OCZ Storage Solutions -- a Toshiba Group Company and the most awarded solid state drive (SSD) brand of all time, today announced plans to showcase the all-new Trion 100 series, a new SSD based on Triple-Level Cell (TLC) NAND flash, at this year's Computex in Taipei, Taiwan held June 2 - 6. As OCZ's new value-oriented option, Trion 100 SSDs are built to provide an easy and affordable way for entry-level users to optimize their mobile or desktop systems.

Leveraging Toshiba's Alishan SSD controller and premium A19 TLC flash memory technology, the Trion 100 series was designed to deliver a superior balance of performance, reliability, and value and will be available this summer. Running live in OCZ's Computex booth, Trion 100's preliminary performance ratings include up to 550MB/s of bandwidth and up to 91,000 random read IOPS, making the Trion 100 series a competitive upgrade solution that will transform any notebook or PC.

"Computex is the ideal venue for us to unveil our upcoming TLC NAND-based Trion 100 SSDs," said Alex Mei, CMO and GM of the Client Business at OCZ Storage Solutions. "By leveraging controller and TLC NAND technology from Toshiba, we are pleased to be able to bring to market the exciting new Trion 100 SSD Series which will offer end-users an optimal mix of performance, features, and value, making it easier than ever for value-conscious consumers to leverage the benefits of a high quality yet affordable SSD that delivers improved desktop and mobile computing experiences."

Since the introduction of our first PC-case, the Deep Silence 1 in the autumn of 2012, our products have been honored with more than 150 awards by trade magazines and reviewers from all over the world. Thanks to their modular design our PC cases are perfectly suited for water cooling systems. Consequentially we began to offer a selected, continuously growing range of high quality accessories for dedicated water cooling enthusiast under the label CoolForce.

Makes you wonder what we will have in store for the Computex 2015, doesn't it? You are hereby cordially invited to join us in the Nangang Exhibition Hall at Booth J1105 from June 2 to June 6. We promise you an impressive range of new products - and not only that...To perfect the introduction of our new Nanoxia CoolForce case series and the presentation of our further optimized Deep Silence models, we brought to life "The NanoXia Project."

SilverStone is flexing its engineering muscle, to woo the compact gaming PC community that the SFX-L form-factor of power supplies have arrived, and ready for multi-GPU. SFX-L is slightly bigger than SFX but significantly smaller than ATX. The company is ready with a 700-Watt PSU in the SFX-L form-factor. Part of the company's new line of SFX-L category with the SFX series, the lineup will be led by the 700W SX700-LPT, and possibly followed by lower wattage models in the future. The company pioneered this form-factor with the 500W SX500-LG, earlier this January. The new PSUs will likely have enough juice and straws for gaming PC builds with up to two graphics cards. The SX700-LPT will boast 80 Plus Platinum efficiency ratings and the company is expected to show them off at Computex 2015, this June

Ahead of the coming 2015, Computex in June computer cooling innovation brand CRYORIG is introducing multiple new products and even multiple completely new product lines. This will be CRYORIG's biggest Computex showing ever, introducing a total of 7 new products, 6 new product lines and four new product categories.

The C7 is designed to be a "fit anywhere, cool anything" low profile cooler. Thanks to it's total height of under 53mm, it is just as small as the Intel stock cooler, but comes with so much more. With stagger total of four 6 mm copper heatpipes and a full proprietary 92 mm 600~2500 RPM PWM fan with Quad Air Inlet technology, it may be small but has all the making of a high-end CRYORIG cooler. The C7 fits both Intel 115x and modern AMD sockets, and basically any case on the market. If the system can fit the stock Intel/AMD cooler, then it will not only fit the C7, it should be upgraded to the C7 immediately.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is hosting two major extreme overclocking events at Computex 2015 (June 2~6): the OC World Cup 2015 and the OC World Record Stage 2015! 19 world-class overclockers, 5 motherboard vendors, and 3 hardware sponsors - all at the G.SKILL Computex Booth I0608, located at Nangang Exhibition Hall, 1F.

Very special thanks to Intel, Samsung, and Kingpin Cooling for sponsoring the OC World Cup 2015 and the 4th Annual OC World Record Stage extreme overclocking events. "Intel is pleased to be a sponsor of this year's G.SKILL OC World Cup & 4th Annual OC World Record Stage at Computex 2015," says Gregory Bryant, Corporate Vice President and General Manager, Intel Corporation. "Intel processors and chipsets enable mind-blowing experiences and we are glad to be a part of this exciting event."

