Intel is expected to start shipping Xeon E3 processors based on 22 nm "Ivy Bridge" silicon within June, according to a DigiTimes report. A key feature of the new Xeon chips driving its advent is support for PCI-Express 3.0, which could greatly increase bandwidth for compatible add-on cards and controllers. Ivy Bridge allows PCI-Express lanes from the processor root complex to be split into x16, x8, and even x4 links, which greatly increase bandwidth from previous-generation PCI-Express 2.0 bus. Built in the LGA1155 package, the new Xeon chips will be compatible with existing platforms that run Xeon Sandy Bridge processors, as well as new lines of server/workstation motherboards that feature PCI-Express 3.0 expansion. We know from a slightly older report that Intel will launch low-voltage Xeon processors around this time.

ASUS has plans to give several of its Z77 and H77 chipsets-based motherboards support for Thunderbolt I/O by means of an optional add-on card. Several of currently-launched ASUS 7-series chipset motherboards feature a header marked "TB_HEADER", which lets the motherboard interface with the Thunderbolt I/O add-on card. This header most likely transmits the motherboard's DisplayPort link (from the Flexible Display Interface) to the Thunderbolt I/O card. The card itself is likely based on Intel's 2-channel "Cactus Ridge" Thunderbolt controller, and connects to the system bus over PCI-Express 2.0 x4. ASUS motherboards supporting the optional Thunderbolt add-on card with the TB_HEADER include Maximus V Gene, P8Z77-V Deluxe, P8Z77-V Pro, P8Z77-V, Sabertooth Z77, P8H77-V, and P8H77-M Pro. The Thunderbolt I/O card should be available starting April 27.

Here are the first pictures of retail boxes of Intel's Core i7-3770K "Ivy Bridge" processors in the LGA1155 package. Pictured below are boxes sourced from a Chinese distributor. Regional branding aside, the box-art hasn't changed from that of the 2nd Generation Core processor family, even the die-shot CGI in the center hasn't changed, which is a missed opportunity. Intel could have used art inspired by the Ivy Bridge silicon, which could have helped identify the new chips easier. The box simply marks the model number "3770K" and socket type "LGA1155" on the key sticker.

The side sticker is where the action is. We know from countless earlier reports, including Intel's RetailEdge marketing material that the TDP rating of "Ivy Bridge" quad-core parts, including the i7-3770K, was rated to be 77W. The sticker on retail i7-3770K, however, tells a different story. The TDP is rated at 95W, on par with previous-generation parts such as i7-2700K. The S-spec number is revealed to be "SR0PL". Before such an important CPU launch as "Ivy Bridge", it's hard to control pre-launch proliferation of retail parts to people who are not NDA signatories. Such people have put the i7-3770K through overclocking, and voices are getting louder that the i7-3770K is a worse overclocker than previous-generation "Sandy Bridge". The chip was found to get too hot, too soon, when overclocking.

AMD and Google are locked in a race to buy out MIPS, an application processor architecture designer competitive to ARM. AMD comes from a decades old presence in the microprocessor industry, while Google is a satrap with smartphones, tablets, and other mobile computing devices thanks to its Android operating system. With Microsoft opening up to ARM architecture with Windows 8 RT, it is in Google's interests to hedge its bets on an alternative machine architecture to both x86 and ARM. The easiest way to that is buying out MIPS and funding development of powerful processors based on it. For AMD, it's a bid to stay competitive in the low-power processor market as Intel began making inroads to smartphone processor market.

Today at its annual partner conference, Cisco (NASDAQ: CSCO) announced Partner Plus, a new global channel program targeting mid-sized customers. Partners who participate in the program will receive increased preference, investment and support in the form of business accelerators such as incremental incentives, engineering support, marketing and demand generation, sales enablement, and customer intelligence.

Partner Plus is a key pillar of Cisco's Partner Led strategy, which is designed to empower and reward channel partners to lead the sale with small and mid-sized customers. This approach combines the power of the partner sales force and Cisco's sales force in an innovative way to go after these market segments. This is part of the $75 million investment that Cisco announced in 2011 for enablement, systems, and support capabilities.

