BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the launch of four brand new motherboards - B760MZ-E PRO, B760MX2-E D4, B760MX2-E, and B760MX-E D4. These motherboards are tailored to meet the needs of a variety of target audiences, from content creators to home entertainment enthusiasts.

The B760MZ-E PRO motherboard is specifically designed for content creators who require a powerful and efficient system for photo and footage editing. This motherboard features the latest Intel B760 chipset and supports 12th/ 13th Generation Intel Core Processors. It supports DDR5 memory and PCIe 4.0, making it one of the advanced motherboards on the market. It also features 2.5 GbE LAN, Wi-Fi 6E module support for faster data transfer and connectivity. The B760MZ-E PRO also has a sleek design with LED ROCK ZONE and VIVID LED DJ RGB lighting, making it a stylish addition to any setup.

Although we've known most of the details of AMD's I/O die in its Zen 4 processors, until now, AMD hadn't shared a die shot of the cIOD, but thanks to its ISSCC 2023 presentation, we not only have a die shot of the cIOD, but some friendly people on the internet have also made annotations for us mere mortals. There are no big secrets here, but based on the annotations by @Locuza_ we now know for certain that it's not possible to use the current I/O die with three CCDs, as it only has two GMI3 interfaces, to which the CCDs are connected.

If you're wondering about the 2x 40-bit memory interface, it's for ECC memory support outside of the on-die ECC support of DDR5 memory. Also note that DDR5 memory is two times 32-bit in non ECC mode. That said, it's up to the motherboard makers to implement support for ECC memory, but it would appear all Zen 4 CPUs support it. The addition of a GPU, even a basic one like this, takes up a fair bit of space inside the cIOD, especially once you add things like video decoders/encoders and so on. In fact, it appears that the parts related to the GPU and video decoders/encoders take up at least a third of the space inside the I/O die, yet thanks to a significant die shrink from the Zen 3 era cIOD, it's physically smaller in the Zen 4 processors, while having an estimated 58 percent increase in transistors.

According to TrendForce's research, global DRAM revenue fell by 32.5% QoQ to US$12, 281 million for 4Q22. The QoQ decline for 4Q22 is larger than the QoQ decline of 28.8% for 3Q22 and comes close to the QoQ decline of 36% for the final quarter of 2008, when the global economy was in the midst of a major financial crisis. The main cause of the steep revenue drop in 4Q22 was the plummeting overall ASP. DRAM suppliers experienced a rapid accumulation of inventory in 3Q22 due to a freeze in buyers' demand. Subsequently, suppliers were much more energetic in price negotiations for 4Q22 contracts as they were struggling for market share. Among the major categories of DRAM products, server DRAM suffered the sharpest price drop in 4Q22. Contract prices of DDR4 and DDR5 server DRAM products registered QoQ drops of 23~28% and 30~35% respectively.

AAEON, a leading manufacturer of AI development solutions, has released the UP Squared Pro 7000, bringing the acclaimed UP Squared Pro series into its third generation. The UP Squared Pro 7000 sees dramatic improvements when compared to the boards preceding it. The first of these is that it is the world's first industrial motherboard equipped with the Intel Core /Atom /N-Series processor platform (formerly Alder Lake-N), which offers 1.4x the CPU performance of the previous generation, alongside the benefit of supporting the Intel Distribution of OpenVINO Toolkit. In addition, the board hosts 16 GB of onboard LPDDR5 4800 MHz system memory, doubling the bandwidth and data transfer speed of the previous model, while also increasing overall energy-efficiency.

A first for the UP Squared Pro product line, the UP Squared Pro 7000 supports MIPI CSI cameras via an FPC port, freeing up its two 2.5 GbE (Intel i226-IT) and three USB 3.2 Gen 2 ports for other peripheral devices. Developers also gain access to exceptional expansion from the dense, 4" x 4" (101.6 mm x 101.6 mm) board, with the same 40-pin GPIO header alongside M.2 E, M, and B Keys for CNVI, PCIe, and USB add-ons.

