Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers. With a 33% increase in data rate and bandwidth over Gen 1 4800 MT/s solutions, the Rambus Gen 3 6400 MT/s DDR5 RCD enables a new level of main memory performance for data center servers. Delivering industry-leading latency and power, it offers optimized timing parameters for improved RDIMM margins.

"Data center workloads have an insatiable thirst for greater memory bandwidth and capacity, and our mission is to advance the performance of server memory solutions that meet this need for each new server platform generation," said Sean Fan, chief operating officer at Rambus. "We were first in the industry to 5600 MT/s, and now we have raised the bar with our Gen 3 DDR5 RCD capable of 6400 MT/s to support a new generation of RDIMMs for server main memory."

SK hynix Inc. (or "the company") reported today financial results for 2022 ended on December 31. The company recorded revenues of 44.648 trillion won, an operating profit of 7.007 trillion won and a net income of 2.439 trillion won. Operating and net profit margin for the full year was 16% and 5%, respectively. "Revenues continued to grow last year, but the operating profit decreased compared with a year earlier as the industry entered into a downturn from the second half," the company said. "With uncertainties still lingering, we will continue to reduce investments and costs, while trying to minimize the impact of the downturn by prioritizing markets with high growth potential."

In 2022, SK hynix increased high-capacity DRAM shipments for server/PC markets, while boosting sales of DDR5 and HBM - of which products that the company has a solid market leadership - to customers in the growing markets of AI, Big Data, and cloud computing. Particularly, revenues for the data center SSD more than quadrupled compared with a year earlier.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

Colorful Technology Company Limited, a world-renowned manufacturer of desktop components, laptops, desktops, AIO PCs, and storage, launches the B760 Series motherboards for the 13th Gen and 12th Gen Intel Core processors. The Intel B760 Series motherboards are ideal gaming and content creation with DDR5 and DDR4 memory support depending on model.

COLORFUL introduces the CVN B760M FROZEN WIFI D5 and CVN B760I FROZEN WIFI motherboards for gamers and enthusiasts. Coming in a compact micro-ATX and Mini-ITX form factors, both motherboards feature PCIe 5.0 x16 slot to support the latest high-end graphics cards. The CVN B760 motherboards also come with Wi-Fi 6, three PCIe 4.0 M.2 slots for the CVN B760M FROZEN WIFI D5 and two PCIe 4.0 M.2 slots for the CVN B760I FROZEN WIFI Mini-ITX motherboard. COLORFUL also presents the BATTLE-AX B760M-F PRO motherboard with DDR4 memory support and two PCIe 4.0 M.2 slots.

ASUS today announced the 15.6-inch Vivobook Go 15 OLED (E1504F) and 14-inch Vivobook Go 14 (E1404F), two exciting and affordable lifestyle laptops that help make users productive or keep them entertained, wherever they go. These light and compact laptops feature superior OLED (E1504F) or IPS (E1404F) displays and powerful ASUS SonicMaster sound systems with DTS Audio Processing for immersive entertainment. The design is stylish and practical, with thoughtful touches that make the user's life easier, such as a 180° lay-flat hinge. Built to survive any lifestyle, these tough laptops are US military-grade tested for durability using the world's strictest test regime.

Speedy performance for any task is assured by up to AMD Ryzen 5 7000-series processors, 16 GB of LPDDR5 RAM and a 512 GB PCIe SSD. Other user-friendly features include an ASUS ErgoSense keyboard; smart conferencing via the HD webcam with ASUS 3D Noise Reduction (3DNR), AI noise cancelation, and a physical privacy shield; and a useful suite of ASUS apps including MyASUS, GlideX and ScreenXpert 3.

Intel is preparing to launch HEDT/workstation processors based on its "Sapphire Rapids-WS" MCM, and one of the first of these parts, the Xeon W9-3495X, surfaced on the Geekbench online database. The W9-3495X is a 56-core/112-thread processor with 56 "Golden Cove" P-cores, each with 2 MB of L2 cache, and sharing 105 MB of L3 cache in a mesh-topology layout. The processor likely features an 4-channel (8 sub-channel) DDR5 memory interface, with ECC; and supports up to 4 TB of memory. The PCI-Express Gen 5 lane counts remain unknown. Intel is expected to launch these processors along with companion W790 chipset motherboards, on February 15, 2023. This processor, running on a Supermicro-designed motherboard, and 128 GB of DDR5 memory, scored 1284 points in Geekbench 5, along with 36990 points multi-threaded.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

Qualcomm has been working on its Snapdragon SoCs for quite some time now, with massive success in the mobile phone space. However, the company's processors needed to be up to the task regarding laptops. For a user to not look at x86 offerings, the only remaining performant alternatives are Apple's M processors. In 2021 Qualcomm purchased the Nuvia team that was developing massively efficient and high-performance IP for laptops, similar to Apple M processors. Today, according to the insights from Kuba Wojciechowski (@Za_Raczke) on Twitter, we have some potential information about the upcoming Nuvia-powered SoC codenamed Hamoa.

