Synaptics Incorporated (Nasdaq: SYNA) today introduced the xMCU, a new class of microcontrollers that runs multimodal Edge AI, with the launch of the Synaptics Astra SR200 Series. Unlike conventional MCUs constrained by limited on-chip memory and compute, the xMCU combines heterogeneous, AI-native compute and acceleration with integrated high-bandwidth custom DRAM scalable to hundreds of megabytes, enabling larger AI models and richer multimodal workloads to run entirely on-device. The Astra SR200 Series of xMCUs is designed for the next generation of AI wearables, battery-powered sensing devices, connected cameras, streamers, and industrial vision and voice systems.

The SR200 Series is powered by the Synaptics Torq AI engine, which brings a standards-based hardware architecture and unified developer experience featuring the Coral NPU from Google Research. It also comes with the industry's first pairing of the Arm Cortex -M85 and Cortex -M52. Together with integrated vision and audio capabilities and hardware-rooted security, the SR200 Series brings unmatched system design efficiency and cost benefits to Edge and Physical AI designs.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces the MANO330, a compact Thin Mini-ITX motherboard powered by the Intel Processor N97 or N150 and DDR5 memory. Designed for space-constrained systems that require flexible connectivity and expansion, the MANO330 combines multi-display capability, dual LAN connectivity, versatile M.2 expansion, and industrial I/O in a compact platform. With a wide 12-24 VDC power input, the MANO330 provides system developers with a flexible foundation for smart manufacturing and industrial automation, digital signage, smart retail, and POS applications.

Compact Performance for Space-Constrained Systems
The MANO330 combines a compact Thin Mini-ITX design with Intel Processor N97 or N150 and DDR5-4800 memory support. The N97 supports up to 32 GB of memory, while the N150 supports up to 16 GB. Measuring just 170 x 170 mm, the MANO330 provides the essential computing performance and I/O capabilities needed for embedded systems, helping developers build space-efficient solutions for a wide range of industrial and commercial applications.

Akasa, a leading provider of thermal solutions, announced the Fermi CM5, a slim 1U fanless aluminium case designed for the Raspberry Pi Compute Module 5 (CM5) with the CM5 IO Board. At 43.6 mm high, it fits within 1U of rack height, measuring 185 x 93 x 43.6 mm (W x D x H) with a compact volume of 0.8L. The case is designed to support up to 10 W TDP, with openings for the main CM5 IO Board interfaces. With its compact form factor and silent operation, the Fermi CM5 is ideal for digital signage, kiosks, edge AI gateways and industrial automation, as well as vision and sensor deployments.

Heat from the CM5 SoC and M.2 NVMe SSD is conducted into the all-aluminium chassis through dedicated custom aluminium thermal modules and high-performance thermal pads. The chassis acts as a heatsink and dissipates heat passively through its external fins. With no fans and no moving parts, the Fermi CM5 removes fan noise, fan wear and fan-driven dust intake, making it suited for applications requiring stable operation under 24/7 continuous use.

SP Industrial introduces six new Enterprise SSD solutions designed for AI, data center storage, and boot drive applications. Built with 3D eTLC Flash, advanced controllers, DRAM, and Power Failure Protection (PFP), and spanning E1.S, U.2, M.2 2280, and 2.5" SATA form factors, the new lineup delivers high performance, data protection, and reliable operation for demanding workloads.

E1.S: Optimized for High-Density Data Center Storage
The EE1S3F0 E1.S SSD is designed for AI and data center storage environments where performance, density, and thermal deployment are important considerations. Featuring a PCIe Gen 5 interface, 3D eTLC Flash, DRAM, PFP, and namespace support, the drive offers capacities of up to 7.6 TB, with both 1 DWPD and 3 DWPD endurance options available. The E1.S form factor is well suited to 1U data center architectures, supporting efficient airflow and flexible thermal deployment.

