GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announces today that its AORUS Gen4 7000s SSD is fully compliant with PS5 M.2 storage expansion. With the read speed of 7000 MB/s and maximum storage capacity of 2 TB far beyond specification requirements, it allows users to enjoy the best gaming experience.

Enhanced by the latest generation PCIe 4.0 controller with advanced 3D-TLC NAND Flash, The AORUS Gen4 7000s SSD boosts more performance than previous generation PCIe 4.0 NVMe SSD. It equips big aluminium thermal interface in different sizes and double side thermal pad with Nanocarbon coating for improved heat dissipation. In response to the latest announcement from Sony for the compatibility of M.2 SSD storage extensions on PS5, GIGABYTE engineers has further verified the original structure and performance of AORUS Gen4 7000s SSD to be the perfect choice of M.2 storage expansion for PS5. In addition, the read speed of up to 7000 MB/s ensures users with optimized data accessing and smoother gaming experience.

At the end of July, Sony Interactive Entertainment (SIE) announced the specifications and guidelines for expanding the console's built-in internal storage and confirmed that the PlayStation 5 (PS5) will now support M.2 SSDs for users to expand storage for game files and applications on the PS5. Today, TEAMGROUP's gaming brand, T-FORCE, is unveiling the T-FORCE CARDEA A440 Pro Special Series M.2 PCIe SSD with the industry's first-ever white graphene heat sink. The latest M.2 SSD, made specifically for expanding storage and will be available for gamers around the world on major e-commerce platforms in October, 2021.

The T-FORCE CARDEA A440 Pro Special Series M.2 SSD is being announced today by TEAMGROUP and is equipped with the industry's first-ever white graphene heat sink. The M.2 PCIe 4.0 SSD, created specifically to expand PS5 storage, can reach read/write speeds of up to 7,400/7,000 MB/s and offers storage capacities of up to 8 TB. The T-FORCE CARDEA A440 Pro Special Series M.2 SSD meets the specifications for the PS5 in heat sink size, read/write speeds, and supported capacities, allowing PS5 gamers to install it easily and get the storage they need instantly.

Seagate has confirmed that it now has a PS5-compatible SSD that should be a worthwhile drop-in replacement for the PS5's user-replaceable storage. This isn't a new product, mind you: the company has announced the Firecuda 530 for some time now. However, the company did announce that this SSD can be used in the PS5 system - even if just barely. With space being so constrained in the PS5's NVMe SSD slot, not all SSDs can even physically fit the available space (110 x 25 x 11.25 mm) - and especially not all SSDs featuring a heatsink, even if PS5's compatibility requirements demand such an heatsink to be present so as to avoid thermal throttling.

The FIrecuda 530 1 TB can easily best Sony's 5500 MB/s sequential read requirements for SSD compatibility with the PS5 - the PCIe 4.0 Firecuda 530 offers 7,300 MB/s on that regard, so it more than fits the part. The user-replaceable SSD storage on the PS5 will only be available for Beta users at first, via an upcoming software update for the console, and there are some hoops to jump through in migrating data to it. Seagate is also releasing a 2 TB version ($569.99) and a 4 TB version ($1,049.99). Seagate's own user-replaceable SSD for the Xbox Series X|S, the Storage Expansion Card, is available in 1 TB capacity for $219.

Sony has recently enabled the M.2 slot found in the PlayStation 5 with a beta update which allows users to upgrade the storage of their device with a compatible PCIe 4.0 M.2 SSD. The PlayStation 5 can only install games to the internal storage as external storage is not fast enough so the introduction of this capability will help expand the 825 GB (667.2 GB usable) of internal storage. Sony recommends that users select a PCIe 4.0 M.2 SSD with sequential read speeds of 5500 Mbps or higher but have yet to certify any specific models as compatible. Seagate has confirmed that their FireCuda 530 SDD which is offered with capacities from 500 GB to 4 TB will be compatible while various models from Corsair, Sabrent, and Western Digital also appear to meet the speed requirements. Sony should release this feature to non-beta users in the near future and also notes that some games may have reduced performance when running with an M.2 SSD.

Chinese manufacturer Asgard has announced the company's (and the Chinese market's) first PCIe 4.0 SSD. The AN4 pairs 128 Layer 3D TLC NAND manufactured by YMTC (Yangtze Memory Technologies Co., Ltd) Xtacking 2.0 technology, which uses a two-step manufacturing process wherein both NAND cells and interconnects are manufactured in two separate wafers and then optically fused. The NAND memory is then paired with Innogrit's IG5236 Rainier controller. The AN4 is rated for 7,500 MB/s and 5,500 MB/s sequential read and write speeds and features a "high" TBW endurance rating, though Asgard didn't clarify the exact random performance figures, nor the TBW rating for the SSD. Pricing is similarly up in the air - Asgard has only announced market availability for the 1 TB SSD solution come August, with additional 2 TB and 512 GB capacities being readied to market for a later timeframe.

