As agentic AI drives new demands for compute density, memory bandwidth, and data movement, MSI is advancing next-generation data center infrastructure with server platforms powered by AMD EPYC 9006 Series SP7 Server CPUs. With SP7 systems entering the shipping phase in Q4 2026 and SP8 platforms planned for the first half of 2027, MSI's portfolio spans liquid-cooled GPU servers, 19" DC-MHS and 21" ORv3 multi-node platforms, and enterprise servers, supporting AI, cloud, HPC, virtualization, and business-critical workloads.

Built on the Zen 6 architecture, AMD EPYC 9006 Series Server CPUs deliver up to 256 cores and 512 threads per socket for high-density computing and AI agent execution. With up to 1.6 TB/s of memory bandwidth and PCIe Gen 6 connectivity, they support data-intensive workloads and high-speed I/O for GPUs, networking, and storage.

ASRock Rack is promising up to 4 TB of DDR5 on a single socket with its DMRD16-2L+, one of the first motherboards built for Intel's upcoming Xeon 7 "Diamond Rapids" processors. The board was shown at the OCP Global Summit 2026 and has since been detailed by ServeTheHome. It has 16 DIMM slots in a one-DIMM-per-channel layout, matching the 16-channel memory setup Intel detailed at HOT CHIPS. Regular RDIMMs top out at 128 GB per module and 8000 MT/s, while MRDIMMs run at up to 12,800 MT/s, with taller 2U MRDIMMs reaching 256 GB each. Populate all 16 slots with those, and you hit 4 TB, along with a theoretical bandwidth of roughly 1.6 TB/s.

Expansion is unusual, with no standard PCIe slots and no OCP NIC 3.0 connector. All I/O goes through up to 16 MCIO x8 connectors, each rated for PCIe 6.0 or CXL 3.0, for 128 lanes in total. The rest is fairly basic: one PCIe 5.0 x4 M.2 slot, two Intel I350 Gigabit Ethernet ports, an ASPEED AST2700 BMC with a dedicated management port, and VGA output. ASRock Rack fits it all on a 12 x 13-inch EEB PCB, about the size of a large E-ATX board, so it could squeeze into some bigger workstation cases. Pricing and availability have not been shared yet, but that is hardly surprising, since Intel has the Xeon 7 family slated for a 2027 debut on the new LGA9324 socket. The board is aimed at servers, though anyone planning a high-memory workstation for local AI will probably keep an eye on it.

Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation.

Thomas Chen, CEO at Cooler Master Corporation"Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities. We aim to help them put liquid cooling to work, whether that means retrofitting an existing data center or building a new site. That requires comprehensive plans about how the equipment being assembled, installed, and serviced."

Astera Labs, Inc. (Nasdaq: ALAB), a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, today announced Orion: a modular rack-scale reference design with production-grade connectivity that allows customers to choose their own GPU and CPU. To be offered through Astera Labs' ODM and OEM partners, the Orion production-grade reference designs are expected to help enable neocloud and enterprise customers to deploy AI infrastructure faster and run it more efficiently, turning racks built on open standards into token-efficient AI factories.

For neoclouds and enterprises to economically serve inference at scale, they must secure sufficient accelerator and CPU capacity while delivering predictable, low-latency performance across increasingly complex AI infrastructure. But because they must commit to that capacity long before they know which accelerator will be available or affordable for their workloads, tying early investment to a single platform carries unnecessary cost and risk. At the same time, ODMs and OEMs are forced to repeatedly solve complex integration, validation, and software challenges for every new accelerator platform—slowing deployments when inference capacity is in critical demand.

AMD (NASDAQ: AMD) today introduced the AMD Helion agentic AI rack, an open blueprint for agentic AI infrastructure based on an Open Compute Project spec-design and powered by AMD compute.

Building on the open-platform approach of the AMD Helios rackscale solution, AMD Helion is designed to provide partners and customers with the flexibility they need for agentic AI infrastructure. With AMD Helion, customers can match CPU performance, core density and power with GPU acceleration for the work their AI agents perform.