Netac on Wednesday launched the Hurricane Z RGB line of premium DDR5 memory kits. These are characterized by their chunky aluminium heatspreaders that have a clear chrome finish (claimed to be silver-plated), and crowned by silicone addressable-RGB LED diffusers. The company released dual-channel (two module) kits with densities of 32 GB (2x 16 GB), across six speed-based variants.

At the very top is a DDR5-8000 variant with 38-48-48-128 timings and 1.5 V module voltage; followed by a DDR5-7600 variant that offers 36-46-46-122 timings at 1.4 V. A notch below is the DDR5-7200 variant with 34-45-45-115 timings and 1.4 V; followed by a DDR5-6600 variant with slightly tighter 34-40-40-105 timings at the same 1.4 V. The DDR5-6200 variant offers a tighter 32-38-38-96 timings at 1.35 V, while the series begins with a DDR5-6000 variant with 36-36-36-96 timings at 1.35 V. All six variants rely on XMP 3.0 profiles to enable their advertised speeds and timings. Under the hood, these modules are using SK hynix-sourced DRAM chips. Netac released the Hurricane Z RGB series in China first, where its prices range between the equivalent of $203 and $335, depending on the model.

Lexar, a leading global brand of flash memory solutions, is excited to announce Lexar ARES RGB DDR5 Desktop Memory. Specifically designed for gaming, this next-gen DDR5 memory delivers superior performance with speeds starting at DDR5-5600 and up to DDR5-6000, and with quick CL32-36-36-68 / CL34-38-38-76 timings (XMP 3.0 & EXPO). A premium aluminium heatspreader keeps the gaming system cool for ultra-fast performance.

Lexar ARES RGB DDR5 Desktop Memory features on-board Power Management IC (PMIC) to provide better power control and power delivery and it also includes Lexar RGB Sync which lets gamers customize the RGB LED to their own style. "Lexar ARES RGB DDR5 Desktop Memory provides the performance that gamers need to master the latest games—and the upcoming titles that will require the speed and capacity of DDR5," said Joey Lopez, Director Brand Marketing. "And in addition to the performance, this memory also features Lexar RGB Sync so gamers can play in style."

Leading memory provider Team Group today has announced a breakthrough in specs for its newest DDR5 ECC R-DIMM memory module, which has an increased clock rate of 5,600 MHz, meeting the JEDEC standard for high-performance specifications. In addition, the company has collaborated with well-known motherboard manufacturer ASRock to complete compatibility testing on HEDT platforms equipped with Intel 4th Gen Xeon processors, codenamed Sapphire Rapids, and W790 motherboards. The memory module not only fully supports XMP 3.0, it is also the overclocking DDR5 ECC R-DIMM memory in the market today with a highest clock rate of 6,800 MHz.

Sapphire Rapids is Intel's first server processor to support DDR5 ECC R-DIMM memory. When it's paired with the next-generation W790 workstation motherboard, users can adjust the CPU's overclocking settings in BIOS and enable the clock speed adjustment feature of DDR5 ECC R-DIMM memory. Having undergone strict compatibility and stability testing, the JEDEC-compliant, high-frequency memory comes in both 16 GB and 32 GB capacity variants to meet the demand for workstation upgrades. The memory is also available in 6,400 MHz and 6,800 MHz models with XMP 3.0 support, providing next-gen HEDT platforms with cutting-edge performance.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

AMD's top two new desktop processors, the Ryzen 9 7950X3D 16-core/32-thread; and the Ryzen 9 7900X3D 12-core/24-thread, go on sale later today (starting 3 PM Central European time, 9 AM EST). The two "Zen 4" processors feature the company's 3D Vertical Cache technology, which significantly improves gaming performance. The 7950X3D in particular attains parity with the Intel Core i9-13900K in both gaming and multi-threaded productivity performance.

3D Vertical Cache is a 64 MB SRAM die that augments the 32 MB on-die L3 cache of one of the two CCDs in these processors. The combined 96 MB cache has a profound impact on compute latencies for gaming. In our testing, the 7950X3D matches the gaming performance of the i9-13900K "Raptor Lake," which means AMD now has a truly competitive processor with Intel's latest. It also matches or exceeds the I/O feature-set, including DDR5 memory, PCIe Gen 5 (including for the CPU-attached NVMe slot); and an iGPU, although it loses out on DDR4 memory support. The Ryzen 9 7950X3D commands an MSRP of USD $700, and the 7900X3D $600.