According to the Twitter thread, Qualcomm's Hamoa processors are part of the Snapdragon 8xc Gen 4 compute platform and feature up to eight high-performance P-cores and four low-power E-cores, all based on Nuvia's IP. Allegedly the P-cores are being tested at 3.4 GHz, while the E-cores are tested at 2.5 GHz. The SoC splits CPU cores into blocks, each being a four-core group with 12 MB of shared L2 cache. There is also an 8 MB L3 cache structure; it needs to be clarified whether it is per core block or for the entire SoC. The chip employs 12 MB of system-level cache, with 4 MB of memory for graphics-related tasks handled by iGPU. The iGPU of choice is Adreno 740, with all modern APIs supported. Discrete graphics solutions are supported by the top-end SKUs, which allow eight PCIe 4.0 lanes to be directed toward dGPU, along with an additional four PCIe 4.0 lanes for NVMe SSD. For RAM, the chip uses up to 64 GBs of LPDDR5X eight-channel memory with up to 4.2 GHz speeds. Chip's media engines are structured to support decoding up to 4K120 and encode up to 4K60 with AV1.

Back in February 2022 SiFive announced its partnership with Intel Foundry Services (IFS), to bring its "Horse Creek" SoC to market and now SiFive has announced that it's getting ready to launch its first development board on said SoC. This summer, SiFive will launch the HiFive Pro P550 development board, which will kick things up a serious notch when it comes to embedded SoC development boards, regardless of the CPU core the SoC is built around. The HiFive Pro P550 will be one of few microATX based embedded SoC development boards out there and so far, to our knowledge, the only one with a RISC-V based SoC. The Horse Creek SoC sports quad core, 2.2 GHz, 13-stage, triple-issue, out-of-order pipeline RISC-V RV64GBC CPU built on the Intel 4 node. The SoC also has a DDR5 5600 MHz memory interface, support for eight lanes of PCIe 5.0 and comes in a 19 x 19 mm FBGA package.

The HiFive Pro P550 will offer 16 GB of DDR5 memory, but based on the render of the motherboard, this is soldered to the board, rather than relying on standard DDR5 DIMMs. Furthermore, the board has two x16 PCIe 3.0 expansion slots, although it's unclear how many PCIe each slot features, as well as a PCIe 3.0 M.2 2280 M-key slot for NVMe SSDs and a PCIe 3.0 M.2 E-key slot for a WiFi/Bluetooth module. The board also sports multiple USB/USB 3.0 ports and even a pair of USB-C ports. The press release also mentions both Gigabit and 10 Gbps Ethernet support, as well as support for onboard graphics and remote system management, without going into any further details. It'll be interesting to see if the Horse Creek SoC can deliver on its expected performance target, especially as SiFive has a lot to prove, especially as the company calls the RISC-V architecture inevitable.

SUS IoT, the global AIoT solution provider, today announced PE3000G—the industry's first edge AI system to support Mobile PCI Express Module (MXM) GPUs from both NVIDIA and Intel. Specifically, the all-new industrial PC works seamlessly with NVIDIA Ampere/Turing or Intel Arc A-series MXM GPUs. Powered by a 12th Gen Intel Core processor and up to 64 GB of DDR5 4800 MHz memory, and combining a proven power design, guaranteed and fanless thermal performance, and superior physical and mechanical ruggedness, PE3000G brings unprecedented longevity, computing power, flexibility and reliability to AI computing at the edge—making it an ideal option for scenarios where resilience, longevity and both CPU and GPU scalability are paramount.

"PE3000G is ASUS IoT's response to the burgeoning demand for accelerating AI inference and extreme deployment in industrial settings," commented KuoWei Chao, General Manager of the ASUS IoT business unit. "With robust power, thermal and mechanical design, it pushes versatile edge-AI-inference applications to business-critical applications. PE3000G is an ideal fit to accelerate edge AI inference in SWaP-constrained applications, such as machine vision in factory automation, outdoor surveillance system and AI-inference systems for autonomous vehicles."

Professional overclocker HiCookie and GIGABYTE partnered to smash the memory overclocking record out of the park, with a jaw-dropping DDR5-11316 memory OC (5567.5 MHz memory clock). This memory OC record was achieved in a single-channel (single module) configuration, on a GIGABYTE Z790 AORUS Tachyon motherboard that has a 1DPC (one DIMM per channel) memory slot topology; while the processor in charge was a Core i9-13900K. A single 16 GB GIGABYTE AORUS DDR5 memory module was used, and the DDR5-11316 speed was achieved at timings of 64-127-127-127-127, with 2T command-rate; although the DRAM voltage remains unknown. The CPUID validation can be found here, and the HWBOT listing here.

