Based on the latest data and research, TrendForce has further corrected down the projected YoY growth rate of whole server shipments for 2023 to 2.8%. Three factors are behind this revision. First, lead time has started to return to its usual length for most orders related to server components from 3Q23 onward. Seeing this, server OEMs and cloud service providers (CSPs) have also begun to correct the component mismatch issue by lowering demand for items that are in excess while maintaining a constant inventory level for items that are still in tight supply. This development, in turn, has reduced the flow of server orders going to ODMs. Second, the wave of demand that was generated earlier from the effects of the COVID-19 pandemic is dissipating. Hence, expansion activities have cooled off noticeably for services such as video streaming, e-commerce, etc. Among CSPs, Meta, Google, and ByteDance (TikTok) have lowered their server procurement quantities for next year. Lastly, the global economic outlook has remained fairly negative, so companies across most industry sectors have formulated a more conservative expenditure plan and scaled back IT-related spending for next year.

Micron Technology, Inc., today announced that in response to market conditions, the company is reducing DRAM and NAND wafer starts by approximately 20% versus fiscal fourth quarter 2022. These reductions will be made across all technology nodes where Micron has meaningful output. Micron is also working toward additional capex cuts. In calendar 2023, Micron now expects its year-on-year bit supply growth to be negative for DRAM, and in the single-digit percentage range for NAND.

Recently, the market outlook for calendar 2023 has weakened. In order to significantly improve total inventory in the supply chain, Micron believes that in calendar 2023, year-on-year DRAM bit supply will need to shrink and NAND bit supply growth will need to be significantly lower than previous estimates. "Micron is taking bold and aggressive steps to reduce bit supply growth to limit the size of our inventory. We will continue to monitor industry conditions and make further adjustments as needed," said Micron President and CEO Sanjay Mehrotra. "Despite the near-term cyclical challenges, we remain confident in the secular demand drivers for our markets, and in the long term, expect memory and storage revenue growth to outpace that of the rest of the semiconductor industry."

Global market intelligence firm TrendForce reports that for 3Q22, the revenue of the whole DRAM industry dropped by 28.9% QoQ to US$18.19 billion. This decline is the second largest to the one that the industry experienced in 2008, when the global economy was rocked by a major financial crisis. Regarding the state of the DRAM market in 3Q22, the QoQ decline in contract prices widened to the range of 10~15% as the demand for consumer electronics continued to shrink. Server DRAM shipments, which had been on a relatively stable trend compared with shipments of other types of DRAM products, also slowed down noticeably from the previous quarter as buyers began adjusting their inventory levels.

Turning to individual DRAM suppliers' performances in 3Q22, the top three suppliers (i.e., Samsung, SK hynix, and Micron) all exhibited a QoQ drop in revenue. Samsung posted US$7.40 billion and a QoQ drop of 33.5%, which was the largest among the top three. SK hynix's revenue fell by 25.2% QoQ to around US$5.24 billion. As for Micron, its revenue came to around US$4.81 billion. Since Micron marks its fiscal quarters differently, its DRAM ASP showed a QoQ decline that was smaller than the ones suffered by the two Korean suppliers. And as a result of this, Micron's QoQ revenue decline was also the smallest among the top three. TrendForce points out that the top three are still maintaining a relatively high operating margin at this moment. Nevertheless, the inventory correction period that has started this year will last through the first half of next year, so they will experience a continuing squeeze on profit.

SK hynix has developed LPDDR5X (Low Power Double Data Rate 5X), the world's first-ever mobile DRAM with an integrated HKMG (High-K Metal Gate) process, which was just recently introduced to the market. The LPDDR5X boasts the industry's highest energy-efficiency as SK hynix succeeded in reducing power consumption by 25% compared to the previous generation and operates in the ultra-low voltage range of 1.01 V to 1.12 V set by the JEDEC (Joint Electron Device Engineering Council).
For the LPDDR, which is also called a mobile DRAM, having a low power consumption is its greatest asset, just as its standard name—LP (Low Power)—suggests. As power is limited in mobile devices, it's necessary to reduce power consumption as much as possible to extend the usage time.