The manufacturing technology of YMTC results in NAND that's as fast as Micron's latest 192-layer NAND tech, and beats well-established Kioxia's 96-layer technology performance-wise. One Bilibili forum user put the drive through its paces, and discovered that to unlock its full potential, one has to have a system capable of 512 bit maximum payload size (MPS), which is currently only supported by AMD motherboards - maximum Intel MPS currently stands at 256 bit, which "only" enables sequential performance of up to 7,150 MB/s. The user put the AN4 through a variety of tests, including PCMark 10's Drive Performance Consistency Test - a 10 to 20 hours workload marathon that puts more than 23 TB of drives on the SSD. It seems that Chinese manufacturers have achieved parity with the top western manufacturers, meaning there is one more option in the global, high-performance NAND market.

Razer, the leading global lifestyle brand for gamers, today announced the next generation of Razer Blade 17 gaming laptops, built-on the latest 11th Gen Intel Core H-series Processors and featuring up to the NVIDIA GeForce RTX 3080 Laptop GPU. Making a first-time debut in the Blade 17 is the Intel Core i9-11900H, the most powerful Intel processor ever found in a Razer Blade. With its many improvements, the new ultra-thin Blade 17 continues to be a powerhouse desktop replacement for gamers and creators alike.

With the inclusion of the i9-11900H processor, packed with eight cores and 16 threads, the Blade 17 reaches new levels of performance that were previously unheard of in an Intel-based Razer Blade. The CPU clocks in with a max turbo frequency of up to 4.90 GHz, meaning users can expect drastically improved speeds both in-game and in multi-threaded workloads. By pairing it with the NVIDIA GeForce RTX 3080 Laptop GPU and display options up to a 4k Touchscreen, Razer has created one of the most powerful 17-inch gaming laptops on the market.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, showcases their flagship Z590 VALKYRIE motherboard paired with the P500 1 TB SSD. Based on the Intel Z590 chipset, the Z590 VALKYRIE is one of BIOSTAR's premium flagship motherboards and offers full support for the latest Intel 11th gen processors with PCIe 4.0 support. Incredible build quality and durability coupled with a feature-rich layout make the Z590 VALKYRIE motherboard the best choice in the market for tech enthusiasts and gamers alike. When paired with BIOSTAR's P500 high-speed premium SSDs, it makes a whole different beast when it comes to gaming and content creation.

The P500 SSD is built with a lightweight metal body with stylish gaming-theme RGB lighting effects allowing users to match it with any theme of their choosing. The faster read and write times of the P500 SSD helps to load large files quicker and cut down on the boot times into both the operating system and the programs and applications on a computer enabling better, faster gaming performance and content creation.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the AORUS XTREME Gen4 AIC SSD with 28 GB/s ultra-fast access speed. This high capacity and extreme performance SSD builds in eight 4 TB 2nd generation PCIe 4.0 NVMe M.2 SSDs with PHISON PS5018-E18 controller, AORUS XTREME Gen4 AIC SSD offers ultra-high transfer bandwidth and superior access performance through RAID configuration.

The AORUS Xtreme Gen4 AIC SSD features ultimate thermal design with large aluminium finned heatsink, M.2 baseplate for passive cooling, 10 temperature sensors and active dual-fan heat dissipation design, while the exclusive SSD Tool Box offers users real-time status and temperature monitoring of SSDs. GIGABYTE AORUS Storage Manager allows users to configure a RAID array with a single click and 3-phase fan speed adjustment, which enabling AORUS XTREME Gen4 AIC SSD to keep cool and performing at a high level. It promises a non-throttling experience for users who phase for high capacity and breakthrough performance.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is pleased to release new PCI-E Extender 4.0 series to the market - PCI-E 4.0 Extender 300 mm/600 mm and PCI-E 4.0 Extender 300 mm with 90 degree adapter. With an easy installation, These PIC-E 4.0 Extenders are the best assistants for weight-bearing graphics cards and avoiding damages on motherboards, with support for a wide range of GPU solutions and fits in any chassis. This series of extremely high-speed PCI-E extenders feature extremely fast graphic data transmission up to 16 Gbps, faster than 8 Gbps of PCI-E 3.0, offering users a wonderful experience for content creating, gaming, or watching videos. They also support PCI Express 2.0 and 3.0 applications.