CHERRY is expanding its range of industrial solutions with the launch of the CHERRY K37ID, a compact keyboard designed for businesses operating in demanding workplace environments. Combining a space-saving design with IP54-rated protection against dust and water splashes, the K37ID delivers a practical and cost-effective solution for organizations looking to equip individual or multiple workstations.

"The K37ID combines the features businesses need most: full-size functionality in a compact design, IP54 protection against dust and splashes and great value for money", says Gunnar Schreck, Head of Product Management at CHERRY. "It's a smart investment for businesses, with benefits at every workstation and even greater value when equipping multiple workstations."

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, today introduced the BIWCL-PAT industrial motherboard. Powered by Intel Core Series 3 (Wildcat Lake) processors, the BIWCL-PAT brings triple independent displays, high-speed NVMe storage expansion, and versatile wired and wireless connectivity into a small-form-factor platform. Designed for system integrators, it supports applications across industrial automation, AIoT, and edge computing, as well as human-machine interfaces (HMI), POS systems, and self-service kiosks.

With a 148 × 102 mm footprint, the BIWCL-PAT is built for integration into space-constrained equipment. It supports processor options from Intel Core 3 to Intel Core 7, and its single DDR5-6400 SO-DIMM slot supports up to 64 GB of memory, providing capacity for multitasking and local data processing. This combination gives developers a solid foundation for systems that bring computing closer to factory equipment, retail terminals, and networked devices.

Akasa, a leading provider of thermal solutions, introduced the Euler MX2, a premium aluminium fanless case for Mini-ITX motherboards. It supports Intel LGA1851, LGA1700, LGA1200 and LGA115X socket-based processors up to 35 W TDP and pairs an integrated 220 W DC-to-DC power converter with two internal 2.5" SATA drive bays. The Euler MX2 suits commercial systems that run unattended, such as industrial automation, point-of-sale (POS) and kiosks, surveillance, digital signage, and long-life edge computing.

Akasa's patented spring-loaded mounting system gives the Euler MX2 wide compatibility with Mini-ITX form factor motherboards and consistent, stable thermal contact across the supported socket range. The case supports Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP. Its fully passive aluminium chassis dissipates heat from the CPU through the external fins. With no fans, the system minimizes noise and mechanical points of failure.

Cervoz Technology, a leading provider of industrial storage, memory, and expansion module solutions, announced the launch of its T449 and T459 Series, a new line of MIL-STD-810H compliant M.2 2280 NVMe SSDs engineered for embedded systems deployed in defense, aerospace, transportation, and industrial automation.

Environmental Reliability
Harsh environments place continuous mechanical and environmental stress on embedded storage. The T449 and T459 Series comply with MIL-STD-810H requirements for vibration, shock, and combined temperature-altitude testing to support reliable operation in demanding deployments.

ASRock Industrial proudly presents its latest lineup of industrial edge computing platform powered by Intel Core Series 3 processors (Wildcat Lake-U), designed to bring power-efficient computing and integrated AI acceleration to mainstream industrial and embedded edge applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 40 platform TOPS, the new platforms support up to 64 GB DDR5 6400 MHz memory, high-speed expansion and storage, rich I/O connectivity, and multi-display capabilities. Spanning industrial motherboards, NUC motherboards, and compact NUC BOX systems, ASRock Industrial's Intel Core Series 3 portfolio provides right-sized computing options for industrial control, HMI, intelligent gateways, smart retail, digital signage, and other mainstream edge applications.

