MONTECH, a global leader in PC cases, power supplies, and cooling solutions, proudly announces the launch of SKY 3, the next evolution of its iconic SKY series PC cases. SKY 3 introduces a reimagined modular internal architecture and integrated horizon lighting, designed to meet the demands of next-generation hardware while delivering a remarkably clean and adaptable build experience. With support for back-connect motherboards and next-gen GPUs, SKY 3 blends future-ready performance with refined, modern aesthetics.

Adaptive Modular Bottom Chamber
At the heart of SKY 3 is an innovative adaptive modular bottom chamber, featuring a fully swappable PSU compartment and bottom fan bracket that allow builders to customize internal layouts based on cooling priorities. In GPU Mode, intake fans are positioned directly beneath the graphics card to maximize static pressure and cooling efficiency. In CPU Mode, airflow is redirected toward the motherboard area, helping dissipate heat from VRMs and surrounding components while supporting stable CPU operation. This flexible design empowers users to tailor airflow behavior to their specific system configuration.

[Editor's note: Our in-depth review of the Montech Sky 3 is now live]

Akasa, a leading provider of thermal solutions, announced the Pascal MX, an IP65-rated dust-tight and water jet resistant aluminium fanless case designed for Mini-ITX and Thin Mini-ITX motherboard systems operating in industrial, outdoor or mission-critical environments. The Pascal MX addresses one of the core challenges in harsh-environment embedded computing: maintaining system reliability where conventional fan-cooled cases fail due to dust ingress and moisture. For engineers and system integrators attending Embedded World 2026 in Nuremberg from 10 to 12 March, the Pascal MX will be on display at Hall 1, Booth 640, alongside Akasa's wider range of fanless cases, CPU coolers, heatsinks, and thermal solutions.

At the heart of the Pascal MX is Akasa's patented spring-loaded CPU mounting system, which maintains consistent, uniform contact pressure across all supported sockets (Intel LGA1851, LGA1700, and LGA1200). This enables the same chassis to support Intel Core processors from 10th-14th Generation and the latest Intel Core Ultra (15th Gen) processors, all at up to 65 W TDP. Heat from the CPU and M.2 2280 SSD is conducted into the aluminium chassis via dedicated thermal modules, dissipating passively through the external fins. With no fans and no moving parts, the Pascal MX eliminates the primary sources of mechanical failure and particulate ingress that limit system uptime in demanding deployments.

Antec Inc., a global leader in high-performance computer components and accessories, proudly announces the launch of the Antec 900, a next-generation full-tower chassis engineered for Edge AI workloads, professional workstations, and high-end gaming systems. Designed for demanding computing environments, the Antec 900 provides a scalable platform for AI development, engineering, content creation, and 8K-capable gaming.

The Antec 900 supports ATX, E-ATX, SSI-CEB, and SSI-EEB motherboards, including AMD Threadripper systems, and is also compatible with back-connect motherboards for cleaner cable management and improved airflow. The spacious interior accommodates multi-GPU and accelerator configurations such as NVIDIA RTX 6000 Ada series GPUs. With support for graphics cards up to 495 mm in length and 160 mm in thickness, the chassis is built for the latest generation of high-performance hardware.

Chieftec is pleased to present our new high-performance ATX workstation chassis, BW-01B-OP. Designed with a timelessly elegant front panel and a modern door concept, it combines professional aesthetics with practical functionality. Its essential front I/O, including a USB Type-C port, ensures convenient connectivity for today's workflows.

Key Features

• Modern ATX workstation with a pre-installed 120 mm PWM HDB fan
• Supports radiators up to 360 mm
• Two tool-less 5.25" drive bays
• Features 3.5" and 2.5" tool-less trays for up to 10 SSD/HDD drives
• Easy-to-remove storage cage system

If you were in or around the PC building space in 2020, you'd have at least heard about the fire risk related to the PCIe riser cable on the original NZXT H1 mini ITX case, which eventually resulted in a recall and replacement PCIe riser kits being sent out. Since NZXT has launched the newest iteration of the SFF case, the H2 Flow—which TechPowerUp has reviewed—the PC case maker has seen fit to publish a blog post explaining the engineering changes it has made to the new H2 Flow's riser cable to avoid the same issues from popping up again. NZXT starts things off by reminding us that the problem with the original H1's PCIe riser cable was that the mounting screw made contact with an internal power plane in the riser cable's PCB, resulting in a short circuit that could lead to a fire.