Back in 2008, when it looked like NVIDIA owned the GPU market, and AMD seemed lagging behind on the performance and efficiency game, the company sprung a surprise. The company's RV770 silicon, the first GPU to implement GDDR5 memory, trounced NVIDIA's big and inefficient GeForce GTX 200 series, and threw AMD back in the game. GDDR5 helped the company double the memory bandwidth, with lower pin- and memory-chip counts, letting the company and its partners build graphics cards with fewer components, and earn great margins, which the company invested in development of its even better HD 5000 series, that pushed NVIDIA with its comical GeForce GTX 480, to hit its lowest ever in market-share. Could AMD be looking at a similar turnaround this summer?

Since the introduction of its Graphics CoreNext architecture in 2012, AMD has been rather laxed in its product development cycle. The company has come out with a new high-end silicon every 18-24 months, and adopted a strategy of cascading re-branding. The introduction of each new high-end silicon would relegate the existing high-end silicon to the performance segment re-branded, and the existing performance-segment silicon to mid-range, re-branded. While the company could lay out its upcoming Radeon R9 series much in the same way, with the introduction of essentially just one new silicon, "Fiji," it could just prove enough for the company. Much like RV770, "Fiji" is about to bring something that could prove to be a very big feature to the consumer graphics market, stacked high-bandwidth memory (HBM).

FSP, the performance power specialist, announces a new line of Energy Storage System (ESS) products. The EMERGY 3000 Series comes in 2.6kWh (Li-ion) or 1.7kWh (Lithium Iron Phosphate) models and the EMERGY 1000 Series provides 900Wh (Li-Ion) of portable power. As a home battery, the fast-charging EMERGY series excels at solar power storage and emergency power delivery. With their portable suitcase design they also function well as a clean and noiseless power pack for camping, outdoor concerts and events, emergency response and more.

Home batteries not only provide backup power when power is lost, but let users save money on their energy bill. With fast charge times, the EMERGY series lets users store power at cheap off-peak rates to use during peak hours and save money on their energy bills. With built-in UPS circuitry, the EMERGY series also excels as a backup power source and clean alternative to a backup generator switching on automatically when the electricity goes out to keep refrigerators and appliances running smoothly until power is restored.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, announces its USB 3.1 Portable RAIDDrive, a high performance storage device that allows you to transfer large files extremely quickly through the USB 3.1 interface.

The Super Talent USB 3.1 Portable RAIDDrive consists of two M.2 SSDs within the enclosure that are set up in RAID 0. This allows increased performance in a small portable form factor that uses the USB 3.1 interface. With speeds up to 750 MB/s read and 700 MB/s write, transferring large files around such as media content only take a matter of seconds.

One of ASRock's prime attractions at this year's Computex, apart from its socket LGA1151 motherboards, will be a fanless compact desktop, the BeeBox. Driven by 14 nm Intel "Braswell" Celeron N3000 series SoC, the BeeBox will pack in 2 GB or 4 GB of DDR3L-1600 memory (expandable to 8 GB using two SO-DIMM slots), 32 GB to 128 GB mSATA SSD storage, and connectivity that includes 802.11 ac WLAN, gigabit Ethernet, Bluetooth 4.0, four USB 3.0 ports (including one type-C port), and display outputs that include HDMI and DisplayPort. Measuring 110 mm x 46 mm x 118.5 mm, the BeeBox will be complete quiet, including its brick-type power supply.

Tesoro Technology USA Inc., a manufacturer of high-tech gaming products, will be showcasing their latest PC gaming peripherals at COMPUTEX 2015, June 2nd - 5th, including a new lineup of gaming products. Attendees can view the whole line of new and upcoming gaming peripherals as well as check out their latest mechanical keyboards at Taipei International Convention Center (TICC) 1F Meeting Room 106.

For the past few years, Tesoro has been focusing mainly on mechanical gaming keyboards. Four years ago Tesoro launched its first mechanical keyboard. Since then, Tesoro has expanded its line into one of the largest portfolios of mechanical gaming keyboards in the market targeting the different needs of gamers. To expand its gaming focus, the company is going to release a new catalog of gaming mice, headsets, PC cases and accessories, while still maintaining and upgrading its vast portfolio of keyboards.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced that it has created the world's fastest DDR4 128GB memory kit running at an astounding 3000MHz. The kit consists of eight 16GB HyperX Predator modules (16GB x 8) motherboard in an eight module, quad-channel configuration along with an MSI X99 MPOWER motherboard in an eight module, quad-channel configuration along with an Intel Core i7 5820K processor.

