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AMD X570 Unofficial Platform Diagram Revealed, Chipset Puts out PCIe Gen 4

AMD X570 is the company's first in-house design socket AM4 motherboard chipset, with the X370 and X470 chipsets being originally designed by ASMedia. With the X570, AMD hopes to leverage new PCI-Express gen 4.0 connectivity of its Ryzen 3000 Zen2 "Matisse" processors. The desktop platform that combines a Ryzen 3000 series processor with X570 chipset is codenamed "Valhalla." A rough platform diagram like what you'd find in motherboard manuals surfaced on ChipHell, confirming several features. To maintain pin-compatibility with older generations of Ryzen processors, Ryzen 3000 has the same exact connectivity from the SoC except two key differences.

On the AM4 "Valhalla" platform, the SoC puts out a total of 28 PCI-Express gen 4.0 lanes. 16 of these are allocated to PEG (PCI-Express graphics), configurable through external switches and redrivers either as single x16, or two x8 slots. Besides 16 PEG lanes, 4 lanes are allocated to one M.2 NVMe slot. The remaining 4 lanes serve as the chipset bus. With X570 being rumored to support gen 4.0 at least upstream, the chipset bus bandwidth is expected to double to 64 Gbps. Since it's an SoC, the socket is also wired to LPCIO (SuperIO controller). The processor's integrated southbridge puts out two SATA 6 Gbps ports, one of which is switchable to the first M.2 slot; and four 5 Gbps USB 3.x ports. It also has an "Azalia" HD audio bus, so the motherboard's audio solution is directly wired to the SoC. Things get very interesting with the connectivity put out by the X570 chipset.
Update May 21st: There is also information on the X570 chipset's TDP.
Update May 23rd: HKEPC posted what looks like an official AMD slide with a nicer-looking platform map. It confirms that AMD is going full-tilt with PCIe gen 4, both as chipset bus, and as downstream PCIe connectivity.

U.S. Tech Industry, Including Google, Microsoft, Intel, and Qualcomm, Ban Huawei

The United States tech industry has overnight dealt a potentially fatal blow to Chinese electronics giant Huawei, by boycotting the company. The companies are establishing compliance with a recent Executive Order passed by President Donald Trump designed to "stop the import, sale, and use of equipment and services by foreign companies based in countries that are potential adversaries to U.S. interests," particularly information technology security. Google has announced that it will no longer allow Huawei to license Android, and will stop updates and Google Play access to Huawei smartphones. Huawei can still equip its phones with open-source Android, but it cannot use Google's proprietary software, including Google Play Store, Chrome, and all the other Google apps. Intel decided to no longer supply processors and other hardware to Huawei, for use in its laptops and server products. Sales of AMD processors will stop, too. Qualcomm-Broadcom have decided to stop supply of mobile SoCs and network PHYs, respectively. Microsoft decided to stop licensing Huawei to use Windows and Office products.

The ban is a consequence of the U.S. Government placing Huawei on a list of banned entities, forcing all U.S. companies to abandon all trade with it, without prior approval from the Department of Commerce. Trade cuts both ways, and not only are U.S. firms banned from buying from Huawei, they're also banned from selling to it. Huawei "buys from" over 30 U.S. companies, (for example, Windows licenses from Microsoft). CNN reports that U.S. firms could lose up to $11 billion in revenues.

BIOSTAR Racing X570GT8 Zen 2 Motherboard Pictured and Detailed

MSI, without naming its product, teased its MEG X570 Ace motherboard late last week, obeying the cardinal rules of a teaser, such as not putting out clear pictures or names. BIOSTAR probably wanted to do something similar, but ended up leaking glaring details and pictures of its flagship socket AM4 motherboard based on the AMD X570 chipset, the Racing X570GT8. The X570 is AMD's first in-house design chipset for the AM4 socket after "Promontory" and FM2-based "Bolton," supplied by ASMedia. It was necessitated by the need to get downstream PCIe connectivity from the chipset to be certified for the latest generations (gen 3.0 or later), by AMD, and overcome many of the connectivity limitations of ASMedia "Promontory," from which AMD carved out previous socket AM4 chipsets.

