Intel's upcoming Core Ultra 4000 "Nova Lake-S" desktop processors will reportedly cap their maximum core frequency at 5.1 GHz whenever they run above 90°C, according to Intel leaker Jaykihn on X. He says the limit applies to the entire Nova Lake-S desktop lineup, works separately from regular TjMax throttling at 100°C, and can't be raised. He also notes that the information is still preliminary. In practice, it looks like a safety net that sits between normal boost behavior and full thermal throttling. Below 90°C, the chips should presumably boost as usual, and models that don't exceed 5.1 GHz in the first place wouldn't be affected at all.

Final Nova Lake clocks aren't official yet, though the current Core Ultra 9 285K already boosts up to 5.7 GHz, so a high-end Nova Lake chip that runs hot could lose a sizable chunk of its peak frequency. A 100°C TjMax would also be lower than Arrow Lake's 105°C, which can be manually raised to 115°C on the 285K. That puts more weight on cooling, since the 28-core Core Ultra 9 4970K BFC was reportedly set to pull up to 296 W at PL2 despite its 125 W rating, and staying under 90°C at that kind of power draw will probably take a really capable cooler. Nova Lake-S is currently expected to arrive in Q1 2027, and Intel hasn't confirmed any of this yet.

Microsoft has rolled out the first firmware update for its RTX Spark-powered Surface Laptop Ultra, less than a week after the laptop started shipping on October 16. Listed in Windows Update as "System Hardware Update 200.0.7.0," the October 22 release fixes three problems spelled out in Microsoft's update history: extended reboot times, screen flickering, and unexpected restarts. It also bundles unspecified bug fixes and general performance improvements. The update is arriving in stages, so not every owner will see it right away, and like other Surface firmware, it can't be rolled back once installed.

These issues had already surfaced in early reviews and owner reports. Windows Central noted reboots long enough to roughly double the time it took to install updates, while some owners saw the Mini-LED panel flicker, in a few cases only when the display sat idle. However, the update doesn't address everything reviewers flagged. Notebookcheck measured a sluggish 57 ms black-to-white response time with visible ghosting, no local dimming, and a grayish 0.61-nit black level, and it seems unlikely that firmware can do much about those. Some owners have also reported the laptop running hot under light workloads, which Microsoft hasn't mentioned.

Intel's Core Ultra 9 4995HX looks set to be the fastest Nova Lake chip for laptops. Leaker Jaykihn on X has confirmed that the 4995HX uses an 8+16+4+2 layout, meaning 8 P-cores, 16 E-cores, 4 LPE cores, and 2 Xe3 GPU cores. That adds up to 28 CPU cores, four more than Intel's current Arrow Lake-HX chips, with the extra cores coming from the LPE cluster Arrow Lake-HX lacked. The overall layout matches the 8P+16E+4LP ceiling earlier reports pointed to, and the name itself fits the Core Ultra 4000 branding said to be extending to HX parts. Intel hasn't confirmed any of this, and clocks, cache, and power figures are still unknown.

The same post lists the Core Ultra 9 4970H as 4+8+4+12, so 16 CPU cores and a 12-core Xe3P iGPU. That is the same core count as Panther Lake's flagship Core Ultra X9 388H, so any gains here should come from the new Coyote Cove P-cores, Arctic Wolf E-cores, and Xe3P graphics rather than extra cores. The tiny iGPU on the 4995HX is less of a concern, since HX chips almost always end up paired with a discrete GPU anyway. Jaykihn also put the final 8+16 HX compute tile, built on TSMC N2P, at 14.8 x 6.6 mm, or roughly 98 mm², shortly after die shots of both chips surfaced. Current reports point to the first Nova Lake-H and HX laptops showing up around CES 2027, though that timing should be treated as tentative for now.

Colorful has just released its latest overclocking motherboard, the X870E Ultra-S V14, a new E-ATX unit with 16+2+1 power phases, five M.2 slots, and plenty of high-speed I/O. The new motherboard, as shared by IT Home, is priced at 1,899 CNY, which comes out to around $284 at the time of writing, although it only seems to be available in China for the time being. The iGame X870E Ultra-S V14 is explicitly marketed to overclockers on AMD's AM5 platform, bearing XMP/EXPO memory overclocking and asynchronous BCLK CPU overclocking, a digital debug display, EZ Debug diagnosis, and easily accessible rear I/O buttons for both clear CMOS and BIOS updates.

