Tesoro Technology USA Inc. - leading manufacturer of Gaming peripheries - will be releasing new products targeted to professional gamers and will announce new technology used in its mechanical keyboards during Computex IT Show in Taipei, from June 3rd to June 7th.

During the show, Tesoro will release new products: Tizona Elite G2NFL - world first 80% mechanical keyboard with full color LED with detachable Tizona Elite Numpads G2NFLP - world first full color programmable mechanical numerical pads. Furthermore, Tesoro will launch its new aggressive high quality mechanical keyboard Excalibur G7NL, which comes with built in memory, macro recording and LED lighting at the price range easily available to most users.

While AMD may have scored one up over NVIDIA by making its 500-Watt dual-GPU graphics card, the Radeon R9 295X2, a 2-slot thick product that draws power from just two 8-pin PCIe power connectors, AMD's implementation also lugs along a radiator and coolant tubing that not everyone may find room in their cases for. Some enthusiasts may simply not trust factory-fitted water cooling solutions. For such people and more, who'd like to keep their builds "dry," PowerColor is coming up with the first truly non-reference design R9 295X2, the Devil13.

Pictured below, the R9 295X2 Devil13 from PowerColor features a completely custom-design PCB that is said to feature a meatier VRM than the one you get on reference design boards; which draws power from 4 (that's right, four) 8-pin PCIe power connectors. The PCB appears taller but just as long as the reference one, and features a back-plate that doubles up as structural reinforcement. The cooler is an interesting piece of engineering. It appears to feature two independent aluminium fin heatsinks, each over one of the two GPUs, and a base-plate heatsink to cool the memory, VRM, and bridge chip. The contraption is then ventilated by three 100 mm fans that appear to feature lateral+axial hybrid air-flow blades, on their impellers. PowerColor could launch the R9 295X2 Devil13 at Computex 2014, if not sooner.

ASUS demonstrated its first SSD, the HyperXpress. As its name might give away, the drive is co-developed by HyperX, the enthusiast memory and storage brand of Kingston. Built in the 9.5 mm-thick 2.5-inch form-factor, the drive features SATA Express interface, which will hit the consumer space this May, with the arrival of Intel's Z97 Express chipset, and Core "Haswell Refresh" processors. Internally, there's not much to this drive. It's a host-agnostic RAID 0 array of two mSATA 6 Gb/s SSDs, wired to a host controller made by ASMedia. To the host machine, it will look like a single drive. The sample demoed to the press, ASUS claims, is a very early prototype, and future iterations could run two M.2 SSDs instead of mSATA, for even higher throughput. The drive was tested to offer sequential transfer rates as high as 778 MB/s. At Computex 2014, flash memory manufacturers are expected to launch legions of new SSDs in the SATA-Express and M.2 form-factors.

Intel is expected to launch its refreshed Core "Haswell" processor lineup in the second quarter of 2014 (between April and June), beating its Computex 2014 anticipated launch window. Motherboard vendors will launch their products based on Intel's new Z97 Express and H97 Express chipsets by the end of April. The products will have reached retail channels worldwide by May.

Intel will release as many as 20 new SKUs spanning its Core i7, Core i5, Core i3, and Pentium brands, including the Core i7-4790, Core i5-4690, Core i5-4590, Core i3-4360, Pentium G3450, and Celeron G1840. Among the low-power SKUs are the Core i7-4790S, Core i5-4590S, and Core i3-4150T. The overclockers among you may want to hold out until Computex (June), because it's only then that Intel is expected to launch the Core i7-4790K and Core i5-4690K, which come with unlocked base-clock multipliers. These chips should be compatible with current socket LGA1150 motherboards, with a BIOS update. Intel's Core i7 "Haswell-E" HEDT platform could also launch around that time. Q2~Q3 promises to be a hectic time of the year for motherboard makers once again.

