News Posts matching "DRAM"

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AMD Announces AGESA Update 1.0.0.6 - Supports up to 4000 MHz Memory Clocks

You've probably heard of AMD's AGESA updates by now - the firmware updates that are ironing out the remaining kinks in AMD's Ryzen platform, which really could have used a little more time in the oven before release. However, kinks have been disappearing, the platform has been maturing and evolving, and AMD has been working hard in improving the experience for consumers and enthusiasts alike. As a brief primer, AGESA is responsible for initializing AMD x86-64 processors during boot time, acting as something of a "nucleus" for the BIOS of your motherboard. Motherboard vendors take the core capabilities of AGESA updates and build on them with their own "secret sauce" to create the BIOS that ultimately populate your motherboard of choice. The process of cooking up BIOS updates built on the new AGESA will vary from manufacturer to manufacturer, but AMD's Robert Hallock says you should be seeing BIOSes based on this version halfway through the month of June - if your vendor isn't already providing a Beta version of some kind.

This new AGESA update code, version 1.0.0.6, should be just up the alley of enthusiasts, however, in that it adds a grand total of 26 new parameters for memory configuration, improving the compatibility and reliability of DRAM, especially for memory that does not follow the industry-standard JEDEC specifications (e.g. faster than 2667, manual overclocking, or XMP2 profiles). Below you'll find the 26 parameters that were introduced.

TechPowerUp and G.Skill Announce the Ryzen-ready Flare X Memory Giveaway

TechPowerUp and G.Skill Memory bring you three more reasons to take the AMD Ryzen leap, with the "Game Faster with Flare X" Giveaway. Up for grabs are three G.Skill Flare X 16 GB (2x 8GB) dual-channel DDR4-3200 memory kits, which are based on Samsung b-die DRAM chips, and are recommended by AMD for the best performance on its Ryzen series desktop processors. The Flare X series kits are renowned for reliably sustaining DDR4-3200 speeds on Ryzen machines, which have a direct impact on their performance, since DRAM clock is synced with the clock speed of the Infinity Fabric interconnect between the two CCX quad-core units on Ryzen processors. The giveaway is open worldwide.

For more information, and to participate, visit this page.

Intel to Introduce 3D XPoint DIMM Tech to the Market on 2018

Early on in Intel's 3D XPoint teasers and announcements, the company planned to have this memory integrated not only as a system cache solution or SSD replacement, but also as a potential substitute for DRAM memory. The objective: to revolutionize the amount of DRAM memory a given system can carry, at a much lower price per GB, with a somewhat acceptable performance penalty. Intel describes the current DRAM implementation as too small, too expensive, and too unstable (read: data loss on power loss) to continue being on top of the memory food chain. This is where the 3D Xpoint DIMM implementation can bear fruits, by offering significantly higher amounts of storage at much lower pricing, while keeping attractive bandwidth and latency performance. DRAM will still be used for system-critical operations and booting, albeit in lower capacities, and will be used side by side with these 3D XPoint DIMM slots, which will take in the bulk of the work.

This kind of usage for Intel's 3D XPoint also delivers an interesting side-effect: since this memory is persistent (which means that data isn't lost when the power is turned off,) interruption or loss of power won't erase the work in memory. At the same time, this means that this kind of DRAM-substitute memory requires some security precautions DRAM doesn't, since anyone with direct physical access to the stick could just remove one and take it with all the data inside. Even though a 2018 time to market seems a little to optimistic, considering all the changes this implementation would require from adopters, the technology is definitely promising enough to tempt users to make the jump.

Source: EXPreview

SK Hynix Updates Memory Catalog to Feature GDDR6 and HBM2

South Korean DRAM and NAND flash giant SK Hynix updated its product catalog to feature its latest GDDR6 memory, besides HBM2. The company had April announced its first GDDR6 memory products. The first GDDR6 memory chips by SK Hynix come in 8 Gb (1 gigabyte) densities, and data-rates of 14 Gbps and 12 Gbps, with DRAM voltages of 1.35V. The company is giving away small quantities of these chips for product development, mass production will commence soon, and bulk availability is slated for Q4-2017. This would mean actual products implementing these chips could be available only by very-late Q4 2017, or Q1-2018.

