processors on March 2nd, six-core and some of the higher-end quad-core Ryzen 5 series processors in Q2-2017, and some of the lower-end quad-core Ryzen 3 parts in the second-half of 2017, now joined by mobile SoCs around the same time.

Source: Reddit

Intel Unveils Compute Card, a Credit Card-Sized Compute Platform

Today, Intel is announcing a new modular compute platform called the Intel Compute Card along with a range of partners who will be working with Intel to help accelerate the ecosystem of solutions based on the Intel Compute Card. Intel has been a leader in delivering technology to help realize the benefits of the Internet of Things and enable more smart and connected devices. The Intel Compute Card is being developed with that in mind, to transform the way compute and connectivity can be integrated and used in future devices.

ECS Readies Liva Z Mini-PC with Intel "Apollo Lake" SoC

ECS is giving final touches to a the new Liva Z mini-PC featuring Intel "Apollo Lake" Pentium and Celeron SoCs. The desktop could come with Pentium J4205, Celeron J3455, and Celeron J3355 options. The J4205 and J3455 feature quad-core "Goldmont" CPUs running at 1.50 GHz, but differ with integrated GPUs and Turbo Boost frequencies. The J4205 features 18 execution units (EUs), maximum iGPU clocks of 800 MHz, and 2.60 GHz maximum CPU Turbo Boost; while the J3455 features 12 EUs, 750 MHz maximum iGPU clock, and 2.30 GHz maximum CPU Turbo Boost frequency. The J3355 features a dual-core "Goldmont" CPU running at 2.00 GHz with 2.50 GHz Turbo Boost, and an iGPU with 12 EUs, with 700 MHz maximum clocks.

The upcoming ECS Liva Z "Apollo Lake" also comes with two DDR3 SO-DIMM slots supporting up to 8 GB of memory, integrated eMMC storage options of 32 GB and 64 GB (for the OS), and an M.2-2280 slot for internal storage expansion. Display outputs include mini-DisplayPort and HDMI. Network connectivity includes two gigabit Ethernet interfaces, and a WLAN controller with 802.11ac and Bluetooth 4.0 support. The rest of its connectivity includes three USB 3.1 type-A ports, and one USB 3.1 type-C port. The company didn't reveal pricing or availability.

Source: FanlessTech

FinalWire Announces AIDA64 v5.80

Today FinalWire released a new stable update to the desktop editions of its popular system information software. AIDA64 v5.80 supports the latest Windows 10 builds and the most recent hardware components, including the AMD RX 400 series and NVIDIA's GTX 1050 GPUs.

As a new feature, it now allows users to define global hotkeys with which they can enable or disable the AIDA64 hardware monitoring panels or switch between multiple hardware information pages on external displays, even when AIDA64 is running in the background. Using these customized key combinations, PC enthusiasts can also start and stop saving temperature, voltage and power measurements as well as fan RPM readouts to a CSV or HTML log file. The developers have made AIDA64 v5.80 DPI aware so that all elements of its graphical user interface scale properly when the DPI zoom is active in Windows. In practice, this means that users will see no more blurry or incorrectly sized graphics or text on high-resolution screens as AIDA64 now looks crisp even on 4K and 8K LCD and OLED displays.

DOWNLOAD: FinalWire AIDA64 v5.80 Installer | FinalWire AIDA64 v5.80 ZIP Package

AMD's Q3 2016 Earnings Call - Revenue is Up, Debt is Down

AMD today released their earnings call for 3Q 2016, giving us some interesting tidbits in regards to their financial robustness. The balance of AMD's economics seems to be pending towards better execution, and, coeteris paribus, a much better outlook for the coming quarters, after the monumental missteps in the past that almost threw AMD under the proverbial bus. Reception for the results seems to be a tangled mess, however, with some sides claiming that AMD beat expectations, while others prefer to draw attention to AMD's 2% stock decline since the report was outed.

AMD posted revenue of $1,307 million, up 27% sequentially and 23% year-over-year. This revenue was distributed unevenly through AMD's divisions, though. "Computing and Graphics" segment revenue was $472 million, up 9% from Q2 2016, primarily due to increased GPU sales (where Polaris picked up the grunt of the work, being responsible for 50% of AMD's GPU revenue), offset by lower sales of client desktop processors and chipsets; whereas "Enterprise, Embedded and Semi-Custom" segment revenue was $835 million, up 41% sequentially, primarily due to record semi-custom SoC sales (such as those found in Microsoft's XBOX One and Sony's PS4 and upcoming PS4 Pro).

Samsung Begins Mass-production of First SoC on 10-nanometer FinFET Node

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry. Following the successful mass production of the industry's first FinFET mobile application processor (AP) in January, 2015, Samsung extends its leadership in delivering leading-edge process technology to the mass market with the latest offering.

"The industry's first mass production of 10 nm FinFET technology demonstrates our leadership in advanced process technology," said Jong Shik Yoon, Executive Vice President, Head of Foundry Business at Samsung Electronics. "We will continue our efforts to innovate scaling technologies and provide differentiated total solutions to our customers."