This is why lowering power consumption is just as important as increasing operating speed. LPDDR5X was the first among mobile DRAMs to integrate the HKMG process and see improved performance and a reduction in power consumption, essentially killing two birds with one stone. As the power consumption of DRAM gets lowered by LPDDR5X, mobile devices can be used for a longer time with a single charge. The reduction in power consumption of such products can subsequently lead to a reduction in the power used by consumers, which is in line with the value of SK hynix's ESG-centered business management.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase extreme memory bandwidth performance of high-frequency DDR5-8000 32 GB (16 GB x2) & DDR5-7800 32 GB (2x 16 GB) overclocked memory kits on the latest Intel Core i9-13900K Processor and ASUS ROG MAXIMUS Z790 APEX motherboard. Working in close partnership with the ASUS motherboard team, a single G.SKILL memory module was overclocked to a staggering DDR5-10000 under air cooling.

Dedicated to developing the fastest possible DDR5 memory on the latest 13th Gen Intel Core processor and Intel Z790 chipset, G.SKILL showcases the high memory bandwidth performance of DDR5-8000 32 GB (2x16GB) memory kit on the ASUS ROG MAXIMUS Z790 APEX motherboard. The following screenshots show the DDR5-8000 CL40 32 GB (2x16GB) and DDR5-7800 CL38 32 GB (2x 16 GB) memory kits validated on an Intel Core i9-13900K processor and ASUS ROG MAXIMUS Z790 APEX motherboard (BIOS 0702) platform, with the DDR5-8000 CL40 32 GB (2x16GB) memory kit reaching memory bandwidth read speed of over 124 GB/s and write speed of over 120 GB/s on the AIDA64 memory benchmark.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today excited to announce the partnership with leading memory brand Team Group to release the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop memory. The new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop RAMs are the collaborative effort of two leading tech brands, Team Group and BIOSTAR. Carrying the legendary DNA of BIOSTAR's flagship VALKYRIE design language and T-FORCE DELTA RGB DDR5 desktop memory technology, the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition RAMs bring superior design, technology, and next-level engineering with jaw-dropping performance unparalleled in its class.

Its stealth fighter-influenced look features the signature wide-angled heatspreader with mesmerizing RGB lightning, unlike any other RAM on the market. Powered by a next-generation intelligent RGB control chip, it allows users full reign over limitless lighting customization using BIOSTAR's Advanced VIVID LED DJ software to create a highly personalized ambiance inside the system. Furthermore, the signature golden wings logo of BIOSTAR's VALKYRIE, together with T-FORCE's iconic wings logo, signify the Norse warriors' majestic wings and stands as a symbol of power and authority with its sleek streamlined design elements.

According to the latest TrendForce research, pandemic-induced materials shortages abated in the second half of this year and the supply and delivery of short-term materials has recovered significantly. However, assuming materials supply is secure and demand can be met, the annual growth rate of server shipments in 2023 is estimated to be only 3.7%, which is lower than 5.1% in 2022.

TrendForce indicates that this growth slowdown is due to three factors. First, once material mismatch issues had eased, buyers began adjusting previously placed purchase order overruns. Thus, ODM orders also decreased but this will not affect the 2022 shipment volume of whole servers for the time being. Second, due to the impact of rising inflation and weakness in the overall economy, corporate capital investment may trend more conservative and IT-related investment will emphasize flexibility, such as the replacement of certain server terminals with cloud services. Third, geopolitical changes will drive the continuing emergence of demand for small-scale data centers and previous construction of hyperscale data centers will slow. The recent ban on military/HPC servers issued by the U.S. Department of Commerce on October 7 has a very low market share in terms of its application category, so the impact on the overall server market is limited at present. However, if the scope of the ban is expanded further in the future, it will herald a more significant slowdown risk for China's server shipment momentum in 2023.