The extenders utilize the latest materials for EMI shielding with five sole flat cable design, allowing each cable to be fully covered by electromagnetic interference shielding with conducting polymer to guard against incoming or outgoing emissions of electromagnetic frequencies, minimize disturbance and degradation on performance. Inevitably, there may be some folding or twisting when connecting to the motherboard; however, the exclusive cable protector is designed to prevent cable damage and enhance durability. This design aims to avoid signal loss and help achieve excellent signal integrity. The ribbonized format flat cable design is crafted for space-saving, permitting multiple folds and an ultra-tight bend radius to deliver an incredible performance. What's more, there is a version coming with a 90-degree adapter that gives users more selection on display.

At the beginning of June, MSI presented the brand-new X570S Series motherboards during MSI's online product launch event. The unique designs and remarkable features sparked widespread discussions. Here are more in-depth concrete details regarding the MSI MAG X570S Series. In 2019, AMD's X570 platform came out and became the first chipset that supports PCIe 4.0 solution. Even now, MSI X570 Series motherboards are undoubtedly a great lineup with high specifications and aggressive designs. However, MSI can't just stop there. Our mission is to deliver the best computing experience for every gamer and creator. The new X570S Series motherboards achieved exactly that.

MSI is dedicated to product optimization so the new motherboards are made with prominent features. The MAG X570S Series is at the forefront of this launch. Inspired by military design, the MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX share identical looks. More excitingly, the MAG X570S TORPEDO MAX now comes in the Pacific Blue colorway, which is all the rage for our fans. Apart from the attractive designs, the imperative modification is the fanless chipset heatsink. We removed the fan to reduce dust and noise, while the ranges of the heatsink are expanded. Also, both MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX have M.2 Shield Frozr. The former has an All aluminium Design while the latter has an Extended Heatsink Design.

TEAMGROUP unveils the T-FORCE CARDEA Z44Q PCIe 4.0 SSD with two patented cooling modules, QLC Flash, and PCIe Gen 4x4 interface that supports the latest NVMe 1.4 standard and provides a massive capacity of up to 4 TB. Consumers can opt for different specs based on their preference and needs, and gamers can have everything from cooling, performance, and capacity in one SSD, and explore the infinite possibilities with T-FORCE CARDEA Z44Q PCIe4.0 SSD.

Equipped with QLC Flash, the T-FORCE CARDEA Z44Q PCIe 4.0 SSD supports the latest PCIe Gen 4x4 interface and NVMe 1.4 standards, meaning that it is compatible with PCIe Gen3.0 interface while offering up to 4 TB in capacity. The read/write speeds reach up to 5,000/4,000 MB/s, which are 10 times faster than traditional SSDs, making it a pioneer for the new TB M.2 era and the best choice for players in terms of cooling, speed, and capacity.

Seagate has recently released a limited edition version of their FireCuda 520 PCIe 4.0 NVMe SSD inspired by Cyberpunk 2077. Seagate has designed a custom Cyberpunk 2077 heatsink and box for the drive and will only produce 2077 units. The custom neon yellow heatsink includes the Cyberpunk logo and addressable 5 V RGB lighting. Seagate claims that the large aluminium heatsink can reduce SSD temperatures by up to 22°C (71°F) however due to its size you may encounter mounting issues on some motherboards.

The drive is available in a single 1 TB capacity and features the same Phison PS5016-E16 SSD controller paired with Toshiba 96L TLC NAND as the normal FireCuda 520. The SSD also features impressive performance numbers with advertised read and write speeds up to 5,000 MBps and 4,400 MBps respectively while endurance is rated at 1,800 TBW. The drive includes a 5-year warranty from Seagate and is now available to purchase from select retailers worldwide with prices ranging from 280 USD - 310 USD which is significantly more than the FireCuda 520 1 TB RRP of 190 USD.

Samsung is preparing to deploy their latest innovations in NAND density with the next-generation V-NAND (7th gen). Samsung says it is preparing products that leverage both V-NAND's higher density (at 176 layers per chip versus up to 136 layers on 6th gen) with the throughput of both PCIe 4.0 and PCIe 5.0. This would of course mean higher density drives available, as well as a reduction in the overall $/GB equation. Due to Samsung's vertical integration (meaning that they are one of the few companies that can design and produce all SSD components in-house), the company is also developing next-gen NAND controllers that can leverage throughputs of 2,000 MT/s transfer rates and thus "optimized for multitasking huge workloads".

