Embedded systems and IPC maker J&W unveiled the first Atom "Cedar Trail" motherboard in the nano-ITX form-factor. The board measures just 120 x 120 mm, and is designed for embedded computing devices. It draws power from a 2-pin 12V DC input. It holds a dual-core Intel Atom D2700 (2.13 GHz) or D2500 (1.83 GHz) processor, one DDR3 SO-DIMM slot (reverse side), which supports up to 4 GB of DDR3-1066/800 MHz memory, and basic connectivity. The lone expansion slot is a mini-PCIe, designed to hold WLAN adapters.

Display outputs include D-Sub (by header), LVDS, and HDMI. Connectivity options include one SATA 3 Gb/s (AHCI), five USB 2.0 ports (three type-A connectors, two via headers), gigabit Ethernet, 6-channel HD audio over HDMI and 2-channel analog audio, RS232 Serial, SD/SDHC card reader, SIM card slot (3G option), consumer IR, and PS/2 (header). The CPU and core logic can be passively cooled. The Cedar Trail Nano-ITX board from J&W will be available to embedded systems and IPC markets, soon.

With over-production, swelling-inventories, and cutthroat competition that doesn't allow even subtle price-increases, DDR3 is a lost-cause for DRAM makers such as Samsung. It is hence hedging its bets on the early arrival of DDR4, and the only company that can make that happen is Intel. Samsung is not only a major supplier of DRAM memory, but also a big player in server memory. It had its first DDR4 UDIMM ready as early as in January 2011. Reports of Intel slating DDR4-equipped platforms in 2013 has Samsung perturbed. Samsung and Hynix are the only two DRAM majors with developed DDR4 products. According to DigiTimes' analysis, DRAM vendors see DDR4 as the only way they can pull themselves out of their ailing situation.

ZOTAC unveiled a monster LGA1155 motherboard aimed at professional overclockers, and based on the new Intel Z77 Express chipset, the ZT-Z77-U1D. Pictured below, the designers' focus was evidently on giving the motherboard a very strong VRM, apart from just enough expansion and connectivity features for 2-way multi-GPU setups. To begin with, the LGA1155 socket is powered by a 27-phase VRM, which consists of AIO ferrite-core solid-state chokes, DrMOS, tantalum capacitors, and a super-ML multiphase capacitor to condition power. The VRM is controlled by a VRD12-compliant controller.

The LGA1155 socket is wired to four DDR3 DIMM slots, supporting dual-channel DDR3-2133+ MHz memory, and two PCI-Express 3.0 x16 slots (x8/x8, when both are populated). Other expansion slots include four PCI-Express 2.0 x1, wired to the Z77 PCH. All six SATA ports from the PCH are assigned as internal ports, that's two SATA 6 Gb/s, and four SATA 3 Gb/s. Display connectivity includes DVI, HDMI, and DisplayPort. Other connectivity includes 8+2 channel HD audio, 802.11 b/g/n, Bluetooth 3.0, gigabit Ethernet, six USB 3.0 ports (two on the rear panel, four via headers), and a number of USB 2.0 ports.

The computing industry will see its next transition to a new memory standard only by 2014, and enterprise processors based on the "Haswell" microarchitecture will drive the change, according to a VR-Zone report. While client processors based on the Haswell architecture will retain current DDR3 memory standard with a possibility of higher DDR3 clock speeds, enterprise processors under the "Haswell-EX" family will feature the industry's first DDR4 memory controllers for x86. Following that, DDR4 will filter down to future client platforms. Pictured below, is a DDR4 UDIMM by Samsung.

A-Tech Fabrication, a company that specializes in hand-crafted HTPCs, unveiled the HeatSync 1200 fanless HTPC. The part that makes it fanless is the chassis itself, which is made of aluminum, with fins on the sides, that dissipate heat. Copper heat pipes transfer heat from key components such as the CPU and chipset to the sides of the chassis, which takes care of the rest. Although most of the chassis is anodized black, with its front-panel, you can choose between silver and black options.

