KINGMAX, a world-renowned professional supplier of memory products, has introduced the latest "Horizon" series of DDR5-5200, DDR5-5600, and DDR5-6000 memory that fully supports both Intel's 13th Gen Raptor Lake and Z790 platform and AMD's Ryzen 7000 processors and 600-series motherboards. DDR5 Horizon also promises to make the most of the overclocking capacities of Intel XMP 3.0 and AMD EXPO, thereby bringing speed-hungry gamers, overclocking enthusiasts, and creators an utterly satisfying performance.

Made from choice chips and fully conforming to JEDEC criteria, KINGMAX's DDR5 Horizon comes in three frequencies: 5200 MHz, 5600 MHz, and 6000 MHz. With a CL36 latency and running at 1.25 V, it is available in single- or dual-channel versions with 8 GB/16 GB/32 GB capacities to cater to different consumer needs. Moreover, the QVL certification of a good number of leading motherboard manufacturers attests to its superior compatibility with brand-new PC platforms.

MSI, the leading brand of gaming products, is launching the MEG Trident X2 with the latest 13th-Gen Intel processor and NVIDIA GeForce RTX 40 Series graphics card. This launch focuses on "Play Unbound". This gaming desktop is equipped with the Intel Core i9 processor, enjoying a 41% of performance increase compared with the previous generation. With RTX 40 Series equipped with the latest Fourth-Gen Tensor Cores, Third-Gen RT Cores, and New Streaming Multiprocessors, the frame rate performance of games has been greatly improved as well. Gamers can play at 100 frames under 4K image quality and with special effects turned on. Designed to completely liberate the next-generation performance, MSI's exclusive HMI (Human Machine Interface) has also ushered in a major upgrade. In addition to the original intuitive operation controls, a 4.5-inch touchscreen and G.I. function are now added.

This MEG Trident X2 is not only equipped with the top-of-the-line i9-13900K processor and RTX 4090 graphics card but also comes with MSI's exclusive Silent Storm Cooling 3 heat dissipation technology, which can effectively reduce the heat generated by components. The Air Baffle design can effectively collect the surrounding cold air and prevent the excess heat inside the chassis from flowing back to the graphics card. It is supplemented by the motherboard's upside-down design so that the graphics card is placed on the top to be cooled by the cold air first.

One of the world's leading PC components & peripheral manufacturers is proud to announce the grand launch of the DDR5-8000 16 GB x 2 CL38-48-48-90 1.45 V ultra-speed modules will be available in Q1, 2023. GeIL DDR5 lineup includes EVO V and Polaris RGB are tailor-made for hardcore gamers and hardware enthusiasts to deliver unparalleled performance and stability. In addition, GeIL Dyna 5 has created a comprehensive and efficient automated testing process for grading and sorting every DDR5 IC. As a result, GeIL ensures the bandwidth data transmission, compatibility, reliability, and integrity to meet all the demands of gamers and overclockers using Intel's latest platforms.

GeIL DDR5-8000 MHz series has passed the required burn-in tests using the latest ASUS ROG MAXIMUS Z790 APEX motherboard. The following screenshots indicate those test results. GeIL is a brand committed to offering memory products with a wider range of overclocking potential to PC enthusiasts and gamers. The latest GeIL DDR5-8000 memory modules are built with the advanced PMIC (Power Management IC), which can effectively obtain and control a wider range of localized voltage adjustments. The PMIC is used to enhance the overall stability and performance of the memory module and can effectively unlock additional overclocking headroom.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B650M-SILVER motherboard. Designed based on the AMD M5 socket, the B650M-SILVER motherboard is fully stacked to enable the latest Ryzen 7000 series processors. Leveraging the latest DDR5 memory technology, it performs exceptionally well at any given task, powered by advanced design elements like support for both AMD EXPO and Intel XMP RAM modules.

The B650M-SILVER, despite its Micro-ATX form factor, offers top-shelf features like a PCI-E Gen4 x16 slot with iron protection. The SILVER series motherboard combines 14 phase (10+2+2) power design with a 90 A power stage VRM solution to match today's power-hungry hardware, thanks to the company's signature DIGITAL PWM and 90 A Dr.MOS technologies.

In a continuing commitment to enabling industry-leading data acceleration in heterogeneous compute environments, Achronix Semiconductor Corporation, the industry's only independent supplier of high-end FPGAs and eFPGA IP solutions, today announced the production release of its AC7t1500 FPGA and the addition of the power-efficient AC7t800 FPGA to the Achronix Tool Suite.