AAEON, a leading manufacturer of AI development solutions, announces the UP Xtreme i12 Edge, its latest addition to the UP product series. The UP Xtreme i12 Edge makes substantial upgrades on its predecessor with the power-efficient multicore architecture of 12th Generation Intel Core i7/i5/i3/Celeron Processors (formerly Alder Lake-P), onboard LPDDR5, and AI module support all contributing to its potential as a system suited to industrial, healthcare, and transport applications.

Providing exceptional expansion options, the UP Xtreme i12 Edge has four M.2 Keys for Wi-Fi 6, 5G, AI and PCIe 4.0 storage module support. With such options, users are able to bring edge AI computing capabilities to a wider variety of markets. Further, the UP Xtreme i12 Edge supports Intel Iris Xe graphics, Intel DL Boost, and the Intel Distribution of OpenVINO Toolkit, boosting GPU image classification inferencing performance by up to 2.81 times that of the previous generation.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B760M-SILVER motherboard. Constructed around the INTEL LGA1700 socket, which supports 12th / 13th Generation Intel Core processors, the B760M-SILVER carries BIOSTAR's RACING pedigree, with visual flair and innovative features strategically picked to enhance the user's overall experience.

The B760M-SILVER features the MicroATX form factor, which makes it ideal for space and cost-conscious applications, coupled with the BIOSTAR-certified 10+1+1 Phase / 70 A power delivery solution great for gaming and entertainment builds. It comes further equipped with BIOSTAR's DIGITAL PWM technology, which provides exceptionally precise power delivery across all its components.

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its DDR5 product for servers using 1anm, the fourth generation of the 10 nm process technology, has been validated on the 4th Gen Intel Xeon Scalable processor (formerly codenamed Sapphire Rapids) for the first time in the industry. "The validation of the 1anm DDR5 compatibility by Intel for its newest processor that supports DDR5 for the first time is monumental," SK hynix said. "We will seek a fast turnaround in the semiconductor memory industry by actively responding to the growing server market through DDR5, which is already in mass production."

The validation of the company's 1anm DDR5 product, which adopts 1anm technology using the EUV lithography process, is for 4th Gen Intel Xeon Scalable processors, Intel's latest server CPU launched on January 10th. The 4th Gen Intel Xeon Scalable processor has been cited as a key to a turnaround in the industry, given that the launch of a next-generation server CPU requires server replacement and thus, results in a rapid increase in demand for high-performance memory chips. Experts predict that DDR5, expected to meet customers' such needs, will soon become the flagship product in the server DRAM market.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

AIC Inc., (from now on referred to as"AIC"), a leading provider in enterprise storage and server solutions, today unveiled its new server systems powered by 4th Gen Intel Xeon Scalable processors (formerly codenamed Sapphire Rapids). The new server platforms are designed to accelerate performance across the most in-demand workloads that businesses rely on including enterprise, storage, AI and HPC.

The newly launched AIC servers, SB102-HK, SB201-HK and HP202-KT, are designed to offer superior processing performance and energy efficiency by leveraging the innovative features of 4th Gen Intel Xeon Scalable processors. With built-in accelerators, the 4th Gen Intel Xeon Scalable processors optimize the utilization of CPU core resources and feature enhanced memory bandwidth with DDR5, advanced I/O with PCIe Gen 5 and Compute Express Link (CXL) 2.0/1.1, and the ability to accelerate PyTorch real-time inference performance by up to 10x using Intel Advanced Matrix Extensions (Intel AMX) compared to the previous generation. The new AIC servers are empowered by advanced security technologies from 4th Gen Intel Xeon Scalable processors, allowing them to protect data and unlock new opportunities for business collaborations.

Inspur Information, a leading IT infrastructure solutions provider, announced that its G7 server platform fully supports 4th Gen Intel Xeon Scalable Processors. The 16 servers making up the brand-new lineup are industry-leading in terms of performance, openness, intelligent operation & maintenance, and sustainability. Compared with the previous generation of Intel-based products, these servers have 61% higher performance and up to 30% higher computing performance per unit of power consumption. The server platform is designed to be deployed in general-purpose computing, critical computing, AI, and other application scenarios.

Inspur Information's brand-new G7 platform was designed with green technology, open-source solutions, security, and intelligence as priorities. It is an industry-leading example of system design, energy efficiency, and operation & maintenance management. G7 servers support diversified computing, with the most comprehensive product lineup in the industry. With a focus on green energy, this product line supports cold plate and immersion cooling schemes, and has unique cooling designs such as T-shaped radiator and advance heat detection with intelligent regulation, which all work together to reduce energy consumption by up to 30%. The new series also supports cloud operation and maintenance for intelligent fault diagnosis with an accuracy rate up to 95%.

