Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung's advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

Team Group Inc. makes an active plan and layout to break into the industrial class and server memory module market in 201. Facing the emerging cloud computing market, Team Group is optimistic about the future potential of cloud technology. To satisfy the customer's need for a more flexible customized server production, Team Group has been actively trying to cut into the industrial class memory module market by means of its advantages in strong R&D and procurement.

Team Group's Registered DIMM memory module comes in two clock specifications, DDR3 1066/1333, and a selection of three capacities of 4GB, 8GB and 16GB. The 16GB was made under a more stringent technological standard than the industry's norm and a more rigorous product testing. It is double-sided and dual-layered to achieve the maximum capacity. The Registered DIMM is compatible with the latest chip sets such as Intel 5500/5520 and AMD SR5670/5690 to provide servers with the most stable memory storage space, making it the best partner for building a cloud server.

Stealth.com Inc., a leader in the industrial computer and peripherals market has released a new ultra small PC designed specifically for in-vehicle/mobile/embedded applications. Stealth's model LPC-125LPM is a rugged small form PC that operates in extreme temperatures and is energy efficient, drawing less than 20 Watts in operational power.

Housed in a rugged aluminum enclosure this energy efficient & versatile PC measures out at only 4.0" x 6.1" x 1.45" (102mm x 155mm x 37mm) or about the size of a deck of playing cards. The Stealth Mini PC weighs in at a mere 1.2lbs or 0.54kg. The PC operates from 10-26V of DC power making it ideal for DC powered applications typically found in vehicles and mobile applications.

Better late than never, MSI is ready with its first socket FM1 motherboard in the ATX form factor. The A75A-G35 is designed for those who can use up to 7 expansion slots, and is a textbook implementation of the AMD Lynx platform. Designed for AMD A-series APUs, the FM1 socket is powered by a simple 4-phase VRM, it is wired to just two DDR3 DIMM slots that can take in dual-channel DDR3-1866 MHz memory. Expansion slots include one PCI-Express 2.0 x16 wired to the APU, three PCI-E x1, one PCI-E x16 that runs at x4 speeds, wired to the A75 chipset, and two legacy PCI.

In terms of connectivity, there's DVI, D-Sub, and HDMI on the display front, with the HDMI port having its own 7.1 channel HD audio with various digital audio formats support; 8-channel HD audio driven by a Realtek codec, gigabit Ethernet, four USB 3.0 ports (two via header), and a number of USB 2.0 ports on the rear panel, and via headers. There are no eSATA ports, as all six SATA 6 Gb/s ports from the chipset as assigned as internal ports. MSI will price this board at €71.50.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class* four gigabit (Gb) DDR3 DRAM chips.

"With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers," he added.

ASUS displayed its new mini-ITX motherboard for IPC (industrial PC) market, the D27NM10-I IPC. As an IPC-ready board, it is designed for rugged industrial environments that have minimal cooling and require high uptime. The D27NM10-I IPC uses next-generation 32 nm Intel Atom "Cedar View" D2700 dual-core processor clocked at 2.13 GHz, featuring HyperTreading to yield 4 logical CPUs for the OS to deal with. The processor is wired to two DDR3 SO-DIMM slots supporting single-channel DDR3 memory. Intel NM10 is the chipset employed, it's also found on previous-generation Pine Trail platform.

A large heatsink covers both the processor and chipset, there are three 4-pin PWM fan headers on board in case a fan has to be latched on to it. The board draws power from an external DC power source over standard 2-pin DC input connector. It can also be powered by any switching power supply with a 4-pin Molex power connector. Storage connectivity includes two SATA 3 Gb/s ports. The only expansion here is an open-ended PCI-E x1, and a mini-PCI-E. There's plenty of serial connectivity, including two serial DE-9 ports on the read panel, and 3 via headers. Other connectivity includes 2-channel HD audio, dual gigabit Ethernet, display outputs that include DVI and D-Sub, and a number of USB 2.0 ports. The board uses UEFI with graphical EZ-Mode setup program.

TEAM Group, of the TEAM Xtreem fame, showed us its latest generation of ultra-high end DDR3 memory modules for overclocking. The theme for this year is LV (low-voltage) modules, which can do their rated DRAM speeds at 1.35V voltage. We begin with TEAM Xtreem DDR3-2400 MHz and TEAM Xtreem DDR3-2000 MHz, which come in 2 GB and 4 GB module capacities, and in triple-channel and dual-channel kits. These kits are the top of the line that TEAM has, to offer.