A graphics card with 14 Gbps GDDR6 memory across a 256-bit memory bus (8 chips) features 448 GB/s of memory bandwidth. A card with 384-bit (12 chips), should have 672 GB/s at its disposal. Likewise, the 12 Gbps memory chips offer 384 GB/s in 256-bit (8-chip) setups, and 576 GB/s in 384-bit (12-chip) setups. Meanwhile, SK Hynix also updated its HBM2 catalog to feature a 32 Gb (4 gigabyte) HBM2 stack, with a clock speed of 1.60 Gbps. The 2.00 Gbps stack which featured in the Q4-2016 version of this catalog is no longer available. At 1.60 Gbps, a GPU with four stacks has 819.2 GB/s of memory bandwidth. A chip with two stacks, such as the purported "Vega 10" prototype that has made several media appearances, hence has 409.6 GB/s.

Source: SK Hynix

Samsung Could Become Top Chipmaker in 2Q17, Dethrone Intel

Samsung could be on the verge of a historic dethroning of Intel as the dominant chipmaker in the IC world, if a recent report from IC Insights is to be believed. The report shows Samsung actually exceeding Intel's semiconductor sales in 2Q 2017, no doubt spurred on by mobile market growth and the proliferation of ARM based SOCs manufactured by Samsung.

Intel has held the dominant position for nearly a quarter century as its x86 architecture powered most PCs and notebooks/netbooks since 1993. The number of components they sell is not just limited to CPUs either: Intel is a provider of chips for everything from networking to thermal sensors, for Samsung to compete with such a giant in the semiconductor market at all (let alone exceed their sales) is quite a feat indeed.

Amidst Production Woes, Pricing of DDR4 DRAM to Climb 12.5% on 2Q17 - Trendforce

Continuing the trend of previous reports, DRAMeXchange, a division of TrendForce, reports the general price increase in the PC DRAM market is growing larger than anticipated as the already tight supply situation is compounded by quality problems with products made on the leading-edge processes. Based on a preliminary survey of completed contracts for the second quarter, DRAMeXchange estimates that the average contract price of 4GB DDR4 modules will go up by about 12.5% compared with the first quarter, from US$24 to around US$27.

"PC-OEMs that have been negotiating their second-quarter memory contracts initially expected the market supply to expand because Samsung and Micron have begun to produce on the 18 nm and the 17 nm processes, respectively," said Avril Wu, research director of DRAMeXchange. "However, both Samsung and Micron have encountered setbacks related to sampling and yield, so the supply situation remains tight going into the second quarter and PC DRAM prices will continue to rise through this three-month period."

G.SKILL Announces Trident Z DDR4-4333MHz 16GB (2x 8GB) Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce a new extreme speed memory kit running at DDR4-4333MHz at 16GB (8GBx2) capacity. And continuing with the pursuit of extreme memory speeds on the latest hardware, G.SKILL has reached an extreme DDR4-4500MHz speed on the Intel Z270 platform, achieving a stunning bandwidth write speed of 65GB per second in dual channel mode.

The latest addition to the Trident Z series of extreme performance memory kit is the DDR4-4333MHz CL19-19-19-39 timing in 16GB (8GBx2) at 1.40V. This is the first DDR4-4333MHz memory kit on the market in the 8GBx2 configuration for a total of 16GB. The stress test screenshot below displays the DDR4-4333MHz memory kit validated on ASUS ROG Maximus IX Apex motherboard and Intel Core i5-7600K processor.

