GALAX has unveiled the specifications for its GeForce RTX 5080 Hall Of Fame Extreme edition graphics card, the only RTX 5080 model featuring two 12V-2x6 power connectors. Interestingly, the card has a TGP of 400 W, and the official GALAX announcement states that the two power connectors are not required for simultaneous use. Instead, they are offered as alternatives to suit different PC builds and cable management preferences, so even if both connections are used, only one will be active. One standard connector is located on the top of the GPU, in the usual spot. The second 12V-2x6 power cable is positioned at the bottom of the card, concealed behind a GPU shroud near the PCIe x16 connector. This serves as an alternative power supply, allowing system builders to hide visible cables for a cleaner look.

For the GPU itself, GALAX has implemented a 20-phase power delivery system for the GPU and a 4-phase power delivery design for the GDDR7 memory, along with a digital PWM controller, eFuse, and HOF-branded inductors. All of this is mounted on a customized white PCB with gold plating on key connections. In OC Mode, which raises the TGP to 400 W, the GPU clock speed reaches 2,805 MHz. In regular Gaming Mode, the TGP is reduced to NVIDIA's reference 360 W, with clock speeds at 2,655 MHz. Since the 12V-2x6 connector is sufficient for these TGP designs, a second power source is unnecessary. GDDR7 memory is running at 30 Gbps on a 256-bit memory bus for a total of 960 GB/s memory bandwidth.

The latest mVolt+ v0.36 update added a number of video card power and voltage management features that appear to make it possible to bypass the stock power limits of some NVIDIA RTX 50-series GPUs without the typical shunt mod or flashing a new vBIOS. Using the new capabilities, one user on r/Overclocking on Reddit claims to have reached 700 W total power draw on their NVIDIA GeForce RTX 5090, scoring 16,523 points in 3DMark Steel Nomad in the process. That's a 125 W up from a stock 5090 TDP of 575 W.

Based on the screenshots of the aforementioned 3DMark benchmark, the GPU topped out at 3,127 MHz, which is a substantial 720 MHz higher than the reference design's 2,407 MHz clock speed. Another user, reporting their results to VideoCardz, managed to overclock an ASUS ROG Astral NVIDIA GeForce RTX 5080 OC to draw a total of 680 W, up from a stock TDP of 400 W—although this can be increased to 450 W with an official tool. In this case, the user notes that there is no shunt mod in use.

At Computex 2026, we've covered a number of well-designed and unique CPU coolers, from the new Cryorig semi-passive cooling case to AIO coolers with swiveling displays on them, and Cooler Master is expanding the list of innovative products at the show with its new hybrid AIO CPU cooler, a new GPU exhaust system, and new active RAM cooling developed in conjunction with. Arguably the most interesting of the lot, and winner of a TechPowerUp "Best of Computex" award, the G11M is a concept cooler that combines air and liquid cooling in an attempt to reach 400 W of cooling capacity. The G11M uses liquid channels, cooling fins, and a downward-firing fan mounted directly on the CPU block to start the heat dissipation process before the warm liquid inside the AIO has even left the CPU block. The rest of the cooler is effectively just a regular 360 mm AIO, so it would theoretically deliver the same performance as a regular AIO with the added benefit of the CPU block cooling and additional airflow over the VRMs and memory.

MaxSun has introduced two additional GPU variants to its Arc Pro B60 Dual GPU lineup. Each card features two of Intel's Arc Pro B60 GPUs, offering a total of 40 Xe2 cores and 48 GB of GDDR6 memory. The first variant is a passively cooled model designed for dual-slot configurations, ideal for server setups with high-airflow chassis that direct air across the card. This design allows any server case with high-RPM fans to accommodate multiple GPUs in parallel for AI inference and local development. However, the standout model is the liquid-cooled edition, measuring 300 x 110 x 20 mm and occupying a single slot. This compact profile is a distinct advantage of the water-cooled design, allowing several cards to be installed close together in dense enclosures without the need for strong airflow.

