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ADATA and XPG Feature Total Mobile Gaming Solution at MWC 2018

ADATA Technology Co., Ltd., a leading manufacturer of high performance DRAM modules and NAND Flash products, is excited to announce the first participation at Mobile World Congress (MWC) 2018,the world's largest gathering for the mobile industry. ADATA and XPG are together presenting a total mobile gaming solution that provides mobility, functionality, and convenience in order to fulfill of growing number of mobile users' needs. ADATA brings the latest three high density battery cellpower bank models that provide a lightweight and versatile choice of colors and capacities. For XPG, EMIX I30 features patented design driven by 5.2 channel surround sound with a rich and detailed sound quality. By bringing these two devices together into a small, tidy package offers an immediate convenience for mobile gamers.

Nowadays, end users have continued to be fascinated and amazed by rapidly evolving mobile technology. Mobile gaming is one of the few segments that have swiftly grown at an immense pace and with a rise in demand. XPG places an emphasis on delivering rich and detailed sound quality. The 5.2 channel EMIX I30 has established an inner vacuum tube technology that creates true 3D surround sound. It also employs oversized 13.5 mm units made of durable yet reactive monomer materials. EMIX I30 works instantly with a majority of electronic devices.

Samsung Begins Mass-production of 30.72-terabyte PM1643 SSD

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) - the PM1643 - for use in next-generation enterprise storage systems. Leveraging Samsung's latest V-NAND technology with 64-layer, 3-bit 512-gigabit (Gb) chips, the 30.72 terabyte (TB) drive delivers twice the capacity and performance of the previous 15.36 TB high-capacity lineup introduced in March 2016.

This breakthrough was made possible by combining 32 of the new 1TB NAND flash packages, each comprised of 16 stacked layers of 512 Gb V-NAND chips. These super-dense 1 TB packages allow for approximately 5,700 5-gigabyte (GB), full HD movie files to be stored within a mere 2.5-inch storage device.

NDRC, Samsung to Sign MOU That Could Moderate DRAM Prices, Increase Production

PC hardware enthusiasts all over (but particularly in our own forums) have been adamant in how this is one of the worst times to be building a new system. And it's true; the DIY market is a mess right now, as our own btarunr mentioned in his latest editorial; so much so, that in a full reversal of years and years of experience, users might now actually be better served in the $/performance department by buying their systems from boutique retailers, than by acquiring all of the parts separately. It's a mad, mad world out there, for a multitude of reasons; but one such reason is DRAM pricing. And fortunately, it seems that China's National Development and Reform Commission (NDRC) is on the verge of signing a Memorandum Of Understanding (MOU) with Samsung that might help the DRAM market as a whole.

SK Hynix Marks its 8Gb GDDR6 Memory Chips "Available" in Latest Catalog Update

SK Hynix, the other Korean DRAM and NAND flash giant than Samsung, updated its DRAM product catalog to reflect immediate availability of its 8-gigabit (1 GB) GDDR6 memory chips. The company is selling four SKUs, part "H56C8H24MJR-S2C" in 14 Gbps and 12 Gbps variants; and part "H56C8H24MJR-S0C" in 12 Gbps and 10 Gbps variants. The -S2C chips are more energy efficient, in achieving 14 Gbps at 1.35V and 12 Gbps at 1.25V; while the -S0C achieves 12 Gbps at 1.35V, and 10 Gbps at 1.25V. Unless NVIDIA decides that the GTX 1080-successor should feature 16 GB of memory, the company could be in the market for 8 Gb GDDR6 chips.

Meanwhile, rival Samsung announced that it began mass-production of 16 Gb (2 GB) GDDR6 memory chips, which should enable 16 GB of memory across a 256-bit memory interface, or 8 GB over a 128-bit interface. Samsung's latest chips not only have double the density as SK Hynix's, but also tick faster, at 18 Gbps, with a voltage of 1.35V. It is widely expected that GDDR6 will be the dominant memory standard for entry, mainstream, and even high-end graphics cards, which launch through 2018-19. NVIDIA is expected this year to launch its new "Volta" graphics architecture across various consumer-graphics market-segments.