The HeatSync 1200 internally packs an Intel DH61AG thin mini-ITX motherboard, which seats an Intel Core i3-2100T dual-core 35W processor, clocked at 2.50 GHz. 4 GB Corsair Vengeance SO-DIMM memory comes standard. Also standard is the Intel SSD 310 40 GB mSATA SSD. Considering there are no mechanical hard drives, or a PSU with active-cooling (a 160W power-brick does the job), the HeatSync 1200 is literally silent. A consumer IR (CIR) receiver with Windows Media Center remote, and Windows 7 Home Premium make for the rest of it.

I-O Data of Japan introduced a new value 8 GB DDR3 memory module (model: DY1333-8G). The module runs at JEDEC-specified speeds of DDR3-1333 MHz, with 9-9-9-24/CR-1T timings, with 1.5V module voltage. The module is sold standalone, and in 16 GB dual-channel kits (model: 8GX2 DY1333). It features standard 240pin UDIMM dimensions, without any heat-spreaders. The single-module kit is priced at 18,060 JPY (US $217.2), while the dual-channel kit goes for 35,280 JPY (US $424.4).

MSI released details about its upcoming value socket LGA1155 motherboard, the B75MA-P45. MSI finds the B75 PCH a worthy option over the current-generation H61 PCH, and could hence price its B75-based motherboards competitively, to capture the entry-level LGA1155 market. The B75MA-P45 comes with out of the box support for 22 nm "Ivy Bridge" Core processors, apart from current-generation "Sandy Bridge" ones. The B75MA-P45 packs a simple 5-phase VRM to power the LGA1155 CPU. The CPU is wired to four DDR3 DIMM slots, supporting dual-channel DDR3-1600 MHz memory.

Expansion slots include one PCI-Express 3.0 x16, one PCI-Express 2.0 x1, and a legacy PCI. The legacy PCI logic is reintegrated with the PCH, and so the board doesn't use any bridge chips, further, since USB 3.0 and SATA 6 Gb/s are integrated with the PCH, MSI didn't add third-party controllers handling the two. SATA connectivity includes one SATA 6 Gb/s, and five SATA 3 Gb/s. The PCH gives out four USB 3.0 ports, two of which are found on the rear panel, two via internal header. Display connectivity includes DVI and D-Sub. 6-channel HD audio, gigabit Ethernet, and legacy PS/2 connectors complete the package. The board is driven by UEFI firmware (5 MB ME 8.0), with a graphical setup program. The B75MA-P45 is said to capture a price-point under US $100.

TYAN has launched 8 cutting-edge platforms based on the Intel Xeon processor E5-2600 product family. These platforms are designed to deliver the benefits of Intel's latest processor architecture. We offer high peak performance along with outstanding power efficiency and are designed for today's HPC/GPU and general server applications. These products help channel customers build solutions for applications ranging from the largest data centers all the way down to the smallest server room implementations in a quick and efficient way.

Sapphire released the new Pure Platinum A55V motherboard to the market. The board offers a value socket FM1 platform based on AMD A55 FCH chipset, in the ATX form-factor. The motherboard supports AMD A4, A6, A8, and Athlon II "Llano" APU/CPUs in the FM1 package. This model is not exactly designed to be "no-frills", as it does pack an interesting mix of features that could help it grab a comfy price-point in the market.

The FM1 socket is powered by a 6-phase VRM, which uses a simple whine-free choke + DPAK MOSFET design, but throws in a heatsink to cool the MOSFETs. The socket is wired to four DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3 memory, with speeds of over DDR3-1600 MHz with overclocking. The APU is also wired to a PCI-Express 2.0 x16 slot, and two PCI-Express 2.0 x1 slots. Apart from these, you get three legacy PCI slots, wired to the FCH.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

Apart from the two Black Extreme models based on the Z77 chipset, ECS also has a value ATX motherboard that will capture a key sub-$150 price point, the Z77H2-A3. It is designed for single graphics cards, and lends the platform with all the connectivity and overclocking capabilities of the Z77 chipset. The CPU is powered by a simple 6-phase VRM, although the PCB is narrow (305 x 210 mm), there's room for four DDR3 DIMM slots. Expansion slots include one PCI-Express 3.0 x16, four PCIe x1, and two PCI.