Design compulsions of being a flagship product aside, there are signs of a clear focus on strengthening the CPU VRM on the Racing X570GT8, to cope with the rumored Ryzen 9 series 16-core "Zen 2" processor. The board draws power from a combination of 24-pin ATX and 8+4 pin EPS connectors, conditioning it for the processor with a 12-phase VRM. There are two metal-reinforced PCI-Express x16 slots wired to the AM4 SoC, and we get the first glimpse of the PCI-Express gen 4.0 lane switching and re-driver circuitry. We haven't seen anything to suggest that the downstream PCIe lanes from the X570 chipset are gen 4.0, yet, but we expect them to at least be gen 3.0. The presence of three M.2 slots bodes well for the downstream PCIe lane count. ASMedia "Promontory" puts out a paltry eight gen 2.0 lanes. It's also interesting to see an active fan-heatsink cooling the X570 chipset, indicating a rather high TDP compared to the 3-5 Watt TDP of the 400-series "Promontory" low-power variant chipsets. The component choices by BIOSTAR look premium and are a callback to its T-Power glory days enthusiasts remember.

AMD Ryzen 3000 "Zen 2" a Memory OC Beast, DDR4-5000 Possible

AMD's 3rd generation Ryzen (3000-series) processors will overcome a vast number of memory limitations faced by older Ryzen chips. With Zen 2, the company decided to separate the memory controller from the CPU cores into a separate chip, called "IO die". Our resident Ryzen memory guru Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen, found technical info that confirms just how much progress AMD has been making.

The third generation Ryzen processors will be able to match their Intel counterparts when it comes to memory overclocking. In the Zen 2 BIOS, the memory frequency options go all the way up to "DDR4-5000", which is a huge increase over the first Ryzens. The DRAM clock is still linked to the Infinity Fabric (IF) clock domain, which means at DDR4-5000, Infinity Fabric would tick at 5000 MHz DDR, too. Since that rate is out of reach for IF, AMD has decided to add a new 1/2 divider mode for their on-chip bus. When enabled, it will run Infinity Fabric at half the DRAM actual clock (eg: 1250 MHz for DDR4-5000).

Announcing DRAM Calculator for Ryzen v1.5.0 with an Integrated Benchmark

Yuri "1usmus" Bubliy, who practically wrote the book on AMD Ryzen memory overclocking, presents DRAM Calculator for Ryzen v1.5.0, the latest version of the most powerful tool available to help you overclock memory on PCs powered by AMD Ryzen processors. The biggest feature-addition is MEMBench, a new internal memory benchmark that tests performance of your machine's memory sub-system, and can be used to test the stability of your memory overclock. Among the other feature-additions include the "Compare Timings" button, which gives you a side-by-side comparison of your machine's existing settings, with what's possible or the settings you've arrived at using the app.

Motherboards vary by memory slot topology, and DRAM Calculator for Ryzen can now be told what topology your board has, so it can better tune settings such as procODT and RTT. The author also de-cluttered the main screen to improve ease of use. Among the under-the-hood changes are improved SoC voltage prediction for each generation of Ryzen. The main timing calculation and prediction algorithms are improved with the addition of the likes of GDM prediction. Also added is support for 4-DIMM system configurations. A bug in which the imported HTML profiles were automatically assumed to be specific to Samsung b-die mode. A number of minor changes were made, detailed in the change-log below.

DOWNLOAD: DRAM Calculator for Ryzen by 1usmus

BIOSTAR Presents A68N-5600E For Home Entertainment and Everyday Computing

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, introduces the new A68N-5600E SoC motherboard featuring a power efficient AMD PRO A4-3350B Processor and AMD Radeon R4 graphics. The BIOSTAR A68N-5600E is perfect for home entertainment and everyday home computing from web browsing to basic office applications. Watch videos on Netflix and YouTube with high-definition and immersive visuals, thanks to the AMD Radeon graphics, and high-resolution display with HDMI support. The A68N-5600E sports an ultra-compact Mini-ITX form factor, perfect for small-form-factor PCs and HTPCs.