The brand goes on to explain that the issue has been avoided in the new PCIe riser cable with two safety measures. First, there is a physical boss, or "shoulder" that extends into the PCB through-hole to protect the PCB from the screw threads and to ensure that there is a consistent and guaranteed gap between the screw and the PCB. Secondly, NZXT has changed the design of the PCB such that there are no power planes or traces surrounding the screw hole—every trace around the screw is grounded, and that ground plane extends externally to a copper screw pad on the top and bottom of the PCB, adding another layer of protection. NZXT notes that the screw pad may be missing in some early review samples, which is something you can observe in our review of the H2 Flow, but it is included in the final mass production versions of the case. NZXT claims that these measures have eliminated the failure mode that caused issues with the original H1 chassis.

Akasa, a leading provider of thermal solutions, introduced the Euler CMX, a compact, aluminium, fanless case designed for Mini-ITX motherboards. The Euler CMX supports Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP and integrates a 220 W DC-to-DC power converter, delivering reliable performance in space-constrained environments while ensuring long-term durability for industrial automation, point-of-sale (POS), kiosk, digital signage, surveillance or other commercial systems.

This case is compatible with Mini-ITX motherboards with Intel LGA1851, LGA1700, LGA1200 or LGA115X sockets, supporting Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP.

NZXT, a leading brand in PC gaming components and prebuilt systems, today introduced the H2 Flow Mini-ITX Case and the C850 SFX Power Supply, two compact solutions designed to bring high-performance PC builds into smaller spaces without compromise. With a focus on airflow, compatibility, and ease of installation, these products make small form factor (SFF) systems more powerful and accessible than ever.

For players who want the performance and design of the H2 Flow without building it themselves, NZXT is also launching the H2 Mini PC, available for a limited time, exclusively in the United States. This prebuilt option delivers the same compact footprint and performance-focused design in a fully assembled, ready-to-play system, making small form factor PC gaming more accessible to a wider audience.

[Editor's note: You can read ourin-depth review of the NZXT H2 Flow Mini-ITX case here]

In Win Development Inc. (InWin), an award-winning innovator in PC chassis design and engineering, today announces the launch of the W50, a new mid-tower panoramic chassis. The W50 combines InWin's signature architectural aesthetic in the shape of a "W" with an expansive interior capacity and advanced thermal management, appealing to a variety of builds.

Iconic W-Shaped Panoramic Glass
The W50 features three tempered glass panels arranged in InWin's distinctive W-shaped split-line configuration, delivering an uninterrupted panoramic view of internal components. Dual-way mirrored glass reveals system hardware when illuminated and while transforming into a refined mirror finish when powered off.

Announcing North Series Momentum Edition—a performance-driven expression of North's transformative design, delivering Momentum-powered cooling straight out of the box.

With three Momentum fans featuring LCP blades and true FDB bearings, North Series Momentum Edition keeps high-performance components running smoothly, supported by the same iconic open front design and top mesh ventilation as the original. That performance foundation is paired with a blackened oak front and
dark alloy accents for a sleek aesthetic that integrates naturally into the gaming station.

[Editor's note: Our in-depth review of the North Momentum Edition is now live]

In early 2026, PC case manufacturers continue to add "wood accents" onto existing products. TechPowerUp spotted multiple examples during time spent perusing company booths at the recent CES trade show, in Las Vegas. For obvious reasons, DeepCool did not get the chance to exhibit its latest wares at this highly important consumer event. Earlier today, ITHome stumbled upon the Chinese computer hardware manufacturer's own attempts at attracting the "wood effect" material crowd. New JD.com listings show Deepcool's "CH260 Wood Grain Edition" microATX cases hitting the native market.

A black option is available at 399 RMB (~$57.30 USD). A pale white alternative demands a small upcharge of +50 RMB (~$7.18 USD). Deepcool's CH-series debuted way back in the spring of 2024, with the well specced and reasonably priced CH160 model quickly gaining favor in ITX/SFF case format circles. A larger spin-off—CH260—launched later on in the year; suitably able to accommodate microATX motherboards. By then, DeepCool was a few months deep into being affected by US trade sanctions. Anyway, the CH260 arrived elsewhere in the world—finished in the usual standard black or white colorways. Over a year later, Chinese buyers get to enjoy first dibs with the local launch of Wood Grain variants. Promo material shows very little visual difference between non-wood and accented options.

Announcing Pop 2 Air - the evolution of the Pop series, bringing enhanced performance and a refreshed design. Pop 2 Air combines an open mesh front, ventilated top, and an integrated GPU air guide to deliver airflow cooling out of the box.