The Z77H2-A3 doesn't add much features beyond what the chipset does. There are two SATA 6 Gb/s, four SATA 3 Gb/s, 8-channel HD audio, gigabit Ethernet, display connectivity that includes D-Sub, DVI/HDMI (variants), and four USB 3.0 ports (two on the rear-panel, two via headers). UEFI with graphical setup program and ECS EZ-Charger come standard.

NEC Corporation of America (NEC), a leading provider of innovative IT, communications, and biometrics solutions, today announced the launch of NEC's new generation of servers based on the new Intel Xeon E5-2600 product family supporting ProgrammableFlow networking.

The new generation of Express5800 E5 Generation Series servers will benefit from the performance boost and energy-efficiency of the new Intel Xeon processor E5 family combined with NEC's own innovations for higher manageability, energy efficiency and higher scalability. Combined with NEC's new ProgrammableFlow support, these new features will become an important factor to help accelerate cloud computing by maximizing the effectiveness of operational expenditure, especially business critical applications and database consolidation at corporate data centers. The Express5800/R120d-2M and R120d-1M family of platforms will be powered by these innovative features.

ASUS hasn't completely ditched the "Thermal Armour" concept it introduced with the TUF Sabertooth P67, which we thought it did away, with the Sabertooth X79. The newest member in the series, the Sabertooth Z77, still very much features it. Thermal Armour is ASUS' idea of blanketing most of the motherboard's component area with a perforated sheet that directs air-flow, and also lends it an aesthetic touch (depending on your taste, you may love it, or hate it).

We spy four DDR3-DIMM slots (with matching Corsair Vengeance modules, not included), and an all-PCIe expansion slot layout, with two PCI-Express 3.0 x16 slots, one PCIe 2.0 x16 (x4), and three PCIe x1. There are two additional SATA 6 Gb/s ports augmented to the ones provided by the Z77 PCH. Display connectivity looks to include DVI and HDMI. 8-channel HD audio, GbE, about 6 USB 3.0 ports, and a number of USB 2.0 ports, complete the package. The board supports ASUS' BIOS Flashback feature. ASUS TUF Sabertooth motherboards are designed to be rock-stable and durable enough to be certified by stress-testing agencies for it.

Apart from other Z77 chipset-based models that have been exhaustively covered in the past, MSI is working on a media-oriented ATX LGA1155 motherboard based on the H77 chipset, the ZH77A-G43. Why MSI added a "Z" in the model name beats us. The LGA1155 socket is powered by a simple 5-phase VRM. MSI is kind enough to provide passive cooling for the entire CPU VRM area. The CPU is wired to four DDR3 DIMM slots, providing dual-channel DDR3 support.

Expansion slots include one PCI-Express 3.0 x16 (wired to the CPU), one PCI-Express 2.0 x16 (electrical x4, wired to the PCH), two PCI-Express 2.0 x1, and three legacy PCI slots. PCI slots are still in good demand by media-professionals who need them for pro-grade sound production cards. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s. All four USB 3.0 ports on this board (two on the rear-panel, two via header) are provided by the H77 PCH. HDMI, DVI, and D-Sub form the display IO. To top it off, you get 8-channel HD audio with THX TruStudio Pro support, and gigabit Ethernet. Expect a value price-point.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of new DDR3 server memory modules for cloud business solutions, which feature improved levels of energy efficiency and performance.

The most striking aspect of the new modules is their high efficiency. This results in major energy savings, leading to reduced overall power consumption for cloud businesses, and all-around lower carbon dioxide emissions. These benefits come with no sacrifice in terms of performance- the high speed operation and reduced memory-bus load of these modules leads to greatly enhanced overall system efficiency. Fully compatible with major motherboards, these server DIMM modules are a reliable solution that reduce power costs and increase environmental protection.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today introduced new industry-leading, single piece 8 GB DDR3-1600 high-density memory modules. Known for industry-high standards of quality control and meticulous device engineering, the new modules will meet and exceed expectations of customers who seek performance and quality in DRAM products.