Samsung Starts Producing Industry's First 16-Gigabit GDDR6 Memory

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass production of the industry's first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced graphics processing for gaming devices and graphics cards as well as automotive, network and artificial intelligence systems.

"Beginning with this early production of the industry's first 16 Gb GDDR6, we will offer a comprehensive graphics DRAM line-up, with the highest performance and densities, in a very timely manner," said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. "By introducing next-generation GDDR6 products, we will strengthen our presence in the gaming and graphics card markets and accommodate the growing need for advanced graphics memory in automotive and network systems."

Samsung Starts Mass-producing 2.4 Gbps 8GB HBM2 Stacks

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass production of its 2nd-generation 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) with the fastest data transmission speed on the market today. The new solution, Aquabolt, which is the industry's first HBM2 to deliver a 2.4 gigabits-per-second (Gbps) data transfer speed per pin, should accelerate the expansion of supercomputing and the graphics card market.

"With our production of the first 2.4 Gbps 8 GB HBM2, we are further strengthening our technology leadership and market competitiveness," said Jaesoo Han, executive vice president, Memory Sales & Marketing team at Samsung Electronics. "We will continue to reinforce our command of the DRAM market by assuring a stable supply of HBM2 worldwide, in accordance with the timing of anticipated next-generation system launches by our customers."

China Regulator to Look Into Possible DRAM, NAND Price Fixing by Manufacturers

It's been a couple years now that we've seen continuously increasing pricing of DRAM and NAND semiconductors. The price increase, which has been hailed and documented over, over, and over again (and there are way more articles on this subject here on TPU), follows reported increased demand which has failed to be accompanied by its respective manufacturing and supply ability.

However, reports that companies were planning on increasing production of DRAM and NAND below the expected increases in supply demand may have turned at least some regulatory eyes towards the issue. China's National Development and Reform Commission's Pricing Supervision Department (NDRC) said they are aware of the situation, how it could point towards price-fixing from the four major NAND production players (Samsung, Hynix, Micron and Toshiba), and are looking into the matter. "We have noticed the price surge and will pay more attention to future problems that may be caused by 'price fixing' in the sector," the official Xu Xinyu was quoted as saying in an interview to Chinese newspaper Daily China.

ADATA Introduces XPG Z1 DDR4 4600MHz Overclocking Memory Modules

ADATA Technology Co., Ltd., a leading manufacturer of high-performance DRAM computer memory modules and NAND Flash products is excited to declare that the 2015 Taiwan Excellence Gold Award winner, XPG Z1 DDR4 overclocking memory, is designed to be the ultimate upgrade for overclockers, enthusiasts, and gamers.

At CES 2018, ADATA will unleash the new XPGZ1 DDR4 16GB 4600MHz CL 19-26-26-46 1.5V (AX4U460038G19-DRZ), a new force designed for Intel Z370/X299 chipset motherboards. The XPGZ1 DDR4 4600MHz Kits features timings of CL 19-26-26-46 16GB at 1.5V and is built to achieve both stability and high performance. XPG Z1 DDR4 4600MHz Kits are ready for action with the MSI Z370I GAMING PRO CARBON AC at CES 2018 and will be available in Q1, 2018. MSRP for dual pack (8GB x 2) will be $579.

Micron Analyses 2017, Looks at the Future of Memory Business

It was a banner year for graphics, both in terms of market strength and technology advancements. Gaming, virtual reality, crypto mining, and artificial intelligence fueled demand for GPUs in 2017. The market responded with a wide array of products: high-performance discrete PC graphics cards that let gamers run multiple 4K displays; game consoles and VR headsets; and workstation-class GPUs that can build the stunning effects we have all come to expect. And since these products are full of our GDDR5 or G5X memory, it was an exciting year for Micron's graphics team too. We had a record-breaking year in GDDR5 shipments and further solidified Micron's industry leadership in graphics memory with the launch of our 12 Gb/s G5X, the highest-performance mass production GDDR memory.

