Netac over the weekend released the NV5000-t, an M.2 NVMe SSD that takes advantage of the PCI-Express 4.0 x4 host interface, offering mid-range performance. Available in 500 GB and 1 TB capacities, the drive uses an unspecified type of 3D NAND flash memory, and a DRAMless controller design. On offer, are sequential transfer rates of up to 4800 MB/s reads, with up to 4600 MB/s writes for the 1 TB variant. The 500 GB variant writes sequentially at speeds of up to 2700 MB/s, but with the same up to 4800 MB/s reads. The 1 TB variant offers endurance of 640 TBW, while the 500 GB variant does 320 TBW. Both models are backed by 5-year warranties. The company didn't reveal pricing.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry's highest bit density. At 1 Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.

"As market demand for denser, greater-capacity storage pushes for higher V-NAND layer counts, Samsung has adopted its advanced 3D scaling technology to reduce surface area and height, while avoiding the cell-to-cell interference that normally occurs with scaling down," said SungHoi Hur, Executive Vice President of Flash Product & Technology at Samsung Electronics. "Our eighth-generation V-NAND will help meet rapidly growing market demand and better position us to deliver more differentiated products and solutions, which will be at the very foundation of future storage innovations."

Transcend, a leading brand in digital storage and multimedia products, has officially launched the advanced PCIe 4.0 M.2 solid-state drive (SSD) MTE250S. Featuring 3D NAND flash, an 8-channel controller, and DRAM cache, this SSD delivers sequential read and write speeds of up to 7200/6500 MB/s (R/W) and ample capacity of up to 2 TB. Its ultra-thin graphene heatsink ensures stable performance during non-stop operation, and its proven performance will bring gamers, content creators, and software developers a fundamental boost, helping them excel in their fields.

Fully compliant with the latest NVMe 1.4 specifications, MTE250S comes in an M.2 2280 form factor with an 8-channel controller and a fast PCIe Gen4 x4 interface, unleashing sequential R/W speeds of up to 7200/6500 MB/s and 4K random R/W speeds reaching 530K IOPS. Video editors and gamers alike will benefit from its impressive speeds, reduced downtime, and ample capacity of up to 2 TB, all of which are necessary for tackling the most demanding tasks.

In September, we reported that Apple, the world's most valuable company, would source some of its 3D NAND flash chips from the Chinese Yangtze Memory Technologies Corp (YMTC). However, according to the latest political pressure from the US government, Apple has reportedly canceled any contracts with the Chinese company and will not include their 3D NAND chips in the production of iPhones, iPads, and Mac computers. Even with YTMC's Xstacking 3.0 six-plane architecture that provides triple-level cell storage with I/O speeds of 2400 MT/s, Apple is not going to source any NAND Flash memory as US-China political relationship gets tighter regulations.

However, this could not be a deal breaker for both companies, as NAND Flash is in high demand, and new clients will emerge. As for Apple, the company has contracts with Kioxia, SK Hynix, Samsung, and possibly others that will ensure a steady supply of storage for the company's solutions.

The economic downturn keeps pushing the PC and related manufacturing markets down, following slumps in demand stemming from increased cost of living, the veritable arms race to technological products during COVID-19, and manufacturer's efforts to increase output to provide enough product to meet said demand. But all that goes up must eventually come down, and now South Korean manufacturers are facing the result of months of decreased consumption, with stock levels increasing ahead of actual product uptake (stocks have reached 67.3% of produced goods and factory shipments have declined 20.4%). This has now led to a 1.7% decline in August's output when compared to the same period last year - the first time the South Korean industry has seen negative growth since 2018.

Samsung and Kioxia both have announced a reduction in production output in the months to come, which should give distribution enough time to clear some of the accumulated inventory. The scales of production typically occur in cycles - ones with excess manufacturing against demand, and other times where the reverse happens. It seems we're now in the descending part of the spectrum, with prices - especially of NAND - being expected to drop in the coming months. It will take a while until the manufacturing reduction makes itself felt in the overall IC pricing landscape. Micron too has announced it's slowing down the production ramp-up of its 232-layer 3D NAND so as not to contribute in excess towards an already over-saturated market.