AMD Reports First Quarter 2019 Financial Results- Gross margin expands to 41%, up 5 percentage points year-over-year

AMD today announced revenue for the first quarter of 2019 of $1.27 billion, operating income of $38 million, net income of $16 million and diluted
earnings per share of $0.01. On a non-GAAP(*) basis, operating income was $84 million, net income was $62 million and diluted earnings per share was $0.06.

"We delivered solid first quarter results with significant gross margin expansion as Ryzen and EPYC processor and datacenter GPU revenue more than doubled year-over-year," said Dr. Lisa Su, AMD president and CEO. "We look forward to the upcoming launches of our next-generation 7nm PC, gaming
and datacenter products which we expect to drive further market share gains and financial growth."

Intel Also Announces Mobile 8th Gen Intel Core vPro Processors

Intel in addition to updating its 5G strategy, also announced availability of its 8th generation Core vPro "Whiskey Lake" mobile processor SoCs. Built as multi-chip modules with the CPU and PCH dies sitting on a single package, the new Core vPro i7-8665U has identical specifications to the original i7-8665U from Q3-2018, but with the addition of vPro, a set of additional features relevant to large organizations, such as AMT (active management technology), and TXT (trusted execution technology). OEM majors Dell, HP, Lenovo, and Panasonic are giving finishing touches to enterprise notebooks based on the new chip, which by itself could be priced around $500.

Samsung Profits Tank as DRAM, NAND Flash, and SoC Prices Slump

Samsung Electronics Q1-2019 preliminary reads like a horror story to investors, as the company posted its worst drop in operating-profit in over four years. Operating income fell 60 percent in the quarter ending March 2019, to about USD $5.5 billion, beating Bloomberg analysts who had predicted a 56 percent drop. Sluggish sales to IoT major Amazon, smartphone major Apple, and other handset makers, compounded by swelling inventory in the supply chain, has triggered sharp drops in DRAM prices that were offsetting critically low NAND flash prices. Demand for Samsung SoCs (application processors) is also on the decline.

Samsung is betting heavily on the success of its Galaxy S10 family of smartphones to recover from losses faced in the three component markets. Prices of DRAM prices fell 22 percent YoY, and NAND flash continues to slide by roughly that much, at 23 percent. NAND flash prices have been on a continuous decline over the past 3 years. DRAM prices, on the other hand, rallied in that period, and it's only now that it posted its first price-drop since 2016. NAND flash prices are expected to slide further down, as oversupply and failure of newer technologies like QLC taking off, hurt NAND flash manufacturers.

AMD "Cato" SoCs Figure in Futuremark SystemInfo

AMD could be giving finishing touches to its new generation of embedded SoCs codenamed "Cato." The chips surfaced on screenshots of UL Benchmarks (Futuremark) SystemInfo, across three models: the RX-8125, the RX-8120, and the A9-9820. For the uninitiated, the RX series embedded processors are part of the company's Ryzen Embedded family. The RX-series are differentiated from the A-series either by microarchitecture, or lack of unlocked multipliers, or other features, such as integrated graphics.

"Cato" is shrouded in mystery. One possible explanation could be AMD manufacturing the existing "Raven Ridge" IP on its refined 12 nm process, and "Zen+" enhancements to its CPUs. SystemInfo reading 8 logical processors could be a case of a 4-core/8-thread CPU configuration with SMT enabled. Another theory pegs this to be a new silicon, based on new IP, and 8 CPU cores. This is less probable since AMD is less stingy with SMT across its product-stack, and is hence less likely to deprive an 8-core silicon of SMT. If the latter theory is true, then this could simply be a case of the SystemInfo module not correctly detecting the prototype chips.

Intel Announces Broadest Product Portfolio for Moving, Storing, and Processing Data

Intel Tuesday unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel's latest data center solutions target a wide range of use cases within cloud computing, network infrastructure and intelligent edge applications, and support high-growth workloads, including AI and 5G.