4Q DRAM Sales Put Exclamation Point On An Amazing Year of Growth

Throughout 2017, DRAM manufacturers faced pressure to boost output of their devices-particularly high-performance DRAM used in data center servers, and low-power high-density DRAM used in smartphones and other mobile products. Strong, ongoing demand put significant upward pressure on DRAM average selling prices. This trend continued into 4Q17 and is expected to drive quarterly DRAM sales to an all time high mark of $21.1 billion (Figure 1), capping an incredible year of growth in which DRAM sales set a new all time high sales mark each quarter. The forecast $21.1 billion sales level in 4Q17 would be an increase of 65% compared to the $12.8 billion DRAM market of 4Q16.

Samsung Now Mass Producing Industry's First 2nd-Generation 10nm Class DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8 Gb DDR4 features the highest performance and energy efficiency for an 8 Gb DRAM chip, as well as the smallest dimensions.

"By developing innovative technologies in DRAM circuit design and process, we have broken through what has been a major barrier for DRAM scalability," said Gyoyoung Jin, president of Memory Business at Samsung Electronics. "Through a rapid ramp-up of the 2nd-generation 10 nm-class DRAM, we will expand our overall 10 nm-class DRAM production more aggressively, in order to accommodate strong market demand and continue to strengthen our business competitiveness."

Intel Readies Optane DIMM Roll-out for 2018

Intel has reportedly slated launch of its Optane DIMM for the second half of 2018. The Optane DIMM marks the biggest change in computer memory in over two decades, and heralds the era of "persistent memory," which combines the best characteristics of DRAM and NAND flash, in that it has the speed and low-latency of DRAM, but the persistence (ability to store data in the absence of power) of NAND flash. Combining the two will be made possible with improvements to the speed and latency of 3D XPoint memory. Intel is currently selling consumer SSDs based on the technology, and has increased production of 3D XPoint chips.

Intel presented the Optane DIMM at the 2017 USB Global Technology Conference. It described Optane DIMM as a primary storage device that will function as a memory-mapped device, but with much higher storage densities than what's possible with current DDR4 DRAM. The enterprise segment, as usual, will have the first take of the technology, with Intel targeting the exascale computing (supercomputers nearing ExaFLOP/s compute throughput) industry, trickling down to other enterprise segments, before finally making its way to the client/consumer segments. This development is also a polite nudge to the DRAM industry to get its act together, and either bring down prices or scale up densities, or miss the bus of change.

Q4 2017 300 mm Silicon Wafer Pricing to Increase 20% YoY in DRAM-like Squeeze

Silicon wafers are definitely the best kind of wafers for us tech enthusiasts, but as we all know, required financial resources for the development and production of these is among the most intensive in development costs and R&D. It's not just about the cost of employing enough (and crucially, good enough) engineers that can employ the right tools and knowledge to design the processing miracles that are etched onto wafers; there's also the cost of good, old production as well. Extreme Ultraviolet Lithography Systems that are used for the production of silicon wafers are about the size of a city bus, and typically cost more than 100 million euros ($115.3 million) each. ASML, a Dutch company that specializes in this kind of equipment, announced this year it was expecting to see a 25% revenue growth for 2017. Increased demand for these systems - and added cost of development of ever increasingly small and complex etchings in wafers - means this sector is seeing strong growth. But where there is strong growth, there is usually high demand, and high demand means higher strain on supply, which may sometimes not be able to keep up with the market's needs.

This is seemingly the case for wafer pricing; as demand for wafer production has been increasing, so to are prices. Faced with increased demand, companies are usually faced with a tough question to answer in regards to the correct course of action. Usually, it goes like this: higher demand at the same supply level means higher pricing. However, if supply isn't enough to satisfy demand, manufacturers are losing out on potential increased sales. This leads most companies to increase supply relative to demand, but always with lower projected output than demand requires, so they can bask in both increased ASP (Average Sale Price) and higher number of sales. This has been the case with DRAM memory production for some time now: and is happening with 300 mm silicon wafers as well.