Intel is planning to launch its 4th generation Core i7 HEDT (high-end desktop) platform, codenamed "Haswell-E," in the third quarter of 2014 (after June), which should space its launch roughly a year from Core i7 "Ivy Bridge-E." With Haswell-E, Intel is expected to increase core counts across the board, launching an "affordable" six-core part around the $400 mark, an eight-core part around the $600 mark, and an Extreme Edition eight-core part around the $1,000 mark. The three will be based on the LGA2011-3 socket, which has the same pin count as today's LGA2011, yet is incompatible with it, because the pin map of Haswell-E will differ from its predecessors'. Driving the platform will be Intel's X99 Express chipset, with support for up to ten SATA 6 Gb/s ports, and a large number of USB 3.0 ports. Some of the first X99 motherboards are expected to be unveiled at Computex 2014.

Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.

Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).

Lepa began rolling out its first G-Series (80 Plus Gold-compliant) and B-Series (80 Plus Bronze-compliant) modular PSUs for gaming PCs, though its EcoMaster sister brand. The two were first unveiled at this year's Computex event. Both series feature identical body designs, cabling, and features, but differ with innards. The G-Series includes 1000W, 800W, 700W, 600W, and 500W variants; while the B-Series includes 1000W, 650W, and 550W variants. Both series feature single +12V rail designs, DC-DC switching, Anti3s Q-Brick bodies, active-PFC, and various electrical protection mechanisms. Measuring about 150 x 165 x 86 mm, these units feature 135 mm fans, are ErP Lot6 compliant, and support low-power C-states of the new Core "Haswell" processors.

Initially displayed at Computex this year, In Win's latest marvel bares the name Tòu, which in Mandarin Chinese stands for transparency, or the phenomenon of light passing through a non opaque medium. A concept which In Win's designers managed to beautifully and successfully evoke with their latest creation. The Tòu employs two distinct and interestingly married materials in its construction. The case panels are made of tough, 3mm thick tempered glass, which achieves mirror like properties after receiving a special, transparent coating. While the frame is made of 2-4mm think aluminium, which is manufactured through a labor intensive process known as Sand Casting, which employs sand molds to produce the intricate shapes displayed by this design.

The Tòu is a full tower chassis, with seven PCI slots, supporting ATX motherboards and smaller form factors (mATX & mITX). It can accommodate four 120mm fans, one frontal intake and three top exhaust fans, where there is also sufficient space for a large 360mm radiator. Aside from the On/Off function, the touch controlled front panel also allows the used to cycle through the integrated fan controller speed steps and to adjust the lighting level inside the case. When the system is turned Off and no lights are On inside the case, the Tòu becomes completely opaque and all the panels become highly reflective, mirrors essentially. But when the system is On and so are the lights inside the case, the panels become transparent and the internals visible, an uncomplicated yet striking visual effect.

Akasa officially launched its Newton V line of cases for Intel NUC platform, which it unveiled at this year's Computex. The all-aluminium cases are available in black, silver, and gold colors, and like most other NUC cases are designed to passively cool the processor and chipset, the two hot components on the platform. Its body panels are chunky and ridged, to double up as heatsinks. The Newton V is designed specifically for Intel's D53427RKE motherboard, which features a 17W Core i5-3427U dual-core processor. Measuring 150 x 150 x 47 mm, the Newton V dry-weighs 950 g. It features VESA wall-mount holes, two holes for Wi-Fi/Bluetooth antennae, three front-panel USB ports, of which one is USB 3.0, and a Kensington lock slot. Akasa didn't announce pricing.

The Acer Aspire S7-392, successor to the original Aspire S7 which was unveiled back in Computex 2012, has finally landed in the states. With a beautiful design and an ultra-high resolution display along with packing Intel's newest 4th generation Haswell based Core processors, Acer's refreshed Aspire S7-392 turned quite a few heads this year at Computex 2013.

