Although we did mention the MSI MEG Z690 GODLIKE in our Z690 motherboard roundup piece, until now, we didn't really know what the board looked like, since MSI has been very shy when it comes to sharing details of the board. However, now the company has released a couple of pictures of the board, courtesy of the board winning a pair of CES 2022 Innovation Honoree awards.

We're still short on details of this monster board, as it'll measure 305x310 mm, which almost puts it in SSI EEB territory. The board has what can only be described as a full cover, since outside of the CPU socket and some of the components near it, you really can't see anything. On top of the memory modules, MSI has gone for a display of some kind that seems to display some system information, such as the CPU type and current clock speed. The location of the display doesn't seem to be ideal though, but it's said to measure in at 3.5-inches.

TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, announces the TOS 5 update for TerraMaster devices. Throughout the year, TerraMaster added more than 50 features and more than 600 improvements to the TerraMaster TOS - more than 300000 lines of codes from our hardworking professional engineers.

The new and improved TerraMaster TOS 5 operating system is designed for professional users to meet business needs and more with improved responsiveness, tighter security, and ease of use. The TerraMaster TOS 5 features a new interface that's designed to be more convenient and easier to use. Below are some of the key features of the new TOS 5 for TNAS devices.

TechPowerUp today released the latest version of NVCleanstall, our popular utility that gives you much greater control over the installation of your GeForce software installation, letting you filter out several components you probably don't need, such as Telemetry. Version 1.11.0 introduces support for Windows 11. The utility will now recommend an upgrade from non-DCH to DCH drivers, because NVIDIA stopped releasing non-DCH drivers recently. A new tweak has been added, which when enabled, shows DLSS status and library version through an in-game overlay. Fixes and improvements include a notice when selecting the "Disable NVIDIA Container" option (that it will break NVIDIA Control Panel); bugs related to several third-party driver packages due to a case-sensitivity issue, etc.

DOWNLOAD: TechPowerUp NVCleanstall 1.12.0Update Nov 11th: We just released NVCleanstall v1.12.0 to fix a bug that got introduced in v1.11.0: On systems with a language that doesn't use "." as decimal separator, an error "Input string is not in a correct format" would pop up.

The change-log follows.

Valve's highly-anticipated handheld gaming console, Steam Deck, is facing a two-month delay. According to the latest news from the company, the console will not be in time for holidays and will get delayed by two months to February. Suppose you are wondering what the reason behind it is. In that case, Valve says that "we did our best to work around the global supply chain issues, but due to material shortages, components aren't reaching our manufacturing facilities in time for us to meet our initial launch dates." These consequences are understandable, given the issues many companies face with the global supply chain and the overall scarcity of components still ruling the market.

If you have pre-ordered a Steam Deck device, rest assured that your reservation will get shipped accordingly, just with a two-month delay. Valve states that "Based on our updated build estimates, Steam Deck will start shipping to customers February 2022. This will be the new start date of the reservation queue—all reservation holders keep their place in line but dates will shift back accordingly. Reservation date estimates will be updated shortly after this announcement." For more information, please head over to the Steam Deck website.

AMD's ROCm compute programming platform—a competitor to NVIDIA's CUDA, dropped support for the "Polaris" graphics architecture, with the latest version 4.5 update. Users on the official ROCm git raised this as an issue assuming it was a bug, to which an official AMD support handle confirmed that the Radeon RX 480 graphics card of the original poster is no longer supported. Another user tested his "Polaris 20" based RX 570, and it isn't supported, either. It's conceivable that the "Polaris 30" based RX 590, a GPU launched in November 2018, isn't supported either. Cutting out a 3-year old graphics architecture from the compute platform sends the wrong message, especially to CUDA users who AMD wants to win over with ROCm. With contemporary GPUs priced out of reach, IT students are left with used older-generation graphics cards, such as those based on "Polaris." NVIDIA CUDA supports GPUs as far back as "Maxwell" (September 2014).

It's 11/11, or Singles Day, when you celebrate in hopes that you don't have to next year! GoDeal24 brings you single-digit pricing on the software your new gaming PC or small business needs. Get Genuine Windows 10 Pro for just $7.49, or as low as $5.79 when you buy a 2-pack. Windows 11 Pro can be had for just $15.49. Also introduced is Microsoft Office 2021. Get genuine, lifetime-valid Office 2021 Professional Plus for just $43.04, or combine it with Windows 10 Pro for $48.79, or even Windows 11 Pro, at $56.37. This also lowers prices on various editions of Office 2019 and Office 2016, pick whatever best suits your needs. Check out other great deals on Windows Server, other productivity software, and system utilities. Happy Singles Day!

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Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies," said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."

AMD announced today that IBM Cloud has chosen 3rd Gen AMD EPYC processors to expand its bare metal service offerings designed to power customers' demanding workloads and solutions. The new servers, featuring 128 cores, up to 4 TB of memory and 10 NVMe drives per server, give users full access to high-end, dual-socket performance with AMD EPYC 7763 processors; a first for IBM Cloud in a dual-socket platform.