With the liquid-cooled edition, the card's TDP remains at 400 W, similar to the passive and fan-equipped versions. However, overall performance is expected to be slightly higher due to the increased stability that liquid cooling provides. The compact liquid-cooled unit was developed in collaboration with abee, and the company reports peak GPU temperatures around 61°C when integrated into a cooling loop, although other loop characteristics are unknown. It is assumed that standard industry loop measurements were conducted. Two hose barbs and a 12V-2x6 power connector are located on the rear edge, along with a fan header for auxiliary cooling control. A single-slot bracket offers one DisplayPort 1.2 and one HDMI 2.1a connector for each GPU, resulting in four display outputs in total. In a workstation, you could fit a few of these GPUs and quickly multiply the compute and memory capacity, creating a capable system even without a high-end GPU.

Tomorrow evening, AMD will host its "Advancing AI" livestream to introduce the Instinct MI350 series, a new line of GPU accelerators designed for large-scale AI training and inference. First shown in prototype form at ISC 2025 in Hamburg just a day ago, each MI350 card features 288 GB of HBM3E memory, delivering up to 8 TB/s of sustained bandwidth. Customers can choose between the single-card MI350X and the higher-clocked MI355X or opt for a full eight-GPU platform that aggregates to over 2.3 TB of memory. Both chips are built on the CDNA 4 architecture, which now supports four different precision formats: FP16, FP8, FP6, and FP4. The addition of FP6 and FP4 is designed to boost throughput in modern AI workloads, where models of tomorrow with tens of trillions of parameters are trained on FP6 and FP4.

In half-precision tests, the MI350X achieves 4.6 PetaFLOPS on its own and 36.8 PetaFLOPS in eight-GPU platform form, while the MI355X surpasses those numbers, reaching 5.03 PetaFLOPS and just over 40 PetaFLOPS. AMD is also aiming to improve energy efficiency by a factor of thirty compared with its previous generation. The MI350X card runs within a 1,000 Watt power envelope and relies on air cooling, whereas the MI355X steps up to 1,400 Watts and is intended for direct-liquid cooling setups. That 400 Watt increase puts it right at NVIDIA's upcoming GB300 "Grace Blackwell Ultra" superchip, which is also a 1,400 W design. With memory capacity, raw computing, and power efficiency all pushed to new heights, the question remains whether real-world benchmarks will match these ambitious specifications. AMD now only lacks platform scaling beyond eight GPUs, which the Instinct MI400 series will address.

TechPowerUp's W1zzard did not honor the ASUS ROG Astral RTX 5080 OC Edition graphics card model with any awards—as disclosed in his late January evaluation, a major negative point was highlighted: "no additional power limit increases allowed." The premium-tier ASUS offering managed to top TPU's "Maximum Overclock Comparison" GeForce RTX 5080-class table; comfortably leading the pack with an out-of-the-box (default) 400 W power setting. Reviewers and well-heeled owners—of this $1500+ special quad-fan package—have lamented the apparent lack of extra headroom. Sitting in fifth place was GIGABYTE's RTX 5080 GAMING OC SKU; a card that can support up to 450 W. As reported by VideoCardz earlier today, ASUS has taken onboard aforementioned feedback.

Resultant under-the-hood tinkerings were implemented mid-way through last month. The "ROG Astral GeForce RTX 5080 16 GB GDDR7 OC Edition" support page has welcomed a new downloadable file—authored on March 14—this BIOS update is advertised as being capable of: "increasing the (model's) maximum TGP to 450 W." Additional bragging rights will be granted with this patch; owners can boast about their expensive bits of kit being further enhanced—NVIDIA's reference specification TGP/TDP is 360 W. Thumbs up go to Team ASUS once again—mid-February Astral series updates tweaked noise profiles; not too long after an absorption of launch day criticism.