MSI, the world's leading gaming PC hardware brand, is proud to announce the new SPATIUM M570 PCIe 5.0 NVMe M.2 HS, with blazing fast read speeds up to 10 GB/s that unites the latest in top-notch PCIe Gen 5 controller technology with high-quality 3D NAND flash, and advanced cooling. Sporting a bronze-coloredaluminiumm heatsink, the SPATIUM M570 PCIe 5.0 NVMe M.2 HS SSD takes a sensational leap in storage performance, bringing more than 1.5 times faster read/write speeds compared to current PCIe 4.0 SSDs. With compliance of NVMe 2.0 and M.2 2280 form factor, the SPATIUM M570 HS offers optimal performance and long-lasting durability in 1 TB, 2 TB, and 4 TB capacity variants for professionals, content creators, and gamers in an easy installation and extreme transfer speeds for multitasking workloads. The strong collaboration between MSI and Phison was showcased to convey innovations in the storage space area during CES 2022 mutually.

"K.S.Pua, CEO of Phison Electronics, said that the cooperation between Phison and MSI started from the SSD product line. Since both companies have their own expertise in NAND controller and computer system integration respectively, and in addition to SSD, MSI has also actively expanded its strategy in the fields of gaming, content creators, commercial, industrial, robotics, and even automotive in recent years, where the application markets are in line with Phison's long-term strategy, so the two companies hit it off. The SPATIUM PCIe 5.0 SSD launched by MSI this time adopted Phison's E26 SSD controller. Since the performance of PCIe 5.0 is much faster than the previous generation of PCIe 4.0, the two companies have conducted a lot of tests and discussions on power consumption and heat dissipation, which is a valuable cooperation experience. In the future, Phison will continue to support MSI through controller technology."

The first batch of PCIe 5.0 SSDs are all likely to be based on Phison's PS5026-E26 controller, which offers eight NAND channels, capable of supporting NAND speeds of up to 2400 MT/s. Phison's own figures for the controller are 13 GB/s writes and 12 GB/s reads, with up to 1.5 million random read IOPS and 2 million random write IOPS. However, as we've already seen from various SSD brands, many PCIe 5.0 SSDs won't exceed 10 GB/s when it comes to the sequential read/write speeds. This is because the current NAND flash simply isn't fast enough to saturate the PCIe 5.0 bus, which is capable of 15.75 GB/s. That said, Micron's 232-layer 3D NAND should be able to boost the performance up to 12.4 GB/s based on the numbers Gigabyte announced for their Aorus Gen 10000 SSD.

Based on an article over at Tom's Hardware, we shouldn't expect too many drives that exceed 10 GB/s sequential writes at launch, due to most drives using 176-layer 3D NAND flash, that is limited to 1600 MT/s. As such, it might be wise to hold off on buying the first generation of PCIe 5.0 drives and wait for better availability of 232-layer 3D NAND, as beyond Micron, SK Hynix is expected to have a 238-layer 3D NAND flash in the market sometime in the first half of 2023. If you're not really eager to have the fastest SSD out there for pure bragging rights, it would seem that mid 2023 might be the right time to get a PCIe 5.0 SSD.

As reported by BusinessKorea, Apple, one of the largest companies in the world, will source its 3D NAND from Chinese memory maker Yangtze Memory Technologies Corp (YMTC). Known for supplying 3D NAND to Chinese SSD makers, YTMC's reported contract with Apple will fuel the upcoming iPhone 14 SKU manufacturing. Whether or not this partnership will expand to other products, it is essential to have as many storage sources as possible, as Apple sells millions of devices per year. YTMC is on track to deliver 3D NAND flash with the latest Xstacking 3.0 six-plane architecture that provides triple-level cell storage with I/O speeds of 2400 MT/s.

YTMC has joined the list of 3D NAND flash vendors that Apple works with, including SK Hynix, Samsung, Kioxia, and possibly others. This partnership also highlights that the Chinese memory output is sufficient and significant enough to break into more markets worldwide, not remaining exclusive to domestic use.