According to TrendForce research, rising inflation has weakened demand for consumer products, flattening the peak of peak season. In 3Q22, memory bit consumption and shipments continued to exhibit quarterly decline. Due to a significant decline in memory demand, terminal buyers also delayed purchases, leading to further escalation of supplier inventory pressure. At the same time, the strategies of various DRAM suppliers to increase their market share remain unchanged. There have been cases of "consolidated Q3/Q4 price negotiations" or "negotiating quantity before pricing" in the market, which are the reasons leading to a ballooning of declining DRAM prices to 13~18% in 4Q22.

In terms of PC DRAM, due to weak demand for notebooks, PC OEMs will remain focused on destocking DRAM inventory. While the DRAM supply side has not actually reduced production since operating profit remains favorable, bit output continues to rise and pressure on suppliers' inventory becomes increasingly obvious. From the perspective of DDR4 and DDR5, the price drop forecast in 4Q22 is 13~18% with DDR5 declining more than DDR4. However, as the penetration rate of DDR5 continues to rise, coupled with a higher unit price, the penetration rate of DDR5 in the PC DRAM sector will increase 13~15% in 4Q22, which will buoy the average unit price of overall PC DRAM (combined DDR5 and DDR4) marginally and PC DRAM pricing in 4Q22 is estimated to drop by approximately 10~15%.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new extreme overclocked performance DDR5 memory specifications to its flagship Trident Z5 RGB series: DDR5-6800 CL32-45-45-108 32 GB (2x 16 GB) and DDR5-6400 CL32-39-39-102 64 GB (2x 32 GB). These memory kits come with Intel XMP 3.0 memory overclocking profiles and have been validated on the latest 12th Gen Intel Core desktop processor and Intel Z690 chipset platform.

Dedicated to developing extreme overclock speed memory kits, the G.SKILL Trident Z5 RGB DDR5-6800 CL32-45-45-108 2x 16 GB memory kit is the ideal choice for overclocking enthusiasts to experience extreme DDR5 frequency performance. The screenshot below shows the DDR5-6800 memory kit validated with Intel Core i7-12700K desktop processor and ASUS ROG Maximus Z690 Hero motherboard.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today it has unleashed a new member of the pack, Kingston FURY Beast DDR4 RGB Special Edition. The white heatspreader with striking RGB lighting makes these modules unique amongst the Kingston FURY line.

Enhance not just the performance of your system but keep it fresh with the library of preset RGB lighting patterns and effects or personalize the settings to create a look that makes your system truly one of a kind with Kingston FURY CTRL software. Along with the patented Infrared Sync Technology, trust your tailored RGB effects stay aligned.

Montage Technology, a leading data processing and interconnect IC design company, today announced that it is delivering the world's first Gen1 DDR5 Clock Driver (CKD or DDR5CK01) samples to the top DRAM memory vendors for their development of memory modules used in new-generation desktop and notebook computers.

For a long time, the clock driver functions have been integrated onto the register clock driver (RCD) device, which is used in the server platforms, rather than the PC computers. With the boost of the DDR5 data rate, the frequency of the clock signal becomes higher and higher, and the signal integrity issue of the clock becomes more and more challenging. As the DDR5 data rate reaches 6400MT/s and above, the memory modules such as UDIMMs and SODIMMs used in desktop and notebook computers, will need an on-DIMM clock driver to buffer and re-drive the clock signal of the memory modules, to meet the signal integrity and reliability requirement of the high-speed clock signal.

JEDEC Solid State Technology Association and Compute Express Link (CXL) Consortium today announced the signing of a Memorandum of Understanding (MOU) to formalize collaboration between the two organizations. The agreement outlines the formation of a joint work group to provide a forum that facilitates communication and sharing of information, requirements, recommendations and requests with the intent that this exchange of information will help standards developed by each organization augment one another.