"Our customers have a high demand for computing processing power and the new 3rd Gen AMD EPYC processors provide the high levels of performance and scalability we were looking for," said Suresh Gopalakrishnan, vice president, IBM Cloud. "Our collaboration with AMD has helped us deliver our highest core counts and bandwidth ever available for IBM Cloud customers, to offer top market performance for today and tomorrow's demanding workloads."

"IBM Cloud customers regularly running compute-intensive workloads can see an immediate benefit to speed and scalability by upgrading to 3rd Gen AMD EPYC processors, while helping to deliver a secure experience for end-users," said Lynn Comp, corporate vice president, Cloud Business Group, AMD. "Our continued collaboration with IBM Cloud is further validation of the strong standing AMD holds in the market as we deliver topline solutions that promote a seamless experience for cloud partners and their customers."

A couple of days ago, GIGABYTE boasted with an overclocking record made using one of the company's motherboards. Allegedly, the company has achieved a world record of Alder Lake overclocking, causing the CPU to go up to 8 GHz frequency. However, such a claim was rather sketchy, according to the CPU-Z developer "Doc TB." In the later investigation, he concluded that the submission took advantage of a false reporting algorithm that gave HiCookie and GIGABYTE a chance to submit a world record as validated by the CPU-Z validator program. Further investigation concluded that the program reported incorrect numbers, and GIGABYTE's world record of 8 GHz on Alder Lake had been made invalid as of now.

The CPU-Z validation team is working hard to update the validation algorithm and make it more challenging for false submissions to appear valid. One interesting thing to point out is that HiCookie and GIGABYTE have already attempted to post false records with the launch of AMD's Ryzen 5000 series of processors, where they claimed that the CPU managed to reach 6,362.16 MHz, where in reality it was running at 5,683.94 MHz. This overclocker submitted those faulty results to HWBot as fake at the time and has now done it again.

NVIDIA has today launched the latest addition to its data-centric graphics card lineup, called A2 Tensor Core GPU. The company envisions the A2 Tensor Core GPU as an entry point of accelerators that power machine learning and artificial intelligence at the edge. It is based on Ampere architecture and built on Samsung's 8 nm node. The GPU has GA107 GPU with 1280 CUDA cores enabled, where the full GA107 has 3072 cores. This GPU has only 1280 CUDA cores because it is configured as a low-power, low-profile body with a configurable TBP (total board power) of 40-60 Watts, depending on the customer use case.

It directly replaced the previous generation T4 accelerator, an edge device, and promises to bring 20-30% higher performance in the same power envelope. As far as memory, it has 16 GB of GDDR6 memory running on a 128-bit bus and 200 GB/s memory bandwidth. The GPU core clocks at 1440 MHz base and 1770 MHz boost frequency, which outputs 4.5 TeraFLOPs of FP32 compute. A2 represents a significant upgrade over the previous T4 because it offers a 60% better price to performance ratio and 10% better power efficiency than the last generation. Overall, this release represents an excellent upgrade for customers that need basic AI processing at the edge, and no, gaming is not supported on these as video output is disabled.

OWC, the premier zero-emissions Mac and PC technology company, and a respected provider of Memory, External Drives, SSDs, Mac & PC Docking Solutions, Network Attached Storage, and Performance Upgrade Kits, today announces the all-new OWC Accelsior 8M2. The OWC Accelsior 8M2 brings impressive speed and storage capacity to 2019 Mac Pros, Windows or Linux computers, and PCIe expansion systems.

It utilizes the total bandwidth of the latest PCIe technology and has a highly efficient heat dissipating design to provide ultra-reliable speeds up to 26,000 MB/s. Creating the fastest PCIe SSD meant combining bold engineering with the latest technology. Each OWC Accelsior 8M2's eight NVMe M.2 SSD slots can run at their full x4 lanes of data throughput. All that insanely fast speed through an entire PCIe 4.0 x16 lane architecture with up to 64 TB of storage.

HyperX, the gaming peripherals team at HP Inc. and brand leader in gaming and e-sports, today announced the HyperX Cloud Alpha gaming headset blackout edition is shipping now across Europe. Designed to deliver the ultimate comfort for hours of extended gameplay, Cloud Alpha leverages premium HyperX signature memory foam, an expanded headband with softer, more pliable leatherette and a durable, lightweight aluminium frame design. The headset features a detachable cable with in-line audio control allowing console gamers to adjust volume and mute microphone right on the cable.

Cloud Alpha features HyperX dual chamber technology to deliver an accurate game sound with incredible range and tone. With 50 mm drivers, the dual chambers allow HyperX to tune and separate the bass from the mids and highs, creating a dynamic sound that makes gaming, music and movies more immersive.

TSMC (TWSE: 2330, NYSE: TSM) and Sony Semiconductor Solutions Corporation ("SSS") today jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. ("JASM"), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes to address strong global market demand for specialty technologies, with SSS participating as a minority shareholder.