"The Speedster 7t product family offers unprecedented FPGA-based performance for data acceleration applications," said Steve Mensor, VP of Marketing and Business Development at Achronix. "The release of the AC7t1500 to production along with the addition of the AC7t800 in our ACE design tools gives customers multiple options from this industry-leading, high-performance family that offers FPGA programmability with ASIC-level performance. These advancements give customers confidence that they can design on a robust, validated FPGA product family that meets their high-performance and high-bandwidth needs."

AMD won't release its Ryzen Threadripper 7000WX "Storm Peak" workstation processors any time before September 2023, suggests a reliable source with AMD leaks. The push to Q3 probably has to do with giving AMD enough "Zen 4" CCD volumes to ship high-margin EPYC "Genoa" server processors first, before the company can turn its attention to the HEDT and workstation markets.

While all indications are that AMD give the "Zen 4" Threadripper a similar treatment this generation as it did with the "Zen 3," by confining it to the workstation segment with only Threadripper 7000WX SKUs that could be OEM-exclusives before crawling their way to the retail market; the source has an interesting theory, that the company could even target the client HEDT market with these chips. The company will also adequately segment the Threadripper 7000WX SKUs apart from EPYC "Genoa" processors.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry's first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD. "Our 12 nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM," said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics. "With exceptional performance and power efficiency, we expect our new DRAM to serve as the foundation for more sustainable operations in areas such as next-generation computing, data centers and AI-driven systems."

"Innovation often requires close collaboration with industry partners to push the bounds of technology," said Joe Macri, Senior VP, Corporate Fellow and Client, Compute and Graphics CTO at AMD. "We are thrilled to once again collaborate with Samsung, particularly on introducing DDR5 memory products that are optimized and validated on "Zen" platforms."

Ahead of CES 2023, Lenovo unveiled its latest ThinkPad X1 laptops featuring recycled materials, updated Lenovo Commercial Vantage software designed to highlight feature settings that can help improve energy efficiency, and a new Lenovo View application offering advanced computer vision technology for enhanced video image quality and tools for collaboration, security, and digital wellness. The latest line of ThinkVision monitors leads with the ultra-bright ThinkVision P27pz-30 and P32pz-30 mini-LED displays followed by ThinkVision's new T-series VOIP monitors built for hybrid work, featuring an integrated Microsoft Teams functionality, 5MP cameras, dual microphones, and speakers. Lenovo also introduced its latest professional-grade 4K ThinkVision P-series monitors and, for the home, new value-conscious Lenovo L-series monitors. Completing an efficient hybrid eco-system are new Lenovo accessories, including the unique Lenovo Go Desk Station, Lenovo Go 4K Pro Webcam, and Lenovo Professional Wireless Rechargeable Combo Keyboard and Mouse.

In line with its vision of achieving net-zero by 2050 aligned to Science Based Target initiatives, Lenovo continues to focus on supporting a circular economy by increasing the use of recycled materials in its products and packaging, and collaborating with industry partners to help increase energy efficiency of its devices. This includes working with suppliers and global logistics providers to decrease the emissions released in its supply chain and take every opportunity to increase the energy efficiency in Lenovo's factories and workplaces.

ADATA, the world's leading memory module brand and XPG, their performance and gaming arm, today announced that they will be attending the CES 2023, where they will showcase a number of new products with the theme "Make it Fusion, Make it Xtreme!" The feature product to be displayed will be the XPG FUSION 1600 W Titanium power supply developed in collaboration with Delta Electronics. Other impressive power supplies also equipped with the latest ATX 3.0 and PCIe 5.0, such as the XPG CYBERCORE II and CORE REACTOR II series will be shown as well.

ADATA will also present impressive offerings in other categories, such as the XPG PCIe Gen5 SSD which offers a patented heat dissipation design, up to 8 TB of storage space, and read/write speed of up to 14,000 MB/s. Additionally, ADATA will present other award-winning memory and storage products, as well as gaming focused products in system, chassis, special themed pc build and peripherals categories.

It would appear that motherboards based on the upcoming Intel B760 chipset aren't much of a secret, as even online price comparison sites are now starting to post details about the upcoming models. German Geizhals has posted details about Biostars B760A Silver motherboard and although the site doesn't have pictures of the board, it does provide a drawing from what appears to be the manual. As this is an entry level model, there isn't too much to get excited about, but it appears to be a decent enough board overall.