"The MOU between JEDEC and CXL Consortium will establish a framework for ongoing communication to align future efforts between the two organizations. The joint work group will collaborate on useful solutions for form factors, management, security, and DRAM and other memory technologies," said Siamak Tavallaei, CXL Consortium President.

According to TrendForce investigations into the DRAM market, under pressure from ever-increasing output, Korean manufacturers have significantly increased their willingness to compromise on pricing in order to stimulate buying from distributors and customers, leading to a steady expansion of falling prices. In addition to Korean manufacturers enthusiastically slashing prices, low-priced chips from the spot market are also circulating in the market. Other suppliers have no choice but to follow suit and fervently reduce pricing for sales, rapidly exacerbating the 3Q consumer DRAM price drop from the original estimate of 8~13% to a quarterly decline of 13-18%.

Looking forward to Q4, it will be difficult for stocking momentum to recover before terminal inventories have been completely depleted. TrendForce expects the price of consumer DRAM to continue to fall until oversupply in the market is alleviated. Thus, consumer DRAM pricing will carry on moving lower by another 3~8% in Q4 and the possibility of sustained decline cannot be ruled out.

As the world dives further into the high-speed DDR5 generation, DDR5 technologies are urged to meet the demands for more reliable and durable products. Team Group, a world-leading memory manufacturer, continues to pursue advancement and is dedicated to providing an upgraded DDR5 solution to offer higher frequencies to users around the world. Today, Team Group launches ELITE PLUS DDR5 Desktop Memory with a brand new heat sink design to effectively increase reliability. Furthermore, Team Group announces a new frequency of 6,000 MHz for ELITE DDR5 to further increase operating performance and deliver an ultra-smooth user experience. The ELITE PLUS DDR5 and ELITE DDR5 6,000 MHz Desktop Memory will be available to global users via Amazon and Newegg in North America soon.

ELITE PLUS DDR5 Desktop Memory is equipped with a sleek, simple, and asymmetric aluminium heat sink that has been specially designed to be non-conductive and to protect against scratches, acids, rusting and rotting to provide full protection for the DDR5 module. ELITE PLUS DDR5 Desktop Memory is also equipped with a 1.1 V standard working voltage which further reduces energy consumption for each unit of bandwidth comparing to the 1.2 V in DDR4, providing a more efficient power usage. The DDR5 module is equipped with PMICs for effective power distribution, reliable power supply, and minimal noise interference. The IC supports on-die ECC, a feature that self-corrects DRAM cells for enhanced stability and reliability by reducing risks of information errors.

Micron Technology, Inc. (NASDAQ: MU) commends and thanks the Biden Administration for their leadership and the bipartisan work of Congress for passing the "Chips and Science" legislation. This is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness for years to come.

This legislation will bring leading-edge semiconductor manufacturing to the U.S., creating tens of thousands of jobs and tens of billions of dollars of new investments - transforming U.S. semiconductor innovation and supply chain resilience.

As we approach the launch of Intel's upcoming Raptor Lake desktop processors, we are getting more leaks of testing performed by system integrators and 3rd parties that have early access to the engineering sample (ES) chips. A few days ago, we saw an Intel Core i7-13700K CPU run Geekbench 5 benchmark with the older DDR4 memory on ASRock Z690 Steel Legend WiFi 6E. Today, we are seeing a similar test performed on the same processor, with ASRock Z690 Steel Legend WiFi 6E/D5 equipped with DDR5 memory. While the previous DDR4 testing used modules running at 3200 MT/s, the DDR5 testing uses 5200 MT/s rated DRAM with unknown timings and setup.

As far as performance goes, the single-core result of the 16-core Intel Core i7-13700K processor was 2090 points with DDR4, while DDR5 showed a slight regression of 2069 points. Of course, this could be attributed to the margin of error. As far as multi-core performance goes, the DDR4 testing managed to produce 16542 points, whereas the DDR5-equipped platform scored 19811 points. This is an immediate 20% performance uplift in multi-core score. It shows that all the cores present in Raptor Lake processors are starving for bandwidth, and a faster memory protocol can bring quite an improvement. As usual, we have to wait to confirm this information with our testing so that we can draw more conclusions.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the release of Kingston FURY Renegade DDR5 and Kingston FURY Renegade DDR5 RGB memory. The Kingston FURY Renegade DDR5 family is engineered to maximize the performance of your system.