The motherboard also features Wi-Fi 7 and 5 GbE networking built-in, alongside expansive rear I/O that includes: 4× USB Type-A 5 Gbps, 3× USB Type-A 10 Gbps, 2× USB Type-A 2.0, 2× USB4 40 Gbps, and both 3.5 mm line in/out ports and SPDIF out for audio. Colorful claims that its 16+2+1 VRMs are capable of 80 A, and the VRMs are covered by beefy aluminium heat sinks. It also has five M.2 slots for expanded storage, each with its own heat sink. The Colorful iGame X870E Ultra-S V14 is available on JD.com at the time of writing.

Intel's "new" four-digit Core Ultra 4000 naming apparently isn't limited to desktop chips. Prominent leaker Jaykihn says on X that "Nova Lake-HX" laptop processors will use the same four-number format, while H-series and suffix-less mobile chips continue with the three-digit naming of the previous generation. The clarification follows a leaked list of seven "Nova Lake-S" desktop processors that showed names like Core Ultra 9 4970K BFC and Core Ultra 7 4870K BFC. In that list, the BFC suffix seems to mark the models with bLLC (big last-level cache). As for the mobile versions, HX chips have traditionally been BGA versions of Intel's desktop silicon, so it looks like Intel is grouping them with Nova Lake-S instead of the other laptop chips. Those would presumably fall under Core Ultra 400, although Jaykihn didn't name the series.

The HX claim isn't entirely new, either. When the Core Ultra 9 4950K surfaced in a CPU-Z leak in August, leaker Golden Pig Upgrade had already mentioned Core Ultra 4000HX naming for laptops. Jaykihn also seems to have cleared up one detail from the desktop list. Apparently, the non-BFC models keep their four LPE cores, even though the leaked table didn't show them for every SKU. We haven't seen any HX model names yet, and Intel hasn't confirmed the naming change. Nova Lake-S qualification samples are already showing up in HWiNFO, and reports point to an early 2027 launch. As if Nova Lake-S reusing Haswell's 4000-series numbering wasn't enough, laptop buyers will probably have to deal with two naming schemes in one generation.

Update Oct 17th: Leaker Jaykihn has now retracted part of that statement. Apparently, H-series and suffix-less Nova Lake Mobile CPUs also utilize the four-number "Ultra 4000" naming scheme.

It has previously been rumored that Apple is planning to launch a new MacBook Pro with a touchscreen OLED panel, ostensibly as a range-topping model that would slot in above the current-gen MacBook Pros. Now, a report by Bloomberg claims that the touchscreen MacBook Pro will launch alongside a new OLED iPad Mini on October 27 or close to that date.

A beta version of macOS 27.2 previously showed up substantiating the rumors that Apple is launching a touchscreen MacBook Pro, with new long-press animations being implemented in the Dock UI for tooltips. It's said that the two new devices will launch alongside a 14-inch M6 MacBook Pro and M6 iMac.

AMD held a press briefing to share how its "Agentic PC" push is going, and it brought a fair number of figures along. Apparently, the company has shipped over half a million Agentic PCs across more than 50 designs, alongside tens of millions of AI PCs across more than 250 designs. Of course, the term "Agentic PC" is AMD's own. It covers any PC whose CPU, GPU, and NPU can run AI agents locally, and AMD says Ryzen AI Max+ systems with 64 GB of memory or more give the best experience. The Ryzen AI Max 400 series is pitched as the "next-gen Agentic PC" for 2026, and most of the briefing focused on its flagship, the Ryzen AI Max+ PRO 495 "Gorgon Halo" with 192 GB of memory.

Following what appears to have been a series of unfortunate events that led to a roadside laptop find resulting in confirmation that Microsoft will be launching a 20-core NVIDIA RTX Spark Surface Laptop, we now appear to have confirmation that Microsoft will also be launching a Surface Laptop Ultra on the other end of the Spark spectrum. According to Windows Central, Microsoft will reveal the full RTX Spark Surface line-up on October 7 at a special event in San Francisco.

Alongside the 20-core variant, the Windows Central report claims that Microsoft will launch a Surface Laptop with NVIDIA's 18-core RTX Spark. It is also claimed that the 18-core SKU will start with 24 GB of unified memory, while the 24-core version will start with 32 GB of memory. There will reportedly be a performance demonstration that shows off how the new Arm SoC delivers the same level of performance on battery life as it does when plugged into the wall.

