MSI IPC is proud to unveil the MS-CF23, a high-performance Mini-ITX motherboard designed for mainstream embedded and industrial applications. Powered by the latest 15th Gen Intel Arrow Lake-S Core Ultra 9/7/5 Series processors and integrated with the Intel H810 chipset, the MS-CF23 delivers exceptional processing power, enhanced connectivity, and maximum flexibility in a compact size.

Notably, the Arrow Lake Core Ultra processors are Intel's first to include an integrated Neural Processing Unit (NPU), bringing dedicated AI acceleration directly on the chip for smarter and faster edge computing. Engineered to meet diverse application needs such as digital signage, automation, and edge computing, the MS-CF23 offers rich I/O, scalable memory support, and advanced display capabilities, all with robust reliability and simple integration. Ideal for applications such as automation, digital signage, and edge computing, the MS-CF23 is packed with features to support robust computing and connectivity.

ASRock Industrial proudly announces its next generation industrial motherboards powered by Intel Core 200S series processors (Bartlett Lake-S), supporting up to 24 cores and 32 threads. The new series delivers improved single-thread, multi-thread and AI-performance, along with DDR5 5600 MHz memory support up to 192 GB, advanced I/O capabilities, PCIe Gen 5/4 expandability, 4K quad-display powered by Intel UHD Graphics 770 with Xe architecture. With BIOS-level update support, the new series enables customers to seamlessly upgrade existing 14th, 13th, and 12th Gen Intel CPU-based motherboards to the latest generation. Available in Mini-ITX, microATX, and ATX form factors with longevity support, the motherboards are built for intelligent edge applications across smart manufacturing, autonomous robotics, machine vision, retail, kiosks, digital signage, gaming, and security environments.

Intel Core 200S Processor Motherboards with DDR5 Support
ASRock industrial's Intel Core 200S DDR5 supported motherboards are available in Mini-ITX, microATX, and ATX form factors, built on Intel W680, Q670, and H610 chipsets to meet a broad range of industrial computing demands.

Here in Jonsbo's booth at Computex 2025 we discovered two new Small Form Factor ITX NAS "style" cases, the NV10 and N10. These compact cases support ITX motherboards and Flex PSUs up to 150 mm. The NV10 is oriented more towards users who want to build a compact PC by offering support for a dual-slot graphics card. The N10, on the other hand is focusing on storage with support for four 2.5-inch drives and cooling fans for SSDs. Another SFF-oriented case is the V12, a microATX case with three-sided glass panels and wood accents.

From Jonsbo's T series they showcased the T9 that sports a modular design with removable metal and wood panels. Going further down the series there are also the T7 and T6, both following a similar design, with the T6 being a compact micro ATX model.

PNY has made its Computex 2025 shine with its new GPU SKUs that feature chrome-plated cooler shrouds. Now only carrying a unique aesthetic, these cards feature what appears to be a printed signature of none other than NVIDIA CEO Jensen H. Huang. Available in GeForce RTX 5090 and RTX 5080 editions, these chrome-polished SKUs feature ARGB lighting control to match any PC aesthetics. PNY has developed an equally interesting RTX PRO 6000 GPU alongside gamer-focused models, with a chrome-plated blower cooler. While this doesn't have any RGB lights, it is supposed to go into workstation builds, where aesthetics aren't exactly the most important factor.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

Over a month ago, TechPowerUp published a review of the Thermaltake TR100 compact dual-chamber ITX chassis. Darksaber was seriously impressed by his Hydrangea Blue variant; thus the resultant "Editor's Choice" and "Great Value" badges of honor. Prior to the receiving of a lone sample evaluation sample, TPU staff members inspected demonstration units on two separate occasions. At last year's Computex trade event, and then at CES 2025. At launch, four colors were made available: Black, Snow (aka white), Matcha Green, and Hydrangea Blue. During the setup of this year's booth, the Thermaltake crew granted early access to members of the press. Upon arrival, TechPowerUp's photographer spotted an intriguing "Gravel Sand" TR100 model. This colorway/finish is a familiar sight, as sported by various readily available "The Tower" and "View" models.

The company's TR100 product page mentions two other color options: Bubble Pink and Mint Strawberry. At the time of writing, their Gravel Sand sibling is not listed. Brand-new taller TR300 and TR200 cases were sat to the left of the original 18.4-liter small form factor (SFF) design. The former seems to be approaching mid-tower elevation; likely voluminous enough to accommodate larger components. An optional front panel piece—sporting Scandi-esque wooden slats—was placed nearby; implying a swappable configuration. Thermaltake's "in-the-middle" TR200 SKUs could be tall enough to accept microATX format motherboards. A snow-white demonstration unit was prepped and running an installed 3.9-inch LCD Screen Kit (also present on the TR300 demo unit)—currently available as an extra attachment for the TR100 series.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

GEEEK, a Taiwanese SFF chassis brand, announced the Rhino open-air frame cases series designed for compact PC builds, featuring a tilted design with acrylic panels and aluminium block construction. The GEEEK Rhino M microATX measures 305 × 250 × 275 mm (excluding protrusions) and supports microATX and Mini-ITX motherboards. This model offers unrestricted compatibility with all standard air and liquid CPU coolers and graphics cards of any length. The open design provides complete freedom for cooling solutions, supporting radiator sizes ranging from 120 mm to 360 mm. Power supply compatibility includes ATX, SFX, and SFX-L formats with no length limitations.