Catch the TechPowerUp Review of the AMD Ryzen 9 7950X3D.

AMD's Ryzen 7000-series CPUs with 3D V-Cache are set to launch next week and alongside the launch, there will obviously be reviews of the upcoming CPUs. As with many other companies, AMD prepared a reviewers guide for the media, to give them some guidance, as well as expected benchmark numbers based on the test hardware AMD used in-house. Parts of that reviewers guide has now appeared online, courtesy of a site called HD Tecnologia. For those that can't wait until next week's reviews, this gives a glimpse of what to expect, at least based on the games tested by AMD.

AMD put the Ryzen 9 7950X3D up against Intel's Core i9 13900K, both systems were equipped with 32 GB of DDR5-6000 memory and liquid cooling. Tests were done with both AMD's own Radeon RX 7900 XTX and an NVIDIA GeForce RTX 4090 graphics card. We won't go into details of the various benchmarks here, as you can find those below, but according to AMD's figures, AMD came out on top with a 5.6 percent win over the Intel CPU, at 1080p using the Radeon RX 7900 XTX and by 6 percent using the GeForce RTX 4090. This was across 22 different games, with Horizon Zero Dawn and F1 2021 being the games favouring the AMD CPU the most and Far Cry 6 and the CPU test in Ashes of the Singularity being the games favouring the AMD CPU the least. TechPowerUp will of course have a review ready for your perusing by the time the new CPUs launches next week, so you'll have to wait until then to see if AMD's own figures hold true or not.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the return of the 7th Annual OC World Cup 2023, after a 3-year hiatus. The G.SKILL OC World Cup extreme overclocking competition will begin with the Online Qualifier stage, held from March 1, 2023 until April 5, 2023 on hwbot.org. Then the top 9 overclockers of the online qualifier will become finalists, who are qualified to join the live competition at the G.SKILL booth during Computex 2023 week from May 30, 2023 to June 2, 2023 and compete for a portion of the $40,000 USD total cash prize pool, with the OC Champion title taking home $10,000 USD!

With the participation of top extreme overclockers from around the world and carefully crafted rules designed to test the ability of each overclocker, the G.SKILL OC World Cup is considered to be one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 overclockers of the Online Qualifier will be eligible to enter the Live Qualifier stage during the week of Computex 2023 at the G.SKILL booth, and the top 3 overclockers from the Live Qualifier stage will compete for the title of OC Champion in the Grand Final.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

A brand-new Razer Blade 15—continuing its storied legacy of pushing the boundaries of thin and light 15" gaming laptops—is now available. This ultra-portable gaming machine is powered by the latest 13th generation Intel Core i7 13800H processor and NVIDIA's newest GeForce RTX 40-series GPUs, up to the RTX 4070. Enhanced vapor chamber cooling and thinner 0.05 mm exhaust fins provide the exceptional thermal control needed to pack this level of performance in a laptop that is 25% smaller than the Blade 16.

The Blade 15 places portability at the forefront. As the thinnest Blade in the 2023 line, it weighs less than four and a half pounds and delivers up to over six hours of battery life from its 80 Wh battery. The 16:9 QHD 240 Hz display provides smooth, sharp visuals with a 2.5 ms response time and 100% of the DCI-P3 color gamut. The Blade 15 is easily upgradeable, accommodating up to 4 TB of storage using an extra M.2 slot and up to 64 GB DDR5-5200 MHz memory, allowing users to keep pace with even the most demanding games and tasks.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

With the new PRO and the FOCUS (E23), XMG introduces two laptop series on a similar hardware basis: Both feature Intel's Core i9-13900HX and NVIDIA graphics cards up to the GeForce RTX 4070. While the PRO 15 and PRO 17 are slightly thinner as gaming workstations and boast more extensive connectivity, the FOCUS scores at a more affordable price and is not only available in 15.6 and 17.3-inch versions, but also in a 16-inch format. For the laptops originally designed as an entry-level series, the hardware upgrades mean a significant upgrade: the FOCUS series moves closer to the PRO laptops.