Intel's upcoming Core "Ivy Bridge" processors for overclockers, namely the Core i7-3770K, and Core i5-3570K, feature multiplier values previously unavailable for Core "Sandy Bridge" series. Chinese proverclocker x-powerx800pro scraped 6.616 GHz utilizing a base clock multiplier value of 63.0x, a clock speed of 6584.86 MHz (104.52 x 63) was validated using the same setup. These clock speeds were backed by core voltages such as 1.056V, and cooled by extreme cooling. The test-bench included a GIGABYTE Z77X-UD5H, 2x 2 GB G.Skill DDR3-2133 MHz memory, and Corsair AX1200W PSU. These clock speeds were found to be Pi-stable, with 6.511 GHz yielding SuperPi 1M timing of 5.585s.

Intel Corporation today reported quarterly revenue of $12.9 billion, operating income of $3.8 billion, net income of $2.7 billion and EPS of $0.53. The company generated approximately $3.0 billion in cash from operations, paid dividends of $1.0 billion and used $1.5 billion to repurchase stock.

"The first quarter was a solid start to what's expected to be another growth year for Intel," said Paul Otellini, Intel president and CEO. "In the second quarter we'll see the first Intel-based smartphones in the market, ship products based on 22 nm tri-gate technology in high volume, and accelerate the ramp of our best server product ever, providing a tremendous foundation for growth in 2012 and beyond."

UBM TechInsights, the leader in technology and IP consulting, is pleased to recognize Intel - Micron for their collaboration on the Intel-Micron Flash Technologies (IMFT) 20 nm MLC NAND Flash and award them with the Insight Award for the 2011 Semiconductor of the Year.

UBM TechInsights' circuit analysis verified that Intel - Micron's latest Flash component was the first to be manufactured at the 20 nm process node. By using high-k dielectric to replace the silicon dioxide, that is traditionally used, Intel-Micron managed to reduce leakage while keeping power consumption low - a must for today's light weight portable electronics.

Intel Corporation announced today the Intel Solid-State Drive 330 Series (Intel SSD 330 Series), a SATA 6 gigabit-per-second (Gb/s) solid-state drive (SSD) that gives consumers a more affordable entry into the accelerated storage performance of SSDs.

Ideal for upgrading desktop or notebook PCs, the Intel SSD 330 Series offers the price-conscious PC enthusiast a brand-name SSD that blends performance, Intel quality and value. Offered in the most popular capacity points, 60 gigabytes (GB), 120 GB and 180 GB, the Intel SSD 330 Series boosts overall system performance and responsiveness for a broad range of applications.

With the 14 nm "Broadwell" architecture, Intel will take a new step towards integration of the platform-controller hub (PCH) with the CPU, by designing it to be a multi-chip module (with the CPU+northbridge in one die, and PCH on the other). This would make "Broadwell" a true System-on-chip (SoC), which allows over 90 percent of the system's I/O to be routed to the processor socket, including memory, PCI-Express, SATA, USB, etc. Although not the first to the industry with single-chip chipsets and integrated memory controllers, Intel rapidly reshaped the arrangement between CPU and core-logic, over the past four years.

It began with transfer of memory controller from northbridge to CPU die (45 nm "Bloomfield"), and transfer of the entire northbridge to the CPU die (45 nm "Lynnfield"). The graphics northbridge transferred a little more gradually, first as multi-chip module with a separate CPU die (32 nm "Clarkdale"), then complete integration with the CPU die (32 nm "Sandy Bridge"). All through, the southbridge, or I/O controller hub (ICH) remained outside the CPU package, with the addition of a display output logic, it transformed into a "platform controller hub" (PCH), which is still just a glorified southbridge. Naturally then, such a drastic relocation of system components will warrant a socket change.