The US Government has instituted a ban on supply of GAA-FET EDA software to China (the Chinese government and companies in China). Humans can no longer design every single circuit on chips with tens of billions of transistors, and so EDA (electronics design automation) software is used to micromanage design based broadly on what chip architects want. Synopsys, Cadence, and Siemens are major EDA software suppliers. Intel is rumored to use an in-house EDA software that it doesn't sell, although this could change with the company roping in third-party foundries, such as TSMC, for cutting-edge logic chips (which will need the software to make sense of Intel's designs).

GAA or "gates-all-around" technology is vital to building transistors in the 3 nm and 2 nm silicon fabrication nodes. Samsung is already using GAA for its 3 nm node, while TSMC intends to use it with its 2N (2 nm) node. Intel is expected to use it with its Intel 20A (20 angstrom, or 2 nanometers) node. Both Intel and TSMC will debut nodes powered by GAAFETs for mass-production in 2024. The US Government has already banned the sales of EUV lithography machines to China, as well as machines fabricating 3D NAND flash chips with greater than 128 layers or 14 nm. In the past, technology embargoes have totally stopped China from copying or reverse-engineering western tech, or luring Taiwanese engineers armed with industry secrets away on the promise of wealth and a comfortable life in the Mainland.

Transcend Information, has recently introduced a whole series of 112-layer 3D NAND solid-state drives featuring wide-temperature tolerance, operating stably from -40°C to 85°C and demonstrating remarkable endurance. The form factors include 2.5", M.2, and mSATA types, suitable for embedded devices, vehicle systems, and slim servers. With up to 4 TB capacity, this rugged solution overcomes the challenges of extreme industrial environments, empowering applications in smart factories, modern infrastructures, and surveillance in the IoT era.

Transcend utilizes 112-layer 3D NAND flash to build wide-temp SSDs, which support the mainstream SATA III interface and the high-speed PCIe interface. With up to 4 TB capacity, proven performance is delivered between -40°C and 85°C thanks to an in-house sorting process and rigorous temperature tests which ensure the SSDs can adapt to rapid temperature change and thermal shock. Meanwhile, anti-sulfur technology, Corner Bond, and 30µ" gold fingers are incorporated to enhance key component protection and effectively prolong SSD lifespan. All these features create higher reliability for demanding applications like roadside monitoring systems which are exposed to long hours of high temperatures, or industrial computers that have to ensure non-stop high-speed operation.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Solidigm has announced the Solidigm P41 Plus, the company's first branded solid-state storage drive (SSD) since becoming a company in December 2021. The P41 Plus is an innovative PCIe 4.0 product that delivers the industry's best combination of performance and value to PC users for everyday productivity and gaming. Capable of delivering up to 4,125 MB/s sequential read speed, the Solidigm P41 Plus represents a breakthrough in cost efficiency, delivering great PCIe 4.0 performance at a price that won't break the budget for everyday PC users. The Solidigm P41 Plus features 144-layer 3D NAND and is widely available in an M.2 2280 form factor in capacities of 512 GB, 1 TB, and 2 TB. For increased design flexibility, the Solidigm P41 Plus is also available to OEMs in 2230 and 2242 sizes.

In a move that reinforces Solidigm's commitment to being a new paradigm in solid-state storage, the company has invested significantly in storage software to unlock the best possible user experience. The result is Solidigm Synergy software, an optional but highly recommended suite that includes both a storage driver and a Windows application with robust drive health monitoring tools. The Solidigm Storage Driver supports host-managed caching by monitoring usage patterns to identify high-priority data, keeping the most important items in the cache, and enabling faster reads as the drive fills up.