The smaller Rhino S case is designed exclusively for Mini-ITX motherboards, featuring a more compact footprint of 300 × 200 × 250 mm (excluding protrusions) and weighs 1.1 kg. Despite its smaller size, it maintains the same unrestricted compatibility for CPU coolers and graphics cards as Rhino M. The case supports radiators up to 360 mm and accommodates ATX, SFX, and SFX-L power supplies, however, with a maximum length of 140 mm (maximum 150 mm). The white version features slightly thicker acrylic panels, which may make it a bit more difficult to secure the graphics card, according to the product page.

MSI IPC, a leading provider of industrial computing solutions, is set to exhibit at Japan IT Week Spring 2025, held from April 23-25 at Tokyo Big Sight, Booth East Hall 3 #21-2. The company will showcase its latest innovations in AI computing, embedded systems, and edge intelligence, designed for smart manufacturing, medical, transportation, and industrial applications.

Explore the Future of Industrial Computing
MSI IPC will host a static demo featuring Intel Twin Lake, Raptor Lake, and Arrow Lake, allowing attendees to experience next-gen performance and AI acceleration. Key platforms include:

• MS-CF20 ATX (W880 chipset)- Built for high-performance workloads with expandability for industrial applications.
• MS-CF23 Mini-ITX (H810 chipset) - Compact yet powerful, ideal for space-sensitive deployments.
• MS-C927 Embedded Box PC (Arrow Lake-U & Meteor Lake-U) - Fanless, wide-temp system for industrial and embedded environments.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

Jonsbo rolls out two new Mini-ITX cases that squeeze a lot of features into just 4.54 liters. The N10 and NV10 models make the most of tight spaces, with each box measuring 205×205×108 mm. These small cases made of aluminium, take different paths to use space. The N10 caters to people who need lots of storage, with enough space for four 2.5-inch drives, kept cool by two 40x20 mm fans at the back running at 5000 RPM. Its counterpart, the NV10, swaps drive and back-fan room for graphics muscle fitting half-height dual-slot GPUs up to 190 mm long and offering PCIe 4.0 extension cable support.

The twins boast top-notch build quality combining 3.3 mm aluminium alloy with 1.0 mm steel plating. This results in a strong yet light frame, N10 weights 1.6 kg, while NV10 just 1.5 kg. Both cases can fit 1U Flex power supplies under 150 mm and CPU coolers up to 38 mm in height. Flexibility is a key selling point, as users can place both models upright or on their side to match different desk layouts. Even with their tiny sizes, these cases manage airflow well enough to handle their intended tasks, whether as small workstations or specialized setups.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, today announced its lineup of new NVIDIA GeForce RTX 50 Series graphics cards. The new iGame GeForce RTX 50 Series graphics cards feature the redesigned Vulcan, Neptune, Advanced, and Ultra W models - featuring improvements in aesthetics and cooling.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

ASRock Industrial proudly unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. The new range of motherboards support up to DDR5 6400 MHz memory, offering versatile I/O, expansion options, quad display capabilities. Featuring PCIe Gen 5, and USB4/ Thunderbolt 4 for ultra-fast connectivity, select models offer 10G LAN to meet the demands of high-speed networking. With flexible form factors including Mini-ITX, Micro-ATX, and ATX, these motherboards cater to versatile edge AI applications across industrial automation, robotics, AI agents, kiosks, retail, gaming and beyond.

Mini-ITX Models (High Rise I/O): IMB-1246 and IMB-1247
Leveraging Intel Core Ultra 200S Processors, the IMB-1246 utilizes the H810 Chipset, while the IMB-1247 features the Q870 Chipset, offering enhanced scalability. Both models support up to 96 GB DDR5 memory via two CSO-DIMM (DDR5 6400 MHz) or SO-DIMM (DDR5 5600 MHz) slots. Offering various expansion capabilities and I/O tailored for diverse applications, including one PCIe x16 (Gen 5) and one USB4/ Thunderbolt 4. The IMB-1246 provides two USB 3.2 Gen 2, one USB 3.2 Gen 1, four USB 2.0, one M.2 Key E, one M.2 Key M, four COM ports, and two SATA 3 ports, while the IMB-1247 enhances connectivity with five USB 3.2 Gen 2, two USB 3.2 Gen 1, two USB 2.0, one M.2 Key B, one M.2 Key E, two M.2 Key M, four COM ports, and three SATA 3 ports. Networking feature offers one 2.5G LAN and one 1G LAN. Display support includes triple display output on the IMB-1246 with two HDMI 2.1 TMDS, one DP 2.1 (via Type-C), and one LVDS/eDP while the IMB-1247 supports quad display output, adding one DP 1.4a for greater flexibility.

