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FSP introduces U3 series adapter that's 50% smaller but just as efficient as the previous generation

FSP Group, a leading manufacturer of power supplies, announced the launch of the new FSP U3 series adapter today. The new U3 series adapter is 50% smaller than its predecessors, making the high-performance CoC tier 2, DOE VI and Energy Star certified adapter one of the most efficient, compact and reliable options available.

With the computing performance of computers and electronic devices becoming more and more powerful, the power wattage they require is also increasing. The FSP U3 Series goes against this trend by offering high load capacity and efficiency in a significantly smaller package. To address the ever-growing need for power efficiency in a smaller footprint, FSP Group, has unveiled its smallest-ever power adapter - the FSP U3 Series Ultra-Slim Adapter.

Alleged Leaked Details on Intel Comet Lake-S Platform Require... You Guessed It... A New Platform

Intel's development of their Core architecture in the post-Ryzen world has been slow, with solutions slowly creeping up in core counts with every new CPU release - but much slowly than rival AMD's efforts. Before Intel can capitalize on a new, more scalable and power-efficient architecture, though, it has to deliver performance and core count increases across its product line to stay as relevant as possible against a much revitalized rival. Enter Comet Lake-S: the desktop parts of Intel's new round of consumer CPUs, which will reportedly see an increase in the maximum core count to a 10-core design. This 10-core design, however, comes with an increase in power consumption (up to 135 W), and the need, once again, for beefier power delivery systems in a new, LGA 1200 package (with 9 more pins that the current LGA 1151).

The move to a new socket and the more stringent power requirements give Intel the opportunity to refresh its chipset offerings once again. If everything stays the same (and there's no reason it should change), new Z470 and Z490 chipsets should be some of the higher tier offerings for builders to pair with their motherboards. The new Comet Lake-S CPUs will still be built in the now extremely refined 14 nm process, and allegedly keep the same 16 PCIe 3.0 lanes as current Coffee Lake Refresh offerings. The new CPU offerings from Intel are expected to roll out in Q1 2020.
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