Building on more than 20 years of world-class data center platforms and deep customer collaboration, Intel's data center solutions target server, network, storage, internet of things (IoT) applications and workstations. The portfolio of products advances Intel's data-centric strategy to pursue a massive $300 billion data-driven market opportunity.

Several Gen11 GPU Variants Referenced in Latest Intel Drivers

The latest version of Intel Graphics drivers which introduce the company's latest UWP-based Graphics Command Center app, hide another secret in their INF. The file has pointers to dozens of variants and implementations of the company's next-generation Gen11 integrated graphics architecture, which we detailed in a recent article. Intel will implement Gen11 on two key processor microarchitectures, "Ice Lake" and "Lakefield," although later down the line, the graphics technology could trickle down to low-power Pentium Silver and Celeron SoC lines, too, with chips based on the "Elkhart Lake" silicon.

There are 13 variants of Gen11 on "Ice Lake," carved using execution unit (EU) count, and LP (low-power) aggressive power management. The mainstream desktop processors based on "Ice Lake," which are least restrained in power-management, get the most powerful variants of Gen11 under the Iris Plus brand. Iris Plus Graphics 950 is the most powerful implementation, with all 64 EUs enabled, and the highest GPU clock speeds. This variant could feature on Core i7 and Core i9 brands derived from "Ice Lake." Next up, is the Iris Plus Graphics 940, with the same EU count, but likely lower clock speeds, which could feature across the vast lineup of Core i5 SKUs. The Iris Plus 930 comes in two trims based on EU count, of 64 and 48, and could likely be spread across the Core i3 lineup. Lastly, there's the Iris Plus 920 with 32 EUs, which could be found in Pentium Gold SKUs. There are various SKUs branded "UHD Graphics Gen11 LP," with EU counts ranging from 32 to 64.

AMD Ryzen 3000 "Zen 2" BIOS Analysis Reveals New Options for Overclocking & Tweaking

AMD will launch its 3rd generation Ryzen 3000 Socket AM4 desktop processors in 2019, with a product unveiling expected mid-year, likely on the sidelines of Computex 2019. AMD is keeping its promise of making these chips backwards compatible with existing Socket AM4 motherboards. To that effect, motherboard vendors such as ASUS and MSI began rolling out BIOS updates with AGESA-Combo 0.0.7.x microcode, which adds initial support for the platform to run and validate engineering samples of the upcoming "Zen 2" chips.

At CES 2019, AMD unveiled more technical details and a prototype of a 3rd generation Ryzen socket AM4 processor. The company confirmed that it will implement a multi-chip module (MCM) design even for their mainstream-desktop processor, in which it will use one or two 7 nm "Zen 2" CPU core chiplets, which talk to a 14 nm I/O controller die over Infinity Fabric. The two biggest components of the IO die are the PCI-Express root complex, and the all-important dual-channel DDR4 memory controller. We bring you never before reported details of this memory controller.

ASUS Rolls Out TUF B450M-Pro Gaming Motherboard

ASUS expanded its TUF Gaming motherboard series for the AMD platform with the new TUF B450M-Pro Gaming, positioned above its existing TUF B450M-Plus Gaming. This board features a more upscale CPU VRM design, chunkier VRM heatsinks, a more premium onboard audio solution, an additional M.2 slot, and more fan headers than the B450M-Plus Gaming. To begin with, the board features a 10-phase CPU VRM compared to the simpler 6-phase design of the B450M-Plus Gaming. Both areas of the CPU VRM are cooled by visibly bigger heatsinks, while the B450M-Plus Gaming features no heatsink over the VSoC phases. The board draws power from a combination of 24-pin ATX and 8-pin EPS connectors.

ASUS rearranged the expansion slot layout to make room for a second M.2 slot. The upper slot features both PCI-Express 3.0 x4 and SATA 6 Gbps wiring, while the lower slot features PCI-Express 3.0 x2 and SATA 6 Gbps wiring. Both slots use SATA switching logic to divert SATA links from the board's six SATA 6 Gbps ports. The third major area of improvement is the onboard audio solution, which uses a top-grade Realtek ALC1220A CODEC compared to the entry-level ALC887 of the B450M-Plus Gaming. This chip is still wired out to 6-channel analog jacks. There are a couple of additional 4-pin fan headers. The onboard gigabit Ethernet solution is unchanged, driven by a Realtek RTL8111H PHY. The ASUS TUF B450M-Pro Gaming is expected to be priced at USD $99.