A new leak by @laurentschoice lists seven desktop Nova Lake-S processors under what looks like Intel's new four-digit Core Ultra 4000 naming, led by a Core Ultra 9 4970K BFC. It apparently has 8 P-cores, 16 E-cores, and 4 LPE cores for 28 in total, plus bLLC (big last-level cache), a 125 W rating, and a 32 EU iGPU. That puts it above the Core Ultra 9 4950K, which first surfaced in a CPU-Z leak in August as a 28-core chip. This list shows the 4950K with 24 cores (8 P-cores and 16 E-cores), without LPE cores or bLLC.

The rest of the list follows a similar pattern. The Core Ultra 7 4870K BFC has 24 cores and bLLC, while the 4850K gets 20 cores without it. There is also a Core Ultra 9 4900 BFC with 22 cores, bLLC, and a 65 W rating. We currently don't know what BFC stands for, although the models carrying it appear to be the ones with bLLC, which Intel is introducing as its answer to AMD's 3D V-Cache. Intel hasn't confirmed any of these names, so they may well change before Nova Lake's official launch.

CD Projekt RED has published the full and updated PC requirements for The Witcher 3: Wild Hunt Remastered, which launches tomorrow, September 29, as a free upgrade for existing owners. Only the minimum and recommended specs were public until now, but the new detailed requirements are broken down by categories and even include separate Ray Tracing and Path Tracing requirements. The updated table covers six tiers: Minimum, Recommended, Ultra, RT Minimum, RT Recommended, and Path Tracing.

The Minimum tier targets 1080p at 30 FPS with the Low preset, and requires a Core i5-8400 or Ryzen 5 2600 CPU, 12 GB of RAM, and a GTX 1660, RX 5500 XT, or Arc A580 graphics card. CDPR says the GTX 1660 can reach 60 FPS or higher there. Recommended (1080p, 60 FPS, High) asks for a Core i7-8700K or Ryzen 5 3600X CPU, 16 GB of RAM, and an RTX 2060 Super, RX 6600 XT, or Arc B580 GPU. If you want to play at Ultra (1440p, 60 FPS), it calls for a Core i7-13700K or Ryzen 7 7700X CPU, 24 GB of RAM, and an RTX 3070 Ti, RX 6800 XT, or Arc B580 graphics card with XeSS.

Intel has released its latest Arc GPU graphics drivers, version 101.9033 beta, which brings day-one support for the new game CONTROL Resonant. We conducted an in-depth review of the game's performance on both traditional discrete GPUs and handheld devices with integrated graphics, including Intel's. In addition to adding support for this game, the GPU driver still contains a range of issues from previous releases that have not been fixed in this beta version. While the beta release focuses on game support, issues like Mafia: The Old Country crashing on "Panther Lake" and Arena Breakout Infinite potentially crashing on Arc "Battlemage" and Arc "Alchemist" remain. Check out the full list of known issues that persist in this driver, but expect a fix in the upcoming WHQL driver update.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.9033 Beta

Beelink already detailed its updates to its ME Pro NAS solutions in May 2026, but it has apparently seen fit to upgrade the internals on its two- and four-bay NAS units once again, this time upgrading the NAS to include Intel's Core Ultra X7 358H line-up. This means the NAS will be able to leverage the powerful Intel Arc B390 iGPU, effectively allowing the NAS to pull double duty as a network-attached render machine or AI accelerator for private cloud applications and similar.

In addition to the Intel Core Ultra X7 358H, the updated version of the NAS will also be available with the Intel Core Ultra 5 325H, which is a much less powerful CPU. The Beelink ME Pro NAS was previously shown to come in both two- and four-bay configurations, and the Chinese version will ship with Feinui fnOS to manage file backups and remote access, and it will have built-in AI video management and organization capabilities. Tencent's Marvis will also be installed for file search, categorization, and archiving. It's currently unclear if the upgraded Beelink ME Pro NAS will launch with those AI features included when it hits international markets, but an October launch is expected.