OCZ Technology Group, Inc. (NASDAQ: OCZ), a leading provider of high-performance solid-state drives (SSDs) and power management solutions for computing devices and systems today announces selected preliminary financial results for the first quarter ended May 31, 2013, subject to customary closing and audit procedures.
Preliminary revenue for the first quarter of fiscal 2014 is estimated to be between $50 and $55 million. The sequential decrease in revenue was primarily due to the continued tight supply of NAND flash. The Company's revenue mix continued to shift towards the mainstream and higher-end client markets, as well as enterprise and OEM solutions as the Company continued to focus on these end markets. At the end of the quarter there was an additional $23 million of shippable backlog that was unrealized in the quarter due to supply constraints.

Gross margin continued to improve and is estimated to be between 17% and 20% for the first fiscal quarter as revenue generated from our Enterprise solutions increased sequentially. The Company continued to reduce its operating expenses by further reducing non critical spending. The Company's break-even level continues to improve due to these actions. Operating expenses for the first quarter are estimated to be between $20 and $22 million, which include restatement related expenses of approximately $1.5 million and stock compensation charges of approximately $2 million. Cash flow improved as we reduced our quarterly cash usage to approximately $6 million in the quarter. Cash ended the quarter between $6 and $7 million with total debt outstanding of $10 million. The Company expects that it will require access to additional capital which it is currently in the process of securing.

ID-Cooling is a new Brand in Europe founded by Shenzhen Wan Jing Hua Technology co., Ltd. Located in Shenzhen China. The Company has a long History in the OEM Business for Cooling Products. In the 10 Years of Company History create the Company behind the Brand ID-Cooling a lot technologies for Cooling.

ID-Cooling had their first International release on the Computex 2013 in Taiwan. The Fair was very successful for the Brand a lot of contacts was created and the Distribution Channel in Europe is Interested in ID-Cooling Products.

Displayed initially at the recently concluded Computex event in Taipei, Xigmatek's newest cooler employs a number of unconventional design choices, meant to usher "the future of CPU cooling." The cooler sits on a solid copper base from which seven 6 mm heat pipes conduct heat into two distinct fin stacks, the five central heat pipes feed the upper, larger aluminium fin stack, which is cooled by a 140 mm PWM fan spinning at 800-1200 RPM, while the two peripheral heat pipes conduct the heat into a smaller aluminium fin stack, situated underneath the larger one, and being cooled by its own 80 mm PWM fan with a maximum speed of 2000 RPM. The heat sink's weight is 875 grams and its makers claim it can dissipate up to 180 W using the two stock fans. Xigmatek chose to dress up the cooler in a black plastic shroud which some may find appealing. I, however, do not find myself among them.

ASUS announced that the Intel Z87-based Republic of Gamers Maximus VI Extreme motherboard has achieved a decisive 91% success rate at a Computex Taipei 2013 overclocking summit sponsored by Intel and Corsair. Additionally, the board tallied eight world performance records at a separate gathering that took place at ASUS headquarters, all mere days after its official launch.

Ten out of eleven wins at the Intel and Corsair Computex OC Main Event
Competing against top-tier overclocking motherboards from a variety of brands, Maximus VI Extreme took ten out of eleven top spots (or 91%) at the Intel and Corsair Computex OC Main Event. Full details found here.

During the week of Computex 2013, 6 overclocking records were shattered by professional overclockers with G.SKILL extreme performance DDR3 memory. Established in 1989 by computer hardware enthusiasts, G.SKILL is a leading memory & Solid State Drive manufacturer based in Taipei, Taiwan. The company's top priority is quality. All of the products undergo a series of the most rigorous tests and strict quality control processes. In addition to a committed, qualified IC testing house to examine the products, all G.SKILL products are 100% tested to ensure the highest yield, reliability and quality.

At Computex, GIGABYTE unveiled its GeForce GTX TITAN with WindForce 3X bundle (GV-NTITANOC-6GD-B), in which you get a reference-design yet factory-overclocked card, and a WindForce 3X cooling solution that you DIY install it on the card yourself. Both the card and the cooler are bundled into a single large box. The card comes factory-overclocked at 928 MHz core, 980 MHz GPU Boost, and 6.00 GHz memory. It maintains these clocks even with the reference cooler, but it could get louder than normal, and may not be able to sustain boost states as the GPU temperature jousts with the 80°C mark. With the WindForce 3X cooler installed, the card will run quieter, and the GPU will sustain boost states better.

