At Computex, BitFenix showed off its Fury line of upper-mainstream PSUs. Offering mid-range capacities of 550W, 650W, and 750W, these 80 Plus Gold-certified PSUs offer semi-modular cabling, a single +12V rail design, APFC, most common protection mechanisms (over/under-voltage, overload, overheat, and short-circuit protection), and support for new Core "Haswell" low-power C-states. The three come with enough cabling for single- to dual-graphics card builds, and are cooled by a temperature-controlled 135 mm fan.

Sapphire unveiled its first socket LGA1150 motherboards, designed for 4th generation Core "Haswell" processors, although they're not completely out of the pipeline, and Sapphire is yet to finalize heatsink designs. Among the boards shown at Computex are the micro-ATX Pure Platinum Z87M-PR, and the ATX Pure Platinum Z87A-MA, both of which offer a pretty mid-range feature-set. The Z87M-PR gives you a 5-phase VRM that powers the CPU, four DDR3 DIMM slots, a single PCI-Express 3.0 x16, and one each of mPCIe, PCIe 2.0 x1, and legacy PCI. The board offers four each of SATA 6 Gb/s and USB 3.0 ports, eight USB 2.0/1.1 ports, DVI, D-Sub, and HDMI display outputs, gigabit Ethernet, and 8-channel HD audio.

The Z87A-MA, on the other hand, offers the same CPU VRM as its little sibling, one PCI-Express 3.0 x16, a PCI-Express 2.0 x16 (electrical gen 2.0 x4, wired to the PCH), two PCI-Express 2.0 x1, and two legacy PCI. You get six each of SATA 6 Gb/s and USB 3.0 ports, but oddly enough, the rest of the connectivity is a notch worse. 8-channel HD audio makes way for 6-channel. Sapphire's other motherboards are more interesting finds, but more on that later.

Enermax rolled out the iVektor (ECA3310) line of ATX mid-towers at Computex. Available in matte black, white, and red, the case features several polygonal design elements you'd normally associate with something from NZXT's Switch lineup. Measuring 234 x 495 x 508 mm (WxDxH), the iVektor uses 0.8 mm SECC steel and ABS plastic. It features three 5.25-inch drive bays, which feature an "Slide-in ODD" bay, which lets you remove the bay cover and simply slide in a SATA optical drive, to connect it. The SATA back-plane, and locking mechanism take care of the rest. Other drive bays include seven 3.5-inch, from which four covert to 2.5-inch. Its cooling system includes two 120 mm front intakes, a 120 mm rear exhaust, two 120 mm top exhausts, with room for a 240 x 120 mm radiator, a 120 mm bottom intake, and a 120 mm side intake. Its utility panel provides two USB 3.0 ports (standard header), two USB 2.0/1.1 ports, and HDA jacks.

Akasa's Newton NUC (next unit of computing) fanless case made its debut with the Galileo, way back in March. The case was formally unveiled at Computex, in three brushed-metal trims: the black one we've already seen, silver, and gold, all of which are made of anodized aluminum. Like most other 4" x 4" NUC cases, Newton's body doubles up as heatsink for the CPU. The cases will be available in variants that support the D33217GKE and D33217CK connector layouts. The cases further feature Kensington lock slots, and VESA mounts, so you can tuck them away behind your displays.

With two of its star attractions at Computex, the tòu and the KingSize H-Frame featuring elements of mirror-finish tempered glass, it's only natural that In Win would roll out a matching PSU lineup, since it's in the business of it. Pictured below is the company's new Serenity PSU, which could be available in various higher-range capacities. The one pictured below offers 900W.

Serenity PSUs are built with chrome brush-finished steel, to match some of the company's newer cases. The units are 80 Plus Platinum-certified, offer full-range APFC, a single +12V rail design, most common protection technologies such as OCP/OVP/OLP/UVP/SCP, and various regional certifications. These units are about 18 cm long, and feature partially modular cabling. The 24-pin ATX, 4+4-pin EPS, and a pair of 6+2-pin PCIe connectors come fixed, while two additional pairs of 6+2-pin PCIe connectors, twelve to sixteen SATA power, and three to six Molex connectors come modular. The unit is cooled by a 120 mm double ball-bearing fan. Its MTBF is rated at >120,000 hours. The Serenity series supports Core "Haswell" processors' low idle power states.