Kingston FURY Renegade DDR5 family pushes the performance of next-gen DDR5 platforms to the extreme with ultra-fast memory up to 6400MT/s1and quick CL32 timings. With premium components hand-tuned by engineers, rigorously tested for compatibility across the industry's leading motherboards, backed by 100% factory testing at speed, and Intel XMP 3.0 Certified, customers can enjoy the ultimate overclock experience.

Thermaltake, the leading PC DIY premium brand for Case, Cooling, Gaming peripherals, and enthusiast memory solutions, is delighted to announce a new series of DDR5 RAM, including TOUGHRAM RC DDR5, TOUGHRAM Z-ONE RGB D5, and the latest TOUGHRAM XG RGB D5 in black and white. In order to provide gamers with the most up-to-date tech, our new DDR5 lineups come with higher capacities, faster speeds, and better overall performance compared with the previous generation and will be compatible with mainstream hardware and the latest Intel motherboards. Let's have a look at our latest offerings:

To begin with, we have TOUGHRAM XG RGB D5 in black and white with a frequency of 5600MT/s recently released and are available for purchase. The TOUGHRAM XG RGB D5 series features a Hynix chipset, the built-in PMIC, On-die ECC, and XMP 3.0 one-click overclocking. However, what makes the TOUGHRAM XG series stand out is its 16 ultra-bright addressable LEDs that are fully compatible with TT RGB Plus 2.0 and NeonMaker, enabling users to highlight the aesthetics they pursue without any limitation. The series also features 2oz, 10-layer PCB, and 10μ Gold Finger, further reinforcing not only the overall quality of the product but its enhanced durability, for the package that's pleasing to look at and enjoyable to game on. Moreover, with its doubled bank group architecture, the new TOUGHRAM XG RGB D5 enhances access availability and brings you higher capacities without lag, paving the way for next-gen memory. Aside from that, the latest TOUGHRAM XG RGB D5 is also compatible with TT AI Voice Control and Amazon Alexa, allowing users to freely configure lighting effects through their voice.

Hyperscalers such as Microsoft, Google, Amazon, etc., all run their cloud divisions with a specific goal. To provide their hardware to someone else in a form called instance and have the user pay for it by the hour. However, instances are usually bound by a specific CPU and memory configuration, which you can not configure yourself. But instead, you can only choose from the few available options that are listed. For example, when selecting one virtual CPU core, you get two GB of RAM and can go as high as you want with CPU cores. However, the available RAM will also double, even though you might not need it. When renting an instance, the allocated CPU cores and memory are yours until the instance is turned off.

And it is precisely this that hyperscalers are dealing with. Many instances don't fully utilize their DRAM, making the whole data center usage inefficient. Microsoft Azure, one of the largest cloud providers, measured that 50% of all VMs never touch 50% of their rented memory. This makes memory stranded in a rented VM, making it unusable for anything else.

At Azure, we find that a major contributor to DRAM inefficiency is platform-level memory stranding. Memory stranding occurs when a server's cores are fully rented to virtual machines (VMs), but unrented memory remains. With the cores exhausted, the remaining memory is unrentable on its own, and is thus stranded. Surprisingly, we find that up to 25% of DRAM may become stranded at any given moment.

World-leading memory manufacturer, Team Group is embracing the new DDR5 generation in full force by offering products that meet a wide range of user demands. In this case, T-CREATE, Team Group's label targeting content creators, is launching the EXPERT Desktop DDR5 RAM and CLASSIC SO-DIMM Laptop DDR5 RAM to serve the booming digital content market and join hands with digital content creators around the world to usher in the next generation.