Construction of JASM's fab in Japan is scheduled to begin in the 2022 calendar year with production targeted to begin by the end of 2024. The fab is expected to directly create about 1,500 high-tech professional jobs and to have a monthly production capacity of 45,000 12-inch wafers. The initial capital expenditure is estimated to be approximately US$7 billion with strong support from the Japanese government.

Under definitive agreements reached between TSMC and SSS, SSS plans to make an equity investment in JASM of approximately US $0.5 billion, which will represent a less than 20% equity stake in JASM. The closing of the transaction between TSMC and SSS is subject to customary closing conditions.

EVGA today rolled out the X570 FTW WiFi, its second AMD Socket AM4 motherboard. While the X570 DARK is aimed at professional overclockers looking to squeeze the most out of Ryzen 5000 series processors, the X570 FTW is aimed at a slightly broader audience—enthusiasts. The board comes with four DDR4 DIMM slots to illustrate this, compared to two slots (1 DIMM per channel) on the X570 DARK. The board pulls power from a combination of 24-pin ATX, and 8+4 pin EPS. It features a 15-phase CPU VRM that's cooled by aluminium fin-stack heatsinks. The Socket AM4 processor is wired to four DDR4 DIMM slots, two PCI-Express 4.0 x16 (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring.

Besides this CPU-attached M.2 NVMe Gen 4 slot, two additional Gen 4 slots are put out by the X570 chipset, cooled by a large aluminium monoblock heatsink. The X570 chipset itself is cooled fanless, which means it's likely the X570S variant. Eight SATA 6 Gbps ports make for the rest of the storage connectivity. USB connectivity includes three 10 Gbps USB 3.1 Gen2 ports at the rear panel, two 5 Gbps Gen1 ports, and two additional Gen1 ports through internal headers. The onboard audio solution uses a Realtek ALC1220 CODEC with SV3H615 headphones amp. Networking connectivity includes Intel-sourced WiFi 6 and 1 GbE. Available to EVGA Elite members, the EVGA X570 FTW WiFi is priced at USD $499, about $200 cheaper than the X570 DARK.

KLEVV, an emerging memory brand introduced by Essencore, today announced the latest addition to its lineup of computer memory upgrades with new DDR5 memory series, including DDR5 standard memory and signature DDR5 series of overclocking/gaming RGB memory. KLEVV DDR5 memory offers assurance of QVL testing with major motherboard brands' Z690 platforms that support the latest Intel 12th Generation 'Alder Lake' Core Processors.

KLEVV DDR5 standard desktop memory (U-DIMM) will adopt SK Hynix chips and will first launch in a 16 GB capacity with JEDEC standard frequencies of 4,800 MHz CL40-40-40 at a power-efficient 1.1 V. KLEVV DDR5 standard desktop memory kits have passed QVL testing with Z690 motherboards from leading partners including ASRock, ASUS, Gigabyte, and MSI, assuring outstanding compatibility for PC builders. Larger capacity 32 GB modules and standard memory for laptops (SO-DIMM) will follow soon.

Minisforum have recently published a press release teasing an upcoming mini PC based on the AMD B550 platform and configurable with up to a Ryzen 9 5900X in addition to lower-tier processors such as the 5600X, 5700G, and 5600G. The PC will also feature a dedicated graphics card however the specific model was not named by the company with the only provided details being a power budget for the entire device between 120 W to 1000 W and dimensions of 16.65 cm x 15.8 cm x 6.7 cm. The company has also published images of the device showing the rear connectivity which includes 2.5 GbE Ethernet, x4 USB 3.0 Type-A, x2 USB Type-C, x2 HDMI, x1 DisplayPort, and separate headphone/microphone jacks. The device will ship with a 120 W gallium nitride charger and use liquid metal for cooling. The complete press release can be found below.

Qualcomm. introduces Snapdragon Spaces XR Developer Platform, a headworn Augmented Reality (AR) developer kit to enable the creation of immersive experiences that seamlessly blur the lines between our physical and digital realities. With proven technology and an open, cross-device horizontal platform and ecosystem, Snapdragon Spaces delivers the tools to bring developers' ideas to life and revolutionize the possibilities of headworn AR. Snapdragon Spaces is in early access with select developers and is expected to be generally available in the Spring of 2022.

Qualcomm Technologies is a pioneer in Augmented Reality with over a decade of AR research and development. Utilizing these years of innovation and expertise, Snapdragon Spaces offers robust machine perception technology that is optimized for performance and low power for the next generation of AR glasses. The Snapdragon Spaces platform provides environmental and user understanding capabilities that give developers the tools to create headworn AR experiences that can sense and intelligently interact with the user and adapt to their physical indoor spaces. Some of the marquee environmental understanding features include spatial mapping and meshing, occlusion, plane detection, object and image recognition and tracking, local anchors and persistence, and scene understanding. The user understanding machine perception features include positional tracking and hand tracking.