HPE (NYSE: HPE) today announced the first four of its HPE ProLiant Gen13 Servers powered by 6th Generation AMD EPYC Server processors. The new systems expand compute, memory, and I/O capabilities to help enterprises accelerate agentic AI and inference, analytics, virtualization, simulation, and modeling while strengthening security, simplifying operations, and providing reliability across distributed IT environments.

As AI systems evolve from generating insights to taking autonomous action, trust becomes a prerequisite for scale. McKinsey's 2026 AI Trust Maturity Survey found that nearly two-thirds of respondents cited security and risk concerns as the top barrier to fully scaling agentic AI. Within this evolving landscape, HPE ProLiant Gen13 helps customers address security and operational barriers with a trusted infrastructure foundation that combines HPE iLO 8 innovations for automatic protection, infrastructure trust, and post-quantum readiness with enhanced visibility and control from HPE Compute Ops Management.

Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, and 5G/Edge IT Total Solution Provider, is now shipping NVIDIA Vera Rubin NVL72 racks integrated with Supermicro's Data Center Building Block Solutions (DCBBS) and its direct liquid cooling stack (DLC-2).

Charles Liang, president and CEO, Supermicro"We have spent years building the liquid-cooling stack, the manufacturing capacity, and the deployment teams for exactly this moment. Our customers can now order a Scalable Unit and receive production-ready systems with end-to-end integration, because we design and build every layer between the cold plate and the cooling tower. Our development of DLC-2 technology is what sets Supermicro apart and allows us to deliver the most complete solution for the NVIDIA Vera Rubin platform."

The TechPowerUp team visited the Chieftec booth at IFA 2026, with some interesting offerings on display. Chieftec brought its case lineup to the show, mixing an unannounced E-ATX tower with two chassis it already launched earlier this year. The new one is the Atlas, an E-ATX case supporting up to 420 mm radiators in the front or top. It has room for three 120 mm fans behind the power supply shroud, one rear fan, and an extra 120 mm unit near the PCIe brackets meant to pull hot air away from the graphics card. There are eight expansion slots and up to 420 mm of GPU clearance. This case is really meant for workstation or server builds, and its clean, functional design makes it ideal for that purpose.

MSI announced that its EdgeXpert AI Supercomputer is now supported by Racknex professional Rack Mount solutions, enabling enterprises to deploy high-performance AI computing resources in standard 19-inch rack environments. Designed specifically for MSI EdgeXpert, the Racknex UM-MSI-201 Rack Mount Kit provides a flexible and standardized deployment option for enterprise AI, edge computing, smart manufacturing, and data center applications.

As generative AI and enterprise AI applications continue to expand, organizations are increasingly seeking AI computing platforms that deliver high performance, low latency, and secure local AI processing. Beyond computing capability, enterprises also require efficient deployment, system integration, space optimization, and simplified management within existing IT infrastructures.

Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly C1000 CPU, Qualcomm High Bandwidth Compute (HBC), Qualcomm Dragonfly AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput at lower total cost of ownership. The new platforms highlight Qualcomm Technologies' growing role in building full-stack data center infrastructure optimized for AI, spanning agentic and data-center-class CPUs, AI inference accelerators, high-performance connectivity, and at scale custom silicon solutions. The Qualcomm Dragonfly AI300 joins the previously announced Qualcomm Dragonfly AI200 and AI250 in its data center solutions portfolio with an annual cadence AI accelerator roadmap.

"Agentic AI is driving a significant increase in demand for AI inference in the data center. As these become the dominant workloads, infrastructure has to deliver much higher performance at lower power and cost," said Cristiano Amon, President and CEO, Qualcomm Incorporated. "That plays directly to Qualcomm's strengths, and we're well positioned for this shift. With Qualcomm Dragonfly, we're bringing our high-performance, low-power computing into the data center, with multi-year, multi-generation agreements with leading customers."

MiTAC showcased an extended portfolio of HPC, servers and enterprise components at Computex 2026, among them being AMD Instinct MI350X air-cooled servers, MI355X liquid-cooled systems and enterprise MI350P PCIe accelerator cards. On display was an impressive 52U liquid-cooled AI rack built around 12x G4826Z5 servers and 96 AMD Instinct MI355X GPUs. In the server area MiTAC presented a 4U liquid-cooled G4826Z5 server powered by AMD Instinct MI355X accelerators and the 8U air-cooled G8825Z5 featuring Instinct MI350X GPUs.