The original H-Frame won In Win quite some praise for ingenuity, but left enthusiasts asking for something similar-looking and bigger. The company responded with the new KingSize H-Frame, on display at Computex. Pictured below next to the original, the KingSize H-Frame is an ATX full-tower that supports large motherboards, in the EATX, HPTX, XL-ATX, SSI-EEB, SSI-CEB, form-factors, apart from the common ATX. Much like the original, its design revolves around stacks of metal rings working as framework for the rest of the case, only this time they protrude out of the front sheet in a jagged pattern. In Win also replaced the brushed aluminum side panels with the same tempered, mirror-finish glass as the tòu.

The KingSize H-Frame offers a 5.25-inch drive bay that's slanted, an internal drive cage that can be configured to offer six 3.5-inch bays, or a combination of four 3.5-inch and two 2.5-inch bays. All bays feature SATA back-planes, letting you slot in and out drives easily. Being an HPTX-supporting case, it features 11 expansion slot bays. The front-panel is particularly interesting, with eight USB 3.0 ports (six on the front, two on the top, all with standard headers), HD audio jacks, and a 3.5-inch hot-plug SATA bay. The motherboard tray gives you enough room for graphics cards up to 42 cm long. Cards such as the Radeon HD 7990 should comfortably fit in, with room to spare. On the cooling front, the KingSize H-Frame offers two 140 mm front intakes, a 140 mm rear exhaust, and two 140 mm bottom intakes that can make room for a 280 x 140 mm radiator.

Corsair, a worldwide designer of high-performance components to the PC hardware market, today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64 GB and speeds up to 2933 MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family (codenamed Haswell) and previous generation Intel and AMD platforms.

Vengeance Pro Series memory modules are built with eight-layer PCBs and RAM ICs specially selected for speed and overclocking headroom, and like all Vengeance memory, incorporate XMP 1.3 profiles allow for automatic, reliable overclocking. The memory kits are designed with new aggressively styled, aluminum heat spreaders for superior cooling. The memory kits are available in black with silver, red, blue, or gold accents to enable enthusiasts, gamers, and modders to customize the look of their PCs.

In Win was always known to be extremely imaginative and experimental with its case designs. Its Computex booth more than lived up to that reputation. The first of In Win's creations for the season is named tòu, and lets builders of great rigs take a good look at themselves. In Win took "mirror finish" a little too literally. The tòu is made of an aluminum framework, with 3 mm-thick tempered glass mirror panels lining its asymmetric shape. The panels are translucent, and you should be able to see through. The glass is so tough, that In Win deemed it LAN transport worthy, and gave it handlebars. Afterall, where else would you get to show something like this off? The In Win tòu is an ATX full-tower with 7 expansion slot bays, a bottom-oriented 5.25-inch drive bay, two 2.5-inch, and three 3.5-inch internal bays, a PSU bay for shock-jockeys up to 220 mm long, and provisions for a 120 mm front intake, and three 120 mm top exhausts, which can be used to hold a 120 x 360 mm radiator.

Corsair isn't without a contingent of new cases at Computex. A star attraction in its suite is the Carbide Air 540D. Pictured below, this somewhat cubical cases partitions the motherboard tray vertically from compartments that hold the PSU and drives. This partitioning makes sure peripheral/drive power cable doesn't clutter the motherboard tray area. The part with the motherboard tray is more airy than the other, with stripes of perforated metal running the front and top. This portion features provision for two front-facing fans, two on the top (with enough clearance for a 240x120 radiator), two bottom intakes, and a 140 mm rear exhaust.

The case can hold ATX and EATX motherboards, with eight expansion slot bays. The space below the motherboard tray and the bottom of the case, can either be used to expand storage with two 3.5/2.5-inch trays, or a second 280x140 radiator. All cables from the motherboard compartment can be routed through the valved holes to the other part of the case, which holds a long PSU bay, two 5.25-inch drive bays, and a couple of detachable drive cages holding multiple 3.5/2.5-inch bays. Corsair plans to launch the case some time in July.