The WindForce 3X cooler is complex aluminum fin-stack heatsink, in which two equally-sized aluminum fin stacks draw heat from the GPU, using five 8 mm-thick copper heat pipes. These are ventilated by a trio of 80 mm fans suspended on a metal shroud. Included in the add-on package are thermal pads for the memory and VRM, two syringes of TIM, screws, washers, an Allen key, and a large mouse-pad. GIGABYTE could price the card at a premium.

Aerocool Advanced Technologies Corp., one of the world leading manufacturers of gaming PC gear, has introduced a brand new PC chassis series during their VIP event related to this year's Computex 2013 exhibition in Taipei, Taiwan. Attendees had a chance to witness three different models of GT series - a new gaming line of PC cases. Each model is already available in black and a white version, which makes it a total of six product editions.

With the focus on ambitious gamers both inside and outside of all the three GT series models - GT-S (super-tower), GT-R (mid-tower), GT (compact mid- tower) were designed with a special effort to satisfy the high demands of different types of users. Top notch of the new series is the Aerocool GT-S model, which is equipped with a big variation of features. It comes in a two-color mix - white and blue and black and red. During the Computex event, the GT-S model attracted a lot of attention thanks to the magnetic front door, which can be placed in any location on the front panel or completely removed. Another highlighted feature of this new PC case is the maximum space (enough for XL-ATX motherboard) which is assured thanks to the super tower form factor and many expansion possibilities.

During the recently ended Computex event in Taipei, be quiet! presented a wide range of new products, CPU coolers as well as power supplies. Among them a new upper-mainstream PSU line dubbed Power Zone, which consists of four models starting at 650 W and followed by 750 W, 850 W and 1000 W versions. This constitutes a premiere for be quiet! in that these are the first fully modular power supplies to be offered by the German brand. Another aspect intended to be addressed with this product line is affordability, which is something few of us would associate with the be quiet! moniker.

The four units comprising the Power Zone line are single +12V rail designs, use only 105° C rated capacitors and claim 80 Plus Bronze efficiency. They also make use of the be quiet! Silent Wings 135 mm fan, which is a Protechnic made Fluid Dynamic Bearing fan, probably the best fan you can have inside a power supply. The modular connector panel also houses three fan headers, feature carried over from the Dark Power Pro P10 line. be quiet! will offer these products with a 5 year warranty and pricing should start below 100 €.

Lacking its own booth at Computex this year, Thermalright displayed a few of its products in Nanoxia's booth, among them the previously teased HR-22 cooler, a massive monolithic heat sink meant to further the merits and virtues of its praised predecessor, the HR-02. Judging by the sheer size of the beast and the design choices evident in the pictures below (eight 6 mm heat pipes and an extended fin area when compared to the HR-02, a massive heat sink in its own right), one would expect the new HR-22 to compete for the top position among passive coolers.

At the international exhibition of computer and consumer electronics Computex 2013, Taipei, Huntkey Enterprise Group presents a wide range of innovative products that reflect the company's leading position and current trends in contemporary performance, economy and environmental security of computer components and systems. The booth number of Huntkey is J1009a, Nangang Exhibition Hall.

During the exhibition, Huntkey has presented a full range of modern productive power supplies for desktop PCs, including the flagship FX500SE, 80Plus Platinum certified, the FX750GM with 80Plus Gold, and the 80Plus Bronze model FX620M with modular system cables. Furthermore, the model FX500SE supports intelligent cooling mode, in which the fan is completely disconnected when the load is below 250 Watt and the PSU is completely silent.