During Computex en Taipei,HyperX will unleash a high-performance system featuring the upcoming 16GB modules powered by the recently released HyperX Predator M.2 PCIe SSD. The live demo will take place during the HyperX Roadshow Experience from June 4-7, 2015, at the ATT 4 FUN center, in Taipei. More details will be forthcoming about availability and pricing for HyperX Predator 16GB DDR4 modules and kits.

At its ongoing Investor Day presentation, AMD announced that will continue to make GPUs for every segment of the market. The company is planning to leverage improvements to its Graphics CoreNext architecture for the foreseeable future, but is betting on a huge performance/Watt increase with its 2016 GPUs. The secret sauce here will be the shift to 14 nm FinFET process. It's important to note here, that AMD refrained from mentioning "14 nm," but the mention of FinFET is a reliable giveaway. AMD is expecting a 2x (100%) gain in performance/Watt over its current generation of GPUs, with the shift.

AMD's future GPUs will focus on several market inflection points, such as the arrival of CPU-efficient graphics APIs such as DirectX 12 and Vulkan, Windows 10 pulling users from Windows 7, 4K Ultra HD displays getting more affordable (perhaps even mainstream), which it believes will help it sell enough GPUs to return to profitability. The company also announced an unnamed major design win, which will take shape in this quarter, and which will hit the markets in 2016.

Here is the first picture of Colorful's premium socket LGA1151 motherboard, the iGame-Z170. The company plans to carve out at lease three unique SKUs out of this PCB (second picture below), the iGame-Z170 being the base model. As its name suggests, the board is based on Intel's upcoming Z170 Express chipset, and is designed for 6th generation Core "Skylake" processors. Some variants of this board, such as the iGame-Z170U, will feature DDR4 DIMM slots (up to 64 GB), while others will feature DDR3 (up to 32 GB).

The board offers a pretty decent feature-set, including a 14-phase CPU VRM, two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated) wired to the CPU, a third PCI-Express x4 slot wired to the PCH, three other PCI-Express x1 slots; storage connectivity that includes six SATA 6 Gb/s, one SATA-Express, and one M.2 10 Gb/s; two USB 3.1 ports, six USB 3.0 ports, gigabit Ethernet, and a modern onboard audio solution with ground-layer isolation, and audio-grade capacitors. The iGame-Z170 series will launch some time in Q3, 2015. The three will likely be exhibited at Computex 2015, this June.

NVIDIA's upcoming high-end single-GPU graphics card, based on the GM200 silicon, which debuted with the GTX TITAN X, will feature a silicon marked "GM200-310." The SKU will be named GeForce GTX 980 Ti, and is more likely to be priced around the $600-650 mark, than replacing the $550 GTX 980 off the shelves. Going by the way NVIDIA re-positioned the GTX 780 to $499 with the introduction of the GTX 780 Ti, we imagine something similar could happen to the GTX 980. From what we gathered so far, the GTX 980 Ti will be based on the GM200 silicon. Its CUDA core count is unknown, but it wouldn't surprise us if it's unchanged from the GTX TITAN X. Its different SKU numbering shouldn't be an indication of its CUDA core count. GTX 780 Ti and GTX TITAN Black had different numbering, but the same CUDA core counts of 2,880.

The card will feature 6 GB of GDDR5 memory across the chip's 384-bit wide memory interface. It will feature five display outputs, similar to that of the GTX 980. Unlike with the GTX TITAN X, NVIDIA partners will have the freedom to launch custom-design GTX 980 Ti products from day-one. There are two theories doing rounds on when NVIDIA plans to launch this card. One suggests that it could launch in mere weeks from now, probably even on the sidelines of Computex. The other suggests that it will launch towards the end of Summer, as NVIDIA wants to make the most cash from its existing GTX 980 inventory.

AMD is preparing to time the launch of its next-generation Radeon R9 300 series with that of Computex 2015, in early June. The company had earlier planned to launch some products that are essentially price-adjusted rebrands of existing ones, such as the R9 380 series (being rebrands of R9 290 series on a slightly improved silicon), and the R9 370 series (being based on the "Tonga" silicon); but has decided to launch the two along with its flagship R9 390 series, based on a brand new silicon, around the same time. AMD's answer to the GTX TITAN-X from NVIDIA, the R9 390X will feature around 4,096 stream processors based on the Graphics CoreNext 1.3 architecture, and will implement an HBM (high-bandwidth memory) interface, with bandwidths in excess of 600 GB/s.