Moving on, there's a second line of memory kits for the performance segment, also LV (low-voltage, 1.35V), called TEAM Xtreem Dark series, which offer speeds of DDR3-1600 MHz, and use slightly smaller heatsinks. These modules come in 2, 4 GB capacities, and in dual and triple channel kits. Next up is the TEAM Green series, that are bare modules without heatsinks, that do JEDEC standard DDR3-1333 MHz and DDR3-1600 MHz at 1.35V, with loose timings. Lastly, there's a performance line of SODIMM modules for Apple Macs, the TEAM Mac SODIMM, which runs at DDR3-1333 and DDR3-1066 MHz speeds, offering 2 GB and 4 GB module capacities.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

Rarely do motherboard vendors dish out mini-ITX form-factor motherboards targeting the overclocking community. There's little space to squeeze in the bare essentials, but nothing is impossible, if there are competent designers at work, a case in point is the new Z68-ITX WiFi from ZOTAC. Based on the Intel Z68 Express chipset, this board supports LGA1155 Core i3/i5/i7 Sandy Bridge, and future Ivy Bridge processors, supports their integrated GPU giving you access to Intel QuickSync technology, as well as a suite of overclocking options.

To begin with the LGA1155 socket is powered by an 8-phase digital-PWM power design that uses high-grade PWM chokes made by Pulse, and in all probability, a Volterra PWM IC giving you precise voltage control as well as vDroop protection (high-precision load-line calibration). It also uses server-grade high-C capacitors. The PWM circuit takes input from an 8-pin EPS connector. The PWM chips are cooled by a large heatsink that sends some of its heat to the heatsink cooling the Z68 PCH, over a heat pipe.

Meet the X79A-GD80 from MSI, where active component cooling is making a comeback to motherboards. The Sandy Bridge-E LGA2011 socket dwarfs everything around it, in the upper-half of the board. Typical of LGA2011 motherboards,the X79A-GD80 has two DDR3 DIMM slots on either sides of the CPU socket, supporting quad-channel DDR3 memory. The VRM area is above the socket, MSI used a 40 mm fan-heatsink to cool the VRM. Further, a fan-heatsink is used to cool the X79 PCH. With the PCH heatsink the use of fan is more of an effort to keep the heatsink small in size, so active air-flow can compensate for its size. That aside, expansion slots are all-PCIe, including three PCI-Express 3.0 x16 (x16/x8/x16), and four PCI-E x1 in middle. All 10 of the SATA 6 Gb/s ports from the PCH are internal ports, with just the one eSATA. Other connectivity includes 8+2 channel HD audio, dual gigabit Ethernet, and USB 3.0.

ASRock is ready with what it will be offering the very top tier of consumers of the Sandy Bridge-E platform, the third largest selling motherboard vendor is ready with the X79 Extreme4. This standard-size ATX motherboard uses essentially the same component layout as most socket LGA2011 boards we've seen so far. The LGA2011 socket is powered by an 8-phase VRM. The socket is wired to four DDR3 DIMM slots on its either sides, to support quad-channel DDR3-2133 MHz memory. The processor also holds a massive 40-lane PCI-Express 3.0 hub, giving out two PCI-Express 3.0 x16 links, distributed between three slots (as x16/x16/NC or x16/x8/x8), with two each of PCI-E x1 and PCI in between.

ASRock did not finalize its chipset/VRM heatsinks design, yet. While we can't see the right portion of the board in the picture, we can assume that all 10 SATA 6 Gb/s and 2 SATA 3 Gb/s ports will be internal ports, with the possibility of one or two eSATA. Other connectivity includes 8-channel HD audio, dual gigabit Ethernet, and four USB 3.0 ports (two by header). The board supports 3-way NVIDIA SLI and AMD CrossFireX.

To make a 'great value' socket FM1 motherboard, there are two approaches, either add dual discrete graphics support by adding a second PCI-Express x16 slot, like on the Gigabyte A75-UD4H, or by adding a boat-load of connectivity while leaving single discrete graphics option, an approach taken by Sapphire on its Pure Platinum A75. This ATX form-factor motherboard comes fully loaded with a 8-phase VRM for the FM1 APU socket, four DDR3 DIMM slots supporting dual-channel DDR3-1600 MHz, powered by a 2-phase VRM, and overclocker-friendly voltage measurement points.