DuckyChannel, the well known mechanical keyboard manufacturer from Taiwan, took the wraps off its new Shine 3 keyboard this week at Computex (Taipei) where it displayed pre-production versions of what seems to be an aesthetically augmented Ducky Shine 2. No details were given in regard to any functional upgrades, probably because at this stage things are nowhere near finalized, however from the pictures below and the video here we can clearly distinguish three different versions of the keyboard, a beautiful looking aluminium tray version, a green camo version with complementary green key caps and a vanilla black version as well. Probably the most distinctive feature of the new keyboard consists in the myriad lighting modes available to the user, and it is also the feature to surely make it to the production version, no such certainty for the aluminum tray or the camo color scheme.

On Thursday at Computex, Intel unveiled a prototype thumb drive which employs the Thunderbolt interface and claims data transfer speeds of up to 10 Gbps. Dubbed the "world's fastest thumb drive," Intel's prototype device boasts transfer speeds far beyond those reachable by established standards such as the omnipresent USB 2.0 and USB 3.0 devices, of which the latter attains a theoretical maximum transfer speed of 5 Gbps.

The small drive hosts a 128 GB SanDisk SSD and connects directly to a Thunderbolt port on your PC or laptop, dismissing the need for the usually expensive cables associated with Thunderbolt peripherals, typically external storage solutions but also monitors. Thunderbolt hasn't seen wide adoption yet, primarily because of high costs, both implementation costs (expensive controllers) as well as adoption costs (few and expensive compatible devices). However that could soon change, seeing how many motherboards that offer Thunderbolt support were unveiled only in the last few days at Computex, one would think that Intel's Haswell platform could accelerate Thunderbolt adoption despite lacking native chipset support for the standard.

We never heard of Apistek before today, but looking some of the stuff they brought to Computex, we won't be surprised if the brand gets popular among enthusiasts all over, particularly those into liquid cooling. Founded in 2011, this Chinese company made its Computex debut this year, where it's scouting for distributors to global markets. The company showed off a unique new full-coverage water block for Radeon HD 7990 dual-GPU graphics cards based on a widely implemented design by TUL. The design involves two independent copper+acetal GPU blocks with coolant tubing running serial, and a heatspreader dropping heat from the card's obverse memory chips, and VRM.

Apistek also showed off two innovative cylindrical tower-type radiators for liquid cooling setups. Design of the two is inspired by Zalman Reserator, a device which had a brief stint at the markets around 2005, that combined the functionality of a pump, reservoir, and radiator into a single cylindrical device that doesn't need fans. Its design involves a pump at the base, a dense helical metal coolant channel that lines the inner wall of a ridged metal cylinder, where heat is dissipated, and a reservoir at the top. Apistek showed off a 370 mm-tall desktop variants that can optionally hold on to four 120 mm fans for better cooling, and a taller 592 mm pedestal version that doesn't need any fans. Both towers have independent AC power input and coolant pressure adjustment on device.

Cooler Master showed off its Hyper 103 compact tower-type CPU cooler at Computex. Pictured below, the cooler is ideal for single-fan configurations, and features a stack of trapezoid aluminum fins, to which heat is transferred by three 6 mm-thick copper heat pipes. This stack is ventilated by a custom-design 92 mm PWM-controllable fan. The fan retention lets you swap out the included fan with any other standard 92 mm one. The stock fan spins at 800 - 2,200 RPM, pushing up to 43.1 CFM of air, with up to 30 dBA noise. The cooler weighs about 580 g (500 g heatsink with 80 g fan). It measures 108 x 89.5 x 138.5 mm. All modern CPU socket types are supported, including LGA2011, LGA115x, LGA1366, AM3+/AM3, and FM2/FM1.

The GeForce GTX 770 SOC is among the five attractions at Galaxy's Computex booth. With GTX 770 being not so different in design to a GTX 680, we imagine Galaxy to have spent very little R&D in coming up with the GTX 770 SOC (super-overclock), which looks nearly identical to the GeForce GTX 680 Hall of Fame aka KFA2 GTX 680 Limited Edition OC V4 graphics card from last year. You get the same all-white combo of non-reference design PCB and cooler, the same strange display I/O of a DisplayPort next to three mini-HDMI connectors, but with higher clock speeds, and GPU Boost 2.0, which will surely take advantage of the cooler to sustain boost states.