NUC Core 300 BOX Series: Compact, Power-Efficient Edge Computing
The NUC BOX-320 and NUC BOX-304 integrate Intel Core Series 3 processors into compact fanned embedded BOX PCs, powered by the Intel Core 5 processor 320 and Intel Core 3 processor 304, respectively. The systems support up to 64 GB of single-channel DDR5 6400 MHz memory with In-Band ECC. For expansion, the systems provide one M.2 Key E (2230) slot with Wi-Fi 6E and Bluetooth 5.3 for wireless connectivity. Networking includes one Intel 2.5 Gigabit LAN and one Realtek 2.5 Gigabit LAN. Storage configuration includes one M.2 Key M (2242) slot with PCIe Gen 4 x1 and one M.2 Key M (2242/2280) slot with PCIe Gen 4 x2 for SSDs. I/O connectivity includes two USB 3.2 Gen2x2 Type-C and three USB 3.2 Gen 1 Type-A ports. The series supports triple-display output up to 4K through two HDMI 2.1 and DisplayPort 1.4a outputs from Type-C. Intel PTT and a 19 V/90 W power adapter further support secure, ready-to-deploy system integration. Built in a compact 117.5 x 110 x 49 mm fanned chassis with VESA mounting support, the NUC Core 300 BOX Series provides a space-efficient computing platform for smart retail, digital signage, kiosks, HMI, and other mainstream edge applications.

MSI IPC introduces the MS-C9ZA, a compact fanless Edge AI Box PC powered by NVIDIA Jetson Orin Nano 8 GB for machine vision, robotics, and embedded edge AI applications. It integrates local AI inference, industrial I/O, dual Gigabit Ethernet, M.2 expansion, and 12-24 V DC input.

Powered by a 6-core Arm Cortex -A78AE CPU, NVIDIA Ampere GPU, and 8 GB LPDDR5 memory, the MS-C9ZA enables AI inference and computer vision processing at the edge, helping reduce cloud dependency, bandwidth usage, and network latency.

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, is currently presenting its latest innovations at Embedded World North America 2026, running from September 22 to 24 at the Anaheim Convention Center in California, USA. At Hall B, Booth 6512, BIOSTAR is spotlighting its comprehensive industrial motherboards, advanced EdgeComp systems, and a cutting-edge EdgeComp MT-N150 DX-M1 edge AI demonstration, delivering high-performance computing solutions tailored for smart manufacturing, smart cities, and smart retail applications.

BIOSTAR's industrial motherboard lineup features the BIW88-AHS, BIH61-AHA, BIPTL-IHT, BITWL-IHT, BIWCL-IHT, BIWCL-PAT, BIRPL-PAT, and BIAST-PAT, offering a versatile range of computing platforms, form factors, and connectivity options for embedded system development. Highlights include the BIW88-AHS, which combines the Intel W880 platform with support for Intel Core Ultra 200 series processors, DDR5 ECC and non-ECC memory, and four 2.5GbE LAN ports. The BIPTL-IHT features the Intel Panther Lake-H platform, DDR5 memory, and quad-display support, while the Wildcat Lake-based BIWCL-IHT and BIWCL-PAT provide Mini-ITX and 3.5-inch single-board computer options, respectively.

ASRock Industrial proudly presents its latest lineup of industrial edge AI platforms powered by Intel Core Ultra Series 3 processors (Panther Lake-H), designed to accelerate next-generation edge AI, industrial automation, and intelligent computing applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 180 platform TOPS, the new platforms support up to 128 GB DDR5 memory at speeds up to 7200 MHz, high-speed expansion, rich I/O connectivity, and advanced display capabilities. ASRock Industrial's comprehensive lineup spans industrial motherboards, NUC(S) BOX, fanless iBOX systems, and iEP-7050E industrial IoT Controller, providing scalable computing options for demanding AI inference, machine vision, robotics, smart manufacturing, and industrial edge applications.

Flexible Industrial Motherboards for Intelligent Edge Applications
ASRock Industrial expands its industrial motherboard portfolio with the IMB-1251-WV Series, SBC-377 Series, and COMHA-300, delivering flexible, high-performance platforms powered by Intel Core Ultra Series 3 processors for next-generation edge AI and industrial applications. The IMB-1251-WV Series combines Mini-ITX flexibility with up to 128 GB DDR5 7200/6400 memory with In-Band ECC, extensive I/O, dual LAN, quad-display support, flexible storage, and optional out-of-band (OOB) functionality, making it ideal for machine vision, robotics, and industrial automation.