ADATA Announces the i-Memory AI920 Jet Black Flash Drive

ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the i-Memory AI920 Jet Black Flash drive for iOS devices. Featuring Lightning and USB 3.1 in one slim 6.9mm device, the AI920 delivers 32GB, 64GB, and 128GB capacity and up to 150MB/s read. The Jet Black color scheme has been added in order to better complement Apple devices with an exact color match with iPhone 7, giving consumer more choice. The AI920 is also Apple MFi certified, making it an official iOS accessory.

PC DRAM Pricing Increased 20% Sep-Oct 2016; Will Continue Rising in 2017 - TrendForce

DRAMeXchange, a division of TrendForce, today reported that the average contract price of 4GB PC DRAM modules increased over 20% between September and October of 2016 (jumping from US$14.5 to US$17.5) as DRAM suppliers completed their fourth-quarter contract negotiations with first-tier PC-OEMs.

These increases come as the result of production capacity gradually shifting from PC-centric DRAM towards mobile and server DRAM, which have seen tremendous growths in demand. In fact, PC DRAM memory accounts for less than 20% of overall DRAM production. The already low inventories of branded device makers go hand in hand with higher-than-expected demand for DRAM-carrying products. And this higher demand comes after the PC DRAM market being severely undersupplied in the second half of 2016. The result: an across-the-board price upturn for all types of DRAM.

Corsair Announces Vengeance RGB DDR4 Memory

CORSAIR, a world leader in enthusiast memory, high-performance gaming hardware and PC components, today announced the immediate availability of CORSAIR VENGEANCE RGB DDR4 memory. VENGEANCE RGB brings vibrant RGB lighting to the DIMM slot, with high luminosity RGB LEDs integrated into every module, all controlled by CORSAIR LINK. CORSAIR VENGEANCE RGB's wire-free integration enables software RGB lighting control without additional wires (patent pending) for a sharp, clean look and providing an instant visual upgrade to any system build.

Equipped with a precision-engineered light bar and an all-new perforated CORSAIR logo, each LED generates vibrant and rich RGB lighting. With four customizable lighting modes; static, rainbow, breathing and color shift, it's simple to color match your system's build or put on a dazzling light show, and with specifically designed lighting circuitry, there's zero impact on DDR4 performance. With CORSAIR LINK, users can set up a temperature alert that automatically changes each memory module's LED color based on system temperatures, as well as monitor and control a wide variety of CORSAIR components, from case fans, lighting, DRAM and compatible CORSAIR power supplies to Hydro Series liquid CPU coolers, providing a complete PC monitoring experience.

Samsung's Z- SSD Featuring Z-NAND Makes a Physical Appearance

NAND has come here to stay, and it's market penetration still has a lot of leeway. Samsung, bar none the biggest and best player in the NAND field, is in a uniquely privileged position to develop new technologies and capitalize on them. Remember that Samsung has so many distinct product lines on which to monetize its advancements that any new investment is hardly a make it or break it affair.

Z-NAND is Samsung's answer to other developing technologies such as 3D XPoint, of which Intel has just announced the first commercial product. Z-NAND looks to stand at the intersection between NAND and DRAM, and is more of an evolution of the NAND design than it is a totally new technology (thus distancing itself from the likes of 3D XPoint.)

Intel Debuts its 3D XPoint Technology with Optane DC P4800X Datacenter SSD

Today, Intel unveiled the Intel Optane SSD DC P4800X Series and Intel Optane SSD DC P4800X Series with Intel Memory Drive Technology, enabling new possibilities to transform storage and memory architectures for the data center. Deployed as blazing fast storage or caching tier, Intel Optane SSD DC P4800X breaks the confines of traditional storage to significantly increase scale per server and accelerate applications. When deployed as extended memory, this drive expands the system memory pool, creating bigger, more cost-effective memory to gain higher quality insights.

An industry-leading combination of high throughput, low latency, high quality of service and high endurance enable the creation of solutions that remove data bottlenecks, unleash CPU utilization and deliver unprecedented insights. Intel Optane SSDs offer unrivaled performance at low queue depth, where the vast majority of applications generate storage workloads, which means CPUs are more active and more fully utilized. Intel Optane SSDs for the data center let users do more work with the same servers, improving TCO or expanding capabilities. And because the drive is extremely responsive under any load, it is highly predictable and delivers ultra-fast service, consistently.