The B760A Silver sports four DDR5 DIMM slots, a PCIe 5.0 x16 slot, a PCIe 4.0 x4 slot and two PCIe 3.0 x1 slots, as well as three PCIe 4.0 M.2 slots for NVMe SSDs and an M.2 for an optional Wi-Fi/Bluetooth card. Other features include an HDMI 2.1 and DP 1.2 port around the back, as well as 2.5 Gbps Ethernet and a 10 Gbps USB-C port. The board has a front header for another 10 Gbps USB-C port, but there's no support for a 20 Gbps USB-C port. Biostar has at least not been stingy with fan headers, as a total of six are spread out around the board and for those that like RGB lights, there are also three ARGB headers. Geizhals isn't listing any retailers stocking the board as yet, so we don't get any indication on the cost of the board.

Intel is expected to launch the B760 chipset alongside a slew of more 13th gen Core CPUs at CES in January, but already details of upcoming motherboards are starting to appear. We've already seen some details about Gigabyte's B760 Aorus Elite and now some very detailed pictures of MSI's upcoming B760 MAG Tomahawk have made an appearance on VideoCardz. The board is a spitting image of its B660 predecessor in terms of layout, but there appear to be some minor changes in terms of header placement.

MSI has also changed the colour scheme for all black to black with some white highlights. The rear I/O cover appears to have changed marginally, but even the heatsinks appear to be nigh on identical to the previous model. The pictures are of the DDR4 version, but there will apparently be a DDR5 version as well of this SKU from MSI. According to the rumour mill, prices of B760 boards will be up about 10 percent over the current B660 models, but nothing has been confirmed as yet.

Netac, a Chinese maker of memory and storage devices, has developed DDR5 memory modules with impressive speeds. The company has used SK Hynix A-type dies to create DDR5 memory with up to 8000 MT/s rates. With incredible speeds comes significant latency, whereas the DDR5-8000 memory kit comes with a CAS latency of 38-48-48-128. Netac has determined that these DRAM modules require as much as 1.5 Volts to power it. The base kit starts at 6000 MT/s, with 6200/6600/7200/7600 and 8000 MT/s variations mentioned above. Available in silver and black, these memory modules are equipped with an ARGB strip at the top that works with every RGB control software of motherboard makers.

You can check out the images and specification table below.

Team Group's creator series T-CREATE launches three DDR5 memory products: T-CREATE EXPERT DDR5 Desktop Memory, T-CREATE CLASSIC DDR5 Desktop Memory, and T-CREATE CLASSIC DDR5 Laptop Memory, comprehensively tailored for creators' demands. Equipped with a variety of frequency specifications from 5,200 to 6,400 MHz and a maximum storage capacity of 32 GB per module, the newly launched products offer a smooth experience for creators working on 4K/8K ultra-high-resolution video editing, professional 3D illustration software and system, as well as multitasking on their desktop computers and laptops.

Specifically built for heavy and complicated processing needs, T-CREATE EXPERT DDR5 Desktop Memory comes in ultra-high frequency options of 6,400 MHz and 6,000 MHz. Paired with low latency specifications, it features unprecedentedly exceptional performance and robust stability to fully support the complex operations and computing demands in professional 3D rendering and long-form super-high resolution video editing. Creators can ensure authenticity and optimal quality in each frame.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the ultimate overclocking motherboard Z790 AORUS TACHYON with the latest 13th gen Intel Core processors has smashed 10 world O.C. records including PCMark 7, 3D Mark…etc, as well as 16 GFP (Global First Place) of individual category test by different core numbers, and obtained 9 HFP (Hardware First Place) highest record in specific CPU ID vs. core count. Designed by world-famous overclocker, GIGABYTE Z790 AORUS TACHYON packs overclocker-exclusive features with top-quality components to become the dream motherboard for overclockers, which delivers unparalleled O.C performance with a more friendly and thoughtful interface to set its leading role on Z790 O.C. motherboards.

"It's inspiring that Z790 AORUS TACHYON breaks 10 overclocking world records and more than 20 various overclocking scores, which not only proves GIGABYTE's strong R&D strength but also demonstrates that GIGABYTE's devotion to providing formidable O.C motherboard. We believe this is just the beginning and will continue to create superior overclocking performance and records by Z790 AORUS TACHYON. We look forward to seeing more overclockers around the world using this motherboard to break more world records!" said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

Team Group's gaming brand, T-FORCE, launches T-FORCE DELTAα RGB DDR5, a gaming memory built for AMD Ryzen 7000 Series Processors and 600 Series Motherboard. DELTAα RGB DDR5 supports the latest overclocking technology from AMD EXPO, enhancing memory performance through excellent compatibility and delivering fast and reliable OC speeds with a single click. T-FORCE is dedicated to providing outstanding performances for gamers around the world and is proud to join forces with AMD to create the ultimate gaming experience.

