BIOSTAR, a leading manufacturer of edge AI solution, IPC systems, motherboards, graphics cards, and storage devices, today introduced the EdgeComp MS-U320, a compact fanless edge AI system powered by the Intel Core 5 320 processor (Wildcat Lake). Designed for equipment manufacturers and system integrators, the MS-U320 combines on-site data processing, light AI computing, and industrial connectivity for applications in industrial automation, smart manufacturing, industrial IoT, smart retail, and smart infrastructure.

The MS-U320 features an onboard Intel Core 5 320 processor with six cores, clock speeds of up to 4.6 GHz, a 15 W TDP, and integrated Intel graphics. A single DDR5-6400 SO-DIMM slot supports up to 64 GB of memory, while the integrated CPU, GPU and NPU deliver up to 40 TOPS of AI performance. This combination supports local data processing and light AI workloads without requiring a separate accelerator.

Xiaomi has officially spilled the beans on the 2027 update to its Redmi Book laptop series, detailing both a launch date and what to expect from the laptops in terms of performance and battery life. The information comes courtesy of the Xiaomi Redmi account on Weibo, and the announcement reveals an October 27 release date for the Redmi Book 14 and likely the 16, alongside it. It's so far unclear if and when the new Redmi Book laptops will launch internationally or what the pricing will be, but the outgoing Redmi Book 14 starts at 6,499 CNY with 16 GB of RAM and 512 GB of storage.

With the post, Xiaomi also confirms that the Redmi Book 14 and 16 will be using Intel's Wildcat Lake Core Series 3 processors, with previous leaks having tipped the Core 5 320 for the Redmi Book 16, and the fine print on the marketing images now confirming the Core 5 320 for the Redmi Book 14. The Redmi Book 14 2027 has also been confirmed to ship with a 72 Wh battery, which Xiaomi claims will deliver over 20 hours of office use, with a claimed 1.26 days of local video playback. It will also use LPDDR5X-7467 RAM, although capacities are unclear at the time of writing, aside from the confirmation that there will be a 16 GB version available. The fine print also confirms that the display will be 2.8K, however the panel tech isn't mentioned.

Ugreen, a leading global consumer technology company, is due to showcase the Ugreen NASync DXP6800 Ultra and DXP8800 Ultra at IFA 2026. Designed as powerful local data centers for small studios and growing businesses, the new systems extend Ugreen's NAS portfolio beyond storage and backup to support high-speed collaboration, centralized data management, and local business applications.

To meet the growing storage, computing, and collaboration needs of creative studios and expanding businesses, Ugreen developed the DXP Ultra Series as the highest-performance tier in its NASync portfolio. Bringing high-capacity storage, high-speed connectivity, centralized data management, and expandable computing power into one local platform, the series helps teams manage large media workflows, protect critical business data, and run lightweight business applications on infrastructure they control.

Dell has launched what appears to be its answer to Apple's MacBook Neo: the Dell 15 laptop, starting at $699.99. The Dell 15 is, as the name suggests, a 15-inch laptop, and the entry-level model comes with an Intel Core 3 304 CPU, but there are also two Intel Core 5 320 versions, with either 8 GB or 16 GB of RAM, for $799.99 and $999.99, respectively. At the time of writing, all versions are available on Dell's online store. Dell claims that the Dell 15 is made from post consumer recycled plastic and aluminium to reduce its environmental impact.

Judging by the specs and construction, the Dell 15 is designed to be a student or home productivity laptop more than a gaming powerhouse, since the most powerful version only comes with a 6-core Intel CPU. The new Dell 15 laptop has unapologetically plastic casing, from the bottom case and keyboard deck to the display bezel and top case, and it has 1920 × 1200 p non-touch LCD with a claimed brightness of 450 nits and 45% coverage of the NTSC color space. Above the display is a 1080 p webcam with IR support for Windows Hello, and all versions of the laptop come with a 512 GB M.2 PCIe NVMe SSD.

The Framework Laptop 12 was an almost instant hit when it launched, thanks to its whimsical, compact design and durable chassis, but there was always a bit of a perception amongst hardware enthusiasts that the small laptop wasn't a serious computer, thanks to its outdated 13th-Gen Intel CPUs. Now, Framework has just announced that the convertible laptop has received an update to Intel's latest Core Series 3 CPUs.