According to two of the most accurate leakers, kopite7kimi and hongxing2020, NVIDIA's GeForce RTX 5090 and RTX 5080 will feature 575 W and 360 W TDP, respectively. Previously, rumors have pointed out that these GPU SKUs carry 600 W and 400 W TGPs, which translates into total graphics power, meaning that an entire GPU with its RAM and everything else draws a certain amount of power. However, TDP (thermal design power) is a more specific value attributed to the GPU die or the specific SKU in question. According to the latest leaks, 575 Watts are dedicated to the GB202-300-A1 GPU die in the GeForce RTX 5090, while 25 Watts are for GDDR7 memory and other components on the PCB.

For the RTX 5080, the GB203-400-A1 chip is supposedly drawing 360 Watts of power alone, while 40 Watts are set aside for GDDR7 memory and other components in the PC. The lower-end RTX 5080 uses more power than the RTX 5090 because its GDDR7 memory modules reportedly run at 30 Gbps, while the RTX 5090 uses GDDR7 memory modules with 28 Gbps speeds. Indeed, the RTX 5090 uses more modules or higher capacity modules, but the first-generation GDDR7 memory could require more power to reach the 30 Gbps threshold. Hence, more power is set aside for that. In future GDDR7 iterations, more speed could be easily achieved without much more power.

Thanks to the renowned NVIDIA hardware leaker kopite7Kimi on X, we are getting information about the final versions of NVIDIA's first upcoming wave of GeForce RTX 50 series "Blackwell" graphics cards. The two leaked GPUs are the GeForce RTX 5090 and RTX 5080, which now feature a more significant gap between xx80 and xx90 SKUs. For starters, we have the highest-end GeForce RTX 5090. NVIDIA has decided to use the GB202-300-A1 die and enabled 21,760 FP32 CUDA cores on this top-end model. Accompanying the massive 170 SM GPU configuration, the RTX 5090 has 32 GB of GDDR7 memory on a 512-bit bus, with each GDDR7 die running at 28 Gbps. This translates to 1,568 GB/s memory bandwidth. All of this is confined to a 600 W TGP.

When it comes to the GeForce RTX 5080, NVIDIA has decided to further separate its xx80 and xx90 SKUs. The RTX 5080 has 10,752 FP32 CUDA cores paired with 16 GB of GDDR7 memory on a 256-bit bus. With GDDR7 running at 28 Gbps, the memory bandwidth is also halved at 784 GB/s. This SKU uses a GB203-400-A1 die, which is designed to run within a 400 W TGP power envelope. For reference, the RTX 4090 has 68% more CUDA cores than the RTX 4080. The rumored RTX 5090 has around 102% more CUDA cores than the rumored RTX 5080, which means that NVIDIA is separating its top SKUs even more. We are curious to see at what price point NVIDIA places its upcoming GPUs so that we can compare generational updates and the difference between xx80 and xx90 models and their widened gaps.

AMD's next-gen EPYC Zen 5 processor family seems to be nearing launch status—late last week, momomo_us uncovered an unnamed motherboard's datasheet; this particular model will accommodate a single 9000-series CPU—with a maximum 400 W TDP—via an SP5 socket. 500 W and 600 W limits have been divulged (via leaks) in the past, so the 400 W spec could be an error or a: "legitimate compatibility issue with the motherboard, though 400 Watts would be in character with high-end Zen 4 SP5 motherboards," according to Tom's Hardware analysis.

AMD's current-gen "Zen 4" based EPYC "Genoa" processor family—sporting up to 96-cores/192-threads—is somewhat limited by its DDR5 support transfer rates of up to 4800 MT/s. The latest leak suggests that "Turin" is upgraded quite nicely in this area—when compared to predecessors—the SP5 board specs indicate DDR5 speeds of up to 6000 MT/s with 4 TB of RAM. December 2023 reports pointed to "Zen 5c" variants featuring (max.) 192-core/384-thread configurations, while larger "Zen 5" models are believed to be "modestly" specced with up to 128-cores and 256-threads. AMD has not settled on an official release date for its EPYC "Turin" 9000-series processors, but a loose launch window is expected "later in 2024" based on timeframes presented within product roadmaps.