The key components found in the new XMG PRO 15 and PRO 17 as well as the XMG FOCUS 15, FOCUS 16 and FOCUS 17 are almost identical. All laptops employ Intel's Core i9-13900HX with 24 cores (8 P-cores, 16 E-cores) and 32 threads. The freely configurable graphics card options each include NVIDIA's new, DLSS-3-capable GeForce RTX 4050 (FOCUS only) as well as 4060 and 4070 (FOCUS and PRO) with a maximum graphics power rating of up to 140 watts (115 watts TGP plus 25 watts Dynamic Boost 2.0). However, since the clock behaviour and the actual power consumption of the GPUs in the new generation are subject to much more restrictive, application-specific specifications from NVIDIA, the maximum values are only achieved in synthetic stress tests such as Furmark - according to the official requirements of the graphics chip manufacturer.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced massive new capacities for its DDR5 memory kits, thanks to new 24 GB and 48 GB UDIMM modules. For the first time from CORSAIR, PC builders can choose from 192 GB (4x 48 GB), 96 GB (2x 48 GB), or 48 GB (2x 24 GB) memory kits. Available in either VENGEANCE RGB DDR5 or VENGEANCE DDR5 kits, these new high capacities are ideal for the most demanding, high-capacity applications such as 8K video editing, as well as DRAM-heavy AI and deep learning workloads. Motherboards with just two memory slots, including Micro ATX and Mini-ITX builds, where space is tight but large capacities are needed also benefit.

CORSAIR VENGEANCE RGB DDR5 and VENGEANCE DDR5, already top choices for performance enthusiasts, are optimized for the latest gaming PCs and workstations and at these new capacities give custom PC enthusiasts the option to build with memory configurations that weren't possible until now. Both 96 GB and 48 GB kits are available immediately in both RGB and non-RGB flavors, running at 5,600MT/s and 5,200MT/s and support Intel XMP 3.0 memory overclocking to ensure owners can easily run their memory at the intended speeds.

On January 7th, the Minisforum UM773 was launched in China with the AMD Ryzen 7 7735HS processor and received widespread praise from consumers. Now, the new version of UM773, UM773 Lite, has arrived globally with a more affordable price. Considering that users usually connect external keyboards and mouses, the two USB 3.2 ports have been replaced with USB 2.0 ports. All other design will be the same as UM773. The price, however, will be more favorable.

The new UM773 Lite features the new AMD Ryzen 7 7735HS, AMD Radeon 680M Integrated Graphics, DDR5 dual-channel memory, PCIe 4.0 SSD, and the most advanced USB4 Type-C port. The Ryzen 7 7735HS is one of AMD's new Ryzen 7000 series mobile processors, featuring 8 cores and 16 threads, with a based clock of 3.2 GHz and a maximum turbo clock of 4.75 GHz and a default TDP targeted at 54 W. The RDNA2 Radeon 680M integrated GPU has 12 CUs up to 2.4 GHz.

HP Inc. announced its new Z by HP high-performance workstation desktop lineup, engineered to change what is possible within complex, data rich workflows. HP is advancing hybrid workforce management with the HP Anyware Remote System Controller, a device that gives IT departments the management capabilities to support high performance devices from anywhere.

The complex workflows in industries spanning media and entertainment, data science, and engineering mean increased time pressure and the need for more compute power to deliver faster results. They also highlight a need to iterate with remote teams and push creative boundaries to deliver more accurate results. The new Z by HP Z4, Z6, Z8, and Z8 Fury desktops, powered by Intel, deliver the scalable balance of CPU and GPU compute needed to fuel new levels of speed, accuracy, and creativity.

Yes, you read that correctly, ASUS didn't launch just one, but two W790 based LGA-4677 motherboards today, namely the Pro WS W790-Sage SE and the Pro WS W790-Ace. The main difference here is that the Sage supports up to seven PCIe 5.0 x16 slots—one is a x8 slot electrically—and is designed for the Xeon W-3400 series, whereas the Ace supports five PCIe 5.0 x16 slots and is in turn designed for the Xeon W-2400 series. One downside of these boards is that they might not fit in a standard ATX case, as the Sage follows the SSI-EEB form factor and the Ace the SSI-CEB form factor, both of which are a fair bit wider than an ATX motherboard and with different mounting holes.