Following the update, the Framework 12 is available for pre-order with the Intel Core 3 304, Core 5 320, and Core 7 350 CPUs, delivering Intel's latest six-core (2× P-Cores, 4× E-Cores) CPUs. Unfortunately, there are still no versions with the Intel Core Ultra X7 358H or any with a proper Intel Arc B390 iGPU. That said, the Framework Laptop 12 also now ships with two Thunderbolt 4-capable USB Type-C ports in the two rear-most expansion bays, theoretically allowing for eGPU expansion or other Thunderbolt peripherals.

The Schenker CONNECT 15 stands out in the office laptop segment thanks to its advanced network connectivity and a variety of external ports. Notable features include an integrated Smart Card reader, an easily swappable battery and an optional LTE module that enables mobile network access via a nano SIM card. The 15.6-inch laptop is powered by the energy-efficient Intel Core 5 120U processor, supports up to 64 GB of socketed DDR5 RAM, and includes advanced security features for use in corporate and public sector environments.

Schenker CONNECT 15 with Intel Core 5 120U and up to 64 GB RAM
Compared to the established WORK and WORK Base series, the 15.6-inch Schenker CONNECT 15 (E26) offers a range of additional functional features. Its plastic chassis measures 361 x 239 x 21 mm and weighs 1.75 kg.

Intel's "Wildcat Lake" processors, part of the Core 300 series non-Ultra family, have been leaked by a reputable source Jaykihn0 on X, revealing the entire lineup across various configurations and SKUs. The lineup includes six SKUs across the Core 3, Core 5, and Core 7 tiers, all designed to operate within a 15 to 35 W TDP range. Each model features a hybrid core configuration, pairing two "Cougar Cove" P-cores with four low-power efficiency cores, completely omitting the traditional "Darkmont" E-cores. Boost clocks range from 4.3 GHz on the entry-level Core 3 304 up to 4.8 GHz on the Core 7 360. All six SKUs share 6 MB of L3 cache, a single NPU tile, and integrated Xe3 graphics. The leak suggests that Intel is bringing architecture closely related to the Core Ultra 300 "Panther Lake" mobile platform into the embedded and industrial space, or perhaps into low-cost laptop configurations that don't require the power of "Panther Lake," appealing to buyers seeking budget-friendly options.

The 2P+0E+4LPE core layout is a deliberate trade-off, prioritizing efficiency over raw multithreaded performance, which suits the thermal constraints common in edge and IoT deployments. NPU performance figures range between 15 and 17 TOPS across the lineup. While this won't power the largest LLMs, it may be more than sufficient for on-device inference in industrial or automation settings. The Core 3 304 deserves special mention: it reduces to a single P-core and one Xe graphics unit, creating a clear cost-optimized option at the bottom of the lineup. SIPP certification, important for buyers needing stable, long-lifecycle platform support, is available on the Core 7 360 and Core 5 330 but not consistently across the lineup. Notably, there is no vPro support on any SKU, clearly distinguishing "Wildcat Lake" from Intel's enterprise mobile portfolio.

Intel is breathing new life into the Socket LGA1700 platform by giving it its fourth processor model generation, under the Core 100-series branding. These chips are based on the "Bartlett Lake-S" microarchitecture, but are designed to capture value price points. The main target of these chips are the gaming PC crowd. "Bartlett Lake-S" is a derivative of "Raptor Lake" but with the E-core clusters physically absent, and the chips only having "Raptor Cove" P-cores. A marketing slide for a new entry-level chip came to light, the Core 5 120F.

The Intel Core 5 120F is probably being designed for a sub-$150 price-point. The company's marketing material makes it abundantly clear that gamers that want maxed out 1080p AAA gaming experiences are the target audience of this chip. Core 5 120F comes with a 6-core/12-thread CPU, with six "Raptor Cove" P-cores, and no E-cores. The company didn't specify L2 cache size, but these are likely 1.25 MB per core. The six cores share an 18 MB L3 cache. It's highly likely that this particular silicon is physically similar to the "Alder Lake" H0 die, which also lacks any E-core clusters, physically only has six P-cores, and an 18 MB L3 cache. The Core 5 120F ticks at 2.50 GHz base frequency, with a 4.50 GHz maximum boost. It features a 2-channel DDR5 memory interface, supporting DDR5-4800 native memory speed, with support for up to 192 GB memory. The chip comes with 65 W processor base power.