AMD's Radeon Memory Business at a Standstill

AMD's Radeon branded memory business appears to be at a standstill, with no new product launches since 2015, and Radeon memory products out of stock (or nearly out of stock) at key retailers across North America.

When AMD was asked if it was planning to exit the memory business altogether, a company spokesperson replied that the memory is still being sold but is "mostly distributed in Eastern Europe, only small quantities are diverted to North America."

Silicon Motion Announces SATA FerriSSD Single-chip 3D NAND SSD

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers and solid-state storage devices, today announced that it has extended its popular family of SATA 6 Gb/s FerriSSD Industrial BGA SSDs to support the latest 3D NAND with end-to-end data path protection, NANDXtend ECC, and IntelligentScan feature - delivering unsurpassed data reliability for embedded storage applications. The new FerriSSD products offer flexible data capacity options up to 256GB and feature proprietary data protection technologies that eliminate drive downtime and extend the service life of these SSDs. FerriSSD products offer customized solutions for various end-market demands and are optimized to meet the specific needs of the customer.

ADATA XPG DDR4 Officially Validated by AMD as Ryzen Compatible

ADATA Technology, a leading manufacturer of highperformance DRAM modules, NAND Flash products, and mobile accessories is proud to share that all DDR4 offerings from its XPG high performance hardware brand have been officially certified by AMD as compatible with the AM4 socket and accompanying processors, namely the recently-launched Ryzen range. XPG memory was validated while installed on MSI motherboards, signaling major cooperation between ADATA and MSI.

With formal AMD approval, customers know they are purchasing a fully compatible product when selecting XPG DDR4 to be used on AMD AM4-based motherboards. As XPG DDR4 has been added to the AMD QVL (qualified vendor list), customers can rely on seamless compatibility without having to worry about POST or other conflict issues.

GeIL Launches its EVO-X Series DDR4 Memory with RGB LED Lighting

GeIL launched its flagship EVO-X line of high-performance DDR4 memory modules featuring RGB LED lighting, which it unveiled at the 2017 International CES, earlier this year. The modules feature a diffused RGB LED lighting element that takes input from most RGB LED standards over 4-pin headers, such as ASUS Aura Sync, ASRock Aura RGB, MSI Mystic Light Sync, and GIGABYTE RGB Fusion. The modules feature two inputs, one on either side. One plugs into a 4-pin RGB LED header, and the other draws additional power from a 9V/12V power source, such as a fan header.

Internally, the LED lighting element is placed on a separate PCB from the actual DRAM module, so there's no scope for electrical interference that can destabilize the memory. The modules come in 4 GB, 8 GB, and 16 GB densities, and in a wide range of speeds and timing combinations, including DDR4-2133, DDR4-2400, DDR4-3000, DDR4-3466, DDR4-4000, and DDR4-4133. The modules further come in single-module and dual-channel kits; and with two heatspreader color options - glossy white and matte black. The company didn't reveal pricing.

TrendForce Reports Global DRAM Revenue Jumped 18.2% Sequentially in Q4 2016

Peak season demand and surging prices for DRAM products across different applications resulted in an 18.2% sequential growth in the global DRAM revenue for the final quarter of 2016, reports DRAMeXchange, a division of TrendForce.

Smartphone shipments peaked in the fourth quarter on account of the traditional busy season. Chinese smartphone brands continued to post strong sales while Apple benefitted from the release of iPhone 7. "Rising demand for mobile DRAM kept squeezing the industry's production capacity for PC DRAM," said Avril Wu, research director of DRAMeXchange. "Contract prices of PC DRAM modules increased by more than 30% sequentially on average in the fourth quarter due to insufficient market supply. Server DRAM lagged behind PC and mobile DRAM in terms of price hike during the same period, but it is expected to catch up in the first quarter of this year."