The Pro WS W790-ACE also sports eight DDR5 DIMM slots that operate in quad-channel and supports up to 2 TB of RAM if ECC R-DIMMs are used. Furthermore, ASUS has kitted out the Ace with a pair of PCIe 4.0 M.2 slots, one 2280 and one 22110 slot, four SATA ports, three slim SAS ports, a Marvell 10 Gbps and an Intel 2.5 Gbps Ethernet interface, a single USB 3.2 Gen 2x2 20 Gbps USB Type-C port around the back and an internal header for a second, case mounted port. Finally the board has four USB 3.2 Gen 2 10 Gbps Type-A ports around the back and a header for a further two., as well as eight USB 2.0 ports around the back and audio courtesy of a Realtek S1220A based solution with optical S/PDIF out.

Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock W790 WS motherboard for workstations for Intel Xeon W-3400/W-2400 series processors (LGA4677). The ASRock W790 WS features up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Supports New 4th Generation Xeon Processor
The W790 WS chipset is optimized for new Intel Xeon W-2400 series (LGA4677) processors and is compatible with W-3400 series processors with up to 56 cores also. The ASRock W790 WS provides a quad-channel DDR5 design with 2DPC over 8 DIMM slots, maximizing memory performance, potential memory pool capacity and supports ECC RDIMMs to ensure data reliability.

Ahead of its launch, the SKU table of Intel's Xeon W "Sapphire Rapids" HEDT/Workstation-class processor lineup was leaked to the web. The lineup is horizontally split between the Xeon W-3400 series, and the Xeon W-2400 series. The W-2400 series come in rather modest CPU core-counts ranging between 6-core/12-thread and 24-core/48-thread. These chips are characterized by a 4-channel DDR5 memory interface (8 sub-channels); and a 64-lane PCIe Gen 5 I/O. The W-3400 series, on the other hand, ranges between 12-core/24-thread and 56-core/112-thread, nearly maxing out the core-count of the "Sapphire Rapids" MCM. These chips feature a massive 8-channel (16 sub-channel) DDR5 memory interface, and a 112-lane PCIe Gen 5 I/O. Prices for the lineup start at a surprisingly low $360 for the base W-2400 series SKU; while the top W-2400 series SKU is priced at $2,189. The W-3400 series ranges between $1,189 for the base 12-core/24-thread part, and goes all the way up to $5,889 for the top 56-core part. All models feature ECC memory support.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its Intel 700 and 600 series DDR5 motherboards can support 24 GB and 48 GB memory modules without BIOS update. This boosts the maximum RAM support from 128 GB to 192 GB on four DIMMs, and 64 GB to 96 GB on two DIMMs. The maximum speed runs up to XMP 7000 on 2 DIMMs 24 GB configuration.

Users can enjoy an effortless overall boost of memory capacity and system performance on both Intel XMP and AMD EXPO platforms, as well as a productivity uplift for multitasking gamers and RAM demanding users. Get your GIGABYTE motherboards now and enjoy the boost. To avail this, update to the latest BIOS on your compatible motherboard.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

Neo Forza today unveiled the Trinity DDR5-7200 32 GB (2x 16 GB) dual-channel memory kit. Based on SK hynix A-dies, the modules pack an Intel XMP 3.0 profile that runs the kit at its advertised speed of DDR5-7200. It also includes an AMD EXPO profile, although this enables a slightly lower speed of DDR5-6400. The DDR5-7200 XMP 3.0 profile ticks at timings of 36-46-46-82; while the DDR5-6400 EXPO profile offers 40-40-40-77. Both these profiles run the modules at 1.4 V. Neo Forza claims that the module comes with good overclocking headroom, and they've achieved DDR5-8000 on an Intel Core i9-13900K machine with minimal effort. The company didn't reveal pricing or availability information.