Modeled after a stealth aircraft, T-FORCE DELTAα RGB DDR5 features a strong and clean geometric silhouette with 120° ultra-wide lighting to deliver a fierce military style. The new gaming memory is compatible with lighting effect software such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light Sync, ASROCK-Polychrome Sync, and BIOSTAR Advanced VIVID LED DJ[1]. With the RGB DDR5, gamers can design their own lighting effects and create an incredibly stunning RGB system. T-FORCE DELTAα RGB DDR5 is equipped with PMIC for better power management and a strengthened PMIC cooling design using thermally conductive silicon or more effective cooling and stable PMIC operations. The memory also supports on-die ECC and one-click overclocking with AMD EXPO so that gamers can enjoy the extreme speeds of overclocking with one simple click.

SK hynix Inc. announced today that it has developed working samples of DDR5 Multiplexer Combined Ranks (MCR) Dual In-line Memory Module, the world's fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8 Gbps, and at least 80% faster than 4.8 Gbps of the existing DDR5 products. MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5. Challenging the prevailing concept that the operation speed of DDR5 relies on that of DRAM chip itself, engineers sought to find a way to improve the speed of modules instead of chips for development of the latest product.

SK hynix designed the product in a way that enables simultaneous operation of two ranks by utilizing the data buffer installed onto the MCR DIMM based on Intel's MCR technology. By enabling simultaneous operation of two ranks, MCR DIMM allows transmission of 128 bytes of data to CPU at once, compared with 64 bytes fetched generally in conventional DRAM module. An increase in the amount of data sent to the CPU each time supports the data transfer rate of minimum 8 Gbps, twice as fast as a single DRAM.

Lattice Semiconductor, the low power programmable leader, today unveiled Lattice Avant, a new FPGA platform purpose-built to bring the company's power efficient architecture, small size, and performance leadership to mid-range FPGAs. Lattice Avant offers best-in-class power efficiency, advanced connectivity, and optimized compute that enable Lattice to address an expanded set of customer applications across the Communications, Computing, Industrial, and Automotive markets.

"With Lattice Avant, we extend our low power leadership position in the FPGA industry and are poised to continue our rapid pace of innovation, while also doubling the addressable market for our product portfolio," said Jim Anderson, President and CEO, Lattice Semiconductor. "We created Avant to address our customers' need for compelling mid-range FPGA solutions, and we're excited to help them accelerate their designs with new levels of power efficiency and performance."

January 3, 2023, on the sidelines of the International CES, Intel could launch dozens upon dozens of 13th Gen Core processor SKUs spanning every conceivable client PC platform. The event is expected to bring "Raptor Lake" to the mobile platform, with announcements spanning the ultra-portable "Raptor Lake-U," the thin-and-light performance "Raptor Lake-P," the mainstream mobile "Raptor Lake-H," and the enthusiast mobile "Raptor Lake-HX." This would cover almost every mobile device segment, including 7-9 W U-segment, to the 15-28 W P-segment, the 35-45 W H-segment, and the >55 W HX-segment, with several SKUs per segment across the four brand extensions (Core i3 thru Core i9).

For the desktop platform, Intel is expected to announce its new Core i9-13900KS "Raptor Lake-S" flagship, the world's first 6 GHz processor, besides a large number of 13th Gen Core "Raptor Lake-S" non-K SKUs in the 65 W TDP class, forming the bulk of the company's desktop processor lineup. Besides these, the company will also announce the more affordable Intel H770 and B760 desktop motherboard chipsets, bringing down platform costs (the 13th Gen Core processors are already supported on inexpensive motherboards based on the B660 and H670 chipsets via a BIOS update). Lastly, the company could announce "Raptor Lake" processors for the workstation segment, possibly compatible with the W780 chipset, and supporting ECC DDR5 memory, among other features relevant to the commercial desktop and workstation segments.

Intel's Sapphire Rapids CPUs are designed to represent the company's finest work for the server/enterprise and high-end desktop processor (HEDT) sector. According to Wccftech, we have an idea of the launch date and availability of the HEDT Sapphire Rapids Workstation counterparts, codenamed Fishhawk Falls. The Intel Sapphire Rapids-WS CPU and W790 motherboard unveil should happen on the 7th week of 2023, which means the 12th Feb - 18th Feb launch window. For availability, April of 2023 is scheduled to meet the needs of the upcoming HEDT clients. With a declining HEDT market, Intel is in no rush to deliver the CPUs, with priority being the server Sapphire Rapids designs.