ASRock announces a full line-up of motherboards using the AMD B850 chipset. New products include high-end Phantom Gaming series line up covering Mini-ITX to ATX form factor, mainstream Steel Legend which features white PCB design and also Pro RS series for budget friendly users.

Ready to Power Everything!
The new ASRock B850 motherboards are designed with 14+2+1 power phase, 8-layer PCBs enabling excellent memory overclocking and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU. The boards also support the latest PCI-Express Gen-5 Graphics card and equipped with Blazing M.2 (Gen5x4) SSD ports.

Earlier today, ASUS uploaded a first sneak peek of several upcoming AMD AM5 motherboards—which we assume will feature the B850 and B840 chipsets—which according to the post on Facebook, will be launching within a couple of weeks. The boards will most likely be on display at CES, which kicks off on the 7th of January. The picture is obfuscated for obvious reasons, but what is clear is that there will be several different SKUs from all of ASUS' typical sub-brands such as TUF Gaming and ROG.

What we can also make out is that there will be at least one Mini-ITX board and one micro-ATX board, with the latter being the TUF Gaming branded board. We tried to clean up the picture a bit, but ASUS has managed to hide all details of possible models names and most of the text is kind of hard to make out. Nothing really sticks out in terms of features, although it's clear we'll end up seeing some higher-end B850 boards, judging by the fact that there are at least three ROG Strix SKUs coming. The question is if there's a market for these boards, considering the B850 chipset is pretty much the same as the B650E chipset, but with optional PCIe 5.0 support for the M.2 slots and no USB4, unlike its X870 counterpart.

Update Jan 1st: ASUS posted a picture of their upcoming mid-range Intel boards on Facebook as well, but as with the AMD boards, ASUS obfuscated the image, although not quite as badly this time around. For its Intel lineup, there's also a lower-end Prime board included, in addition to the TUF Gaming and ROG Strix boards. ASUS didn't reveal any launch window for the Intel boards.

Antec Inc., a global leader in high-performance computer components and accessories, is proud to announce the launch of the Antec Performance 1 M Aluminium ITX Gaming Case. This latest addition to Antec's chassis lineup combines compact design with cutting-edge modern style, delivering a jaw dropping ITX case that's perfect for modern, high-performance PCs.

Optimal airflow and aesthetics
Perforated panels keep your system cool with a refined modern touch. Engineered for quiet confidence and clean style.

Chinese OEM brand Erying presented its first AMD-based motherboard, the Alkiad B650 ITX D5. The overall design of the Erying Alkiad B650 ITX D5 sports a white PCB with black components and is equipped with an EPS 8-pin power connector alongside a 24-pin ATX connector. 5 V ARGB connectors are included for those who cannot live without a colorful build. The VRM is based on an 8+2+1 phase power delivery design and covered by a decent heatsink, more than enough for a budget AM5 65 W platform in a standard ITX 170 x 170 mm format.

The Alkiad B650 ITX D5 motherboard has 2 DDR5 DIMM memory slots, supports 6400+ (OC) MT/s, and Intel XMP 3.0 / AMD EXPO profiles. The Erying motherboard offers 1x PCIe 4.0 ×16 and 1x PCIe 4.0 ×4 M.2 slots, and 4x SATA III ports while the Realtek RTL8125BG provides 1x 2.5GbE RJ45 connectivity. The rear I/O panel offers 4x USB 2.0, 3x USB-A 5 Gbps and 1x USB-C 10 Gbps ports, 1x DP and 1x HDMI connectors and the usual audio combo (one S/PDIF and a pair of 3.5 mm). The motherboard comes before AMD's expected expansion of its Ryzen 9000 series "Granite Ridge" desktop processor family in Q1 2025 with new 65 W CPU models and the introduction of the AMD B850 chipset. There is no exact information yet regarding pricing and availability.

Jetway JPIC-ADN1 is a compact 2.5" Pico-ITX motherboard powered by the Intel Processor N97. It supports up to 32 GB of DDR5-4800 MHz memory, making it capable of handling demanding workloads. With its versatile I/O options, including 6x USB ports, 2x Serial ports, 1x B+M-Key M.2 slot, 1x E-Key M.2 slot, and 1x SATA3 port, the JPIC-ADN1 is ideal for a variety of applications, it's ready to handle even the most demanding tasks.