Honor, the smartphone and computer company formerly owned by Huawei, has officially revealed the Tiangong AXB35, a new AI workstation platform that designed for enterprise use and made to run on a choice of AMD, Intel, or NVIDIA hardware in a tiny SFF desktop chassis measuring just 70 × 192 × 203 mm, or around 2 L volume. Honor says that the Tiangong SFF PC is designed for everything from high-level office work and local knowledge bases, AI inference workloads, and agentic applications, but it would also be useful as a raw computational workstation for everything from 3D modelling and creative tasks to developing, and even gaming.

The Tiangong AXB35 comes in three variants: Standard, Pro, and Ultra, The Standard AXB35 comes equipped with Intel's Core Ultra X7 358H CPU, which features the new Intel Arc B390 iGPU, a total of 16 cores (4× P-Cores, 12× E-Cores, 4× LP E-Cores), and support for up to 96 GB of memory. The Pro version comes with AMD's 16-core Ryzen AI Max+ 395, packing the Radeon 8060S iGPU and up to 128 GB of LPDDR5X memory on a wide 256 GB/s bus. Meanwhile, the Ultra version comes with NVIDIA's new RTX Spark platform, based on the Arm architecture.

Framework, the maker of repairable laptops and mini PCs, previously stirred up some controversy when it increased pre-order pricing on its Laptop 13 Pro after promising that the announced pricing would hold throughout pre-orders. Following that July price increase, however, Framework has revealed that it has once again dropped the price of pre-orders on the Framework Laptop 13 Pro, after it was able to secure a batch of LPCAMM2 memory at a lower price.

According to the latest update to Framework's RAMpocalypse tracker and updater page, the new Laptop 13 Pro pricing will not be lower than the original pre-orders, but it will be lower than the adjusted pricing after the previous price increase—that is to say, buyers will still be paying a higher price than expected, but it will not be as much higher. Framework will not only be reducing prices for currently available pre-orders, but it will be retroactively applying a discount to existing pre-orders and issuing partial refunds for pre-orders that have already been shipped at the higher price.

Intel's upcoming "Nova Lake-S" desktop processors are nearing launch, and the rumor mill is intensifying as we receive more information about clock speeds, core configurations, and power consumption. According to a post on the Weibo forums, Intel's 28-core SKU with a big last-level cache (bLLC) integrated into the package will reach up to 296 W of power consumption at the Power Level 2 (PL2) setting. This is the maximum power draw the CPU can achieve during short bursts of turbo clocking, reaching its peak. Compared to the current top-end "Arrow Lake-S" 24-core Core Ultra 9 285K, which has a PL2 setting of 250 W, the additional four LPE-Cores on the latest "Nova Lake-S" will increase that number by about 18.4%.

Previously, we learned that "Nova Lake-S" will be very power-hungry, especially in the top-end SKUs. For example, Intel's top-end, overclocking-focused, dual compute die "Nova Lake-S" CPU with 52 cores will feature a PL2 mode with a power level of 474 W. This is an unprecedented number for an Intel consumer desktop platform, typically expected from a high-end desktop (HEDT) design. However, since this is a 52-core design that can be overclocked, it represents the highest CPU PL2 setting that Intel will be shipping with "Nova Lake-S." For single compute die SKUs, the PL2 limit appears to be 296 W.

Keychron previously teased the V6 Ultra Hybrid, a new wireless hybrid keyboard that is compatible with both magnetic and mechanical switches, and the company has now officially launched the new keyboard on Kickstarter with a pledge goal of $30,000. Merely a day after launching on the crowdfunding platform, the V6 Ultra Hybrid has managed to accrue over $166,000 from 926 backers.

The Keychron V6 Ultra Hybrid is compatible with both regular MX-style 3- or 5-pin mechanical switches and more modern, gaming-oriented magnetic switches, thanks to its TMR sensing tech. The keyboard has a built-in mechanism to automatically detect whether mechanical or magnetic switches are installed in a given socket and automatically switch between mechanical or magnetic mode without human intervention.

Intel's upcoming desktop CPU generation, part of the "Nova Lake-S" processor family, might adopt a new naming convention that returns to a four-digit format, unlike the current three-digit format used in the "Arrow Lake" family. According to a leaked CPU-Z submission, Intel's Core Ultra 9 4950K has been identified as a 28-core "Nova Lake-S" desktop chip. It features 8 "Coyote Cove" P-Cores, 16 "Arctic Wolf" E-Cores, and 4 LPE-Cores. This chip was tested on an unknown Z990 high-end overclocking platform, where it achieved over 1,000 points in single-core CPU-Z rankings and exceeded 20,000 points in multicore performance. This performance surpasses any consumer-focused desktop CPU currently available.