Designed for compatibility with high-performance gaming components, it supports graphics cards up to 416 mm, top-mounted radiators up to 360 mm, and includes three swept-blade fans for smooth, efficient airflow.

GAMEMAX, a rising innovator in PC gaming hardware, today announced the launch of the NEX C53 Panoramic Chassis, a compact yet highly capable PC case designed to showcase modern components without sacrificing airflow or compatibility. Built around a panoramic view layout, the NEX C53 delivers a clean, immersive visual presentation while maintaining efficient internal space utilization. Engineered for enthusiasts and gamers seeking high-performance hardware support in a streamlined form factor, the GAMEMAX NEX C53 accommodates large graphics cards of up to 410 mm in length, advanced cooling configurations, and modern connectivity. Its redesigned internal structure breaks away from traditional layouts, allowing GAMEMAX to deliver premium aesthetics, enhanced airflow customization, and improved space efficiency within a compact chassis footprint.

EXO 626 is a premium concept chassis that blends the freedom of open-frame architecture with the refinement of a fully enclosed system. Inspired by exoskeletal design, it presents the PC as an architectural object that is minimal, intentional, and visually striking.

The chassis features separated compartments for GPU, PSU, and AIO cooling, combined with passive-focused airflow for quiet, efficient performance. Mesh panels support optimal airflow while maintaining a clean, streamlined form. EXO 626 supports large, high-end GPUs and AIO solutions, offering a layout that balances performance with visual impact.

If you want a PC case that has high-performance cooling as well as a modern look with continuous glass, then the SK6 ARGB is the right choice. For an impressive illumination, there are three pre-installed ARGB PWM fans - two of which have a side-panel air intake to provide a balanced cooling despite the glass paneling. In addition, the stylish ATX case has a spacious interior for all the latest hardware and offers compatibility with modern BTF mainboards.

Stylish Design with Glass Front and Side
The SK6 ARGB is all about showcasing your hardware: The front and side are made of tempered glass and combine almost seamlessly to create a look that is both modern and chic.

Thermaltake debuted a number of new retro PC cases and some flashy new PSU hardware at CES 2026, but aside from the limited edition Koralie TR100 case, one of the most striking cases presented on the show floor in Las Vegas has to be the Thermaltake Core PX Infinity WS ARGB. That mouthful of a name has been bestowed upon a new open frame chassis that Thermaltake has been working on. The Core PX Infinity WS ARGB features a double-curved tempered glass side panel, front-mounted wood accents, and dual infinity mirrors, and is designed to be built as a statement piece. It also supports vertical GPU mounting and even has an option to be wall mounted. It also sports a wood panel that covers the PSU to match the aesthetic of the front wood slats.

The Thermaltake Core PX Infinity WS ARGB has integrated addressable RGB lighting in the infinity mirror panels on the top and front panels, and it has decent support for cooling hardware, with up to 420 mm radiators supported in the motherboard-adjacent position. The open air design, means that not much airflow is needed, so that's about where support for cooling hardware ends. The case is also compatible with the Thermaltake 6-inch screen kit, which was also shown off at the CES booth. Pricing and availability for the Core PX Infinity WS ARGB have not yet been announced, but features like the double-curved tempered glass side panel tend to inflate costs dramatically, so expect this to be on the high end. It will be available in both Snow (white) and black color ways. Curiously, the build TechPowerUp's CES team spotted on the show floor had the side panel rotated 90° from the orientation shown in Thermaltake's official CES information packet, with the wood "front panels" being moved to the top to accommodate the change, suggesting that the case can accommodate a number of configurations.

The iBuyPower booth at CES 2026 is loaded with new RGB-clad CPU coolers destined to land in its pre-built PCs in 2026, but the system integrator has also revealed new case designs and custom loop liquid cooling solutions that it says will "make hard-line water cooling accessible to everyone." The highlight of iBuyPower's new pre-built PCs are the Trace X and Trace X CL pre-built PCs and PC cases. Both versions of the Trace X build use the same redesigned Trace and Slate cases, which now feature a curved tempered glass panel that serves as a window for both the front and side of the PC build, allowing buyers to show off their internals, while a mesh panel that runs along the case's top and right side bring in fresh air. The Trace X case has space for eight 120 mm fans—three side intake, three top-mounted exhaust fans, a rear exhaust fan, and one bottom intake—as well as support for 415 mm long GPUs, 165 mm CPU tower air coolers, and PSUs up to 230 mm long. The Trace X case will be available starting January 2026 for $99.99 in white, with silver or optional pink and lavender trim on the side panel, or black with gunmetal gray or optional faux wood side panel trim.