NVIDIA Announces Xavier, Volta-based Autonomous Transportation SoC

At its inaugural European edition of the Graphics Technology Conference (GTC), NVIDIA announced Xavier, an "AI supercomputer for the future of autonomous transportation." An evolution of its Drive PX2 board that leverages a pair of "Maxwell" GPUs with some custom logic and an ARM CPU, to provide cars with the compute power necessary to deep-learn the surroundings and self-drive, or assist-drive; Xavier is a refinement over Drive PX2 in that it merges three chips - two GPUs and one control logic into an SoC.

You'd think that NVIDIA refined its deep-learning tech enough to not need a pair of "Maxwell" SoCs, but Xavier is more than that. The 7 billion-transistor chip built on 16 nm FinFET process, offers more raw compute performance thanks to leveraging NVIDIA's next-generation "Volta" architecture, one more advanced than even its current "Pascal" architecture. The chip features a "Volta" GPU with 512 CUDA cores. The CVA makes up the vehicle I/O, while an image processor that's capable of 8K HDR video streams feeds the chip with visual inputs from various cameras around the vehicle. An 8-core ARM CPU performs general-purpose compute. NVIDIA hopes to get the first engineering samples of Xavier out to interested car-makers by Q4-2017.

GIGABYTE AMD B350 Socket AM4 Motherboard Pictured

Here are some of the first pictures of a socket AM4 motherboard by GIGABYTE. Positioned as an entry-mainstream offering by the company to launch with AMD's 7th generation A-series "Bristol Ridge" APUs, while being ready for upcoming "ZEN" based CPUs and APUs, this board appears to be based on AMD B350 chipset, the company's mid-tier socket AM4 chipset alongside the entry-level A320 and enthusiast-segment X370. This board appears to feature a rectangular CPU cooler retention-module like older AMD sockets. Could the "square" bolt-type RM we spotted on OEM boards, as well as AMD's own platform demonstrator board not make it to the DIY segment?

This unnamed (label not clearly pictured) motherboard is built in the micro-ATX form-factor, drawing power from 24-pin ATX and 8-pin EPS power connectors. It uses a 7-phase CPU VRM. AMD appears to have introduced new voltage domains with AM4, probably because these are full-fledged SoCs, with core-logic completely integrated. The board features four DDR4 DIMM slots, and PCI-Express gen 3.0 slots. The B350 chipset wires to the SoC over PCI-Express gen 3.0, and puts out additional downstream general-purpose PCIe gen 3.0 lanes, besides additional SATA 6 Gb/s and USB 3.1 ports.

Source: Eteknix

GLOBALFOUNDRIES Announces its 7 nm FinFET Technology

GLOBALFOUNDRIES today announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology that will offer the ultimate in performance for the next era of computing applications. This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

GLOBALFOUNDRIES' new 7nm FinFET technology is expected to deliver more than twice the logic density and a 30 percent performance boost compared to today's 16/14nm foundry FinFET offerings. The platform is based on an industry-standard FinFET transistor architecture and optical lithography, with EUV compatibility at key levels. This approach will accelerate the production ramp through significant re-use of tools and processes from the company's 14nm FinFET technology, which is currently in volume production at its Fab 8 campus in Saratoga County, N.Y. GLOBALFOUNDRIES plans to make an additional mutli-billion dollar investment in Fab 8 to enable development and production for 7nm FinFET.

"The industry is converging on 7nm FinFET as the next long-lived node, which represents a unique opportunity for GLOBALFOUNDRIES to compete at the leading edge," said GLOBALFOUNDRIES CEO Sanjay Jha. "We are well positioned to deliver a differentiated 7nm FinFET technology by tapping our years of experience manufacturing high-performance chips, the talent and know-how of our former IBM Microelectronics colleagues and the world-class R&D pipeline from our research alliance. No other foundry can match this legacy of manufacturing high-performance chips."

Sony Launches AMD "Polaris" Powered PlayStation 4 Pro

Sony today announced an addition to its PlayStation family of entertainment systems, with the new PlayStation 4 Pro (PS4 Pro). The PS4 Pro isn't meant to succeed the PS4, and is still a "current generation" console, in that all of its games are compatible with the PS4, and there won't be PS4 Pro-exclusive games. What sets it apart is higher-resolution game rendering that looks best on 4K Ultra HD TVs. This doesn't necessarily mean that the games are being rendered at 3840 x 2160 pixels. They could be rendered at resolutions higher than 1080p, and using just the right upscaling algorithms, made to look significantly better than 1080p. Another key visual component is hardware HDR. The PS4 Pro falls in line with Sony's big push for 4K HDR TVs this holiday shopping season.

Under the hood, the PlayStation 4 Pro features an all new semi-custom SoC designed by Sony and AMD. The CPU component sticks to the "Jaguar/Puma" architecture, with 8 cores, but features higher CPU clock speeds. The 8 GB GDDR5 memory is said to run at higher clocks, too, and is bolstered by new lossless memory compression tech by AMD. The GPU component is where the action is. The GPU features over double the shading power of the PS4, and is based on the "Polaris" GPU architecture. The PS4 Pro also ships with a bigger 1 TB hard drive. There is seamless interplayability between PS4 and PS4 Pro. PS4 games you already own are being added with higher-resolution content meant for PS4 Pro. The console also has the muscle for PS-VR. For those still holding on to 1080p HDTVs, the PS4 Pro rewards with higher visual detail, more geometric complexity, and better effects, at that resolution. The PS4 Pro starts at $399.
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