With this launch ADATA is continuing its tradition as an industry leader in DRAM product line-up. These 8 GB Premier Series DDR3-1600 single piece memory modules allow users to boost system performance over the limitations of memory slot availability.

PowerColor's parent company, TUL, showed off its barebones Mini-PC at CES. Its main unit measures just 165 x 165 x 55 mm (LxWxH), and is available in black and white color options. Under the hood is an AMD G-Series embedded APU, backed by Hudson M1 FCH chipset. It takes in 1 DDR3-SODIMM module, up to 4 GB in size, and runs it at speeds of up to PC3-8500 (DDR3-1066 MHz). The G-Series APU provides AMD Radeon HD 6310 graphics, with DVI and HDMI display outputs. The mini PC barebone has room for one 2.5-inch SATA 6 Gb/s drive. Its front-panel offers one USB 2.0 port (USB 3.0 can be opted for), a multi-format card reader, and eSATA 6 Gb/s. Its rear panel connectivity includes 2-channel audio outputs, gigabit Ethernet, four USB ports, and display connectivity. The unit has an internal 40W PSU.

Apart from the Z77H2-AX, ECS showed off a mainstream socket LGA1155 motherboard based on the H77 "Panther Point" chipset, in the micro-ATX form-factor. The H77 chipset has the same feature-set as the Z77, except it lacks Rapid Storage Technology, and overclocking features. Out of the box, this board supports next-generation "Ivy Bridge" Core processors.

The LGA1155 socket is powered by a 6-phase VRM. It is wired to four DDR3 DIMM slots supporting dual-channel DDR3 memory; and a PCI-Express 3.0 x16 slot. Other slots include a PCIe 2.0 x1, and two legacy PCI slots driven by an ITE-made bridge chip. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s, all wired to the PCH. Display connectivity includes DVI, D-Sub, and HDMI. Other connectivity includes 8-channel HD audio, gigabit Ethernet, and four USB 3.0 ports (all driven by the PCH). The board uses cost-effective electrolytic capacitors on all circuits that don't deal with large currents, only the power conditioning circuits have solid-state capacitors.

Intel has, in the past, referred to its two-chip low-wattage computing solutions as "SoC" (system on a chip), keeping with that trend, it was assumed that "Centerton", an Atom-derived processor for NAS servers that the company is working on, could be a similar 2-chip solution with the tiny NM10 PCH sitting next to the CPU. It is now coming to light that Intel will design Centerton to run as a true single-chip SoC, without the PCH.

Centerton's core and uncore components, housed on the same piece of silicon, are detailed in the first picture, below. It packs two x86-64 cores. Each core has 32 KB L1I cache, 24 KB L1D cache, and 512 KB of dedicated L2 cache. There is no shared tertiary cache between the cores, however, they converge at the integrated memory controller (IMC). This IMC can control a single DDR3 memory channel, supporting 1.5V DDR3 UDIMMs with ECC support or 1.35V DDR3 SO-DIMMs, at speeds of PC3-10600 (DDR3-1333 MHz). Up to 8 GB of RAM is supported. The core can be clocked as high as 1.60 GHz. It features HyperThreading technology, enabling four logical CPUs for the OS to deal with. Any current 32-bit or 64-bit x86-capable OS should run.

Buffalo Japan unveiled new 8 GB memory modules in the 204-pin SO-DIMM and standard 240-pin DIMM form-factors. These modules pack 8 GB capacity, and stick to JEDEC DDR3-1333 MHz standards. Featured in the D3N1333 series, these modules 1024M x 64bit DIMM configuration. They achieve 1333 MHz speeds with CAS latency of 9T and DRAM voltage of 1.5V. The Buffalo Tools software comes bundled with these modules. The two are priced at 26,670 JPY, around US $341.6.

ASRock kicked off its "Sandy Bridge-E" compatible motherboard series with one of the most complete lineups, including a micro-ATX model. It did include some oddities, such as the X79 Extreme7, with its six DIMM slot arrangement. Socket LGA2011 Core i7 processors embed a quad-channel integrated memory controller, and so it's only logical to either have one DIMM slot per channel (four DIMM slots in all), or two DIMM slots per channel (eight in all).