Samsung Electronics to Increase its DRAM Output

Samsung Electronics, one of the largest manufacturers of DRAM and NAND flash memory, is poised to increase its production of DRAM. The company is bolstered by expansion of two of its DRAM manufacturing plants, located in Hwasung and Pyeongtaek, South Korea. The company is re-purposing a portion of its 2D NAND flash line at its Hwasung plant to produce DRAM. The new production line will begin its output from Q1-2018. The Pyeongtaek plant has been seeing similar activity where DRAM manufacturing clean-rooms are being built on the plant's second floor.

It's only in the second half of 2018 when end-users could expect Samsung's increased DRAM output to have any effect on prices of PC memory. The PC industry is not the only consumer of DRAM, as a larger share of it is consumed by the mobile industry (smartphones, tablets). DRAM inventories have been under tremendous strain over the past three quarters, which have forced PC memory prices to surge by 80-100 percent and beyond.

DRAM Output in 2018 Planned for Continued High Pricing - TrendForce

DRAMeXchange, a division of TrendForce, has come forward with the expected announcement that DRAM output in 2018 likely won't be enough to fully satisfy supply. This has been the case for some time now. However, what started with simple insufficient output that could contain the explosion of DRAM capacity in smartphones seems to now be turning into a conscious decision by the three top memory manufacturers. Samsung, Micron, and SK Hynix are seemingly setting output at a lower than required level so as to artificially inflate pricing due to low supply. TrendForce themselves say so, in that these suppliers "(...) have opted to slow down their capacity expansions and technology migrations so that they can keep next year's prices at the same high level as during this year's second half. Doing so will also help them to sustain a strong profit margin."

DRAM production is expected to increase by 19,6% in 2018; however, this ratio is lower than the expected growth in demand, which is being pegged at 20,6%. This means 2018 is likely to see increased constraint in the supply channels (whereas 2018 was actually expected to see a slight relief in supply issues). This means that pricing will either stabilize or tend to increase from current levels. To be fair, semiconductor production isn't as simple as hitting a "increase production by 10x" button; reports say that all three players are contending with insufficient room to expand output on their production lines, and getting a new production facility online isn't a trivial effort - neither in funds, nor on time. However... All involved companies would much rather keep prices as they are than see them being brought down by oversupply.

Kingston Technology Celebrates 30 Years in the Industry

Kingston Technology Company, Inc., a world leader in memory storage products and technology solutions, announces tomorrow that it celebrates its 30th year in the business as an innovative technology hardware provider for computers and devices. Kingston was co-founded on October 17, 1987, by CEO John Tu and COO David Sun. The two co-founders continue to guide the company and remain very active in day-to-day operations.

The entrepreneurial spirit of both owners and the success of the company have been recognized globally through the years. Kingston's core tenets of respect, loyalty, flexibility and integrity have created an exemplary corporate culture - one that guides its relationships with customers, partners and vendors, and to which Kingston owes its success. The company continues to be the largest supplier of DRAM modules among non-semiconductor manufacturers and a leading maker of Flash memory products - especially SSDs - where it has become a dominant force among consumers and organizations alike looking to upgrade existing systems and data centers.

Kingston manufactured just one product when it started in 1987 and has steadily and strategically evolved as a company by controlling as much of the production cycle as possible - from initial wafer processing through finished product - for both DRAM and Flash. The company has done this through expansion, strategic investments, partnerships and adapting to industry needs as early as possible.

ADATA Launches ISDD336 and IUDD336 Industrial-Grade SD Cards

ADATA Technology, a leading manufacturer of highperformance DRAM modules and NAND Flash products,today launched industrial-grade ISDD336 SD cards and IUDD336 microSD cards. Diversifying ADATA offerings for industrial storage, all models feature wide temperature tolerance as well as shock, vibration, and humidity resistance well beyond consumer product ratings. ISDD336 and IUDD336 cards utilize durable and long-lasting 3D MLC NAND Flash, and are fully compliant with SD 3.0/SPI specifications, making them reliable choices for embedded systems. Performance across the board reaches 95MB/s read and 90MB/s write. Customers can choose ISDD336 SD cards in 16GB to 256GB capacities, and IUDD336 microSD cards in 16GB to 128GB capacities.