Simply NUC, a global leader in customized computing solutions, proudly adds ASUS's NUC 15 Pro Cyber Canyon to its product lineup, setting a new benchmark for AI-optimized performance in a compact form factor. Engineered with Intel Core Ultra Series 2 processors and Intel Arc Graphics, the Cyber Canyon is designed to accelerate AI workloads, empower edge computing, and deliver seamless business productivity.

"The NUC 15 Pro Cyber Canyon is not just a step forward—it's a leap into the future of AI computing," said Ed Barkhuysen, VP of Product at Simply NUC. "With the latest Intel Core Ultra processors, Wi-Fi 7 connectivity, and cutting-edge security, Cyber Canyon is built for professionals and businesses looking for a powerful yet compact computing solution."

The latest update to CPU-Z, the popular system information and diagnostic tool, has rolled out comprehensive support for upcoming processor architectures from both AMD and Intel, along with new memory standards. Among the notable additions is support for AMD's Ryzen 7 9800X3D, which builds upon AMD's successful 3D V-Cache technology and is scheduled to launch tomorrow. The update also covers Intel's "Arrow Lake" processors, including both HX and H series variants. The Arrow Lake lineup integration spans multiple performance tiers, from the flagship Core Ultra 9 285HX down to the mainstream Core Ultra 5 series. The H-series mobile processors, including the Core Ultra 9 285H and various Ultra 7 and Ultra 5 models, are also fully supported.

Additionally, CPU-Z now recognizes Intel's complete Raptor Lake refresh, covering an extensive range of processors across different power segments. This includes the Core 7 series (160HL through 150U), Core 5 series (130HL through 120U), and Core 3 series (100HL through 100U), catering to various computing needs from high-performance to energy-efficient applications. The update extends beyond processors to support CUDIMM ((Clocked Unbuffered DIMM) DDR5 memory. CUDIMMs represent a modified DDR5 memory featuring an integrated Client Clock Driver (CKD) that generates its clock signal to minimize noise and jitter at speeds of 6400 MT/s and above, ensuring better stability and data integrity than traditional DDR5 modules.

DOWNLOAD CPU-Z 2.12 here.

In a surprising development, Intel plans to extend the longevity of its Socket LGA1700 platform even as the newer LGA1851 platform led by the Core Ultra 200 "Arrow Lake" remains on track for a late-Q3/early-Q4 2024 debut. This, according to a sensational leak by Jaykihn. It plans to do this with a brand-new silicon for LGA1700, codenamed "Bartlett." This should particularly interest gamers for what's on offer. Imagine the "Raptor Lake-S" die, but with four additional P-cores replacing the four E-core clusters, making a 12-core pure P-core processor—that's "Bartlett." At this point we're not sure which P-core is in use—whether it's the current "Raptor Cove," or whether an attempt will be made by Intel to backport a variant of "Lion Cove" to LGA1700.

This wouldn't be the first pure P-core client processor from Intel after its pivot to heterogeneous multicore—the "Alder Lake" H0 die has six "Golden Cove" P-cores, and lacks any E-core clusters. Intel is planning to give launch an entire new "generation" of processor SKUs for LGA1700 which use the newer client processor nomenclature by Intel, which is Core 200-series, but without the "Ultra" brand extension. There will be SKUs in the Core 3, Core 5, Core 7, and Core 9 brand extensions. Some of these will be Hybrid, and based on the rehashed "Raptor Lake-S" 8P+16E silicon, and some "Alder Lake-S" 8P+8E; but "Bartlett" will be distinctly branded within the series, probably using a letter next to the numerical portion of the processor model number. There will not be any Core 3 series chips based on "Bartlett," but Core 5, Core 7, and Core 9.