Expansion slots include a PCI-Express 2.0 x16, an open-ended PCI-Express x4, and two each of PCI-Express x1 and legacy PCI. There is also an mSATA slot to hold SSDs in the mSATA form-factor. Storage connectivity includes four SATA 6 Gb/s internal ports, an mSATA slot, and eSATA. Other connectivity includes four USB 3.0 ports (of which two are by header), 8-channel HD audio, Bluetooth, gigabit Ethernet, and a number of USB 2.0 ports. Display connectivity includes D-Sub, DVI, and HDMI 1.4a.

The A75A-G35 caught our attention at the MSI booth, a slim ATX socket FM1 motherboard based on the AMD A75 chipset. Supporting the AMD A-series accelerated processing units, the A75A-G35 uses a simple 3+1 phase VRM to power the APU, the board features just two DDR3 DIMM slots, but supports dual-channel DDR3-1600 MHz memory. Expansion slots include one PCI-Express 2.0 x16, a PCI-Express x16 running at x4 speed, three PCI-E x1, and two legacy PCI.

Display connectivity includes DVI, D-Sub, and HDMI. All six SATA 6 Gb/s ports from the A75 FCH are assigned as internal ports. Other connectivity includes 8-channel HD audio, gigabit Ethernet, and USB 3.0. The A75A-G35 uses UEFI and ClickBIOS GUI-driven setup program, and Winki 3 desktop manager.

With the "entry level" of its socket LGA2011 lineup, ASUS is making a return to its signature gold-colored PCB with the C1X79 EVO. Based on the Intel X79 Express chipset, the board provides a basic feature-set sticking to whatever the chipset provides. The LGA2011 socket is powered by a simple 6+1 phase VRM, the two DDR3 DIMM slots are located on either sides of the socket in groups of two, and are powered by a 4-phase VRM.

Expansion slots include three PCI-Express 3.0 x16 (electrical x16/x16/NC or x16/x8/x8, depending on whether the third slot is populated), two PCI-E x1, and an open-ended PCI-E x4. All 10 of the SATA 6 Gb/s ports provided by the X79 chipset are assigned as internal ports, apart from four additional 3 Gb/s ports. That aside, there's little in terms of connectivity, with just the 8+2 channel HD audio, dual gigabit Ethernet, and a couple of USB 3.0 ports. The board uses ASUS' UEFI setup program with EZMode. We're not entirely sure if the production version of this board sticks to the golden PCB color, let's hope it does.

When Intel's Sandy Bridge platform was launched, P67 Express was perceived as the top of the line discrete graphics chipset that gives performance segment users everything they'll ever need. ASUS hence based its prestigious ROG Maximus branded motherboard based on it, and came up with the Maximus IV series. With Intel releasing a higher-end chipset with the Z68 Express, ASUS decided to redo its socket LGA1155 ROG motherboard lineup, with the Maximus IV Extreme-Z. The new motherboard gives users access to the processors' embedded graphics via a HDMI port, and gives them the benefit of Intel Smart Response technology that P67 lacks.

The Maximus IV Extreme-Z looks similar to its P67-based cousin. Based on the Intel Z68 chipset, the motherboard uses an NVIDIA nForce 200 bridge chip to ensure PCI-Express connectivity to up to four graphics cards, supporting NVIDIA SLI and AMD CrossFireX. The CPU is powered by ASUS Digi+ Extreme VRM, backed by high-grade components and proadlizers to condition power. There are four DIMM slots supporting dual-channel DDR3-2000 MHz memory by overclocking. Expansion slots include four PCI-Express 2.0 x16 (x16/NC/x16/NC or x8/x8/x8/x8), there's also a PCI-E x1 and open-ended PCI-E x4.

AMD's new Fusion A-Series "Llano" accelerated processing unit (APU) is shaping up to be a credible home and entertainment platform, but it is also carrying the responsibility of making it to office spaces. Part of that initiative would rest with the motherboard manufacturers to come up with inexpensive and durable sub-$100 motherboards that can be bought and deployed in bulk. Enter the Gigabyte A75M-UD2H. This micro-ATX form-factor motherboard relies entirely on the platform's feature-set.

The FM1 APU socket is powered by a simple 4+1 phase VRM, it is wired to four DDR3 DIMM slots supporting dual-channel DDR3-1600 MHz memory. Of the four expansion slots, there's one PCI-Express 2.0 x16, a PCI-E x16 that's electrical x4, and one each of PCI-E x1 and legacy PCI. To further make for its business PC outlook, there are headers for legacy ports such as LPT and COM (for dot-matrix printers in banks, etc.).