It looks like the 31.5-inch PQ321 won't be the only 4K Ultra-HD monitor from ASUS for long. The company unveiled the even bigger unnamed 39-incher at Computex for a brief moment, before veiling it back, leaving us just enough time to take a few snaps. The 39-inch monitor is based on a VA (vertical-alignment) panel, compared to the IGZO panel that drives the PQ321. That could possibly make it cheaper. It offers a native resolution of 3840 x 2160 pixels, single-figure response time, 60 Hz refresh rate (when taking input from DisplayPort 1.2), 5,000:1 static contrast ratio with dynamic mega-contrast, 350 cd/m² brightness, 170°/170° viewing angles, and inputs that include a DisplayPort 1.2, and two HDMI. It also features a different forked stand design to the PQ321.

At Computex, GIGABYTE showed off the first AMD platform motherboard in its coveted G1.Killer series, which targets gamers and overclockers, the G1.Sniper A85X. The board is based on AMD A85X FCH chipset, and comes with out-of-the-box support for AMD A-series "Richland" APUs, including the AMD A10-6800K quad-core APU, with the fastest integrated graphics in market. Built in the narrow ATX form-factor, the G1.Sniper A85X draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 6-phase VRM to condition it for the APU.

The FM2 socket is wired to four DDR3 DIMM slots, which support up to 64 GB of dual-channel DDR3-3000 MHz memory; and a PCI-Express 2.0 x16 slot. In addition, the board offers a PCI-Express 2.0 x16 (electrical x4, wired to the FCH), three PCI-Express 2.0 x1, and two legacy PCI. The board shines in connectivity, where it offers eight SATA 6 Gb/s internal ports, a combination of DVI, D-Sub, and HDMI display outputs, Creative Sound Core3D audio with user-replaceable OPAMP and audio-grade capacitors, four USB 3.0 ports, and gigabit Ethernet. The board is driven by AMI Aptio UEFI BIOS, backed by GIGABYTE Dual-UEFI redundancy, and the new BIOS interface that made its debut with GIGABYTE's socket LGA1150 motherboards.

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The world-renowned motherboard manufacturer MSI announces motherboards that are equipped with Intel's newest 8 series chipset today. There is the "GAMING" series that are wildly popular among gamers, which is equipped with the Killer network chip and Audio Boost, in which the Z87-GD65 GAMING motherboard was even awarded the Computex 2013 Best Choice Golden Award! This was the first time a motherboard won a Golden Award, which proves that MSI's GAMING series motherboards are definitely the best choice for gamers.

For overclocking enthusiasts, MSI continued using the design standards which have passed the OC certified tests, creating the all new "Overclock" series, which includes the Z87 XPOWER, the Z87 MPOWER MAX, and the Z87 MPOWER. The Z87 XPOWER has a 32-phase digital power design, and supports 4-Way SLI / CrossFire. The Z87 MPOWER MAX and Z87 MPOWER are suitable for heavy-duty overclocking enthusiasts. Not only did they all pass rigorous overclock burn-in tests (OC Certified), they also come with the Extreme Tuning Utility adjustment software which was developed in cooperation with Intel. These rich overclocking software features and hardware design, make it a must-have weapon to break world-records.

Acer presents the next-generation 13.3-inch Aspire S7Ultrabook at Computex Taipei. In addition to retaining the celebrated characteristics of the previous model, the new S7 Ultrabook has improved battery life for all-day computing, a refined electroluminescent (EL) backlit keyboard for more natural typing, and 2nd generation Acer TwinAir cooling with less fan noise. In addition, it is equipped with wireless display (WiDi) technology for big-screen entertainment and productivity.

"We designed the S7 to be the best touch Ultrabook in the world, bar none," said Jim Wong, Acer Corporate President. "We listened carefully to users to find substantial ways to make it even better." The re-engineered S7 delivers improved battery life of up to 7 hours, a 33% increase from its predecessor. Its new light-sensing EL backlit keyboard is also refined, with a deeper keystroke for more natural and comfortable typing. Plus, thanks to 2nd generation Acer TwinAir cooling technology, the noise at maximum load is more than 20% lower than the previous S7, keeping the system quiet and cool.