At CES 2026, InWin presented a mix of showcase chassis, mainstream PC cases and enterprise platforms, covering everything from enthusiast builds to AI and HPC deployments. Leading the lineup is AEON, InWin 12th signature chassis. This full-tower case uses aluminium, tempered glass, stainless steel, and mirrored mosaic panels. It supports motherboards up to 305 × 330 mm (E-ATX), offers eight PCIe slots, fits GPUs up to 360 mm, and includes space for two 270 mm PSUs. Cooling support includes up to six 120/140 mm fans and dual 360/420 mm radiators. The front I/O panel features dual USB 3.2 Gen 2 Type-C ports, and we should add that the case features RFID-based access.

For professional workloads, COVALENT targets AI and HPC users with a modular workstation design. It supports EEB motherboards, eight PCIe slots, up to eight 3.5-inch or nine 2.5-inch drives, and extensive cooling options with up to 13 fans or multiple large radiators.

The TechPowerUp team was invited up to Bitspower's Las Vegas suite earlier today. An overwhelming number of collaborative custom PC builds were on display, but two rows of new case designs occupied a corner of the Taiwanese brand's presentation space. Immediately, the manufacturer's GX chassis series drew our eye—the gigantic brushed aluminium GX1 model seems an ideal showpiece. Thanks to large sections of glass panelling, mounted/installed components can be displayed to the maximum degree. Unfortunately, most of Bitspower's latest offerings did not contain demonstration hardware. As expected, their smaller GX2 cases share much of the same design lingo, but the "M" variant forgoes glass side panels. A mostly mesh design is armed with seven pre-installed fans.

The Bitspower CA100 enclosure family was spread evenly across the entire length of one of the suite's tables. Comprised of nine SKUs, TechPowerUp picked out one demo unit for closer inspection. As far as we can tell—in isolation—the CA100F-S8 model sports a front-facing selection of connectors, a mix of solid and mesh panels, and mounting points for left side-oriented fans. This low-key design likely targets low noise PC system enthusiasts. The other CA100 cases offer a myriad of different panel types (solid, mesh, glass), and front or top port placements.

Thermaltake introduced at CES 2026 two new PC cases aimed at very different audiences. The View Cross TG is a concept design dual-system microATX chassis designed to run two PCs in a single enclosure. Available in Black and Snow color options, the case supports up to two microATX motherboards, dual power supplies mounted behind the motherboard tray, and up to thirteen 120 mm fans. Cooling support up to 2x 280 mm AIO radiators (side) stacked, up to 2x 360 mm radiators (top/side), or combos with 280 mm (side only). Storage options include up to four 3.5-inch hard drives and six 2.5-inch SSDs. The top I/O panels (2 sets) feature 4x USB 3.0 + 2x USB 3.2 Gen 2 Type-C and 2x HD Audio. This Thermaltake idea can be useful in some cases, bringing a certain degree of ergonomics to the desk area. However, we can see one "small problem": it will be a little more difficult to quickly "pack your own things and leave". No exact info on availability and pricing.

Also on display was the TR100 Koralie Edition, a limited-edition (500 units) Mini-ITX case created in collaboration with French artist Koralie. It is based on the existing TR100 series, a compact 18.4-liter small form factor chassis that uses a dual-chamber layout and includes a PCIe 4.0 riser cable. It supports SFX power supplies, up to two 120 mm or 140 mm fans on the top, and AIO liquid coolers up to 280 mm. Thermaltake also offers optional accessories such as a 3.9-inch LCD screen kit and a portable gaming suitcase. Each TR100 Koralie Edition case is hand-signed and features a hand-numbered plate, available from Q1 2026 at $169.99.

COUGAR returns to CES with an evolutionary lineup of PC hardware and gaming furniture. By reorienting chassis topology to augment cooling and merging mechanical design logic and aesthetics with ergonomics, our 2026 portfolio focuses on evolutionary design: harmonizing advanced technology with the human experience, shaped for balance, efficiency, and comfort.

A revolution might change the world in an instant, but evolution re-encodes the very DNA of how we inhabit it. As boundaries between users and high-performance technology dissolve, innovation must not only disrupt, but endure. From thermal engineering that repurposes dormant space as active air paths to furniture that supports the human form as the extension of the machine, we perfect the union of form and function to redefine the interface. COUGAR will be exhibiting from January 6-8 in a private VIP showroom at the Venetian Resort Las Vegas.

Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly introduces the Retro Series at CES 2026. Inspired by the character, colors, and playful simplicity of classic tech aesthetics, the Retro Series reimagines familiar vintage motifs through modern design. The collection features two chassis and a new AIO liquid cooler, each blending expressive retro style with the performance required by today's PC builders.

The Retro Series features soft tones, textured panels, and subtle retro accents, paired with enhanced airflow, hidden-connector motherboard support, vibrant LCD displays, and next-generation cooling. It's a retro-futuristic approach that blends nostalgia with contemporary performance. At its core, the Retro Series celebrates theme-driven building, systems that express personality and creativity. Whether users want a retro-inspired battlestation or a cozy themed setup, the series offers a playful yet premium canvas for personal expression.

MSI introduces the new PRO MAX Series, a unified high-end platform shaped by Modernity, Acceleration, and eXperience for the evolving rhythm of everyday work. Guided by a consistent design language of color, hierarchy, and structure, PRO MAX keeps the focus on what matters most-the content itself. Performance is tuned for multitasking, image processing, data-driven workloads, and out of office collaboration, while an intuitive and predictable user experience ensures a smooth and uninterrupted flow across different work environments.

As work expands across shared, and hybrid settings, PRO MAX maintains continuity wherever work happens. The PRO MAX Series debuts with a complete product lineup spanning Monitor, Desktop PC, All-in-one PC, Motherboard, Power supply, Chassis and Liquid cooler-forming a fully integrated ecosystem for everyday work.

Lian Li Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, launches the Vector V100 MINI, a compact microATX case that offers the same design and performance as the original V100 in a smaller form factor. Despite its reduced size, the V100 MINI maintains extensive fan support with configurations for up to three 120 mm side fans, three 120 mm or two 140 mm top fans, and one 120 mm rear fan, ensuring strong airflow and cooling flexibility.

The V100 MINI is compatible with both standard and back-connect microATX motherboards, features front and side tempered glass panels for 270° unobstructed visibility, and can fit GPUs up to 415 mm with an included anti-sag bracket and PSU shroud cable opening for clean routing and a professional look. The Vector V100R MINI version includes 4x pre-installed 120 mm ARGB PWM fans (3x reverse side intakes and 1x rear exhaust). Both variants are available only in black.

FSP has introduced the S210, a compact microATX small tower case with a 23-liter volume. The case measures 350 × 212 × 310 mm and can accommodate full-length graphics cards up to 340 mm and CPU air coolers up to 170 mm in height. It's made of 0.7 mm SPCC steel, paired with a single tempered glass side panel. A metal mesh section covering the front and top of the case improves airflow, while a built-in carry handle adds basic portability. As with many small form factor cases, power supply support is limited to standard ATX units up to 140 mm in length. Cooling options include space for two 120 mm fans or a 240 mm radiator at the top, along with a single 120 mm rear fan.

Storage support consists of one 3.5-inch drive (shared with an SSD mount) and two dedicated 2.5-inch SSD mounts. For expansion, it features four PCIe slots while the front I/O panel is minimal, offering two USB 3.0 ports, an audio jack and a power button. The S210 supports microATX and Mini-ITX motherboards and is currently listed in black as the S210-B variant, so we can expect other color options in the future. Pricing and exact availability haven't yet been announced by FSP.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to introduce the S380 TG ARGB Mid-Tower Chassis, available in Black and Snow. Designed for users who value both performance and simplicity, the S380 TG ARGB combines an elegant minimalist mesh front panel with high airflow design, delivering a chassis that's as efficient as it is refined. Behind its clean exterior lies a layout optimized for cooling and component compatibility. The S380 TG ARGB supports Mini-ITX, microATX, and ATX motherboards, including the latest hidden-connector motherboard designs such as ASUS BTF, MSI Project Zero, and GIGABYTE Project Stealth. Dedicated cutouts along the motherboard tray ensure tidy cable routing and a clean interior.

To achieve high thermal performance, the chassis comes pre-installed with a SF360 ARGB PWM Reverse Fan on the PSU cover and a SF120 ARGB PWM fan at the rear, providing immediate and balanced airflow. The reverse fan directs cool air toward the GPU area, maximizing graphics card cooling efficiency. Builders can further expand cooling with support for up to ten 120 mm fans or dual 360 mm radiators installed on the top and front simultaneously.