NVIDIA MGX architecture AI servers powered by 6th Gen AMD EPYC processors and NVIDIA Blackwell B200 GPUs were also presented.

FSP brought several new case families to Computex 2026, covering gaming, SFF, workstation, and server form factors. The M Series flagship is the M581 model, a full ATX aquarium-style case with 270-degree curved tempered glass and back-connect motherboard support. The case has an underglow lighting system that shifts from blue to red based on chassis temperature. It also features an adjustable fan bracket and a rear fan with a built-in display showing real-time fan speed and system temperature. The M381 is a smaller ATX case with semi-curved glass panels, 360 mm radiator support and preinstalled ARGB fans. The M221 is a mesh-focused ATX case with a tool-free side panel.

The S350 is a microATX SFF case with full mesh panels, support for a 240 mm radiator and two preinstalled 120 mm fans. The S210 microATX is the more notable model as it has the NVIDIA SFF-Ready certification. It features a carry handle and support for GPUs up to 340 mm with 240 mm liquid cooling support. FSP had an NVIDIA SFF-Ready-certified system on display built around the S210 case.

Synology today announced the launch of the RS6426xs+, RS4826xs+, and RS3626xs. These next-generation models deliver the performance and reliability required for enterprise backup, data management, and virtualization storage at scale.

"As IT environments continue to grow more complex, organizations' needs for reliable and versatile infrastructure that can be purposed dynamically continue to grow." said Peggy Weng, Product Manager at Synology. "These systems are designed to help businesses facilitate team collaboration and multi-site synchronization, protect production environment, or deploy virtualization storage for high performance workloads."

NVIDIA today launched the NVIDIA Vera CPU, the world's first processor purpose-built for the age of agentic AI and reinforcement learning—delivering results with twice the efficiency and 50% faster than traditional rack-scale CPUs. As reasoning and agentic AI advances, scale, performance and cost are increasingly driven by the infrastructure supporting the models that plan tasks, run tools, interact with data, run code and validate results.

The NVIDIA Vera CPU builds on the success of the NVIDIA Grace CPU, enabling organizations of all sizes and across industries to build AI factories that unlock agentic AI at scale. With the highest single-thread performance and bandwidth per core, Vera is a new class of CPU that delivers higher AI throughput, responsiveness and efficiency for large-scale AI services such as coding assistants, as well as consumer and enterprise agents.

Panmnesia, an AI infrastructure link solution provider, today announced the signing of a strategic Memorandum of Understanding (MOU) with SK Telecom, South Korea's largest telco and a leading AI company. The agreement, signed at MWC26 in Barcelona, aims to jointly develop a CXL-based next-generation AI data center architecture.

As large-scale AI services continue to expand, data centers are investing heavily in massive deployments of high-performance GPUs, resulting in astronomical costs. Recognizing the need for sustainable scalability, SK Telecom and Panmnesia are focusing beyond simple GPU expansion to technologies that enable more efficient utilization of existing computing resources. Through this collaboration, the two companies aim to simultaneously improve cost efficiency and performance by innovating data center interconnect architecture based on Compute Express Link (CXL) technology.

Asustor has rounded out its AS72 rackmount NAS lineup with the AS7224RDX Lockerstor 24R Pro Gen 2, adding a 24-bay option to sit alongside the existing 12-bay AS7212RDX and 16-bay AS7216RDX models that launched back in August 2025. The new model supports drives up to 32 TB, giving it a raw internal capacity of 768 TB. It can be expanded to 36 bays with the AX7012R expansion unit, at which point it can pass the 1 PB internal capacity. The AS72 family runs on an AMD Ryzen 7 Pro 7745 (8 cores, up to 5.3 GHz) and comes with 16 GB of DDR5-4800 ECC memory, upgradeable to 192 GB. Networking covers dual 10 GbE and dual 1 GbE out of the box, with PCIe Gen 5 x8 and x4 slots available for 25/40/50 GbE NICs or SAS cards if you need more. Asustor quotes SMB multichannel speeds of up to 2,309 MB/s read and 1,886 MB/s write over 10 GbE in RAID 5.