Samsung expects to be able to scale V-NAND well past the 1,000 layer mark - a far-cry from the claims made by SK Hynix, who have only talked about a theoretical 600-layer NAND configuration. While the 176-layer, 7-gen V-NAND is only now entering mass production and the final stages of product development, Samsung has already taped out the initial batches of their 8th-gen V-NAND, which feature "more than 200 layers". It's likely that Samsung's 1,000-layer claim actually looks towards the future in a timeframe of decade(s?) and isn't actually something to look forward to in the approximate future.

The EUROCOM Sky Z7 R2 has unmatched levels of upgradeability through the Mobile Supercomputer's modular slots, allowing the safe removal and replacement of important hardware components such as the laptop's CPU, GPU, Memory, Storage, LCD, and more. Having slots or sockets allows the Sky Z7 R2 to customized, upgraded and modified with compatible parts- giving this Eurocom Mobile Supercomputer the ability to run the most demanding applications and perform high level tasks for a very long time. As newer and improved technologies emerge within the same chipset, the EUROCOM Sky Z7 R2's hardware components such as the CPU, GPU, RAM, storage, LCD, to name a few, can all be upgraded and replaced relatively easy in order to acquire more power as desired. Having modular components greatly increases the laptop's lifespan for many years and prevents the cycle of having to buy new laptops every few years, which can be the case with most laptops that have non-upgradeable components.

Eurocom's Sky Z7 R2 is one of the few laptops that utilizes modular GPU technology based on the MXM 3.1 version 2.0 socket technology. This means the Mobile Supercomputer's high performance GPU can be replaced at any time as long as it is compatible in the chipset, allowing the EUROCOM Sky Z7 R2 to perform at an extremely high level throughout the duration of its long lifespan. This Mobile Supercomputer can be configured up to the GeForce RTX 3080 which delivers twice the performance as its previous generation counterpart (GeForce RTX 2080). The EUROCOM Sky Z7 R2 offers seamless and stutter-free 4K gaming at 60 FPS, as well as 8K video editing, rendering and gaming.

Micron, the US-based manufacturer of various kinds of memory technologies, has today announced some quite interesting products at its Computex 2021 keynote. For starters, the company has announced a new portfolio of products based on 176-layer NAND. There are currently two products listed that use this new technology and those are the Micron 3400 and 2450 M.2 NVMe SSDs. Based on the PCIe 4.0 interface, the 2450 SSD lineup is designed as a value-oriented solution that comes in M.2-2280, M.2-2242, and M.2-2230 sizes. It ranges from 256 GB to 1 TB in capacities, which are supposed to be priced as a value purchase.

In a contrast, the 3400 SSD is M.2-2280 design, meant for only the highest performance. The sequential read speeds go up to 6600 MB/s, while the sequential writes go up to 5000 MB/s (in the case of the 2 TB model). Capacities range from 512 GB to 2 TB and only the 1 TB and 2 TB variants have the 5000 MB/s write speeds, while the 512 GB version is capped at 3600 MB/s speed. Both SSD models are featuring a heat spreader on top of NAND chips and spot an in-house and Micron-developed NVMe 1.4 SSD controller. However, Micron does note that the company is free to use any 3rd party SSD controller as we are deep in component shortages with high demand for SSDs. You can get an in-depth look at the 2450 and 3400 M.2 SSDs from Micron's website.

Western Digital today introduced another addition to their PCIe 4.0 lineup - which previously consisted only on the WD Black 850, their enthusiast-level offering. Now, the Black 850 gets some entry-level company with the Black 750 SE, which makes use of a 4-channel DRAMless controller to keep the drive fed at some still respectable 3600 MB/s, Sequential Write, and 2830 MB/s Sequential Read speeds (WD isn't quoting the random read/write speeds just yet).

The new WD_Black SN750 SE will start at $49.99 for the 250 GB model. Pricing on the 500 GB and 1 TB capacities hasn't been announced at time of writing, nor is there a mention of a 2 TB model being a part of the current lineup plans. The WD_Black SN750 SE is available for preorder from WD now, and will land on store shelves this summer.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

AMD's roadmap for notebook processors from 2020 - 2022 has recently been leaked and it reveals some interesting information for the launch of Zen 3+ and Navi 2. AMD will release the Rembrandt "H" series for mobile workstations in 2022 manufactured on the 6nm node with Navi 2 graphics and a Zen 3+ core design. These chips will include PCIe 4.0, LPDDR5/DDR5, and USB 4 support and will come with a power target of 45 W while a 15 W lineup of U series processors will also be released with identical specifications. The roadmap also shows the launch of Dragon Crest processors for tablets and handheld devices in 2022 with Navi 2 graphics and Zen 2 core designs. AMD is also set to launch the Barcelo "U" series for ultrathin laptops with very similar specifications to Cezanne "U".