GIGABYTE Technology, today announced at OCP Summit support for the Ampere Altra Max processor and unveiled the new GIGABYTE high-density server, H262-P60, that embodies performance and scalability for HPC clusters and HCI. The Ampere Altra processor has also shown great power efficiency in cloud and edge applications while gaining momentum as it uses Arm architecture to give x86 a run for its money.

The competitiveness of Ampere Altra processors and ARMv8 64-bit architecture has become even more apparent as the Ampere Altra Max processor maintains the same 250 W TDP as Ampere Altra and is pin-to-pin compatible, yet it is able to add 60% more cores for up to 128 cores. For networking, storage, or accelerators the single socket supports 128 PCIe lanes, while the dual socket configuration for Altra Max will support 192 PCIe lanes. The H262-P60 will ship with updated support for Altra Max.

Niantic, developer of the world's first and only scaled AR platform, announced it's opening its Lightship Augmented Reality Developer Kit (ARDK) to developers that will make creating augmented reality experiences more accessible. The Lightship ARDK will present several of the tools used in Niantic's games, such as Pokémon GO and Pikmin Bloom. These tools will allow developers to create games using three features made popular by Niantic games: Real-time mapping, understanding (which helps AR objects interact with real-world places), and multiplayer sharing features.

On the light of the occasion Niantic CEO, John Hanke, said "At Niantic, we believe humans are the happiest when their virtual world leads them to a physical one. Transforming humanity's relationship with technology by merging the physical and virtual worlds will require the ideas and perspectives of as many people as possible. That's why we're so excited to open the vault of technology that powers our own games, so developers, creators and brands globally can build inclusive experiences that push the boundaries of what's possible in AR."

NVIDIA today announced NVIDIA Omniverse Avatar, a technology platform for generating interactive AI avatars. Omniverse Avatar connects the company's technologies in speech AI, computer vision, natural language understanding, recommendation engines and simulation technologies. Avatars created in the platform are interactive characters with ray-traced 3D graphics that can see, speak, converse on a wide range of subjects, and understand naturally spoken intent.

Omniverse Avatar opens the door to the creation of AI assistants that are easily customizable for virtually any industry. These could help with the billions of daily customer service interactions—restaurant orders, banking transactions, making personal appointments and reservations, and more—leading to greater business opportunities and improved customer satisfaction. "The dawn of intelligent virtual assistants has arrived," said Jensen Huang, founder and CEO of NVIDIA. "Omniverse Avatar combines NVIDIA's foundational graphics, simulation and AI technologies to make some of the most complex real-time applications ever created. The use cases of collaborative robots and virtual assistants are incredible and far reaching."

Today, Logitech launched POP Keys, POP Mouse and Logitech Desk Mat, the newest products in the Logitech Studio Series to bring character, joy and self-expression to your work routine. The release of the new mouse and mechanical keyboard redefine what your personal workspace can look like with three vibrant new aesthetics. "The Studio Series by Logitech embraces the originality of each individual out there," said Art O'Gnimh, vice president of the lifestyle business for creativity and productivity at Logitech. "With POP Keys and POP Mouse we created innovative products that aim to be just as expressive as our users, with big personalities and no compromise on productivity.

POP Keys comes with eight swappable emoji keycaps in the box - four on the keyboard itself. The emoji keys can be easily customized to your favorite emoji or another handy shortcut using Logitech Options software, available via a simple download for PC or Mac. POP Mouse also features a top button that opens the emoji menu and can be customized for one-tap convenience.

CORSAIR, a world leader in high-performance gear for gamers and content creators, today announced a colorful new lineup of its CORSAIR K65 RGB MINI 60% mechanical gaming keyboards: the Flavor Rush Series. These limited-edition keyboards, available exclusively from the CORSAIR webstore in the United States, are decked-out in four unique color schemes and kick off the new CORSAIR COLLECTIONS product line - limited-release gaming gear with unique color combinations and designs for personalizing your setup or building the ultimate PC gaming collection.

Flavor Rush K65 RGB MINI keyboards adorn your desktop with bright, charming colors atop a brilliant white frame for truly eye-catching aesthetics. Choose from the refreshingly green Hint of Mint, Bubblegum Pop's burst of pink, the blue splash of Berry Wave, or a sweet slice of forever summer in Watermelon Blast. Each Flavor Rush keyboard also includes a new CORSAIR Artisan sails logo keycap - the first of its kind - launching today as a standalone product as well. This premium clear resin keycap lets maximum RGB backlighting shine through, giving your keyboard a brilliant accent point of light and color while showing off your CORSAIR flair. With all these color and customization options, Flavor Rush keyboards make unforgettable additions to your CORSAIR setup.

In order to offer even more options for industrial hardware users, IoT hardware manufacturer and solution provider, OnLogic (onlogic.com), has announced two new additions to their popular ML100 Series of compact fanless computers. The ML100G-53 and ML100G-41 are powered by embedded processing platforms from Intel and AMD. The new devices build on the company's experience in highly-reliable, passively cooled computers for industrial, IoT, and edge computing applications.