After displays of socket AM3+ motherboards based on AMD 990FX chipset, by ASUS, and MSI were pictured by various tech sites, it's quite expected of Gigabyte's offering to somehow make it to the web. Gigabyte is going full guns with its top AM3+ motherboard, with the GA-990FXA-UD7. Based on the same Black+Graphite+Gold color scheme as the socket LGA1155 "UD7" models based on Intel P67 and Z68, the GA-990FXA-UD7 comes with zesty dimensions that almost make it an EATX form-factor board, although it's not. The AM3+ socket is powered by a 10-phase VRM that is cooled by a long heatsink that appears to be contiguous with the northbridge heatsink, which in turn shares heat with the southbridge over a heat pipe. The socket is wired to four DDR3 DIMM slots supporting DDR3 frequencies in excess of 1866 MHz.

Gigabyte utilized each of the seven expansion slots, packing in six PCI-Express 2.0 x16 neatly spaced out to support NVIDIA 4-way SLI and AMD 4-way CrossFireX; two out of six slots two are electrical x4, wired to the southbridge. A legacy PCI slot is thrown in, just in case you hate to throw away that expensive PCI sound card that still sounds great. Storage connectivity includes eight internal SATA 6 Gb/s ports, six from the SB850 southbridge, and two from a third-party controller. There are two eSATA ports, of which one appears to be power-eSATA.

ASRock just couldn't hold its rocks. The third-largest motherboard company released the first picture of its upcoming socket FM1 motherboard that supports AMD's upcoming performance A-series accelerated processing units. The ASRock A75 Extreme6 as it's called, is based on AMD's Hudson-D3 A75 single-chip chipset. With the northbridge component completely relocated to the APU die, what's left of the chipset is a little more than a southbridge. The 905-pin socket is significantly different from the 940-odd pin sockets from AMD in recent times, though its cooler retention brackets haven't essentially changed. So most AM3-supportive coolers should fit on FM1.

The FM1 socket is powered by a 10-phase VRM, it is wired to four DDR3 DIMM slots for dual-channel DDR3-1866 MHz memory support; and to two of the three PCI-Express 2.0 x16 slots. The first two PCI-E x16 slots switch to electrical x8 when both are populated. The third slot is electrical x4, and wired to the chipset. Expect a big chop in CPU to discrete GPU latencies. Other slots include one PCI-E x1, and three PCI.

Remember the very first strains of Ibex Peak LGA1156 platform motherboards such as this one? Remember that small memory slot next to the bigger DIMM slots? That was Intel's ambitious "Braidwood" technology, a NAND-flash based hard drive assist feature. Fast NAND flash memory would be installed onto the motherboard in the form of removable modules, and those modules would quicken system booting, and act as a fast cache for the system drive. Alas, Braidwood was axed for reasons unknown till date. Maybe it made Ibex Peak platform a lot faster than it should be, or maybe its design wasn't perfected or flawed. Regardles, it disappeared.

Two platforms (Ibex Peak and Cougar Point) later, a similar technology is making its way through Intel's pipes, this time it has a proper market name: Intel Smart Response Technology, and comes with another new development, Larsen Creek. Larsen Creek is the codename of Intel's upcoming line of solid state drives. However, it is targeting entry-level, low-capacity markets, and what better way to sell it than club it with Intel's new platform technology, Smart Response. Instead of NAND flash modules (Braidwood), Intel's Smart Response technology uses SATA SSDs to accelerate hard drives. The SSD can be of any size and speed, it's just that Larsen Creek is the most appropriate given that it will come in capacities as low as 20 GB, and be quite inexpensive.

The GS-AH6G3N embeds the new LGA1155 Intel platform for mobile products, with the most powerful and efficient processor and chipset for a reliable and durable business notebook. Designed for professional end users, our product includes all the most important features required by a utilization in a business environment. The GS-AH6G3N is therefore a very versatile business notebook, with the highest standard of performance and quality from GIGABYTE. It is nevertheless a stylish product, with an excellent design and ultra-thin profile, as well as a very light weight and a large power autonomy for the smoothest mobility. With its high value features, the GS-AH6G3N has everything to be the best work tool for your daily business life.

The GS-AH6G3N offers all the important features that e good business notebook should have. Probably the most critical feature, the GS-AH6G3N has a power autonomy of about 7 hours, which can be extended to 10 hours with a second battery docked in the swappable ODD bay (this bay can also dock a second HDD).