ASRock unveiled its latest addition to its X79 Extreme family, the X79 Extreme6/GB, which sets this oddity straight, while creating another. This model is supposed to be a notch inferior to the X79 Extreme7, yet it provides eight DIMM slots (two per channel). Other features, however, are consistent with those of the cheaper X79 Extreme4. So it's safe to call this ASRock's answer to MSI's recently-launched X79A-GD45 8D, a relatively cheaper X79 motherboard with eight DDR3 DIMM slots. 8 DIMM slots stopped being a thing of the "premium" (again, relatively), the moment Intel launched a $210 X79 motherboard that features it, the DX79TO.

Intel's Desktop Board division didn't miss out on the Sandy Bridge-E LGA2011 platform launch, after all, it's ceremonial for Intel to launch a new generation of processors with its own branded motherboards that are fully compatible with them. While Intel had two models of LGA2011 motherboards in the pipeline, the DX79SI and DX79TO, only the former was launched in November, which made it to most platform reviewers. The DX79SI was launched at a price point of US $289 - $299 MSRP, though some retailers easily set that price above $300. The new DX79TO is designed to be a down-scaled version of the DX79SI, targeting a price range of $203 - $208, according to ARK. Naturally then, the price that's 30% lower than that of the DX79SI invites some aggressive feature-cutting.

To begin with, the DX79TO could have a slightly slimmer CPU VRM. Thankfully, it doesn't cheap out much on VRM heatsinks, with the same exact ones found on the DX79SI. The heatsink cooling the VRM area south of the socket is not linked to the PCH heatsink with a heat-pipe, like on the DX79SI. The PCH heatsink itself looks slightly slimmer, though it's not a major area of concern. The CPU socket is still wired to as many as eight DDR3 DIMM slots, supporting up to 64 GB of quad-channel DDR3 memory.

After releasing the tri-channel RAM to take "Triple-Channel" initiatives, the global leading brand Team Group Inc. presents the 8GB memory module of the Team Elite DDR3 series. The ultra memory storage item goes with the JEDEC standard, marking a turning point of the RAM market to enter the "Triple-Channel" and also the ultra big storage generation.

The new memory module of the Elite series, U-DIMM with 16 GB (8GBx2 kit) as its largest storage capacity and SO-DIMM 8GB, both uses selected DDR3 chips and passes 100% stringent testing. The item is in BGA package with stability and compatibility between memory modules and PC platforms have been greatly improved. Meanwhile, the Elite's exclusive heat spreader is helpful in cooling computing temperatures and enlarging storage to offer stability and efficiency. In addition, it features high speed, low power consumption, and high efficiency. It takes only 1.5V low voltage to function well, it lowers carbon emissions, is electricity-saving, power-saving, and environmentally friendly. All these taken together make it the best choice for your PC.

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces a new line of 1333 MHz, quad rank registered DDR3 RDIMM modules for servers. Today's new motherboards that support the new 16 core processors, now require a new type of RDIMMs, quad-channel DDR3. On the heels of their single and dual rank RDIMMs, Super Talent is pleased to announce a new Quad-Rank Module for those who require even more DRAM capacity.

At 8 GB per module, today's servers can now support a maximum of 128 GB of RAM. These modules have passed vigorous testing using the new AMD Interlagos compatible motherboards and even support fully loaded configurations at speeds up to 1066 MHz. If you're deploying a new server and have been looking for RDIMMs to deliver maximum performance and capacity, you owe it to yourself to call SuperTalent. Products available and shipping now. Part Number: W13RC8G8x - 8GB RDIMM Module.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced a line of high-performance memory upgrade kits for power laptop users.

Operating at speeds of 1600 MHz and 1866 MHz, the new Vengeance laptop memory upgrade kits are an ideal solution for notebooks equipped with a 2nd Generation Intel Core i5 or Core i7 processor. Vengeance laptop memory is designed to be plug-and-play, with no BIOS adjustments needed to instantly take advantage of the faster memory speed.