Despite this information, it's still uncertain if the naming convention is final. Intel is testing many SKUs for "Nova Lake-S," and a four-digit naming could be necessary due to the numerous SKUs and configurations. Some leakers, like Golden Pig Upgrade and Gotou_3rd, have suggested that the four-digit naming is a possibility, leaving room for speculation. Interestingly, qualification samples for NVL-S have not yet started shipping, but we can expect these shipments in the coming weeks, before manufacturers and motherboard makers begin integrating the latest CPU generation into their products.

According to supply chain sources and those close to TSMC, NVIDIA is already working on prototyping the replacement for its "Rubin" and "Rubin Ultra" GPU designs with the next-generation "Feynman" GPU microarchitecture. As noted in the latest report from DigiTimes, NVIDIA is opting for TSMC's A16 node, bypassing the N2 family of nodes entirely in favor of the more advanced 1.6 nm A16 design. Mass production is scheduled for the second half of 2028. The "Feynman" designs will rely on the backside power delivery in the A16 node, as well as on packaging technologies like 3D chiplets using SoIC, CoWoS-L 2.5D integration, and next-generation panel-level packaging.

Initially, NVIDIA will use SoIC 3D stacking technology to stack multiple chiplets into a single package, which will shorten the travel time between chips and reduce latency. These 3D chips will then be packaged side-by-side in a CoWoS-L or CoPoS packaging, creating a multi-kilowatt design capable of processing dozens of PetaFLOPS. For memory, NVIDIA will work with its partners to develop customized HBM, likely HBM4E, by the time "Feynman" reaches mass production. This customized memory includes a specialized base die that can contain logic elements like a memory controller or packet processing unit. Think of it as a way to pre-process data before it enters memory, or as a simple speedup, depending on what NVIDIA aims to achieve.

Intel is gradually laying the groundwork for the launch of its Core Ultra 400 "Nova Lake-S" desktop processors with a basic branding overhaul. However, the company is reportedly preparing different launch dates for various SKUs, according to VideoCardz. We know that Intel has SKUs arriving with either one or two compute dies, featuring up to 8 "Coyote Cove" P-Cores and 16 "Arctic Wolf" E-Cores, along with 4 LPE-Cores that are part of the I/O die. Depending on the SKU, Intel can pack a single compute die for up to 28 cores total or two compute dies for a 52-core CPU SKU. It seems that the single compute die version will arrive first, with the dual compute die variants following. The 28-core "Nova Lake-S" DS version, a new SKU segment, is expected to launch in Q1 of 2027. For the regular overclocking-focused "K" SKUs, Intel reportedly plans an early Q2 launch between March and April.

What is particularly interesting to enthusiasts is when the 52-core compute powerhouse will launch. With its dual compute dies, Intel's most powerful desktop CPU is set to arrive between late May and September 2027, bringing this model to consumers. As for a possible reason why Intel is choosing such a schedule, we might assume that the recent change in plans to bring back most of the compute tile production on the 18A node is the reason. As Intel ramps up 18A high-volume manufacturing for its internal needs, the company likely needs more time to stockpile fully-fledged compute dies for the flagship 52-core SKUs. Since they require double the compute tiles compared to the 28-core designs, the production capacity may need to catch up first.

Apple has recently overhauled its entire M-Series chip plans, scrapping the launch of the M6 Pro and M6 Max processors and jumping straight to the M7 series. While the base M6 SoC is expected to launch, Apple is moving into the M7 series without the M6 Pro/Max variants, with plans to offer some of the most powerful computing solutions in the market. Apple is testing the M6 SoC in the base MacBook Pro model, featuring many improvements in CPU microarchitecture and NPU performance for local AI processing. Reportedly, memory is also being upgraded for higher bandwidth, now targeting around 200 GB/s, up from 123 GB/s in the current base M5 SoC. The integrated GPU will see a 20% increase in core count, featuring 12 GPU cores in the M6, which will be a noticeable improvement from the current 10-core configuration in the M5.