Transcend Information, Inc. (Transcend), a leading global manufacturer of memory and storage solutions, has introduced its DDR5-6400 CUDIMM and CSODIMM embedded DRAM modules, offering capacities of up to 64 GB per module to meet the computing demands of edge AI, smart manufacturing, industrial automation, and high-performance embedded systems. Featuring DDR5's dual-channel architecture and a low operating voltage of 1.1 V, the modules incorporate a Client Clock Driver (CKD) to minimize signal interference caused by noise and jitter during high-speed operation, thereby enhancing signal stability. An integrated power management IC (PMIC) further improves power efficiency and voltage regulation. The SPD chip features a built-in temperature sensor for real-time memory temperature monitoring, while a transient voltage suppressor (TVS) helps protect components from damage caused by voltage fluctuations. In addition, On-Die ECC built into the DDR5 DRAM chips enhances data integrity and long-term operational reliability. Together, these features provide next-generation industrial computing platforms with a high-capacity, high-performance, and dependable memory solution.

Up to 64 GB per Module for Demanding Industrial Applications
Transcend's DDR5-6400 CUDIMM and CSODIMM modules offer capacities of up to 64 GB per module, meeting the intensive computing requirements of industrial computers, edge computing devices, and embedded systems. DDR5's dual-channel architecture improves data access efficiency and overall transfer performance, while DDR5-6400 speeds accelerate large-scale data exchanges and real-time processing. The modules provide the capacity and bandwidth required for high-performance industrial applications.

As we enter the middle of September, we kick off the week with an open world creature collector that doesn't appear to borrow too heavily from the famous Nintendo franchise, but some parallels can obviously be drawn. As for the rest of this week's release, we start with a different take on an RPG, where you're the guild master instead of the adventurer and we follow this up with an action horror FPS with PvP battles. If you'd rather be a DVD salesman/assassin, we got you covered this week and if that's not your beat, how about part of a JRPG or maybe you prefer an evolutionary resource management automation builder? Don't forget to check out the other new releases this week as well, but be warned that they're all early access games.

Aniimo / This week's major release / Wednesday 16 September
Aniimo is a free-to-play, next-gen creature-catching open-world RPG. Explore the vast continent of Idyll, Twine with unique Aniimo, unlock new abilities. Travel to a sky-floating metropolis, meet other Pathfinders, and battle in exciting competitions. Choose your Aniimo and begin your epic journey. Steam link

D-Link Corporation (TWSE: 2332), a global leader in networking solutions, today announced the expansion of its industrial networking portfolio with the launch of the DIS-110G Series Industrial Unmanaged Gigabit Switches. Designed to deliver rugged, cost-optimized Ethernet connectivity, these four new models empower system integrators to extend reliable data and PoE power across city surveillance, building automation, and digital signage deployments.

Built for Harsh Environments
As demand for IP surveillance and smart city infrastructure continues to grow, operators need switches that withstand demanding conditions yet fit into space-limited cabinets. The DIS-110G Series combines a space-saving, fanless IP40-rated metal enclosure with 6 kV surge protection on every copper port and supports DIN-rail mounting for flexible installation.

DFI, a Qisda Group company and a global leader in embedded motherboards and industrial computers, introduces the ARH171/ARH173, expanding its AI-ready portfolio with a Mini-ITX platform built for space-constrained, mission-critical deployments. Powered by Intel technologies, the ARH171/ARH173 is purpose-built to handle demanding Physical AI workloads from perception to reasoning, enabling next-generation smart logistics and industrial automation.