Akasa Turing is an Art Deco Fanless "Bean Canyon" NUC Case

Akasa Turing is the company's latest fanless cases for Intel "Bean Canyon" NUC family, which embeds 8th generation Core "Coffee Lake" processors. Designed for living rooms or corner offices, the Turing is a carbon-black monolith with its aluminium body doubling up as heatsink for the processor. Fins and ridges of the body panel curve in an almost Art Deco style. You can either orient the case vertically, or sideways. The case can handle SoCs with TDP of up to 28 W without needing fans. Front panel connectivity includes a pair of USB 3.1 type-A, an IR receiver, and headset jack, while the rear panel is designed for most "Bean Canyon" boards. Akasa will reveal pricing very soon.

ECS LIVA Z2L is a Palm-sized Compact Desktop with GPIO

ECS today rolled out the LIVA Z2L, a palm-size compact desktop with something in it for electronics hobbyists - a GPIO header. Driven by Intel Pentium/Celeron "Gemini Lake" SoCs, these desktops measure 132 mm x 118 mm x 56.4 mm (WxDxH), and feature VESA mounts, so you could tuck them away behind your display. The unit is completely fanless, and draws power from an external power adapter. Connectivity includes four USB 3.0 ports, including a type-C, two USB 2.0 ports, D-Sub and HDMI display outputs, gigabit Ethernet, and 802.11ac WLAN. Under the hood, the "Gemini Lake" SoC is wired to 4 GB of LPDDR4 memory over two SODIMM slots (single channel), and storage is care of a 64 GB eMMC device that can juggle hot data from a 2.5-inch HDD. The company didn't reveal pricing.

AMD Doubles L3 Cache Per CCX with Zen 2 "Rome"

A SiSoft SANDRA results database entry for a 2P AMD "Rome" EPYC machine sheds light on the lower cache hierarchy. Each 64-core EPYC "Rome" processor is made up of eight 7 nm 8-core "Zen 2" CPU chiplets, which converge at a 14 nm I/O controller die, which handles memory and PCIe connectivity of the processor. The result mentions cache hierarchy, with 512 KB dedicated L2 cache per core, and "16 x 16 MB L3." Like CPU-Z, SANDRA has the ability to see L3 cache by arrangement. For the Ryzen 7 2700X, it reads the L3 cache as "2 x 8 MB L3," corresponding to the per-CCX L3 cache amount of 8 MB.

For each 64-core "Rome" processor, there are a total of 8 chiplets. With SANDRA detecting "16 x 16 MB L3" for 64-core "Rome," it becomes highly likely that each of the 8-core chiplets features two 16 MB L3 cache slices, and that its 8 cores are split into two quad-core CCX units with 16 MB L3 cache, each. This doubling in L3 cache per CCX could help the processors cushion data transfers between the chiplet and the I/O die better. This becomes particularly important since the I/O die controls memory with its monolithic 8-channel DDR4 memory controller.

GIGABYTE Intros B450M Gaming Socket AM4 Motherboard

GIGABYTE today introduced the B450M Gaming, a low-cost socket AM4 motherboard based on AMD B450 chipset, designed to be priced under $100. Built in the compact micro-ATX form-factor (205 mm x 244 mm), the board draws power from a combination of 24-pin ATX and 8-pin EPS, and uses a 4+3 phase VRM to power the AM4 SoC. A large VRM heatsink dominates the main MOSFET block, which also covers up a portion of the rear I/O area. The AM4 socket is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel memory, the board's sole M.2-2280 slot, and the PCI-Express 3.0 x16 slot with metal reinforcement. Two PCI-Express 2.0 x1 slots wired to the B450 chipset make for the rest of the expansion area.