With over-production, swelling-inventories, and cutthroat competition that doesn't allow even subtle price-increases, DDR3 is a lost-cause for DRAM makers such as Samsung. It is hence hedging its bets on the early arrival of DDR4, and the only company that can make that happen is Intel. Samsung is not only a major supplier of DRAM memory, but also a big player in server memory. It had its first DDR4 UDIMM ready as early as in January 2011. Reports of Intel slating DDR4-equipped platforms in 2013 has Samsung perturbed. Samsung and Hynix are the only two DRAM majors with developed DDR4 products. According to DigiTimes' analysis, DRAM vendors see DDR4 as the only way they can pull themselves out of their ailing situation.

Come 2013, and PC consumers could finally break the shackles of regressive PC resolution "standards" such as 1366x768 and 1920x1080, if Intel has its way. At a presentation at IDF Beijing, Intel expressed its desire to see much higher resolution displays for all computing devices, not just PCs, which could in true terms be "retina-matched" display resolutions. At an optimal (comfortable) viewing distance, the resolution of a computing device's screen should match that of your eyes.

If Intel has its way, a 21" all-in-one desktop PC, and a 15" notebook PC screen will have a resolution of 3840x2160 pixels; a 13" Ultrabook PC could have a resolution of 2800x1800 pixels, a 11" Ultrabook and 10" tablet with 2560x1440, and 5" handheld/smartphone with 1280x800. Compare these to the $500+ 27" 1920x1080 monitors that are still sold in the market! A very bold proposal, but one only a company with the industry prominence of Intel can pull off.

At IDF Beijing, Intel showed off an almost unique new class of Ultrabook devices which could be sold by various notebook OEMs in the future, codenamed "Letexo". This is a tablet + slider ultrabook, similar in form (albeit larger) to the ASUS EeePad Slider, except that it has an Intel processor inside, and runs Windows 8 (the EeePad Slider was NVIDIA Tegra 2 and Android 3.0 driven). When slid down, Letexo is almost as compact and functional as a tablet PC, with its multi-touch screen, letting you take advantage of Windows Metro UI; when slid up, a keyboard and trackpad are revealed, letting you use it as just another laptop. Perhaps Letexo is intended to be a large-scale effort by Intel to bring about a transition between laptops and tablets, by shaping people's usage patterns towards more touch-based interface.A video presentation follows.

Custodian of the Ultrabook specification, Intel pushed the storage industry to churn out slimmer devices to go with increasingly slimmer Ultrabooks sold by the various partner ODMs in the ecosystem. Even as HDD and SSD makers have only just come up with 7 mm-thick storage devices, Intel has a fresh list of changes it wishes to see with storage devices in the very near future, to be able to make it to the constantly-evolving Ultrabook specification. Intel wants near-future storage devices (SSDs and HDDs) to be no thicker than 5 mm.

Further, it wants to see the standard SATA host interface changed from "around" (out of) form, to "along" (inside) form host interface, which further slims down the drive compartment. These proposals were floated at IDF, Beijing. While coming up with slimmer SSDs was never really a tough task for SSD makers, as SSDs are essentially just millimeter-thick printed circuit boards with millimeter-thick components (controller logic, NAND flash memory, and ancillaries), it posed a huge technical challange to mechanical HDD designers, who have had to slim down key components that work to maintain inertial motion of spinning platters. This new proposal for 5 mm-thick HDDs could pose a newer, tougher desgin challenge.

With eager OEMs such as ASUSTek, HP, Acer, and Lenovo breathing down its neck, Intel is reportedly pulling forward the official launch date of its 3rd Generation Core processor family based on 22 nm "Ivy Bridge" silicon, to the 23rd of April, from its older date of 29th April. 23rd April will be the day Intel announces all its processor models originally slated for the 29th.

Notebook OEMs are expected to launch their products based on these chips at the earliest, by May. The date of market-availability of these chips in the retail channel, however, remains unclear. One possibility is that Intel will announce and make these chips available on the same day (23rd), while another possibility is that it announces these chips on the 23rd, allows the media to digest them (by posting reviews), and open them up for sale on the 29th. Two models every PC enthusiast and their cat are looking out for, are the Core i7-3770K and Core i5-3570K.