Samsung prepares regulatory filing for its next-generation 990 PRO flagship client-segment SSD. The M.2 NVMe drive will leverage PCI-Express Gen 5. It remains to be seen if the drive will be an "all-Samsung" solution (in-house controller + NAND flash + DRAM cache); or if it will use some of the first crop of third-party Gen 5 controllers; although the former seems more likely. At least two capacities are known so far—1 TB and 2 TB. Samsung will be gunning to compete with flagship Gen 5 M.2 SSDs powered by next-generation Phison and Silicon Motion controllers that will be combined with 3D NAND flash chips with over 144 layers. The drive succeeds the current 980 PRO, the company's flagship Gen 4 SSD.

Micron Technology, Inc., today announced that it has begun volume production of the world's first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry's highest areal density and delivers higher capacity and improved energy efficiency over previous generations of Micron NAND, to enable best-in-class support of the most data-intensive use cases from client to cloud.

"Micron's 232-layer NAND is a watershed moment for storage innovation as first proof of the capability to scale 3D NAND to more than 200 layers in production," said Scott DeBoer, executive vice president of technology and products at Micron. "This groundbreaking technology required extensive innovation, including advanced process capabilities to create high aspect ratio structures, novel materials advancements and leading-edge design enhancements that build on our market-leading 176-layer NAND technology."

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5) solid state drives (SSD) utilizing the SATA III interface. They include the ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs. All three SSDs are designed to be energy efficient, feature high capacities, and are well suited for high-load industrial systems relating to industrial computing, embedded devices, automation, networking, transportation, and other fields.

The industrial-grade ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs are all equipped with 112-layer 3D TLC (BiCS5) flash memory developed by WDC and KIOXIA and come with a maximum capacity of 2 TB. They have undergone rigorous temperature verification and testing to ensure they can operate optimally in a wide range of temperatures (from -40 °C to 85 °C) to ensure excellent quality, reliability, and durability.

VIPER, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, is proud to announce the market launch of its VPR400, the world's first RGB M.2 PCIe Gen 4x4 SSD. A unique aluminium heatspreader has been included to keep the drive thermally stable while accenting the onboard RGB LEDs. This SSD is built using the latest Innogrit IG5220 Gen4 x4 controller along with the highest quality 3D NAND memory chips, allowing the drive to provide the 4K Aligned Random Read and Write speeds up to 600K and 500K IOPs and Sequential Read and Write speeds up to 4,600 MB/s and 4,400 MB/s (1 TB model). Now available in capacities of 1 TB and 512 GB.

"The VIPER VPR400 has been crafted to deliver blazing speeds and performance for intense gaming and video content creation. VIPER understands that keeping high-speed SSDs thermally stable is the key to maintaining the storage unit's performance and longevity." said Roger Shinmoto, Vice President of VIPER GAMING. Onboard RGB is fully synchronizable with other VIPER GAMING RGB peripherals using the smart VIPER RGB 3.0 software, allowing users to customize their lighting profiles or choose any pre-programmed RGB lighting patterns.

Micron Technology, Inc., today announced the upcoming availability of two new consumer storage products, the Crucial P3 Plus Gen4 NVMe and Crucial P3 NVMe solid state drives (SSDs), as an expansion of its award-winning Crucial NVMe SSD product portfolio. The all new Crucial P3 Plus SSD product line will deliver attractive price-performance metrics with sequential read/write speeds up to 5000/4200 MB/s, while next-generation Crucial P3 SSDs will provide read/write speeds up to 3500/3000 MB/s. Both drives will be available in capacities up to 4 TB, making them the ideal scalable storage solutions that professionals, creatives, gamers and other high-performance users need.

"For users that have been waiting to upgrade their PCs to Gen4 SSDs, the wait is over. With the forthcoming availability of the new Crucial P3 Plus SSD, anyone seeking high-performance SSDs can upgrade to NVMe Gen4 storage and affordably futureproof their PC," said Teresa Kelley, vice president and general manager of Micron's Commercial Products Group. "Both the Crucial P3 Plus and P3 SSD products will strengthen our overall SSD portfolio and NVMe product category by offering competitive choices for high-performance storage that enables users to get more done in less time."