"The amount of performance we're able to offer through integrating the latest processing platforms in the NUC and mini-PC footprints is astounding," said Mike Walsh, OnLogic Industrial Product Line Manager. "The ML100 Series has been, quite literally, a great fit for our customers looking to integrate powerful computing in space constrained industrial environments. Paired with our Hardshell fanless technology for thermal management and reliability, the newest additions to our ML100 Series will offer the kind of flexibility our customers and integrators demand, while letting them choose the ideal processing option for their particular application."

Noctua today introduced new, LGA1700-specific revisions of its award-winning NH-L9i and NH-L9i chromax.black low-profile CPU coolers. The new NH-L9i-17xx and NH-L9i-17xx chromax.black are ideal for building ultra-compact HTPCs and Small Form Factor (SFF) systems using Intel's brand new 12th generation Core processors such as the Core i9-12900K, Core i7-12700K or Core i5-12600K. The new, optional NA-FD1 fan duct makes it possible to further improve the performance of the coolers by bridging the gap between the fan and perforated case panels in order to enable the coolers to draw in fresh air from the outside.

"We're very happy with the performance of the NH-L9i-17xx coolers on Intel's new LGA1700 CPUs", says Roland Mossig (Noctua CEO). "We have managed to dissipate up to around 160 W on the Core i9-12900K, pushing it to over 4.2 GHz, and up to 125 W on the Core i5-12600K running at 4.3 GHz. These are excellent results for such small coolers, making them fantastic options for highly compact Intel Z690 builds that pack a lot of processing power!"

NVIDIA today introduced NVIDIA Jetson AGX Orin, the world's smallest, most powerful and energy-efficient AI supercomputer for robotics, autonomous machines, medical devices and other forms of embedded computing at the edge. Built on the NVIDIA Ampere architecture, Jetson AGX Orin provides 6x the processing power and maintains form factor and pin compatibility with its predecessor, Jetson AGX Xavier. It delivers 200 trillion operations per second, similar to that of a GPU-enabled server but in a size that fits in the palm of your hand.

The new Jetson computer accelerates the full NVIDIA AI software stack, allowing developers to deploy the largest, most complex models needed to solve edge AI and robotics challenges in natural language understanding, 3D perception, multisensor fusion and more. "As robotics and embedded computing transform manufacturing, healthcare, retail, transportation, smart cities and other essential sectors of the economy, the demand for processing continues to surge," said Deepu Talla, vice president and general manager of embedded and edge computing at NVIDIA. "Jetson AGX Orin addresses this need, enabling the 850,000 Jetson developers and over 6,000 companies building commercial products on it to create and deploy autonomous machines and edge AI applications that once seemed impossible."

NVIDIA today announced NVIDIA Quantum-2, the next generation of its InfiniBand networking platform, which offers the extreme performance, broad accessibility and strong security needed by cloud computing providers and supercomputing centers.

The most advanced end-to-end networking platform ever built, NVIDIA Quantum-2 is a 400 Gbps InfiniBand networking platform that consists of the NVIDIA Quantum-2 switch, the ConnectX-7 network adapter, the BlueField-3 data processing unit (DPU) and all the software that supports the new architecture.

TSMC will commercialize its N3 (3 nm) EUV silicon fabrication node in 2022, with volume production set to commence in the second half of the year. The company is looking to maximize capacity on its current N5 (5 nm) node, which already serves major customers such as Apple. AMD is expected to utilize N5 allocation going into 2022 as its next-generation "Zen 4" processors are expected to leverage the node to drive up CPU core counts and caches. The company is also utilizing N6 (6 nm) for its CDNA2 compute accelerator logic dies. N5 could also power mobile application processors from several manufacturers.

SilverStone today introduced the HELA 2050 fully modular ATX power supply. This absolute unit packs over 2 kW of juice in a box that's just 18 cm in length. Typically, PSUs over 1600 W are over 20 cm in length. The 18 cm length makes this PSU fit for even mid-towers, if you've figured out what to do with that much power—a record-chasing overclock on both your swanky new Core i9-12900K plus an equally maxed out RTX 3090 or RX 6900 XT. The PSU has been certified Cybenetics Platinum for its main function, and Cybenetics Standard+ for acoustics.

The SilverStone HELA 2050 W uses a 135 mm double ball-bearing fan, and can be made to run completely fanless up to 820 W load. Connectors include one 24-pin ATX, two 4+4 pin EPS, one 12-pin Molex microfit 3.0 connector that you can directly plug into NVIDIA RTX 30-series Founders Edition graphics cards, eighteen 6+2 pin PCIe power connectors, twelve SATA power, three 4-pin Molex, and a Berg. Under the hood, the HELA 2050 uses a single 170-Amp +12 V rail (enough juice to crank a truck). You also get active PFC, DC-to-DC switching (up to 120 W on the 5 V and 3.3 V rails), and most common electrical protections. Available toward late-December 2021, the SilverStone HELA 2050 is expected to be priced at USD $599.