Intel is planning to launch a line of low-power Xeon processors in Q2-2012, which will be the company's first Xeon processors built on the 22 nm fab process, with 3D transistors. It is quite likely that these chips are built in the LGA1155 package, however Intel is only releasing low-power variants, which ensures performance-segment Xeon E3-1200 family isn't disturbed, and more importantly, it doesn't have to pull out the best bins of its 22 nm Ivy Bridge silicon just yet (for use in higher clock-speed Xeon parts).

Intel has another emerging problem. With the advent of "micro-servers" (low power independent servers in high-density data-centers, which provide better cost-performance and manageability than virtual servers), ARM processor architecture is making inroads to the enterprise computing market. Intel's answer to that is refining the same silicon that goes into making low-power Atom processors, and making it enterprise-grade. This part is codenamed "Centerton", and Intel expects an entire micro-server platform based on these chips to be out in the second half of 2012.

Intel today finally announced its SSD 910 "Ramsdale" PCI-Express SSD family. This is Intel's first SSD in the PCI-Express add-on card form-factor. Like its 2.5" SSD 710 series, the SSD 910 utilizes HET-MLC NAND flash chips, arranged in four SSD subuits. SSD 910 design consists of three stacked PCBs, the one with the PCI-Express 2.0 x8 bus interface holds a PCI-Express to SAS bridge (essentially a RAID controller), and four SAS/NAND ASICs (SSD controllers). Each controller is wired out to its NAND flash memory chips, which are arranged in the other PCBs.

The PCIe-SAS bridge is made by LSI. The SSD 910 series comes in two variants based on capacity: 400 GB and 800 GB. The 400 GB variant has just two SSD subunits, and hence provides transfer rates (according to an older article) of 1 GB/s reads and 750 MB/s writes, with 90,000 IOPS reads, with 38,000 IOPS writes; while the 800 GB variant, with its four subunits, provides 2 GB/s reads with 1 GB/s writes, and 180,000 IOPS reads, with 75,000 IOPS writes. The launch price of the SSD 910 400 GB variant is US $1,929; while the 800 GB variant is priced at US $3859, at launch.

Although Intel will launch its first 3rd Generation Core processor family, based on the 22 nm "Ivy Bridge" silicon, towards the end of this month, it will not be in a position to launch Core i3 desktop processors until Q3. These include 3.40 GHz Core i3-3240, the 3.00 GHz Core i3-3240T, the 3.30 GHz Core i3-3225, the 3.30 GHz Core i3-3220 (slower IGP) and the 2.80 GHz Core i3-3220T. All these chips pack two cores, four threads (with HyperThreading enabled), and 3 MB of L3 cache.

The standard models have 55W TDP, with the energy-efficient "T" models bearing just 35W rated TDP. Introduction of these chips was originally slated for June, but the delay to Q3 may have been caused due to a variety of factors, such as undigested inventories of current-generation chips or even lack of 22 nm production volumes (with a bulk of them being allocated to mobile chips). Q3 begins in July.

For those who thought with the Indilinx buyout and release of Everest and Kilimanjaro series NAND flash controllers, OCZ is on course of becoming a largely self-sufficient SSD industry player, here's a revelation. Its new Everest series silicon, used in recently-launched SSD families (such as Octane and Vertex 4), is essentially a re-badged Marvell controller (found on SSDs such as Crucial M4, Intel SSD 510), with custom firmware developed by OCZ. This discovery by Anandtech was confirmed by OCZ (Indilinx).

The Indilinx Everest (Octane and Petrol series) and Everest 2 (Vertex 4 series), are both re-badged Marvell chips with Indilinx firmware. Although it doesn't change anything, it perfectly explains how OCZ could come up with two "new" SSD controllers (Everest and Everest 2) almost instantly, after the Indilix acquisition. Everest 1 is essentially a higher-clocked Marvell 88SS9174, while Everest 2 could very well be a re-badged Marvell 88SS9187, according to the source.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced the launch of its GIGABYTE B75 series motherboards, designed to offer small business users a simple, easy to manage office IT infrastructure using the new and exclusive Intel Small Business Advantage software suite.