However, Bloomberg's Mark Gurman, in the PowerOn newsletter, confirmed that Apple's plans for the M7 Ultra chip include much faster local AI with more CPU, GPU, and NPU power, as well as a total memory capacity of 1.5 TB, a configuration only seen on the Mac Pro desktop systems. Next year's base M7 processor is expected to arrive in the first half of 2027 and will also upgrade memory bandwidth to about 240 GB/s. This is supposed to be the first Intel-manufactured Apple Silicon design, utilizing the 18A-P node. The M7 Pro and M7 Max will arrive in late 2027 with much higher bandwidth and performance. An M7 Ultra version will follow in 2028 for Mac Studio, which will be a 1.5 TB DRAM machine. With that unified memory, local model development and heavier tasks will be supported without hassle.

Recently, new Intel Nova Lake-S iGPU IDs were added to the Linux kernel driver stack, revealing that Intel may be planning to launch as many as seven SKUs in the Core Ultra 400 desktop CPU series. Until a new rumor by leaker @jaykihn0 on X, however, little was known about the upcoming Nova Lake-H and Nova Lake-S CPUs and their iGPU configurations. The leaker claims that Intel's Nova Lake-S desktop line-up will feature at least one SKU with a 12-core Xe3P iGPU configuration.

A 12-core Xe3P iGPU solution would conceivably be a worthwhile entry-level dGPU replacement, given the performance observed in tests of the current Xe3 B390 iGPU. The leaker also tips that Nova Lake-H, the upcoming mobile CPU line-up, will feature several 12-core Xe3P configurations, similar to the current Core Ultra X7 358H and Core Ultra X9 388H SKUs which both feature 12 Xe3 cores, while lower-end Nova Lake-S and -H parts will fall back to 4 Xe3 or 2 Xe3 configurations. There is no word on whether there will be a 10-core Xe3 or Xe3P iGPU SKU as there is with the Arc G3 handheld gaming CPU family. These leaks come not too long after another rumor revealed that Intel's Xe3P iGPU architecture is expected to be significantly faster than even the current Arc B390 iGPU that has taken the crown for high-performance integrated graphics from the likes of AMD's Radeon 890M.

Apple has reportedly canceled its M6 Pro and M6 Max processors, according to a recent note from Bloomberg's Apple insider Mark Gurman. Behind the scenes, there is a significant shift in Apple's silicon rollout strategy. The company is postponing the launch of its higher-end M6 SoC variants, like the M6 Pro and M6 Max, and is instead moving directly to the M7 processor family. Currently, Apple is testing the M6 SoC in the base MacBook Pro model, with many improvements in CPU microarchitecture and NPU performance for local AI processing. Reportedly, memory is also being upgraded for higher bandwidth, now targeting around 200 GB/s, up from 123 GB/s in the current base M5 SoC. The integrated GPU will see a 20% increase in core count, featuring 12 GPU cores in the M6, which will be a noticeable improvement from the current 10-core configuration in the M5.

Regarding the more powerful versions of the M6, such as the M6 Pro and M6 Max, this will be the first generation of Apple M-Series chips to lack the Pro and Max versions, as these will appear in the next-generation M7 series coming next year. Apple is planning a complete overhaul of the SoCs to bring major performance increases for on-device AI processing, which will first appear with the M7 SoCs. Next year's base M7 processor is expected to arrive in the first half of 2027 and will also upgrade memory bandwidth to about 240 GB/s. As a reminder, this is supposed to be the first Intel-manufactured Apple Silicon design, utilizing 18A-P node. The M7 Pro and M7 Max will arrive in late 2027 with much higher bandwidth and performance. An M7 Ultra version will follow in 2028 for Mac Studio.

At Computex 2026, NZXT has debuted its latest Ultra RGB Fan series, which upgrades the materials and design of the existing RGB fan frame with a focus on premium aesthetics and customization. The NZXT Ultra fans come in four sizes: F120U with a single 120 mm fan, F140U with a single 140 mm fan, F360U with three 120 mm fans, and F420 with three 140 mm fans. Each fan frame features a single eight-pin NZXT combo header that serves as both RGB and PWM control, and the single-fan versions have two RGB zones, while the three-fan F420U and F360U frames have three zones each. Pricing on the new NZXT Ultra Fans comes in at $29.99 for the F120U, $34.99 for the F140U, $89.99 for the F360U, and $99.99 for the F420U. The new fans use the same fluid dynamic bearings as the original frame fans, but this time, there is a metallic accent on the fan hubs for a more premium touch.