Phison Electronics Corp., a leading provider of NAND controller and flash storage solutions, announced today a strategic collaboration with AMD and Micron to build a cooperative PCIe Gen5 ecosystem of compatible products that elevate the gaming and creator experience. Phison's role includes delivering a class-leading PCie Gen5 SSD controller - PS5026-E26 - that features nearly a 2x performance increase over the previous generation flagship while adhering to the same power limitations of the M.2 form factor.

"We are pleased to announce our cooperative effort with Micron and AMD to advance the technological development of PCIe Gen5 storage offerings, as this validates Phison's commitment to upholding customer-centric values," said Leo Huang, Sr. Director, Product Marketing, Phison. "The E26 controller enables gamers to compete at the highest level and helps content creators to maximize the overall system performance to increase productivity." The need for high-speed storage has increased with the popularity of 5G Wireless availability worldwide. Global markets including desktop PC, notebooks, gaming consoles, cloud servers and even mobile devices will benefit from increased data transfer rates and the bandwidth available for multitask purposes. The ecosystem consisting of AMD's AM5 platform, Phison's PS5026-E26 controller, Micron's DDR5 DRAM and Replacement Gate 3D NAND allow for platform acceleration across the entire system to meet the requirements for today's always-connected lifestyle.

Micron Technology, Inc., today announced new client solid-state drives (SSDs) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables from legacy architectures that can rob devices of battery power, performance and productivity. The Micron 2300 SSD combines the power and density needed to drive compute-heavy applications in a compact form factor with the reduced power consumption modern mobile users demand. For the first time, Micron brings together NVMe performance and low-cost quad-level-cell (QLC) NAND in the Micron 2210 QLC SSD. It combines fast NVMe throughput and Micron's leadership in QLC technology to offer flash capabilities at hard disk drive-like price points while reducing power consumption by 15 times when compared to hard drives.

"Ninety percent of client platforms will ship NVMe SSDs within the next year, and the market is fast bifurcating into mainstream and value market segments," said Roger Peene, vice president of marketing, Storage Business Unit, Micron. "Our two new client SSDs, the 2300 and 2210, are optimized for each segment. The 2300 offers outstanding power performance, while the 2210 delivers compelling price performance by using Micron's industry-leading QLC NAND." Both SSDs introduced today are built on Micron's innovative 96-layer 3D NAND technology to deliver power savings, right-sized capacity and compact form factors that enable flexible designs. They also deliver enhanced client security features and capabilities for protecting data, with TCG Opal 2.0 and TCG Pyrite 2.0 support.

ATP Electronics, the global leader in specialized storage and memory solutions, rolls out its N600Vc Series M.2 2242/2280 NVMe 1.3 PCIe Gen3x4 and A600Vc Series SATA 2.5", M.2 2242/2280, and mSATA Value Line solid state drives (SSDs). Built with triple-level cell (TLC) NAND on leading 100+-layer 3D architecture, the new line is geared toward industrial/embedded applications requiring reliable performance, wide range of capacity options, and long-term supply commitment at friendly price points.

The new N600Vc/A600Vc Series SSDs offer lower cost per GB compared to ATP's mainstream Superior Line, but use prime NAND die along with ATP's superior integrated circuits (IC) sorting process to guarantee drive quality, performance, reliability, and endurance better than other SSD solutions in the market that use pre-packaged ICs instead of wafers or die.

Inspired by the way people work today, Western Digital Corp. introduced the Western Digital PC SN740 NVMe SSD to help address the unique needs of the hybrid workforce and elevate the computing experience. "Hybrid and remote work environments have become the 'new normal' for businesses over the past few years and have driven tremendous growth in PC shipments," said Eric Spanneut, vice president, Client and Enterprise SSDs, Flash Business Unit, Western Digital. "As work habits and locations change, there is a tremendous opportunity to support our corporate and commercial PC OEMs with storage solutions that are thin and light, have advanced security features and pack more performance while preserving power efficiency."

Featuring a DRAM-less architecture and leveraging Western Digital's in-house SSD controller design, BiCS5 3D NAND, firmware development, and vertical integration, the new SN740 NVMe SSD underscores the company's strengths in developing innovations that allow customers to unlock the potential of data.