T-CREATE's EXPERT Desktop DDR5 RAM, unlike its DDR4 iteration, uses a dedicated DDR5 cooling module and all-new cooling fin design to strengthen cooling under high-intensity applications and ensure digital content creators can continue to experience high-speed performances at the ideal operating temperature. Digital content creators require strong performances and large capacities. The EXPERT DDR5 has the specs to achieve speeds of up to 5600 MHz and dual-channel options available in 16 GB x2 or 32 GB x2, which can fulfill any multi-tasking needs and drastically enhances the creative experience.

According to the latest TrendForce research, despite the rapid weakening of overall consumer demand in 1H22, DRAM manufacturers previously presented a tough stance on price negotiations and gave little ground, steadily conveying inventory pressure from buyers to sellers. Facing uncertain peak-season demand in 2H22, some DRAM suppliers have begun effectively expressing clear intentions to cut prices, especially in the server field, where demand is relatively stable, in order to reduce inventory pressure. This situation will cause 3Q22 DRAM pricing to drop from the previous 3~8% to nearly 10% QoQ. If a price war is incited due to companies competing for sales, the drop in prices may exceed 10%.

PC OEMs have continuously downgraded their shipment prospects. With average DRAM inventory levels at more than two months, unless a huge price incentive exists, there is no urgent demand for procurement. At the same time, thanks to continuous adoption of the advanced 1Z/1alpha process, supply continued to increase in 3Q22. DDR4 output could not be effectively reduced due to high pricing limiting the penetration rate of DDR5. The price decline of PC DRAM in 3Q22 is revised to 5~10%.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

Nanya Technology, part of the Formosa Plastics Group, which is one of the largest conglomerates in Taiwan, will hold a ground-breaking ceremony for its new 12-inch fab that will be built in New Taipei City later this week. It'll be the biggest investment Nanya has done in the past decade, as the company is investing US$10.1 billion into building the new fab. This is obviously a lot less than TSMC is investing, but DRAM is made on different nodes to those that TSMC makes its customers products on, since DRAM doesn't benefit as much from node shrinking as other types of semiconductors.

The new fab will be located near one of Nanya's current fabs, in the Taishan district. Mass production is scheduled to start some time in 2025 and the fab is said to have a monthly capacity of around 45,000 wafers. Right now it's scheduled for a 10 nm technology node, but this might change by the time that the fab is up and running, especially considering that Nanya is already producing a range of 10 nm based products in some of its current fabs. Nanya's goal is to develop its next generation of 10 nm DRAM independently from other DRAM makers, as to avoid having to pay patent licence fees to its competitors.

Intel's semiconductors nodes have been quite controversial with the arrival of the 10 nm design. Years in the making, the node got delayed multiple times, and only recently did the general public get the first 10 nm chips. Today, at IEEE's annual VLSI Symposium, we get more details about Intel's upcoming nodes, called Intel 4. Previously referred to as a 7 nm process, Intel 4 is the company's first node to use EUV lithography accompanied by various technologies. The first thing when a new process node is discussed is density. Compared to Intel 7, Intel 4 will double the transistor count for the same area and enable 20% higher performing transistors.

Looking at individual transistor size, the new Intel 4 node represents a very tiny piece of silicon that is even smaller than its predecessor. With a Fin Pitch of 30 nm, Contact Gate Poly Pitch of 50 nm between gates, and Minimum Metal Pitch (M0) of 50 nm, the Intel 4 transistor is significantly smaller compared to the Intel 7 cell, listed in the table below. For scaling, Intel 4 provides double the number of transistors in the same area compared to Intel 7. However, this reasoning is applied only to logic. For SRAM, the new PDK provides 0.77 area reduction, meaning that the same SoC built on Intel 7 will not be half the size of Intel 4, as SRAM plays a significant role in chip design. The Intel 7 HP library can put 80 million transistors on a square millimeter, while Intel 4 HP is capable of 160 million transistors per square millimeter.