As Physical AI transitions to operational deployment, intralogistics is driving rapid mobile automation adoption. Mordor Intelligence projects the autonomous mobile robot (AMR) market to expand at a CAGR of nearly 15% through 2029 to counter labor shortages, while advanced systems like 3D cube storage robots require on-device AI to navigate floors, climb racks, and process dense sensor streams in real time.

AAEON (Stock Code: 6579), today announced the release of two new microATX industrial motherboards featuring Intel Core Ultra 200S Series Processors (formerly Arrow Lake-S), the MAX-Q870A and MAX-H810A.

The two boards are compatible with a range of Arrow Lake-S CPUs, with the MAX-Q870A supporting up to 125W SKUs and the MAX-H810A supporting up to 65 W SKUs. This difference reflects the market positioning of the two boards, with the former marketed for advanced AI and machine vision use and the latter for more cost-efficient industrial automation and HMI applications.

At IFA 2026 in Berlin, we visited the ADATA booth to see what the company has in store. To many, the surprising factor is the introduction of the relatively new "TRUSTA" brand by ADATA, which focuses on enterprise and industrial product offerings, a departure from what traditional PC enthusiasts know about ADATA. First, we explored the TRUSTA brand to see what the company offers. This includes the T7P5 SSDs, which boast read speeds of 13.5 GB/s and write speeds of 10.3 GB/s, and come in capacities ranging from 1.6 TB to 7.68 TB. All of this is powered by 3D NAND Flash using eTLC architecture, with the SSD form factors including U.2, E1.S, and E3.S versions, all carrying the same PCIe Gen 5 x4 interface, just with different twists depending on server or workstation needs.

Ahead of IFA, Qualcomm Technologies, Inc. today announced the Qualcomm Dragonwing Q-2390 and IQ-2390 processors, expanding the Dragonwing portfolio with highly integrated platforms designed to make intelligent edge computing more accessible to consumer, commercial and industrial segments. As demand grows for devices that can perceive, analyze and act on data locally, the Dragonwing Q-2390 and IQ-2390 processors are designed to bring AI, vision, connectivity and security to a broader range of connected devices, helping power the next wave of intelligence across homes, businesses, cities and factories.

"AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration," said Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc. "With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before."

Arduino S.r.l., a subsidiary of Qualcomm Technologies, Inc., today opened pre-orders for Arduino VENTUNO Q, its most advanced edge AI platform to date, powered by the Qualcomm Dragonwing IQ8 Series. Now available worldwide, VENTUNO Q was built for developers, prioritizing familiarity and ease of use with the right software, accessories and extensions.

One Board to Sense, Decide, and Act
The VENTUNO Q has a dual-brain architecture, pairing a Dragonwing IQ-8275 processor, delivering up to 40 dense TOPS of AI performance, with 16 GB LPDDR5 memory, 64 GB eMMC and expandable M.2 NVMe storage, alongside a dedicated STM32H5 real-time microcontroller, enabling systems that don't just interpret sensor data but respond to it physically, immediately and offline.

Transcend Information, Inc. (Transcend), a global leader in memory and storage solutions, has introduced a comprehensive lineup of DDR5-7200 embedded DRAM modules designed to meet the growing performance and data-processing demands of next-generation computing platforms. The portfolio includes CUDIMM, CSODIMM, ECC CUDIMM, ECC CSODIMM, and RDIMM modules, supporting a wide range of applications—from AI PCs, desktop computers, and industrial embedded systems to workstations, servers, and data centers. With transfer speeds of up to 7200 MT/s, the modules significantly enhance memory bandwidth, data-processing efficiency, and multitasking performance while maintaining low power consumption, stable operation, and high system reliability. This enables customers to accelerate the deployment of AI computing, edge computing, and other data-intensive applications.

7200 MT/s High-Speed Data Transfer for Next-Generation Computing
Transcend's DDR5-7200 modules accelerate large-scale data access and multitasking, making them ideal for applications such as AI inference, industrial automation, smart healthcare, in-vehicle systems, and high-performance computing. Featuring a dual-channel architecture, an integrated power management IC (PMIC), a low operating voltage of 1.1 V, and on-die ECC, the DDR5 DIMM modules enhance data access efficiency while optimizing power management and ensuring stable data transmission.

