Business Korea got the scoop on Samsung hiring an ex TSMC executive by the name of Lin Jun-Cheng, who was with TSMC for almost 19 years. His role at Samsung will be as VP of Samsung's advanced packaging business, something he should be more than familiar with, as during his time at TSMC, he was part of no less than 450 patents involving chip packaging. Lin has also worked for Micron and more recently for a company called Skytech, that specialises in advanced IC packaging equipment.

Samsung has relied on third parties when it comes to more advanced chip packaging and has been behind Intel and TSMC in this area. The Business Korea article mentions that Samsung has been spending a lot of resources over the past year to build its own advanced packaging business, including hiring industry experts. Samsung has hired ex Apple, Intel and Qualcomm staff to join or head various teams related to its foundry division, not only for packaging, but also experts in various lithography processes, such as EUV. Samsung is clearly taking its foundry business seriously, even though they have had their fair share of issues with various customers over the past few years.