Apacer, a leading manufacturer of storage and memory, has launched a god-tier M.2 Gen4 x4 SSD, the AS2280Q4U. 7,400/7,000 MB/s read-write speeds mean you can load a world in a moment. The SSD is protected by heat dissipation fins that keep temperatures low and performance sky-high. It meets the M.2 SSD requirements for PS5 in all respects, making it a simple solution to gain extra storage space on PS5. And a 5-year global warranty makes it an easy choice for both gamers and digital content creators like animators, YouTubers and video editors.

AS2280Q4U's blazing-fast PCIe Gen4 x4 interface is fully compliant with the NVMe 1.4 standard. With sequential read/write performance of up to 7,400/7,000 MB/s, it is twice as fast as a Gen3 SSD, and 15 times faster than a SATA SSD, providing unparalleled performance for gamers and video creators.

Today Solidigm is expanding its performance-optimized D7 Product Series with new solid-state storage drives (SSDs)—the D7-P5520 and the D7-P5620—for data center and enterprise use. These drives are optimized for real-world compute and storage server workloads and are available in an extended range of form factors and capacities. They offer accelerated performance and reduced total cost of ownership (TCO) by enabling a smaller storage footprint and lower power consumption. The D7-P5520 (designed for read-intensive and light mixed workloads), and the D7-P5620 (designed for mixed workloads), are the first family of products being introduced by Solidigm, which launched as a standalone company in December 2021.

The D7 Series comprises the industry's most advanced PCIe 4.0 SSD family of products given their capacity offerings, breadth of form factors and optimized performance capabilities. These SSDs are optimized for real-world workloads and reflect insights gained from deep technical engagements with leading cloud service providers, OEMs, and storage innovators. Designed and tested with zero tolerance for data errors, consistently durable IOPS and QoS, and with near-zero lifetime performance degradation, they can be deployed with the utmost confidence.

MSI is launching a new blazing fast model to its SSD product line - SPATIUM M480 PCIe 4.0 NVMe M.2 PLAY, exceeding all performance requirements for PlayStation 5 use. MSI SSDs enhances our company's identity as a high-performance PC brand by expanding our ecosystem and covering the high-performance storage category. These SSDs are built with high-quality, high-density 3D NAND flash that delivers great performance with up to 7000 MB/sec read. On SPATIUM M480 PLAY, the sleek dual finish aluminium heatsink is designed to fit the PlayStation 5. This improves heat-dissipation to sustain transfer speeds across all platforms for professionals, content creators, and gamers. Other performance-improving technologies include DRAM cache buffer and an SLC cache.

SPATIUM M480 PLAY is the optimal product made for console gaming in the SPATIUM lineup with four storage capacities - 500 GB, 1 TB, 2 TB, and 4 TB. This brings next-level storage performance to players for PlayStation 5, content creators, and PC gamers. Expanding the storage device on the PS5 is a simple upgrade that allows for lightning-fast save and load times for large game files.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drive (SSD) and hybrid storage products announces the next generation of its DuraFlash ME2 family of SATA SSD products, which includes industry-standard M.2 2242, M.2 2280, mSATA, Slim SATA and 2.5" form factors. These SSDs are available in both industrial and commercial temperature grades and have versions that implement SMART's SafeDATA power-loss, data-protection technology for graceful handling of power fluctuations and sudden power loss events.

The new ME2 SSDs incorporate the latest generation 3D NAND-technology and SMART Modular's proprietary NVMSentry firmware to deliver high performance SSD products with endurance up to one drive writes per day (DWPD) for five years using JEDEC JESD219A enterprise endurance workload. The new NAND device offers better cost per bit over previous 64-layer and 96-layer NAND generations without sacrificing performance and reliability. Further optimization of the NVMSentry firmware also yields enhancements in read and write consistency over wide ranges of application workloads. High performance computing, data centers, networking, cloud systems and many other applications that demand high reliability and consistency over long operating lifetime can benefit from the new ME2 SSD products.