AMD today announced the new AMD Instinct MI200 series accelerators, the first exascale-class GPU accelerators. AMD Instinct MI200 series accelerators includes the world's fastest high performance computing (HPC) and artificial intelligence (AI) accelerator,1 the AMD Instinct MI250X.

Built on AMD CDNA 2 architecture, AMD Instinct MI200 series accelerators deliver leading application performance for a broad set of HPC workloads. The AMD Instinct MI250X accelerator provides up to 4.9X better performance than competitive accelerators for double precision (FP64) HPC applications and surpasses 380 teraflops of peak theoretical half-precision (FP16) for AI workloads to enable disruptive approaches in further accelerating data-driven research.

In celebration of Sony Pictures' upcoming film Resident Evil: Welcome to Raccoon City, ZOTAC Technology Limited today announces that its gaming brand, ZOTAC GAMING, will launch a global "Survive with Power" campaign featuring Resident Evil: Welcome to Raccoon City themed hardware, which will include AMP Extreme Holo graphics cards, the ultimate Mini PC, and more. The limited-edition hardware are designed to amplify your PC gaming experience and, in addition, love letters to ZOTAC'S worldwide community for supporting ZOTAC over the past 15 years since being established.

The "Survive with Power" campaign kicks off today and will run until December 17, 2021. For a limited time, ZOTAC and RESIDENT EVIL fans will have a chance to win one of the ZOTAC GAMING Resident Evil: Welcome to Raccoon City Limited Edition Graphics Card or Mini PC hardware. Challenge yourself with our Mini Game and enter to win one of the ultimate prizes in the grand lucky draw, as well as joining our social media giveaway where more awesome prizes await. Visit this page for more details.

Delivering on the promise of SSDs that address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced production-ready availability of its 9.5 mm XD6 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S data center class SSDs. Introduced in late 2020, KIOXIA XD6 drives were the first EDSFF E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Platform (OCP) NVMe Cloud SSD Specification. XD6 series also supports popular E1.S 15 mm and 25 mm form factor options, providing the flexibility to select the right balance of cooling through different E1.S heatsink options.

Representing the latest innovation in flash storage for servers in cloud and hyperscale data centers, KIOXIA EDSFF E1.S SSDs are designed to optimize system density, efficiency and management. As defined by the EDSFF consortium and leveraging the OCP NVMe Cloud SSD Specification, the small form factor E1.S replaces the M.2 form factor and delivers greater density, performance, reliability, and thermal management. E1.S is also designed to be hot pluggable for increased serviceability, which is another benefit over M.2.

HyperX, the gaming peripherals team at HP Inc. and brand leader in gaming and esports, today announced it is offering the Pulsefire Haste gaming mouse in two new colorways: black and red, and white and pink. Weighing in at 59 grams with an ultra-lightweight honeycomb hex shell design, Pulsefire Haste offers quicker movements and increased ventilation.

Designed to meet the needs of gamers looking for an ultra-lightweight mouse, Pulsefire Haste delivers ultimate comfort and command. The mouse is built with low-friction, pure virgin-grade PTFE skates for effortless glide movement. This mouse also utilizes a HyperFlex USB cable designed to reduce tension and resistance for easier mouse movements with the use of light and ultra-flexible paracord material.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry's first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

"In recent years, hyperconnected market segments such as AI, augmented reality (AR) and the metaverse, which rely on extremely fast large-scale data processing, have been rapidly expanding," said SangJoon Hwang, senior vice president and head of the DRAM Design Team at Samsung Electronics. "Our LPDDR5X will broaden the use of high-performance, low-power memory beyond smartphones and bring new capabilities to AI-based edge applications like servers and even automobiles."

AMD on Monday made several major announcements covering different parts of its enterprise product roadmap. These included the 3rd Gen EPYC "Milan-X" processors with 3D Vertical Cache memory; Instinct MI200 CDNA2 compute accelerators, and announcements related to next-generation "Zen 4" based EPYC "Genoa" and "Bergamo" processors that come with core counts as high as 128. The company's stock rallied up to 12%, closing up 10%, which left many in the tech community scratching their heads. It turns out that the AMD-Meta deal has a profound impact on investors.

Meta, the holding company of Facebook covering all its businesses, aspires to be a major cloud solutions provider on par with Microsoft Azure, AWS, and Google Cloud. The deal could see Meta buying large stocks of AMD processors and compute accelerators to drive its next-gen server infrastructure. Sales of enterprise processors doubled year-over-year for AMD, and EPYC processors now account for 20% of the company's revenues.