The rest of the feature set is what you'd expect at this level: RAID 0/1/5/6/10/50/60, hot-swap bays, a hardware encryption engine, M.2 PCIe Gen 5 SSD support, four USB 3.2 Gen 1 Type-A ports, and dual redundant 550 W 80 Plus Platinum PSUs. No pricing has been announced.

The CP152-1 is a concept PCIe storage adapter card designed to explore market demand for a compact, rear-swappable 2.5" SATA SSD/HDD solution with built-in RAID 1 functionality. By utilizing a dual-slot PCIe form factor, the CP152-1 enables the installation of two 9.5 mm 2.5" SATA drives with RAID 1 or JBOD support, delivering a simplified approach to data protection and storage expansion without the need for traditional drive cages or backplanes.

The CP152-1 adopts a rear-accessible removable tray architecture, allowing system integrators to evaluate alternative service workflows and chassis layouts while maintaining a clean, cable-free PCIe installation.

Upgrade the standard 9.5 mm Ultra-Slim ODD bay into a removable U.2/U.3 NVMe SSD bay that delivers enterprise-class speed and reliability in limited space. Ideal for Dell, HP, and Lenovo business desktops, compact workstations, and industrial or government systems, the MB411V4PO-2B enables quick drive maintenance, secure data access, and flexible storage expansion for environments where uptime and serviceability matter. This conversion adapter enables quick drive maintenance, secure data access, and flexible storage expansion where uptime and serviceability are essential.

OCuLink 4i PCIe Gen 4 x4 - Native U.2/U.3 NVMe Performance
Equipped with a native OCuLink 4i (SFF-8612) interface, the MB411V4PO-2B connects directly to NVMe hosts for PCIe Gen 4 x4 performance, delivering up to 64 Gbps transfer bandwidth - over 10× faster than traditional SATA ODD interfaces (6 Gbps). This dramatic increase in throughput enables faster data migration, real-time backups, and improved workflow efficiency for business and industrial applications.

AMD, a leader in high-performance and AI computing, and Tata Consultancy Services, a global leader in IT services, consulting, and business solutions, have expanded their strategic collaboration. TCS, through its subsidiary HyperVault AI Data Center Limited (HyperVault), and AMD will codevelop a rack-scale AI infrastructure design based on the AMD "Helios" platform in support of India's national AI initiatives.

Powered by GPUs, next-generation AMD EPYC "Venice" CPUs, AMD Pensando Vulcano NICs and the open ROCm software ecosystem, "Helios" is purpose-built to deliver a rack-scale AI platform supporting sovereign AI factories. "Helios," combined with TCS' enterprise expertise and scale, will accelerate deployment and enhance operational efficiencies for enterprises. As part of this strategic collaboration, both companies will offer an AI-ready data center blueprint supporting up to 200 MW of capacity and will work with hyperscalers and AI companies to accelerate data center build-outs in India.

During Foxconn's annual tech day in Taipei, the company announced that its $1.4 billion supercomputing center, built in partnership with NVIDIA, will be ready in the first half of 2026. The facility will become Taiwan's largest advanced GPU cluster, powered by NVIDIA Blackwell GB300 hardware and operated under Foxconn's new AI and cloud unit, Visonbay.ai. NVIDIA VP Alexis Bjorlin said that with GPU performance rising so quickly, many companies will find it more economical to rent compute capacity instead of building their own facilities. Foxconn plans to invest $2-3 billion per year in AI as Chairman Young Liu says the company can already build around 1,000 AI racks per week, a number set to rise next year.

In a separate announcement, OpenAI confirmed a new partnership with Foxconn to co-develop hardware for data centers. Foxconn will design and manufacture components such as cabling, power systems, and other infrastructure gear. While the agreement doesn't include purchase commitments, OpenAI will get early access to test the hardware. Foxconn's deepening collaboration with OpenAI mirrors the model it already uses with Google, AWS, and Microsoft. The partnership gives Foxconn better feedback on rack design and helps speed up new system development. OpenAI CEO Sam Altman said that demand for advanced AI infrastructure continues to exceed supply, and that new AI models will require new types of server racks, cooling systems, and power hardware.