Dynabook Americas, Inc., the gold standard for long-lasting, professional-grade laptops, today announced that it has refreshed its value-packed 14-inch Satellite Pro C40 and 15.6-inch Satellite Pro C50 laptops with Intel Core processors (Series 1) and spill-resistant keyboards, and +Care Service Warranty with On-site.

"Our refreshed Satellite Pro C Series laptops underscore Dynabook's commitment to meeting the diverse needs of the public, private and education sectors. With their blend of modern performance, durability, and affordability, these laptops empower organizations of all sizes to thrive in today's dynamic and competitive landscape," said James Robbins, General Manager, Dynabook Americas, Inc.

Intel's current generation mobile processor product stack is vast, to say the least. In Q4-2023, the company launched its Core Ultra "Meteor Lake" mobile processors spanning the U-segment (7 W to 28 W), and H-segment (35 W to 45 W). Today, the company capped the upper end of the stack with the 14th Gen Core HX-series mobile processors based on "Raptor Lake Refresh," which dial up core counts to 8P+16E. And now, the company is adding more choice to the U-segment with the Core Processor Series 1, based on a lower core-count variant of the "Raptor Lake Refresh" architecture.

The Core Processor Series 1 follows the same nomenclature as the Core Ultra, where the "Ultra" denotes the latest "Meteor Lake" architecture. Processor model numbering and case badges are similar between Core Processor Series 1 and Core Ultra, except the lack of the "Ultra" brand extension. These chips are built on the monolithic "Raptor Lake Refresh" dies on the Intel 7 foundry node, and lack innovations such as the Low-power Island cores, 3D Performance Hybrid architecture, the all important AI Boost and on-silicon NPU; as well as that 2x faster Arc Xe-LPG integrated graphics, but use existing combinations of "Raptor Cove" and "Gracemont" CPU cores, along with older Xe-LP graphics with up to 96 EU; and a mostly similar I/O.

With the reality of high performance Arm processors from Apple and Qualcomm threatening Intel's market share in the client computing space, Intel is working on learner more PCB-efficient client SoCs that can take the fight to them, while holding onto the foundations of x86. The first such form-factor of processors are dubbed -MX. These are essentially -U segment processors with memory on package, to minimize PCB footprint. Intel has fully integrated the PCH into the processor chip with "Meteor Lake," with PCH functions scattered across the SoC and I/O tiles of the processor. An SoC package with dimensions similar to those of -UP4 packages meant for ultrabooks, can now cram main memory, so the PCBs of next-generation notebooks can be further compacted.

Intel had recently shown Meteor Lake-MX packages to the press as a packaging technology demonstration in its Arizona facility. It's unclear whether this could release as actual products, but in a leaked company presentation, confirmed that its first commercial outing will be with Lunar Lake-MX. The current "Alder Lake-UP4" package measures 19 mm x 28.5 mm, and is a classic multi-chip module that combines a monolithic "Alder Lake" SoC die with a PCH die. The "Meteor Lake-UP4" package measures 19 mm x 23 mm, and is a chiplet-based processor, with a Foveros base tile that holds the Compute (CPU cores), Graphics (iGPU), SoC and I/O (platform core-logic) tiles. The "Lunar Lake-MX" package is slightly larger than its -UP4 predecessors, measuring 27 mm x 27.5 mm, but completely frees up space on the PCB for memory.

Intel today announced its first major branding change for its client-segment Core desktop and mobile processor family in over 15 years (since the introduction of the very first Core "Nehalem"). "Core" still remains Intel's main client-segment processor brand, but the way the company draws its processor model numbers, is being significantly changed. The company is also introducing the Core Ultra brand of premium processors. The new nomenclature also sees Intel discontinue the use of "generations" within the SKU name.

The current Intel naming scheme sees the company mention processor generation before the main brand Core. For example, the 13th Gen Core is Intel's current line of client-segment products. Right next to Core, Intel places the brand extension "i" followed by the product tiering number 3, 5, 7, or 9. The product model number follows, and even this model number tends to begin with the processor generation. For example, the "i9-13900" already conveys that it is a processor from Intel's 13th Gen Core family. This is where Intel is making its two main changes.