Memoright is announcing next-generation XTM Series SATA III SSD products at Computex 2013. Including Memoright's exclusive Endurance Write firmware architecture developed with in-house R&D, the product supports MLC and TLC flash memory made with the latest process technology. Offering the best combination of reliability and high-speed performance, the product is ideal for applications in cloud computing, business servers, workstations and high-end personal computers. Using the latest 19 nm MLC / TLC flash memory, the XTM SSD includes Memoright's exclusive Endurance Write firmware architecture that significantly enhances SSD life while providing stable, high-speed read/write performance.

Earlier TLC flash memory applications have been confined to digital audio players and other products that have flash drive storage requirements at the low range of performance and service life. Yet market expectations for SSDs have increased steadily, making a design that balances performance, product life and product cost an important test for the SSD industry and manufacturers.

Ahead of its grand Computex launch alongside the Core "Haswell" processor family, Intel's homebrew socket LGA1150 Desktop Board products are being previewed online. One such covers the company's flagship motherboard, the DZ87KLT-75K "Kinsley." The board features a CPU power supply that's most compliant to Intel's iVR design for Core "Haswell" processors, with an 8-phase design. You'll either love or hate the new heatsink design. Expansion slots include three PCI-Express 3.0 x16 (x16/x8/x4), three PCI-Express 2.0 x1, and surprisingly, a legacy PCI.

Storage connectivity includes six SATA 6 Gb/s ports from the Z87 PCH, two from a third-party controller, and an mSATA 6 Gb/s. The board features a single first-generation Thunderbolt port, which doubles up as mini-DisplayPort, the only other display output than HDMI. A variant of this board without Thunderbolt (in which the port works only as mini-DisplayPort), could be sold as DZ87KL-70K. Rest of the board's connectivity include eight USB 3.0 ports (six rear, two by header), eight USB 2.0/1.1 ports, two 800 Mbps FireWire ports (one rear, one by header), 8-channel HD audio with optical SPDIF, two gigabit Ethernet interfaces, and an optional front-panel module that gives the board front-panel USB 3.0 ports, 802.11 b/g/n WiFi, and Bluetooth 4.0. In addition to the five 4-pin PWM fan headers, the board appears to feature several overclocker-friendly features. Find a video presentation at the source.

G.SKILL International Co. Ltd., the worldwide leading high performance memory designer and manufacturer, will be making a strong entrance in the field of PC gaming peripherals with newly engineered gaming headsets.

G.SKILL will be debuting gaming headsets with various industry-first features; it is built to provide gamers with enhanced competitiveness and unique gaming experiences. Along with G.SKILL's persistence on creating products of the highest quality and cutting-edge designs, the new headsets are set to satisfy all kinds of gaming needs. Detailed specifications and pricing will be released after the debut.

Computex is Asia's largest high-tech event and will run from June 4th to to 8th, 2013 in Taipei, Taiwan and BIOSTAR will be showcasing their embedded/IPC solutions and graphics cards products as well as their line of Intel and AMD based motherboards in the Nangang Exhibition Hall at Booth M0402. The theme of their exhibition this year is their Hi-Fi Puro integrated products, including Intel's next generation Haswell based boards and their FM2 motherboards that support AMD's new Fusion "Richland" CPU. Continuing the tradition of their own in-house audio technology called "Puro Hi-Fi Technology"; Biostar is going to present the 2nd generation of this technology, called "Hi-Fi 3D".

Targeting audiophiles, HTPC enthusiasts and high-end gamers alike, Puro Hi-Fi features an integrated independent audio power design with a built-in amplifier. The technology utilizes audio components with an independent power delivery design for a significant reduction in electronic noise producing superb sound quality. The unique noise-blocking multi-layer PCB layout is conducive for an exceptionally clean signal. That design feature, together with a sampling rate of 192 kHz/24-bit, delivers high quality audio through an analog connection to your home theater system, multi-channel speakers or high-end headphones, allowing you to enjoy true high-definition 7.1-channel surround sound.