As with previous NZXT Fan Frame designs, the Ultra Fan series aims to minimize cable clutter and streamline both physical installation and software management of case fans. The Ultra Fans take use standard 120 mm and 140 mm fan screw spacing, but there are only four screws per frame on both the small and large frames. The Ultra fans also feature an RGB-illuminated loop around the fans, in addition to the typical fan hub lighting effects, and you can run different effects on the hub and loop. The RGB addressable RGB zones in the Ultra Fan series are customizable in NZXT Cam, but there is an optional 5 v ARGB header for native motherboard control instead. NZXT claims that the frames with 120 mm fans offer noise levels of 32.2 dBA per fan, while the 140 mm variant bumps it up to 36.9 dBA per fan. Both fan frames are available in black and white. NZXT also showed off the RGB Reverse Fan single-fan frame, which takes the original 360 and 420 mm Frame designs and flips the fan orientation for more diverse PC build options.

ASRock has officially announced an update to its fanless iBox mini PC line-up designed for industrial applications. The updated versions of the iBox mini PCs are available with either the Intel Core Ultra X7 358H and the Intel Core Ultra 5 325 CPUs. The Core Ultra X7 CPU variant will be available with dual-channel DDR5-7200 RAM, while the Ultra 5 325 SKU comes with dual-channel DDR5-6400 memory, both are available with up to 128 GB of memory, and all SKUs support in-band ECC. The mini PCs do not ship with storage, but they feature both an M.2 2242 and 2280 slot (M key).

The chassis of the ASRock iBox is made of aluminium and weighs in at 3 kg, with the aluminium housing aiding in cooling the Panther Lake internals. Given its industrial intentions, the iBox fanless PC is quite pragmatic, with a number of high-speed connectivity options. The iBox mini PC's front I/O consists of a single USB 3.2 Gen2 Type-A port, a Thunderbolt 4/USB4 port with DP 2.1 support, a USB 3.2 Gen2 ×2 Type-C port with DP 1.4a support, two USB 2.0 Type-A ports, a 3.5 mm audio jack, and a COM port. On the rear, there are dual HDMI 2.1 ports, two 2.5 Gb Ethernet LAN ports, two USB 3.2 Gen2 Type-A ports, and an OOB port for remote power on/off/reset functionality. Pricing is subject to inquiry on ASRock's product page.

Keychron has been busy updating its mechanical keyboard line-up over the last few months switching to hyperefficient firmware and its updated Silk POM mechanical switches. Now, the Keychron Q11 gets the same treatment, with the Q11 Ultra being a much bigger improvement over the original Q11 than the other keyboards Keychron has recently updated. The reason for this is that Keychron's only split keyboard was the Q11, with no Max or Pro variants to add wireless connectivity into the mix. This time, though Keychron has gone one step further with the Q11 Ultra, not only eliminating the USB-C cable to the PC, but also making the two halves of the split keyboard communicate wirelessly as well. Keychron claims that the dual batteries in the Q11 Ultra are capable of delivering 300 hours on a single charge, and the keyboard connects via Bluetooth, 2.4 GHz, or via the USB-C cable on the left half. With 2.4 GHz and the wired connection, the polling rate can go as high as 8 kHz, even though that's hardly necessary for a mechanical switch. The Q11 Ultra is available for $239.99 from Keychron's online store.

The Q11 Ultra is a 75% split keyboard, meaning the keyboard splits in half for ergonomic purposes, although it still maintains the row staggered layout, so it should feel familiar for most users coming from a regular mechanical gaming keyboard. Despite the 75% layout, the Q11 Ultra has an additional five-key macro column on the left edge of the left side of the keyboard, and there are two programmable knobs—one on each half of the keyboard. The keyboard cases are constructed from CNC aluminium with an integrated top plate, and the keyboard uses double-shot PBT keycaps in Keychron's KSA profile. The Q11 Ultra is only available in black with blue accent keycaps, and it seems to miss out on the decorative bottom panel found on the likes of the Keychron Q1 Ultra. It comes with a choice of Keychron Silk POM Red (linear), Brown (tactile), and Banana (sharp tactile) switches, but the PCB is hot-swap compatible, so you can bring your own switches and keycaps if you don't like the stock experience. The Q11 Ultra has south-facing per-key RGB backlighting, which, along with the layout, is fully programmable in Keychron Launcher.