As a reminder, the HEDT models should come with up to 56 cores and 112 threads, 105 MB of L3 cache, 350 W TDP, and 112 PCIe Gen 5.0 lanes. For memory, the platform support 8-channel DDR5-4400 (1DPC) / DDR5-4800 (2DPC) configurations with a capacity of up to 4 TB.

TechPowerUp in partnership with Team Group are giving away six pieces of Team Group T-Force gaming hardware. We've actually been at this since November 14, and entries close tomorrow, November 25. That leaves you with a day to fill up a tiny form and answer a couple of quizzy questions on Team Group; for a chance to win a T-Force Delta RGB DDR5-6400 CL40 32 GB (2x 16 GB) memory kit, or one of five Vulcan Z 1 TB SSDs! The Delta RGB DDR5 would be a great addition to your next-generation desktop build, as its DDR5-6400 frequency goes great with the latest "Raptor Lake" and "Zen 4" processors! The Vulcan Z 1 TB makes for a decent game storage drive to add some room to your game library. Both look great when powered up and viewed through a tempered glass panel! Hurry up!

For more details, and to participate, visit this page. Entries close November 25 (tomorrow).

AMD Ryzen 7000-series "Zen 4" desktop processors got their first round of price-cuts on leading retailer Newegg, as the company has a hard time justifying their launch-prices in the wake of Intel's 13th Gen Core "Raptor Lake" and declining demand in the PC components market. The new pricing sees the top Ryzen 9 7950X 16-core/32-thread chip priced at USD $574, down from $700 (an 18% price-cut). The 12-core/24-thread Ryzen 9 7900X sees its price go down from $550 to $474 (down 14%).

The 8-core/16-thread Ryzen 7 7700X gets a $50 price-cut sending its price down from $400 to roughly $350. The 6-core/12-thread Ryzen 5 7600X gets a similar $50 cut, which means the chip can now be had for roughly $250, down from its $300 launch price. All four SKUs face stiff competition from the aggressively priced 13th Gen Core SKUs, which include the i9-13900K, the i7-13700K, and the i5-13600K. Prices of Socket AM5 motherboards are another big put-off as they're a major contributor to platform costs, which is restricted to DDR5 memory. The Intel platform currently includes entry-level chipset options, as well as motherboards with DDR4 support.

AMD will build "Zen 4" based Ryzen Threadripper processors in an attempt to meet competition from Intel, which is rumored to launch HEDT processors of its own based on "Sapphire Rapids." While Intel's chip tops out at 60-core/120-thread and has a constellation of task-specific hardware-accelerators, AMD will arm its processors with raw CPU core-count, going as high up as 96-core/192-thread. The company has assigned the codename "Storm Peak" for these chips.

The Ryzen Threadripper 7000-series "Storm Peak" processor engineering samples surfaced on the Einstein@Home user database. As many as three OPNs have surfaced, "AMD Eng Sample: 100-000000884-21_N" and "AMD Eng Sample: 100-000000884-20_Y," which are 96-core/192-thread; and the "AMD Eng Sample: 100-000000454-20_Y," which is 64-core/128-thread. "Storm Peak" is likely just a variation of EPYC "Genoa," geared for higher frequencies.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to introduce its premier SILVER series, the Z790A-SILVER motherboard. Built around the Intel Z790 platform, the Z790A-SILVER is a masterful piece of tech designed to serve gamers, content creators, and casual users faithfully. With support for 12th/ 13th Generation Intel Core processors, a quad DIMM DDR5 ram interface, and a PCIe 5.0 x16 slot tailored for that beastly new graphics card, make it the ideal choice for a hardy gaming rig that turns average gamers into true champions.

As an expansion of BIOSTAR's RACING series motherboard range, the Z790A-SILVER carries a robust build and styling handed down by its predecessors, showcasing the classic RACING stripes on its PCB and the Silver colored cooling blocks. PCIe M.2 4.0 and SATA III (6 Gb/s) are the chosen storage technology for the Z790A-SILVER motherboard. They are highly stable and efficient for any given task, with superior USB 3.2 (Gen2) type-C and USB 3.2 (Gen2) type-A ports for blisteringly fast data transfers.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, brings its upcoming server platforms powered by 4th Gen Intel Xeon Scalable processors optimized for HPC and storage markets at SC22 on November 14-17, Booth#2000 in the Kay Bailey Hutchison Convention Center Dallas.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue driving the changes in the HPC landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in chip technology coupled with the rise in cloud computing has brought high levels of compute power within reach for smaller organizations. HPC now is affordable and accessible to a new generation of users."