Is this what Intel's 4th generation Core i7 "Haswell" retail box looks like? That is the question. For the first time in a decade, Intel could use a collage of pictures in its box-art. The running theme appears to be "creativity," with the box asking "what will you make?" You'll also notice that the box-art doesn't feature a small case-badge art. The top half of the front side could be what the badge ends up looking like. A little while ago, Intel made a cryptic Facebook post confirming a series launch along the sidelines of Computex 2013, held between 3rd and 7th June.

Intel is expected to unveil its 4th generation Core "Haswell" processor family by early-June, along the sidelines of the 2013 Computex event. In addition to being available in 1000-unit tray quantities to OEMs, the desktop variants of these processors will be available in their familiar retail box packages. Multiple sources confirm that pricing of these chips will be largely identical to that of the current Core "Ivy Bridge" series, with succeeding next-generation part for each current generation one. The table below describes their US MSRP (excl. taxes).

Akasa unveiled pictures of two new fanless PC cases for 2013, the Galileo and the Newton (pictured in that order). Both cases are made almost completely of aluminum, double up as CPU heatsinks, and feature VESA-mount capabilities. The Galileo is a thin mini-ITX case which can passively cool CPUs with thermal output as high as 35W, while the Newton is designed for the NUC form-factor. Both cases will be showcased at Computex 2013, held in June.

We've known for a while that Intel's 4th generation Core "Haswell" line of processors are going to miss the 2013 International CES. It turns out the new line of processors will be launched in June, in fact right on the backdrops of the 2013 Computex, the year's biggest PC hardware expo. A few days ahead of Computex, Intel will host a press-conference announcing the processors with downstream partners. The processors, and related products (motherboards, coolers), will be exhibited at Computex, and market availability will soon follow. The company is optimistic about the new chips, estimating them to make up 14-16 percent of its CPU shipments by the end of Q3 2013 (September).

It looks like Intel's Core "Haswell" processor family will miss its anticipated March-May launch window, with the company choosing Computex 2013 as its next launch-pad. According to a leaked document intended for distributors and large retailers, desktop Core "Haswell" processors will launch only after May 27, before June 7, and retailers are told to hold off advertising the launch till June 2nd.

Among the products featuring in the new May 27 - June 7 launch window are the Core i7-4770K flagship product, i7-4770, i7-4770S, i7-4770T, i7-4765T, i5-4670K, i5-4670, i5-4670S, i5-4670T, i5-4570, i5-4570S, i5-4570T, i5-4430, and i5-4430S, all of which are quad-core parts. In addition, socket LGA1150 motherboards based on Intel Z87 (flagship, OC-ready), H87, Q87, Q85, and B85 chipsets, will be launched. In all likelihood, one piece of decoration the CES venue could miss, is the wall of LGA1150 motherboards, which is usually put up by Intel.

ASUS' Republic of Gamers MARS III dual-GeForce GTX 680 graphics card may have been extensively covered at this year's Computex event, but very few have had a peek at its innards (PCB). Expreview posted pictures of the card's PCB, sourced from the manufacturer.

The pictures reveal an unusually long and tall PCB, which draws power from three 8-pin PCIe power connectors, a 21-phase VRM that uses Super Alloy chokes and driver-MOSFETs, PLX PEX8747 PCI-Express 3.0 x48 bridge chip, and of course the two GK104 GPUs with a total of 32 individual GDDR5 memory chips (16 for each GPU, 16 on each side of the PCB) wired to them, totaling 8 GB of memory.

Edit: We received an update from ASUS, clarifying that this card will not be released. The design was only displayed during a factory tour, to show ASUS craftmanship.

It has been known since Computex that AMD plans to synchronize launch of its second-generation "Trinity" desktop APUs and second-generation "Vishera" desktop CPUs, in late-Q3 or early-Q4, 2012. In likely preparation for that, and to step up price-performance of its current lineup, AMD cut prices of its desktop CPUs and APUs across the board. These include price-cuts for Phenom II AM3 series, FX-series AM3+, and A-series FM1 CPUs and APUs. Some of the prices as down by as much as 22.9%. The Phenom II series chips are the ones with the biggest price-cuts. Find a list of chips with old and new pricing, and differences, compiled by CPU World, below.