Storage connectivity includes one M.2-2280 slot with PCI-Express 3.0 x4 and SATA 6 Gbps wiring, and four SATA 6 Gbps ports. USB connectivity includes four USB 3.1 gen 1 type-A ports on the rear panel, and two USB 3.1 gen 1 ports via header. Networking, interestingly, is a 1 GbE interface driven by Realtek Dragon 8118AS controller, which was originally launched as Realtek's competitor to the i219-V (comes with various performance enhancements). Audio is a basic 6-channel fare driven by Realtek ALC887, somewhat improved with ground-layer isolation and electrolytic capacitors.

The Subor Z+ Console/PC Hybrid with AMD Fenghuang SoC Benchmarked

Last August Chinese pC maker Zhongshan Subor announced a mysterious new console/PC hybrid called Subor Z+ with an interesting spec sheet. The most intriguing part of that machine was none other than a new AMD SoC custom with the code name 'Fenghuang/FireFlight'. Based on the Zen architecture instead of the Jaguar used in consoles such as the Xbox One X or PS4 Pro, this SoC has a CPU with 4 cores and 8 threads at 3.0 GHz a Vega-based GPU with 24 CUs at 1300 MHz, 8 GB GDDR5, 128 GB SSD and 1 TB HDD.

The preliminary tests that we could see thanks to DigitalFoundry have now been completed with a new series of benchmarks from a Chinese YouTube user in which we can see the Subor Z+ running different Windows games at more than 60 fps in some of them. The graphics power sits between a RX 570 and a GTX 1060 according to the content producer, and among the results we have different scores showing how far this can go. For example, Fire Strike Extreme (486 points), Time Spy (3288), Tomb Raider (74.81 fps without clarifying graphic config), Cinebench (110/581) or PUBG, which was running at around 50-55 fps at 1080p and with low level of detail.

Intel to Outsource Entry-level CPU and Chipset Fabrication to TSMC

Intel is facing a manufacturing crisis, in which demand has far outstripped supply, and the company is firing up all its silicon fabrication facilities to manufacture 14 nm products, mainly processors under the Core and Xeon brands. We've been hearing reports since early-September of Intel seeking out third-party foundries such as TSMC to manufacture its chipsets. We now get confirmation that TSMC will also manufacture entry-level Intel processors under brands such as Atom, Celeron, and Pentium Silver SoCs, leaving the company's socketed processors to Intel's fabs. DigiTimes does not name the third-party foundry as TSMC, but mentions that the only company that meets Intel's requirements at the moment is TSMC.

Intel Acquires NetSpeed Systems for Chip Design and Interconnect Fabric IP

Intel today announced the acquisition of NetSpeed Systems, a San Jose, California-based provider of system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP). Deal terms were not disclosed. NetSpeed's highly configurable and synthesizable offerings will help Intel more quickly and cost-effectively design, develop and test new SoCs with an ever-increasing set of IP. The NetSpeed team is joining Intel's Silicon Engineering Group (SEG) led by Jim Keller. NetSpeed co-founder and CEO, Sundari Mitra, will continue to lead her team as an Intel vice president reporting to Keller.
Intel is designing more products with more specialized features than ever before, which is incredibly exciting for Intel architects and for our customers. The challenge is synthesizing a broader set of IP blocks for optimal performance while reining in design time and cost. NetSpeed's proven network-on-chip technology addresses this challenge, and we're excited to now have their IP and expertise in-house.

Jim Keller, senior vice president and general manager of the Silicon Engineering Group at Intel

UL Benchmarks Kicks Huawei Devices from its Database over Cheating

UL Benchmarks de-listed several popular Huawei devices from its database over proof of cheating in its benchmarks. Over the month, it was found that several of Huawei's devices, such as P20 Pro, Nova 3, and Play; overclocked their SoCs while ignoring all power and thermal limits, to achieve high benchmark scores, when it detected that a popular benchmark such as 3DMark, was being run. To bust this, UL Benchmarks tested the three devices with "cloaked" benchmarks, or "private benchmarks" as they call it. These apps are identical in almost every way to 3DMark, but lack the identification or branding that lets Huawei devices know when to overclock themselves to cheat the test.