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

XMG introduces an additional configuration variant to the high-end NEO range of gaming laptops with Intel's new Tiger Lake H45 processors. The eight-core CPUs from the 11th Core generation not only offer higher performance compared to their predecessors, but also boast the advantages of a completely updated platform. These includes support for PCI Express 4.0 and Thunderbolt 4 - features that the AMD version of the XMG NEO cannot offer. In addition, the models utilising the new Intel processor also benefit from a slight performance increase on the graphics card side. The GPU in the XMG NEO 15 and NEO 17 (M21) now operates with a TGP of up to 165 instead of 150 watts.

German publication, Igor's LAB, has got ahold of some information regarding AMD's upcoming Radeon RX 6600 series graphics card. Based on the Navi 23 SKU, the GPU is supposed to satisfy all the entry-level needs one would expect from a GPU. That means light 1080p gaming and multimedia streaming. For starters, let's get into details of the die. Igor's LAB notes that the die size is 235.76mm2, with a 35x35 mm package. The die will be centered in a package with a 45-degree rotation, which you can see how it looks in the images below. Additionally, the Navi 23 GPU will have SKUs ranging from 65 Watts to 95 Watts of Total Graphics Power (TGP). As far as frequency goes, the card BIOS points to the maximum clock speed of 2350 MHz, which is lower than the rumored 2684 MHz.

When it comes to memory, the upcoming Navi 23 GPUs can be equipped with up to 16 GB of GDDR6 memory, however, it is most likely that the regular gamer version will come with 8 GB of VRAM, while the Radeon Pro models will use the full 16 GB limit. As far as interface is concerned, the Radeon RX 6600 series will be limited to PCIe 4.0 x8 connection, as the low-end GPU doesn't require a full x16 slot. With the bandwidth of the PCIe 4.0, only eight lanes are enough for this GPU. These cards are expected to hit the market sometime in June, and we are waiting for the official announcement.

Yesterday, we got information that Intel's upcoming DG2 discrete graphics card is "right around the corner". That means that we are inching closer to the launch of Intel's discrete GPU offerings, and we are going to get another major player in the current GPU market duopoly. Today, however, we are in luck because Igor from Igor's LAB has managed to get ahold of the specifications of Intel's Xe-HPG DG2 graphics card. For starters, it is important to note that DG2 GPU will first come to laptops later this year. More precisely, laptops powered by Alder Lake-P processors will get paired with DG2 discrete GPU in the second half of 2021. The CPU and GPU will connect using the PCIe 4.0 x12 link as shown in the diagram below, where the GPU is paired with the Tiger Lake-H processor. The GPU has its subsystem that handles the IO as well.

Sabrent first teased their upcoming RocketQ Battleship SSD offering 8x 8 TB RocketQ M.2 NVMe SSDs paired with the Highpoint SSD7540 8-port PCIe 4.0 x16 NVMe RAID controller in January. This combination offers 64 TB of NVMe storage with speeds of up to 28 GB/s, the product appears to be nearing release after HighPoint listed the SSD on their website. The RocketQ Battleship has been listed on HighPoint Technologies NVMe AIC Drive Solutions page as coming soon. The RocketQ Battleship won't come cheap with the individual 8 TB RocketQ drives costing 1299 USD each, we would expect the product to retail for north of 10,000 USD if it ever gets a public release.

HighPoint TechnologiesBuilt around Sabrent's diverse Rocket Series of NVMe SSD's, Elite Class AIC drives offer unprecedented storage capacity and class-leading versatility

MSI, the world's leading gaming motherboard brand, proudly announces the new flagship Intel Z590 MEG Series motherboards - the MEG Z590 ACE GOLD EDITION, MEG Z590 UNIFY, and MEG Z590 UNIFY-X. They're not only tailored for enthusiast gamers but also offered more possibilities to satisfy various desires - the luster of gold against endless darkness.

Gold symbolizes a unique attribute of pride and elites. The pure luster of gold, 24K presents utmost in color and luminosity. With craftsmanship and hours of dedication, the 24K gold and state-of-the-art technology have been harmonized into one. The MEG Z590 ACE GOLD EDITION boasts premium aesthetics with a brand new color scheme - the platinum color finish and genuine 24K-gold foil heatsink perfectly show off the concept of beauty.

AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.