ASUS today announced the rollout of XA GB721-E2, built on NVIDIA GB300 NVL72 rack-scale system. Designed for large-scale model training, high-throughput inference, and advanced AI/HPC workloads, the system combines breakthrough performance, sustainable liquid cooling, and serviceability at rack scale to help enterprises and research institutions accelerate innovation.

Rack-scale performance with NVIDIA Grace Blackwell Ultra GPU
NVIDIA GB300 NVL72 systems integrate 36 NVIDIA Grace CPUs and 72 NVIDIA Blackwell Ultra GPUs in a single NVIDIA NVLink domain, delivering ultra-low-latency, high-bandwidth GPU-to-GPU communication for trillion-parameter workloads. Together with NVIDIA Quantum-X800 InfiniBand platform or NVIDIA Spectrum-X Ethernet platform and NVIDIA ConnectX-8 SuperNIC, the system is engineered for high-throughput inference and cluster-scale expansion, fully support the recent need of enterprise AI factory innovation.

Qualcomm Technologies, Inc. today announced the launch of its next-generation AI inference-optimized solutions for data centers: the Qualcomm AI200 and AI250 chip-based accelerator cards, and racks. Building off the Company's NPU technology leadership, these solutions offer rack-scale performance and superior memory capacity for fast generative AI inference at high performance per dollar per watt—marking a major leap forward in enabling scalable, efficient, and flexible generative AI across industries.

Qualcomm AI200 introduces a purpose-built rack-level AI inference solution designed to deliver low total cost of ownership (TCO) and optimized performance for large language & multimodal model (LLM, LMM) inference and other AI workloads. It supports 768 GB of LPDDR per card for higher memory capacity and lower cost, enabling exceptional scale and flexibility for AI inference.

We are excited to introduce our latest 4U rack server chassis, the UNC-409S-AIO-OP. Designed for demanding industrial environments, it combines robust performance, flexible configuration options, and reliable durability.

The UNC-409S-AIO 4U rack server chassis is engineered to deliver robust performance and dependable reliability in demanding industrial environments. Constructed from 1.2 mm thick SGCC steel, it offers superior hardware protection and serves as a durable, long-term solution with flexible configuration options.
To enhance thermal efficiency, the chassis supports the installation of a 360 mm all-in-one (AIO) water cooler, enabling effective CPU heat dissipation. It accommodates various motherboard form factors, including SSI-EEB, allowing for high-performance configurations. It supports either a standard ATX PSU or a mini-redundant PSU, ensuring stable power delivery and system redundancy for mission-critical operations.

Today at the Open Compute Project (OCP) Global Summit in San Jose, AMD (NASDAQ: AMD) showcased a static display of its "Helios," rack scale platform for the first time in public. Developed based on the new Open Rack Wide (ORW) specification, introduced by Meta, "Helios" extends the AMD open hardware philosophy from silicon to system to rack, representing a major step forward in open, interoperable AI infrastructure.

Extending AMD leadership in AI and high-performance computing, "Helios" provides the foundation to deliver the open, scalable infrastructure that will power the world's growing AI demands. Designed to meet the demands of gigawatt-scale data centers, the new ORW specification defines an open, double-wide rack optimized for the power, cooling, and serviceability needs of next-generation AI systems. By adopting ORW and OCP standards, "Helios" provides the industry with a unified, standards-based foundation to develop and deploy efficient, high-performance AI infrastructure at scale.

STULZ, the global based mission-critical air conditioning specialist, has announced the availability of its innovative CyberRack SideCooler. Precision engineered to meet the cooling demands of data centers in space constrained or remote locations with major benefits for edge add microdata centers. This closed loop water cooled unit is ideal for environments with higher heat loads, where efficient air conditioning is essential for optimal operation and uptime.

The CyberRack SideCooler has been designed with flexibility at its core. It can be seamlessly integrated between server racks or within a microdata center, delivering efficient cooling directly at the heat source. Its compact footprint maximizes space efficiency, while front and rear service access points simplify maintenance work. Additionally, the use of hot-swappable fans enables quick, safe replacement without interrupting operations.