ADATA continues to increase its focus on industrial-grade products, with more offerings for users. As the SD standard has clear advantages for industrial customers thanks to its compact form factor, durability, and low power requirements, ADATA strives to provide more choice in the SD space. Thus, ISDD336 cards arrive in SD form factor while IUDD336 cards deliver the same quality and performance in microSD.

Corsair Announces Vengeance LPX DDR4-4600 16GB Memory

CORSAIR, a world leader in PC components high-performance gaming hardware and enthusiast memory, today announced its fastest ever kit of DDR4 memory, VENGEANCE LPX 16GB (2x8GB) 4,600MHz. Co-developed with leading motherboard manufacturer ASRock and its X299 OC Formula motherboard, this latest addition to the CORSAIR range of VENGEANCE LPX memory takes Intel XMP 2.0 performance on the Intel X299 platform and Intel Core X-Series Processors to new heights, able to achieve 4,600MHz with just a single setting.

Built using hand-sorted industry-leading Samsung B-die IC's and running performance timings of CL19-26-26-46 at 1.5V, VENGEANCE LPX 4,600MHz is ready for enthusiasts, overclockers or those who simply demand the very fastest components, to push their system's performance to the limit. High-speed memory doesn't stop at 16GB and CORSAIR also leads the way when it comes to high-speed DDR4 at a wide range of capacities. With more Intel XMP certified kits than every other DRAM manufacturer combined, you'll find record setting kits of VENGEANCE LPX at 32GB (4x8GB) 4,133MHz, 64GB (8x8GB) at 4,200MHz, 32GB (2x16GB) at 4,000MHz and for those who need the maximum in speed and capacity, 128GB (8x16GB) at 3,800MHz.

ADATA Releases the IMSS314 Industrial-Grade mSATA Solid State Drive

ADATA Technology, a leading manufacturer of highperformance DRAM modules and NAND Flash products,today launched the industrial-grade IMSS314 3D NAND SSD. Available in 3D MLC (32GB/64GB) and 3D TLC (128GB/256GB/512GB), the new model uses the compact mSATA form factor and SATA 6Gps connectivity. It has been purpose-designed for onsite deployment with industrial, enterprise, and organizational users. It offers speeds up to 500MB/s read and 400MB/s write, and can easily tolerate a wide temperature range, extreme shocks, vibration, and humidity. The IMSS314 delivers highly reliable and durable embedded storage for applications where speed and responsiveness are important. The availability of more affordable 3D TLC versions caters to users that prioritize large capacities, and stays true to the ADATA pledge of providing more options.

Intel Readies "Coffee Lake" Based Skull Canyon NUCs

Intel is preparing to expand its Skull Canyon line of high-performance NUC compact desktops, with new models based on its upcoming "Coffee Lake-U" silicon. The company is preparing variants based on 28W TDP Core i3, Core i5, and Core i7 ultra-low power processors, and 300-series chipset. The Core i3 based parts offer 4-core/4-thread CPU configuration, while the Core i5 and Core i7 ones offer 4-core/8-thread configurations. One of these could even feature a large onboard graphics core cushioned by on-package eDRAM L4 cache. The three "Coffee Lake-U" based NUCs could be released in Q2-2018, which is quite a wait.

ADATA Launches the ICFS314 Industrial-Grade CFast 2.0 Card

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products,today launched the industrial-grade ICFS314 CFast storage card. Designed for demanding applications and harsh or high traffic environments, the ICFS314 uses 3D MLC NAND to increase durability and longevity. As a CFast 2.0 product, it delivers data in the SATA III (6Gbps) protocol, capable of 550MB/s read and 520MB/s write (more than twice CFast 1.0 speeds). The ICFS314 consumes just over 2W, making it exceedingly power efficient, and is available in a wide range of capacities from 32GB to 512GB.