Stores in Taiwan have started stocking up on Gigabyte's latest high-end LGA1155 motherboard, the GA-Z68X-UD7 B3. Based on the new Z68 chipset that combines the overclocking capabilities of P67 with the Flexible Display Interface (FDI) feature of H67, Z68 will be Intel's most functional desktop chipset for the LGA1155. Gigabyte's board carries forward the feature-set of the P67A-UD7, and adds a GUI-based Hybrid EFI setup program. Quite surprisingly, there are no display outputs, so we're not quite sure why the designers opted for Z68 in the first place.

The GA-Z68X-UD7 uses a 24-phase VRM that uses driver-MOSFETs to power the CPU, four DDR3 DIMM slots to support dual-channel memory, four PCI-Express x16 slots supporting 3-way SLI and CrossFireX. Gigabyte is probably using an NVIDIA nForce 200 bridge chip for the additional PCI-E lanes. Storage connectivity includes four SATA 6 Gb/s, six SATA 3 Gb/s, and two eSATA/USB combo ports. There are at least four USB 3.0 ports. Gigabyte's new board will reach western markets later this month, after Z68's formal launch.

The GIGABYTE GA-6UASL Series of single socket motherboards for server offers the best platform to deliver the new world class performances available through Intel's brand new processor microarchitecture and chipset series.

Designed for small and medium business applications, the GIGABYTE GA-6UASL Series offers a multipurpose product perfect for applications such as web server, file & print server, e-mail server, storage server, and any type of vertical-specific business applications, but it is also absolutely suitable for high performance computing and embedded applications.

Viking Modular Solutions, a leading global provider and manufacturer of innovative DRAM technology and Solid State Drive solutions, today announced the release of its next generation SATADIMM. Viking Modular's SATADIMM provides the highest-capacity, highest-performance Solid State Drive (SSD) in the smallest form factor on the market today. Leveraging the form factor of DDR3 DIMMs and the non-volatile capabilities of SSDs, SATADIMM enables enterprise servers to take advantage of its innovative small footprint to drive significantly increased performance per server or "per U". Viking Modular will demonstrate the product's unique capabilities at Storage Networking World in Santa Clara, California, April 4-7, 2011, at Booth # 517.

Available in both 25mm and 18.75mm (VLP) heights in the industry standard 240-PIN DDR3 form factor, Viking Modular's SATADIMM has the same Bill of Materials (BOM) as a 2.5 inch SSD but with 75% less footprint, greatly enhancing the quantity of SSDs that can be supported within a 1U server. Utilizing the enterprise-class SATADIMM, 1U servers can produce 1.4M Input/Output Operations Per Second (IOPS) and up to 3x the capacity and overall performance levels compared to current industry standard servers deployed with traditional SSDs.

Lexar Media, a leading global provider of memory products for digital media, today introduced the Crucial Ballistix Sport memory series designed to provide mainstream users, gamers, and general PC enthusiasts with a reliable, no-hassle gaming experience. The new Crucial Ballistix Sport memory supports today's latest AMD and Intel platforms, including 2nd Generation Intel Core processor (formerly codenamed Sandy Bridge) technology. It also features a stylish new heat spreader design, along with standard timings and voltages, providing maximum memory stability and system compatibility. Additionally, industry-standard specifications require little or no BIOS configuration, resulting in easy product installation.

"Over the years, Crucial Ballistix memory has earned a reputation amongst gamers and enthusiasts as high-quality, high-performance, reliable memory," said Jeremy Mortenson, senior product manager. "The Crucial Ballistix Sport series offers casual gamers an accessible, easy-to-use Ballistix memory product at an affordable price. This new Ballistix offering is part of our broader product strategy and a commitment to satisfy the needs of our customers."

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3-1333MHz RDIMM BOM-controlled server DRAM for customers who require a Bill of Material (BOM), revision control, as well as Product Change Notices (PCNs). BOM-control applies to the DRAM component, register, and PCB of eligible Crucial server memory modules. The new BOM-controlled server memory is covered by the Crucial Reliance Server Program, and enables registered partners to stay ahead of product changes, reduce the frequency of memory qualifications that occur due to memory revisions, and ultimately optimize productivity. Participating customers with Crucial BOM-controlled server memory will receive at least 30 day advanced notification of pending module revisions.

Crucial DDR3-1333MHz RDIMM BOM-controlled server memory is halogen-free, RoHS compliant, and will be validated on Intel CPUs and platforms; 2GB, 4GB and 8GB densities are now available for sampling and qualification. For additional information on how to purchase BOM-controlled server memory, contact your Crucial memory provider, or visit this page for details and qualifications.