AMD today announced the debut of its 6 nm CDNA2 (Compute-DNA) architecture in the form of the MI200 family. The new, dual-GPU chiplet accelerator aims to lead AMD into a new era of High Performance Computing (HPC) applications, the high margin territory it needs to compete in for continued, sustainable growth. To that end, AMD has further improved on a matured, compute-oriented architecture born with Graphics Core Next (GCN) - and managed to improve performance while reducing total die size compared to its MI100 family.

A new era for flash used in servers and storage is here, and it's being introduced by KIOXIA America, Inc. Today, the company announced the industry's first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology - the CD7 Series. Building on the KIOXIA E3.S full-function development vehicle that received a 'Best in Show' award at last year's Flash Memory Summit, the CD7 Series E3.S increases flash storage density per drive for optimized power efficiency and rack consolidation.

Breaking free from the design limitations of the 2.5-inch form factor, the EDSFF E3 family is optimized for the needs of high-performance, highly efficient servers and storage. EDSFF enables the next generation of SSDs to address future data center architectures, while supporting a variety of new devices and applications. It provides improved airflow and thermals, signal integrity benefits, and options for larger SSD capacity points. EDSFF standardizes status LEDs on the drive, which eliminates the need for LEDs on the drive carriers. Support for higher E3.S power budgets than 2.5-inch form factor SSDs and better signal integrity allows EDSFF to deliver the performance promised by PCIe 5.0 technology and beyond.

AMD held its Accelerated Data Center Keynote address by CEO Dr Lisa Su today. The company made some big announcements for the enterprise space in this first major series of announcements by AMD after Intel's launch of its Alder Lake 12th Gen Core processors that set the tone for what's to come from Intel in the enterprise space (Xeon "Sapphire Rapids"). First up is the EPYC "Milan-X" line of server processors leveraging 3D Infinity Cache memory, a tripling in L3 cache amount, which the company claims significantly improves performance of memory-intensive applications. This should also give you an idea if any upcoming Ryzen desktop processor based on the refreshed chiplet could live up to its claim of "up to 15% gaming performance boost." The next-generation Instinct MI200 series GPU compute accelerators are equally important as they bring the CDNA2 compute architecture to market, establishing competition to NVIDIA's A-series Tensor Core processors, and Intel's upcoming "Ponte Vecchio" Xe-HPC accelerators.

be quiet!, the German manufacturer for premium PC components, launches its new Light Wings series: be quiet!'s first fans with ARGB illumination. Besides its characteristic lighting properties, development focused on performance, low-noise operation as well as the manufacturer's typical high-quality standards. Light Wings fans are equipped with a PWM connector and have one LED ring at the fan's inlet and another narrow LED ring at the outlet. They are available in 120 mm and 140 mm sizes.

Light Wing's light rings are equipped with up to 20 individually addressable LEDs with a diffuser to spread the light in both directions. This results in a remarkably uniform illumination and impressive lighting effects. Light Wing triple packs additionally contain an ARGB hub to enable the synchronization of up to six ARGB components in total. The fans can also be connected to motherboards with 5 V ARGB-headers and controlled by motherboard software. Light Wings fans allow daisy-chaining of its signal cables for a cleaner case interior.

With Intel's Alder Lake processor generation launch, the platform merges support of two different DDR memory standards: DDR4 and DDR5. While there are motherboards that offer the latest DDR5 standard, there are boards that provide users to use the cheaper DDR4 memory option in their builds as we transition to the newer standard and newer memory becomes more available. The DDR5 products are currently on the expensive side, and DDR4 represents a good choice for creating a PC build in the following years, at least in the transition to DDR5 standard's better availability and lower prices.

According to Moore's Law is Dead Twitter account, the DDR4 support may reside for a little longer on Intel's platforms. As per their sources, Intel's 13th generation Core processors, codenamed Raptor Lake, will carry over DDR4 platform support and possibly retain compatibility with the 12th generation Alder Lake platform. That means that the Z690 and future H670/B660/H610 boards could be compatible with Raptor Lake-S and also carry support for the DDR4 memory protocol for it. This could indicate that Alder Lake-S buyers that build PCs with DDR4 memory could have a viable processor upgrade path without upgrading the memory. Of course, information like this should be taken with a grain of salt.

AMD in its Computex 2021 presentation showed off its upcoming "Zen 3" CCD (CPU complex dies) featuring 64 MB of "3D vertical cache" memory on top of the 32 MB L3 cache. The die-on-die stacked contraption, AMD claims, provides an up to 15% gaming performance uplift, as well as significant improvements for enterprise applications that can benefit from the 96 MB of total last-level cache per chiplet. Ahead of the its debut later today in the company's rumored EPYC "Milan-X" enterprise processor reveal, we're learning that AMD could brand 3D Vertical Cache as "3D Infinity Cache."