Along the sidelines of GDC 2015, Intel offered a few details on how the year could look for its desktop processor lineup. The company is preparing to launch socketed Core "Broadwell" processors in mid-2015 (late Q2 or early Q3), likely in the sidelines of Computex 2015. Broadwell is an optical shrink of "Haswell" to the new 14-nanometer silicon fab process, with a minor feature-set update, much in the same way as "Ivy Bridge" was an optical shrink of "Sandy Bridge" to the 22 nm process.

The socketed Core "Broadwell" chips could come in the LGA1150 package, running on existing 8-series and 9-series chipset motherboards, with BIOS updates. The optical shrink seems to be working wonders for the silicon. Quad-core chips based on "Broadwell" could come with TDP rated as low as 65W (and we're not talking about the energy-efficient "S" or "T" brand extensions here). Some dual-core variants in the series may even be based on the smaller Core M "Broadwell" silicon, which physically features just 2 cores (and isn't a bigger quad-core silicon with two cores disabled in what's a colossal waste of rare-earth metals on a production scale). Some of those dual-core parts could come with TDP rated as low as 28W.

Intel reportedly delayed the launch of its next-generation "Skylake" desktop CPUs to August 2015, from its usual schedule of launching new CPUs each Q2. Skylake is Intel's next-generation CPU architecture, built on the company's new 14 nanometer silicon fab process. Sources in the motherboard industry based out of Taiwan tell DigiTimes that launch of Skylake and its companion 10-series chipset, and hence they won't be able to show their latest products at this year's Computex trade-show, in June. Intel is either tweaking production of its new chips, or is waiting for the market to digest inventories of its current-generation products.

Right before for Christmas Thermalright presents two new CPU coolers, which have been designed especially for fans of compact Mini-ITX or Micro-ATX systems: The Macho 90 and the Silver Arrow ITX.

The Macho 90 is the newest member of our highly successful Macho Family and rounds off the series. The layout is tailored to fit the typical limitations encountered when dealing with small sized Mini-ITX motherboards. The height of just 135 mm allows the installation of the cooler in various compact PC cases. In order to avoid incompatibilities to RAM modules or motherboard components as much as possible, the nearly square heatsink has been placed directly above the CPU-socket.

ECS launched the Z97I-DRONE and H97I-DRONE mini-ITX, socket LGA1150 motherboards, which it first unveiled at Computex 2014. The two are identical to each other, with the only difference being the chipset. The Z97I-DRONE supports CPU and memory overclocking. Drawing power from a combination of 24-pin ATX and 8-pin EPS power connectors, the board features a 5-phase CPU VRM. The CPU socket is wired to a lone PCI-Express 3.0 x16 slot, and two full-length DDR3 DIMM slots. The only other expansion slot is an mPCIe 2.0 x1. Storage connectivity includes five SATA 6 Gb/s. Display connectivity includes one each of dual-link DVI, HDMI, and DisplayPort. Six USB 3.0 ports (four on the rear panel, two by headers), 8-channel HD audio with TOSLINK SPDIF output, and gigabit Ethernet make for the rest of them.

MSI teased the first CGI sketches of its next-generation TwinFrozr V cooling solution, designed for high-end GPUs, under its Gaming Series. A prototype of the cooler made its first appearance at Computex 2014, in June. The cooler features a large dual-stack aluminium fin heatsink to which heat drawn from the GPU is fed by five 8 mm thick nickel-plated copper heat pipes. The fin-stack is ventilated by a pair of what's now appearing to be two 100 mm fans. MSI is rumored to be innovating a new impeller design that steps up air-flow to noise ratio.

It's interesting to note that in its CGI render of a card equipped with this cooler, MSI showed a PCB with two NVIDIA SLI bridge fingers, and two 6-pin PCIe power inputs. Could this be the NVIDIA GeForce GTX 980, in effect making the card the MSI GTX 980 Gaming OC? Wait until the 19th of September to find out. GeForce GTX 980 and GTX 970 are NVIDIA's next high-end GPUs, based on the 28 nm "GM204" silicon, derived from the company's new "Maxwell" architecture.