Micron's Outlook for the Future of Memory: GDDR6, QuantX in 2017

After finally reaching mature yields (comparable to those of planar NAND processes), Micron's 32-layer first generation 3D NAND has grown increasingly prominent in the company's NAND output. Now, the company is looking to ramp-up production of their (currently sampling) 64-layer 3D NAND, promising "meaningful output" by the end of December 2017, looking for an 80% increase in total GB per wafer and a 30% decrease in production costs.

When it comes to the graphics subsystem memory, Micron is looking to transition their 20nm production to a "1x nm" (most likely 16nm) node, in a bid to improve cost per GB by around $20, with introduction of 16nm GDDR5 memory to be introduced later this year. However, GDDR5X volume is expected to grow significantly, in a bid to satisfy bandwidth-hungry uses through GPUs (like NVIDIA's GTX 1080 and potentially the upcoming 1080 Ti) and networking, with GDDR6 memory being introduced by the end of 2017 or early 2018. The company is still mum on actual consumer products based on their interpretation of the 3D XPoint products through their QuantX brand, though work is already under way on the second and third generation specifications of this memory, with Micron planning an hitherto unknown (in significance and product type) presence in the consumer market by the end of this year.

DRAM Prices to Continue to Rise Over 2017

There will be no respite from the rising prices of DRAM chips over 2017, according to a report by Taiwan-based industry observer DigiTimes. Prices of DRAM chips directly affect DDR4 memory modules. Pei-Ing Lee, president of Nanya Technology, a DRAM maker, said that DRAM prices will continue to rally (rise) over the second quarter of 2017, but could stabilize (not necessarily fall) over the second half of the year.

The stability of DRAM prices could still depend on the capex plans of major DRAM manufacturers. The rise in DRAM prices is being attributed to tight supply. Nanya is upgrading its production lines to the new 20 nm node, with early production by the end of Q1-2017. Prices of consumer DDR4 memory modules have nearly doubled over the past six months. A typical 32 GB dual-channel DDR4 memory kit, which could be had for a little over USD $90 in Summer 2016, is now priced around $170.

Source: DigiTimes

Plextor Details Release Availability of their M8Se NVMe TLC SSDs

At CES 2017, Plextor announced their next SSD product line. Dubbed the M8Se, these will be restricted to NVMe SSDs with 15nm 3-bit-per-cell TLC of Toshiba manufacture, ranging from 128 GB, 256 GB, 512 GB and 1TB capacities leveraged by Marvell's Eldora controller.

The new mid-range NVMe SSD uses a new heatsink design (slight cost-reduction when compared with the one the M8Pe carries), that Plextor says will improve cooling by up to 20% - convenient, since throttling does happen with NVMe based SSDs - and particularly with Marvell's Eldora controller - as it did with Plextor's M8Pe line of SSDs. The card also features blue accent lighting. Plextor will also sell a heatsink-less M8PeGN model in the M.2 form factor.

CORSAIR Readies Up for New 7th Generation Intel Core Processors

CORSAIR, a world leader in enthusiast memory, high-performance gaming hardware and PC components today announced its readiness for the new 7th Generation Intel Core processors and Intel 200 series motherboards, paving the way for a new generation of performance PCs. With full compatibility on CORSAIR Performance DDR4 and the award-winning range Hydro Series liquid CPU coolers and wide-reaching compatibility on quiet, efficient CORSAIR PSUs, CORSAIR is ready to help enthusiasts squeeze every ounce of performance from their next PC build.