ASRock Industrial today announced a strategic collaboration with Axelera AI to deliver high-performance, power-efficient, and cost-effective AI inference solutions for edge computing. The collaboration integrates Axelera Metis AIPU cards into ASRock Industrial's edge AI platforms, delivering a compact, scalable AI inference solution optimized for real-world edge environments. The solution enables parallel AI processing by extending the system's native AI computing capabilities with up to 214 TOPS of additional inference through the Metis M.2 or PCIe AI acceleration cards. Powered by Metis AIPU, it delivers superior performance while significantly lowering power consumption and total cost of ownership (TCO) compared with conventional GPU-based architectures. Designed for edge AI applications including LLM, machine vision inspection, robotics, smart retail and city environments, the solution enables organizations to deploy advanced AI workloads where data is generated while minimizing the system footprint, power requirements, and infrastructure costs.

Validated Edge AI Platforms Accelerate Deployment
These validated configurations provide customers with a scalable path to deploying advanced AI capabilities on compact edge systems. On ASRock Industrial's expandable Edge AIoT platforms, including the iEPF-11000S, iEPF-10000S, iEPF-9500S, iEPF-9040S, and iEPF-9040VS series, the Axelera Metis PCIe card enables scalable, industrial-grade AI processing for demanding edge applications. For compact edge systems such as the AI BOX-A395, NUC BOX-358H, NUC BOX-255H, and NUC BOX-155H, the Axelera Metis M.2 card delivers high-performance AI inference in a compact, power-efficient form factor. Supporting multiple AI workloads running in parallel, these solutions enable real-time analysis for machine vision, robotics, retail and hospitality, warehouse automation, smart surveillance, and intelligent transportation.

Compact embedded systems are becoming smaller, while storage requirements continue to grow. Applications such as embedded computing, medical computers, self-service kiosks, and service robots need reliable local storage for operating systems, data, logs, updates, and system files.

However, when system space is limited, adding storage is often not as simple as installing another SSD. Designers may face limited PCB space, low-profile enclosures, and a lack of available M-Key storage slots.

Taiwan Commate Computer Inc. (COMMELL), a global leader in industrial single board computers, proudly introduces the LV-6718, a Mini-ITX mobile motherboard powered by Intel Core Ultra Series 3 Processors (PTL-H / Panther Lake-H Platform). Designed for next-generation industrial, edge AI, automation, and smart embedded applications, the LV-6718 delivers powerful computing performance, high-speed memory, advanced AI acceleration, rich I/O connectivity, and flexible display support in a compact Mini-ITX form factor.

Next-Generation Performance with DDR5 and AI Acceleration
The LV-6718 supports Intel Core Ultra Series 3 Processors with advanced 3D performance hybrid architecture, providing excellent computing efficiency for modern embedded workloads. With 2x DDR5 SO-DIMM slots supporting up to 128 GB at 7200 MHz, the LV-6718 offers high memory bandwidth for multitasking, data processing, industrial control, and AI applications.

ARBOR Technology Corp., a global leader in industrial IoT and edge AI computing solutions, announces the FPC-9309W-G5, a rugged Edge AI platform powered by Intel Core Ultra Processors (Series 2) and supporting NVIDIA RTX 50 Series GPUs up to 575 W. Designed for AI vision, intelligent transportation, and smart manufacturing applications, it delivers exceptional AI computing performance at the edge.

Next-Generation Computing for Demanding AI Workloads
Powered by Intel Core Ultra processors and NVIDIA RTX 5090 GPU support, the FPC-9309W-G5 delivers real-time AI inference, machine vision processing, and high-performance analytics. Its optimized thermal and power design ensures reliable operation for intensive AI applications.