This came to light when Greymon55, a reliable source with AMD and NVIDIA leaks, used the term "3D IFC," and affirmed it to be "3D Infinity Cache." AMD realized that its GPUs and CPUs have a lot of untapped performance potential with use of large on-die caches that can make up for much of the hardware's memory-management optimization. The RDNA2 family of gaming GPUs feature up to 128 MB of on-die Infinite Cache memory operating at bandwidths as high as 16 Tbps, allowing AMD to stick to narrower 256-bit wide GDDR6 memory interfaces even on its highest-end RX 6900 XT graphics cards. For CCDs, this could mean added cushioning for data transfers between the CPU cores and the centralized memory controllers located in the sIOD (server I/O die) or cIOD (client I/O die in case of Ryzen parts).

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today Z690 AORUS TACHYON motherboard with the latest 12th generation Intel Core i9 12900K processor and LN2 liquid nitrogen heat dissipation set the world-leading overclocking records of dual 8 GHz, which is 8000 MHz on i9-12900K CPU and 8300 MHz on DDR5 memories. GIGABYTE Z690 AORUS TACHYON motherboard designed by world-famous overclocker equips with plenty functions exclusively for extreme overclockers, which promise overclockers higher scores with easier operation, establishing GIGABYTE's leading role in overclocking on the Z690 motherboards.

"GIGABYTE demonstrate its determination of returning to the overclocking glory with the launch of the Z590 AORUS TACHYON motherboard, and the release of the Z690 AORUS TACHYON further verified the continuation of GIGABYTE's overclocking pedigree on motherboards." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. "Z690 AORUS TACHYON proves GIGABYTE's strong R&D strength on LN2 overclocking by the world records it created. We will definitely use Z690 AORUS TACHYON to create better overclocking performance, and can't wait to see that overclockers around the world use this motherboard to break more world records.

Xiaomi today unveiled its latest breakthrough in heat dissipation - Loop LiquidCool Technology. Inspired by cooling solutions used in the aerospace industry, Loop LiquidCool Technology utilizes a capillary effect which draws liquid cooling agent to the heat source, vaporizes, and then disperses the heat efficiently towards a cooler area, until the agent condenses and is captured via a unidirectional closed looped channel. Compared to conventional vapor chambers solutions, this new technology has twice the cooling capabilities and ranks as the most efficient smartphone cooling solution. Xiaomi aims to bring Loop LiquidCool Technology to its products in H2 2022.

This new technology features an annular heat pipe system that is composed of an evaporator, a condenser, a refill chamber, as well as gas and liquid pipes. Placed at heat sources, the evaporator has refrigerant that evaporates to gas when the smartphone is under high workload. The gas and airflow is then diffused to the condenser, where the gas condenses into liquid again. These liquids are absorbed and collected through tiny fibers in the refill chamber—which refills the evaporator—making it a self-sustaining system.

Intel has recently released their first 12th Gen Core desktop processors with the 125 W TDP K-Series and they appear to be preparing to launch the mid-range 65 W TDP chips in the coming months. The i5-12400F is set to feature 6 cores and threads consisting entirely of high-performance cores without any efficiency cores as found in the existing lineup. The processor features a peak single-core clock speed of 4.4 GHz, while multi-core speeds are 4.0 GHz and 3.4 GHz at PL2 and PL1 power limits respectively. The chip features a 65 W TDP/PL1 power rating and an apparent Maximum Turbo Power PL2 value of 117 W.

This processor has reportedly been tested by French publication Comptoir Hardware where it consistently matched or surpassed the Ryzen 5 5600X in synthetic and gaming benchmarks. These benchmarks were run on Windows 11 with DDR5 memory running at an unspecified speed and an AMD Radeon RX 6900 XT GPU. We have recently seen a listing for the processor at a Canadian retailer which lists the i5-12400F for 249 CAD (200 USD) which if true would be a sizable jump from the 157 USD price of its predecessor but still significantly under the 280 USD Ryzen 5 5600X. The Intel Core i5-12400F is expected to be officially announced sometime in January 2022 possibly at CES 2022.

NZXT, a community-driven provider of PC hardware, software, and services today announces a new Puck in NZXT's CRFT series of fan-inspired licensed products based on the iconic space opera series, Mass Effect. This year NZXT is celebrating N7 Day in style. N7 day lands on November 7th each year and is aptly named after the Systems Alliance rank from the Mass Effect Trilogy.

The NZXT Mass Effect Puck features the seal of the N7 special forces and designates each Puck owner's achievement of completing the training program of the highly sought-after special class. Not only is this special edition Puck a great way to showcase N7 Day pride, it's also a stylish way to store headsets, VR headsets, or cables magnetically on a PC case.

Performance reviews of the Intel 12th Gen Core "Alder Lake-S" processors are out, and spell big trouble for AMD Ryzen 5000 series processors at their current prices. Until the company can refresh these processors, it must content with price-cuts. Early signs of these are already out. American retailer Micro Center just put out a sub-$300 price for the Ryzen 7 5800X, at $299. Prices of the Ryzen 9 5900X and Ryzen 5 5600X remain unchanged, at $500 and $280, respectively, but it's only conceivable that these too will change. At current prices, the Core i7-12700K offers 15% higher performance per Dollar than the Ryzen 7 5800X.