Today, Lenovo unveiled 25 new ThinkSystem and ThinkAgile server and hyperconverged solutions powered by Intel's 4th Generation Xeon Scalable Processors as part of its recently announced Infrastructure Solutions V3 portfolio. Designed to help accelerate global IT modernization for organizations of all sizes, the integrated solutions deliver advanced performance, efficiency and management capabilities specifically optimized for complex workloads, including mission-critical, AI, HPC and containerized applications.

"In today's competitive business climate, modern infrastructure solutions that generate faster insights and more efficiently enable complex workloads from the edge to the cloud are critical across every major industry," said Kamran Amini, Vice President and General Manager of Server & Storage, Lenovo Infrastructure Solutions Group. "With the performance and management improvements of the Intel-based ThinkSystem V3 portfolio, customers can reduce their IT footprint by up to three times to achieve greater ROI and more easily transform their infrastructure with one seamless platform designed for today's AI, virtualization, multi-cloud and sustainable computing demands."

World-leading memory brand, Team Group, has announced new breakthroughs in the Team Group ELITE U-DIMM DDR5 Standard Memory. To ensure compatibility with next-generation platforms, Team Group has pioneered the first high-performance 6400 MHz spec per JEDEC definitions for consumers to enjoy upgraded performances with ease in the DDR5 generation.

To ensure a stable performance of 6400 MHz and above of the DDR5, Team Group has adopted the new CKD (client clock driver) components designed to strengthen, buffer, and steadily output high-frequency signals from the CPU to DDR5 memory kits, effectively ensuring high frequencies while supporting reliable high-speed transmissions. Team Group is dedicated to R&D and working simultaneously with motherboard manufacturers for rigorous compatibility testing, offering high-quality and highly compatible memory products for desktops and laptops to consumers around the world, fulfilling user demands for PC, laptops, or other small systems.

Micron Technology, Inc., today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family. Micron DDR5 memory delivers up to twice the memory bandwidth over previous generations, which is essential to fueling the rapid growth of cores in today's data center processors. Transitioning to DDR5 will help alleviate a potential bottleneck for years to come by providing higher bandwidth to unlock more computer power per processor. Micron DDR5, in combination with 4th Gen Intel Xeon Scalable processors, benefits a wide range of workloads including SPECjbb, which delivers up to 49% performance improvement on benchmarking for Critical-jOPS (Java operations per second) compared to previous generations. In addition to increased memory bandwidth and performance, Micron DDR5 memory is also designed to improve reliability across the data center with features such as on-die Error Correction Code (ODECC) and bounded faults. On-die ECC corrects single-bit errors and detects multi-bit errors.

"The deep collaboration we have established with Intel as a highly valued ecosystem partner, has allowed Micron to remain at the forefront of the industry transition to DDR5," said Raj Hazra, senior vice president and general manager of Micron's Compute and Networking Business Unit. "This work has been pivotal in developing solutions that meet the complex needs and challenges of our data center customers as they convert massive amounts of data into insights."

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

Intel today marked one of the most important product launches in company history with the unveiling of 4th Gen Intel Xeon Scalable processors (code-named Sapphire Rapids), the Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and the Intel Data Center GPU Max Series (code-named Ponte Vecchio), delivering for its customers a leap in data center performance, efficiency, security and new capabilities for AI, the cloud, the network and edge, and the world's most powerful supercomputers.

Working alongside its customers and partners with 4th Gen Xeon, Intel is delivering differentiated solutions and systems at scale to tackle their biggest computing challenges. Intel's unique approach to providing purpose-built, workload-first acceleration and highly optimized software tuned for specific workloads enables the company to deliver the right performance at the right power for optimal overall total cost of ownership. Additionally, as Intel's most sustainable data center processors, 4th Gen Xeon processors deliver customers a range of features for managing power and performance, making the optimal use of CPU resources to help achieve their sustainability goals.

Giga Computing is an industry leader in high-performance servers and workstations, today announced the next-generation of GIGABYTE servers and server motherboards for the new 4th Gen Intel Xeon Scalable processor to achieve efficient performance gains with built-in accelerators. The new processors have the most built-in accelerators of any processor on the market to help maximize performance efficiency for emerging workloads; and do so while boosting virtualization and AI performance. Generational improvements make this platform ideal for AI, cloud computing, advanced analytics, HPC, networking, and storage applications. For these markets, Giga Computing has announced fourteen new series that constitute seventy-eight configurations for customers to choose from. And all these new GIGABYTE products support the full portfolio of 4th Gen Intel Xeon Scalable processors, including those with high bandwidth memory (HBM) in the Intel Xeon Max Series.