The JPIC-ADN1's compact design and efficient Alder Lake-N processor make it perfect for edge computing and IoT gateway applications. Its powerful processing and expansion capabilities enable seamless data processing, communication, and remote management in industrial IoT solutions.

ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new AmITX Mini-ITX motherboards, a range of compact form factor motherboards sporting the latest Intel technology for high-performance computing. The new AmITX series supports processor options ranging from low power consumption Intel N97 to high-performance 14/13/12th generation Intel Core i9/i7/i5/i3 and includes features such as PCIe 5.0 x16, 2.5 Gbe, DDR5, USB 3.2 Gen 2, and M.2 B/E/M Key to suit applications in smart city, smart manufacturing, and smart medicine.

The Mini-ITX motherboards in the AmITX series boast 2.5GbE LAN for ultra-fast data connectivity, USB 3.2 Gen 2 to connect with other devices, M.2 B/E/M Key slots for SSD, and wireless cards, and RS-232/422/485 to connect with machine components. The high-performance computing AmITX-RL-I supports 14/13/12th Gen Intel Core i9/i7/i5/i3 processors up to 65 W TDP, up to 64 GB of DDR5 4800 MHz memory, and has a PCIe 5.0 x16 slot for a GPU card. The low power consumption AmITX-ALN has an Intel N97 processor with 12 W ultra-low power, supports up to 32 GB of DDR4 3200 MHz memory, and has a PCIe 3.0 x1 slot.

In Win Development Inc. (InWin), a leading innovator in PC hardware has announced the F3 mini tower, which combines aesthetics and practicality for mini ITX and micro ATX builds. This compact enclosure supports the latest trend of motherboards featuring backside connections (ASUS BTF or MSI Project Zero), ensuring the cleanest-looking PC. The front panel consists of mesh windows to enhance cooling directly to the internal components. The F3 utilizes a minimalist approach with its stunning SECC steel and tempered glass materials but also simplifies assembly with a screw-free, unobtrusive design. Choose between black or white variants with wooden accents on the white edition.

Build Big. Stay Compact.
Motherboards with different backside connector placements will not be an issue within the InWin F3 since multi-orientation brackets are available on the motherboard tray. Four PCI-Express slots are available for graphics cards with extra-large heatsinks, supporting up to 340 mm long. The F3 is compatible with NVIDIA's new SFF-ready sizing guidelines to make component compatibility easier for DIY PC builders. The compact enclosure allows CPU heatsinks up to 160 mm tall or radiator support up to 240/280 mm on top for liquid cooling setups. ATX power supplies up to 160 mm long are installed behind the front panel as a space-saving design. The front I/O includes USB 3.2 Gen 2x2 Type-C, two additional USB 3.2 Gen 1 Type-A ports, and a 3.5 mm HD audio combo jack (CTIA).

Designed by Dan Hansen and engineered by Lian Li, the new DAN Case Wooden Edition takes everything great about the DAN Case A3 series, including the minimalist design and small form factor, and adds elegant wooden features to elevate any gaming set up.

Minimalist Exterior
The standout feature for the Lian Li DAN Case A3 is the front panel. While the current range hosts a solid plastic panel with a sleek geometric design, the new Wooden Edition swaps out the plastic for wooden slats over the fine mesh. This creates a touch of warmth to the minimalist case whilst keeping an optimized design for cooling.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the Shark X, a groundbreaking pre-built PC that redefines the boundaries between performance, design, and art. The Shark X delivers an exceptional computing experience while standing as a bold statement piece inspired by the ocean's mightiest and most efficient predator.

"The Shark X is not just a high-performance PC—it's a masterpiece that brings art and technology together, reflecting Cooler Master's commitment to innovative design and engineering," said Jimmy Sha, CEO of Cooler Master.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.

Industry leader AAEON has expanded its RISC computing product portfolio with the release of the SRG-IMX8PL and PICO-IMX8PL, a Mini PC and 2.5" PICO-ITX board, respectively. Both products are powered by the NXP i.MX 8M Plus platform, featuring a quad-core Arm Cortex -A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.

Built to provide cost-efficient IoT Gateway solutions in rugged environments, the SRG-IMX8PL and PICO-IMX8PL both offer wide temperature ranges of -40°C to 80°C with the use of a fanless heatsink, a 9 V to 36 V power input range. The SRG-IMX8PL Mini PC also features enhanced shock, drop, and vibration resistance. Dual LAN ports with IEEE 1588 and TSN capabilities, alongside Wi-Fi and 4G module support via M.2 2230 E-Key and full-size mini card, provide each device with broad connectivity options for industrial IoT use. Additionally, both the PICO-IMX8PL and SRG-IMX8PL support a wide range of operating systems, including Debian 11, Android 13, Windows 10 IoT, and Yocto, as well as data communication protocols such as Modbus, MQTT, and OPC Unified Architecture (OPC UA).