G.SKILL International Co. Ltd., the leading high performance memory designer and manufacturer, is excited to announce this year's overclocking world record results at Computex 2014! During the week of Computex 2014, six world records were broken with G.SKILL memory! Established in 1989 by PC hardware enthusiasts, G.SKILL specializes in high performance memory and SSD products, designed for PC gamers and enthusiasts around the world. Combining technical innovation and rock solid quality through our in-house testing lab and talented R&D team, G.SKILL continues to create record-breaking memory for each generation of hardware and hold the no. 1 brand title in overclocking memory.

Intel's presentation for Italian technology conference 3D Revolution 2014 was leaked to the web, revealing the company's most up-to-date desktop CPU roadmap, which looks deep into 2015. It reveals a wealth of new information. To begin with the HEDT (high-end desktop) segment, Intel plans to drag Core i7 "Ivy Bridge-E" through Q3-2014, and launch its succeeding Core i7 "Haswell-E" processor close to Q4-2014, or late into Q3, which would pin its launch some time in September 2014. "Haswell-E" is built in the new socket LGA2011-3 package, and is supported exclusively by Intel X99 Express chipset. It also heralds DDR4 memory to the consumer space. "Haswell-E" will have its reign till late-Q3 2015, when Intel plans to launch Core i7 "Broadwell-E," which is built in the same package, and supported by the same X99 platform, but based on a swanky new 14 nm silicon.

Things get interesting with the company's mainline desktop processors. Intel recently launched its "Haswell" Refresh silicon, and is bound to launch their unlocked variants, codenamed "Devil's Canyon," on the 25th of June. Built in the LGA1150 package, "Haswell" Refresh runs on both 8-series and 9-series chipset. Intel's 9-series chipset was originally designed to launch alongside the company's first processors built on the 14 nm silicon fab process, codenamed "Broadwell," which is an optical shrink of "Haswell," with a few minor tweaks and speed bumps, just as "Ivy Bridge" was to "Sandy Bridge." Intel's "Broadwell" chips are now expected to debut in Q1-2015, probably along the sidelines of the 2015 International CES. These chips will be supported by existing LGA1150 motherboards, some with BIOS updates.

GAMDIAS has swept the eSports world off its feet with unrivaled and innovative gaming peripherals in 2014. As an up-and-coming gaming brand, GAMDIAS amazes the whole world with its rise to stardorm. GAMDIAS has energized gamers with the most recent gaming peripherals giving fans tons to rave about.

This year at 2014 Computex, GAMDIAS presents its top-of-the-line gaming peripherals, 8 in total, which are EREBOS Laser/Optical gaming mouse, OUREA Laser/Optical gaming, ARES/ ARES Essential gaming keyboard, and EROS V2, HEBE V2 gaming headset. "We regard ourselves as a company for gamers, and we are a brand working with gamers. That's where our new products will come from," said by R.K., the brand director.

QNAP, Inc. unveiled its next generation NAS designed for both SOHO and home entertainment aficionados, the TS-x51 along with an industry-first private cloud computing capability feature at COMPUTEX 2014.

The QNAP TS-x51 features a potent Intel Celeron dual-core processor, an upgrade of the Atom NAS series, and comes standard with the latest QTS 4.1 operating system. The TS-x51 packs a powerful storage backup along with swift streaming capability with both on-the-fly and offline transcoding. It is also the world's first hypervisor equipped NAS for Home/SOHO segment which allow users to run Windows or Linux OS on the QNAP intelligent private cloud platform.

The annual COMPUTEX TAIPEI is where the world's tech companies come together to show off the latest innovations and technologies. MSI, world leader in gaming technology, rolls into COMPUTEX with a bunch of Laptop products, including the brand-new, widely-acclaimed, top-selling GAMING series that has received numerous awards and honors around the globe.

To design the most innovative MSI GAMING series Laptop, MSI has sponsored and collaborated with more than 10 professional gaming teams worldwide. Experts from different fields were called in to co-design and implement the best gaming features such as Super RAID 2 storage technology, Killer Game Networking, Cooler Boost 2 thermal technology, Matrix Display multi-monitor support, Steelseries gaming keyboards, Dynaudio high-performance speakers, Audio Boost 2 technology, Creative Sound Blaster Cinema 2 audio solution, XSplit Gamecaster streaming app and more. Every MSI GAMING laptop is an accumulation of shared minds and finest experiences of gaming enthusiasts and eSports professionals.