The results were startling. When the devices have no clue that a popular benchmark is being run (or if has no way of telling that 3DMark is being run), it chugs along at its "normal" speed, which is 35% to 36% lower. The rules that bind device manufacturers from advertising UL's 3DMark scores explicitly state that the device must not detect the app and optimize its hardware on the fly to ace the test. Huawei responded to UL by stating that it will unlock a new "performance mode" to users that lets them elevate their SoCs to the same high clocks for any application.

Intel "Whiskey Lake-U" Core Processor Lineup Detailed

Intel is giving final touches to its 9th generation Core "Whiskey Lake-U" processors for Ultrabooks and other ULV platforms. Successors to 8th Gen "Kaby Lake Refresh" chips, these 15-Watt SoCs may not pack a newer microarchitecture in terms of IPC increases, but Intel is building them on the latest iteration of its 14 nm node, along with tweaks made to their Turbo Boost algorithm, which combined with higher boost clocks, should offer better performance than the previous generation.

The lineup begins with the Core i3-8145U, successor to the i3-8130U. This 2-core/4-thread chip is has a lower nominal clock at 2.10 GHz (vs. 2.20 GHz of its predecessor), but significantly higher boost clocks of 3.90 GHz (vs. 3.40 GHz of the i3-8130U). The Core i5-8265U and top-end i7-8565U are both 4-core/8-thread chips with a nominal clocks of 1.60 GHz and 1.80 GHz, respectively. The i5-8265U has a boost clock of 4.10 GHz and 6 MB of L3 cache; while the i7-8565U tops that with 4.70 GHz boost clocks, and 8 MB of L3 cache. All three chips have 15W TDP, configurable to 25W by applying the "high performance" power scheme.

Intel "Crimson Canyon" NUCs with Discrete GPUs Up for Pre-order

One of the first Intel NUC (next unit of computing) mini PCs to feature completely discrete GPUs (and not MCMs of CPUs and GPUs), the "Crimson Canyon" NUC8i3CYSM and NUC8i3CYSN, are up for pre-order. The former is priced at USD $529, while the latter goes for $574. The two combine Intel's 10 nm Core i3-8121U "Cannon Lake" SoC with AMD Radeon 540 discrete GPU. Unlike the "Hades Canyon" NUC, which features an MCM with a powerful AMD Radeon Vega M GPU die and a quad-core "Kaby Lake" CPU die; the "Crimson Canyon" features its processor and GPU on separate packages. The Radeon 540 packs 512 stream processors, 32 TMUs, and 16 ROPs; with 2 GB of GDDR5 memory.

All that's differentiating the NUC8i3CYSM from the NUC8i3CYSN is memory. You get 4 GB of LPDDR4 memory with the former, and 8 GB of it with the latter. Both units come with a 2.5-inch 1 TB HDD pre-installed. You also get an M.2-2280 slot with PCIe 3.0 x4 wiring, and support for Optane caching. Intel Wireless-AC 9560 WLAN card handles wireless networking, while an i219-V handles wired. Connectivity includes four USB 3.0 type-A ports, one of which has high current; an SDXC card reader, CIR, two HDMI 2.0 outputs, and 7.1-channel HD audio. The NUC has certainly grown in size over the years. This one measures 117 mm x 112 mm x 52 mm (WxDxH). An external 90W power-brick adds to the bulk.

Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its strategic foundry collaboration with Arm will be expanded to 7/5-nanometer (nm) FinFET process technology to remain a step ahead in the era of high-performance computing. Based on Samsung Foundry's 7LPP (7nm Low Power Plus) and 5LPE (5nm Low Power Early) process technologies, the Arm Artisan physical IP platform will enable 3GHz+ computing performance for Arm's Cortex -A76 processor.

Samsung's 7LPP process technology will be ready for its initial production in the second half of 2018. The first extreme ultra violet (EUV) lithography process technology, and its key IPs, are in development and expected to be completed by the first half of 2019. Samsung's 5LPE technology will allow greater area scaling and ultra-low power benefits due to the latest innovations in 7LPP process technology.
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