The shift to more efficient, higher density, and longer lasting 3D NAND is well under way in SSDs. Enterprise and industrial users now also have the option of benefitting from 3D NAND advantages on CompactFlash/CFast products, such as the ICFS314. Stacked or layered NAND improves on its planar predecessor in every way, from speed to lifespan. The ICFS314 arrives in up to 512GB of meticulously-sorted 3D MLC NAND.

Graphics Memory Prices Surge 30% in August, Could Affect Graphics Card Prices

The DRAM industry is experiencing an acute shortage of various classes of GDDR memory (graphics DDR), which could affect graphics card prices come Holiday. Supplier quotes for various graphics memory components have risen by as much as 30.8% in August, from an average of USD $6.50 in July, to $8.50. Top graphics memory suppliers Samsung and SK Hynix have committed a bulk of their inventories to manufacturers of servers and mobile handsets, which triggered the price rally. Samsung is the largest supplier of graphics memory, with a 55 percent market-share, followed by SK Hynix at 35 percent, and Micron Technology at 10 percent.

TrendForce Reports 4.6% Sequential Monthly Gain for ACP of PC DRAM Modules

DRAM prices began to rise in the second half of 2016 and have maintained a strong upward momentum through the first half of 2017, according to data from DRAMeXchange, a division of TrendForce. The average contract price of PC DRAM modules rose by nearly 40% sequentially in the first quarter to US$24 and then by more than 10% sequentially in the second quarter to US$27. Furthermore, the average contract price of PC DRAM modules increased by about 4.6% between this June and July. DRAMeXchange's price forecast for this year's second half indicates and steady and incremental gains as the general trend in the DRAM market.

GALAX to Launch Updated Gamer III DDR4 Memory With RGB LEDs

Around one year ago, GALAX introduced their Gamer DDR4 memory kits, which counted with LED illumination - these were not RGB parts, mind you, and instead, you had to choose between either Red, Green or Blue LEDs with matching color lid. But the times, they are a-changing, and nowadays, pure LED illumination isn't enough: gamers want permanent customization ability, so they can keep cycling kaleidoscopic colors around them at a whim.What the GALAX Gamer III line-up does well is that their RGB prowess comes absent of any unsightly extra cables for separate RGB power; like the G.Skill Trident Z, these make do without any extra wiring. However, where these fall short is on frequency and timings. It's almost as if the added LEDs reduce DRAM performance, since these kits will (at least for now) only be available in 2666 MHz frequency kits with CL 15... Which, for a company such as GALAX, with its over the top GPUs, seems slightly anemic. GALAX has yet to announce which motherboard manufacturers will support RGB controls, pricing, or actual availability dates (so, all the important bits.)

ADATA Launches ISSS314 Industrial-Grade SSDs in 3D MLC and 3D TLC NAND Versions

ADATA Technology, a leading manufacturer of highperformance DRAM modules and NAND Flash products,today launched industrial-grade ISSS314 solid state drives in 3D MLC and 3D TLC versions. All models can withstand a wide temperature range, extreme shocks and vibrations, as well as humidity to meet the needs of industrial users. Using hardened and carefully sorted components, ISSS314 SSDs consume just 2.5W to lower operating costs while providing speedy 560 MB/s read and 520 MB/s write. They are offered in 3D MLC and 3D TLC NAND plus capacities ranging from 32GB to 512 GB in order to better cover and serve as many budgets and needs as possible.

The increased durability and power efficiency of stacked NAND Flash compared to older planar NAND offers very appealing advantages in applications that require non-stop and long term use. The ISSS314 range has an MTBF of 2 million hours, which is 25% more than comparable 2D NAND drives. At the same time, they consume just 2.5W per drive while reaching 512 GB in capacity. Modest power draw translates into major electricity savings over the life of the drive, especially in large installations where many units are needed. Across the range, ISSS314 drives reach 560 MB/s read and 520 MB/s write.
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