"The GIGABYTE B75 series represents an exciting step up in GIGABYTE's commitment to Intel's business platforms, and we are investing significant company resources to promote broad adoption amongst our global customer base," commented Henry Kao, Vice President of GIGABYTE Motherboard Business Unit. "We plan to go to market on launch day with no less than 4 models that will be an integral part of our product portfolio as we believe the features offer an opportunity for our system integrator and retailer partners to differentiate their products and services with the elegant and easy-to-use Intel Small Business Advantage IT management system."

Intel is on the brink of launching its new line of enterprise PCI-Express SSDs, codenamed "Ramsdale", carrying the market name "SSD 910 Series". The new SSD 910 series is coming to existence leapfrogging SSD 710 series, which was also codenamed "Ramsdale", but never made it to the market. The original Ramsdale SSD 720 was meant to be primarily based on SLC NAND flash memory with the probability of an MLC variant, Intel decided against launching it, probably because it was hedging its bets on 25 nm HET-MLC NAND flash, which provides endurance levels closer to SLC, while offering the capacity-advantage of MLC. The SSD 910 implements this new NAND flash standard that attempts to offer the best of both SLC and MLC.

The new SSD 910 will be available in two capacity options: 400 GB and 800 GB. Built as a PCI-Express expansion card, the SSD 910 consists of three stacked PCBs that hold SSD subunits and HET-MLC NAND flash chips, lots of them. Each of these subunits interfaces with the core logic over SAS. The core logic connects to the host over PCI-Express 2.0 x8 bus interface. The 400 GB variant provides sequential read speeds up to 1 GB/s, and up to 750 MB/s writes. The 800 GB variant provides up to 2 GB/s reads, with up to 1 GB/s writes.

Over the past few days, several retailers have been reporting shortages of 15-inch MacBook Pro 2011 (including its variants based on higher processor clock speeds), suggesting that Apple is lowering its production to make way for the new 2012 MacBook Pro. Apple is a known early-adopter of technologies, and the advent of low-TDP 22 nm "Ivy Bridge" processors by Intel could catalyze 2012 MacBook Pro.

The new MacBook Pro launch is imminent, according to Apple Insider, and could happen any time this month. We know from older reports that by design, the new MacBook Pro closely resembles Apple's successful MacBook Air. The new MacBook Pro could be driven by Intel's Core i7-3820QM or Core i7-3720QM "Ivy Bridge" quad-core processors, with integrated Intel HD 4000 graphics, and options for discrete graphics.

Throughout Intel Corporation's developer forum that starts today, company executives emphasized the importance of collaborating with China's government and industry to help create new business and innovation opportunities for Intel and its 14 million developers worldwide. The management team detailed its vision of how such collaborations could potentially spawn the next-generation of advances in business, consumer electronics and many more industries around the globe.

"The impact of major global trends, such as the rapidly growing middle class as well as the explosive growth of connected, mobile Internet and cloud computing traffic, is playing out ten-fold in China," said Sean Maloney, executive vice president of Intel Corporation and chairman of Intel China.

Intel Corporation today introduced an Intel studybook, a tablet that is part of the Intel Learning Series family and features unique classroom-ready features and capabilities including an ultra rugged design and specialized educational software. Purpose-built for 1:1 e-learning, a studybook's innovative features include front and rear cameras, microphone, light sensor support project-based inquiry and mobile learning environments. It comes with a capacitive multi-touch LCD screen and is based on an Intel Atom processor Z650.

The rugged tablet reference design is constructed from a single piece of plastic and includes shock-absorbers around the screen. It is designed to withstand accidental drops from a standard student desk and is also water- and dust-resistant. Young students, often owners of slippery fingers can learn and have fun in and out of the classroom with reduced stress for parents and teachers concerned about damage.

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its newest All-in-One Desktop PCs, the 21.5-inch LX815 and 23-inch LX835, which perfectly blend high performance, style and affordable pricing. These All-in-One computers serve as all-purpose devices ideal for the kitchen, family room and dorm room for effective multitasking and HD entertainment.