With DDR4 performance frequencies skyrocketing beyond 4,000MHz and kit densities of up to 64GB, CORSAIR has the memory your PC needs to not just run fast, but look great. CORSAIR Dominator Platinum, Vengeance LED or Vengeance LPX DDR4 make system builds look one of a kind and are built for overclocking to push DRAM frequencies even higher. CORSAIR is the industry leader in high-speed Extreme Memory Profile (XMP) memory, and with more Intel XMP certified DDR4 kits than any other manufacturer, CORSAIR is committed to compatibility and ensuring memory runs at the speed it claims. What's more, all CORSAIR current dual-channel DDR4 kits are fully compatible with both the new 7th Generation Intel Core Processors and new Intel 200 Series Chipsets, so you can easily choose the memory that's right for your build.

SK Hynix to Construct a Cutting Edge NAND Flash FAB in Cheongju

SK Hynix Inc. announced it will construct a new memory semiconductor FAB in Cheongju, Chungcheongbuk-do to meet increasing NAND Flash demand. This is a part of a mid/long-term investment plan that SK Hynix declared at M14 completion ceremony in August 2015. At that time, the Company said it could spend 46 trillion won to set up 3 new FABs in Icheon and Cheongju including the M14.

The new FAB will be located in a Cheongju Technopolis site. SK Hynix starts a design within next month then begins construction of the shell and the cleanroom in August 2017 to be completed in June 2019 with total investment of 2.2 trillion won. Equipment installation into the FAB shall be decided considering market conditions as well as the Company's migration plans.

G.SKILL Announces Revolutionary RGB Lighting DDR4 with Trident Z RGB Series

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the Trident Z RGB Series - the world's most revolutionary RGB lighting DDR4 memory kit. Requiring no additional power connections, this incredible feat of engineering bares pure RGB lighting across an uncovered full-length light bar on the award-winning Trident Z series heatspreader design.

By default, the Trident Z RGB will display a rainbow of colors in a wave-style lighting effect, illuminating any system with a myriad of hues. Further lighting effects and color customizations can be controlled and chosen through software, scheduled for a February 2017 release.

Samsung Announces World's First 8GB LPDDR4 Memory Package

Samsung Electronics, announced today that it is introducing the industry's first 8-gigabyte (GB) LPDDR4 (low power, double data rate 4) mobile DRAM package, which is expected to greatly improve mobile user experiences, especially for those using Ultra HD, large-screen devices. The 8GB mobile DRAM package utilizes four of the newest 16 gigabit (Gb) LPDDR4 memory chips and advanced 10-nanometer (nm)-class process technology.

"The advent of our powerful 8GB mobile DRAM solution will enable more capable next-generation, flagship mobile devices around the world," said Joo Sun Choi, executive vice president of Memory Sales and Marketing at Samsung Electronics. "We will continue to provide advanced memory solutions offering the highest values and leading-edge benefits to meet the escalating needs of devices having dual camera, 4K UHD and VR features."

AMD's ZEN to Implement Advanced Security Features not found in Intel's solutions

Thanks to AMD's incorporation of an ARM-based "AMD Secure Processor" in their upcoming ZEN micro-architecture, the company is poised to offer something competitor Intel's microprocessors yet don't: memory encryption. This processor, and its underlying technologies, could prove to be a stepping-stone for AMD towards regaining lost server market share. Essentially, because in a market ever more steered by cloud computing considerations, it allows for the client's data to be encrypted at every moment of the work chain. Assuming all works as intended, for the first time not even cloud providers, with either hypervisor-level privileges or even physical access to the servers, will be able to carry out any malicious actions against their clients.

One only has to consider the writing on the wall: Morgan Stanley predicts that by 2018, 30% of Microsoft's revenue will stem from its cloud services; Amazon Web Services (AWS) generated $7.88B in revenue on Q4 2015, up 69% over 2014; and worldwide spending on public cloud services by itself will grow from $70B in 2015 to an estimated $141B in 2019. Cloud computing is here to stay, and with security being as important as it is for some businesses, this is an important area of investment for AMD. This "AMD Secure Processor" will work on essentially two fronts: SME (Secure Memory Encryption) and SEV (Secure Encrypted Virtualization), backed by an hardware-based SHA (Secure Hash Algorithm).
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