Greenliant has started sampling its NVMe M.2 ArmourDrive solid state drive (SSD) modules to customers requiring high-performance, high-capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and 2280 form factors.

88 PX Series NVMe ArmourDrive SSDs provide high performance and low latency for high transactional and business critical applications. NVMe is a highly scalable protocol optimized for efficient data transport over PCIe for storage on NAND flash. Small form factor, power efficient M.2 2242 products support the PCIe Gen3x2 interface and can reach up to 1,550/950 MB/s sequential read/write performance. Offered with hardware encryption and DRAM, M.2 2280 products support the PCIe Gen3x4 interface and can reach up to 3,470/3,000 MB/s sequential read/write performance. These versatile NVMe M.2 ArmourDrive form factors are ideal for space-constrained, embedded and enterprise systems in cloud computing, broadcasting, industrial gaming, factory automation, networking and security.

Triple level cell (TLC) flash, long considered for consumer applications only, is now making inroads into rigid industrial segments where reliable performance and extended endurance are essential. 3D TLC-based flash solutions are among the next-generation products that ATP Electronics will showcase during the 2019 Flash Memory Summit at the Santa Clara Convention Center in California, USA from August 6 to 8 in meeting room #205. ATP is the leading manufacturer of "Industrial Only" memory and storage solutions committed to delivering the best total cost of ownership (TCO) value through longevity support, extensive testing and screening, and uncompromising quality.

"As an industrial only manufacturer, ATP is dedicated to making sure that our customers get the most out of their TCO. We take pride in having full in-house ownership of the manufacturing process, which allows us greater flexibility to meet customer needs and guarantee superior quality. With ATP NAND packaging and stringent testing capabilities, we guarantee the NAND quality control of our own-built modules to deliver extended lifespan and longevity support even after other manufacturers have stopped making products for legacy systems," said Marco Mezger, ATP Vice President of Global Marketing.

SK hynix Inc. announced today that it launched a new low-power Non-Volatile Memory express (NVMe) Enterprise SSD (eSSD) with the 72-layer TLC 3D NAND flash that offers best-in-class performance for power as well as Quality of Service. The product features an in-house NVMe controller on top of the 72-layer 3D NAND technology currently in mass production. With the launch, SK hynix has established itself as a memory producer that designs, develops, and mass-produces all key components, from NAND and DRAM to controllers, in-house, for not only Client but also Enterprise applications.

Meanwhile, power consumption of datacenters is an increasingly important concern in terms of energy and environmental preservation, as their footprint grows amid rising enterprise demand for cloud, Artificial Intelligence (AI), and Machine Learning (ML). As datacenters are expected to account for one-fifth of the world's energy consumption in 2025, low-power components that enable datacenter energy efficiency are expected to only grow in importance.

Experience the sensation of evolution in bloodbath battle! The latest masterpiece in Apacer Gaming series, Apacer AS2280P2 PRO M.2 PCIe "PANTHER" SSD; equipped with "battle armor". When the battle is fierce, the "battle armor" will evolve from orange to a dazzling golden color when temperature rises, cheering on gamers even more! The sequential read/write speed of Apacer AS2280P2 PRO can reach up to 1,580/950 MB/s, and the random write performance can even reach up to 92,160 IOPs, bringing the best gaming experiences for gamers with their best performances.

Gamers may have had the experience of almost being defeated during a battle, but then their characters suddenly leveled up and their HP/MP were instantly filled, the battle situation was reversed all of sudden! Apacer is dedicated to creating unique gaming experiences for gamers, AS2280P2 PRO SSD is equipped with a creative "battle armor" that changes color with temperature, reproducing the exciting sensation when leveling up during death battles. The "battle armor" displays a passionate orange color under room temperature, but when it heats up during battles, it will evolve into a dazzling golden armor, accompanying players to enjoy killing enemies on the battlefield.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories announces that it has upgraded the endurance rating of its industrial-grade 3D TLC solid state drives (SSD) to 3K P/E cycles, bringing their endurance, reliability, and stability up to par with 2D MLC SSDs. Combined with their ability to operate in a wide range of temperatures (-40° C to 85° C), they are excellent solutions that provide the durability and consistency required by applications such as Artificial Intelligence, Internet of Things (IoT), Intelligent Transportation Systems, surveillance systems, data centers, network operations, defense systems, and energy exploration.

The continual improvements in NAND Flash design and manufacturing, as well as the ever-changing demands of the market, have driven 3D NAND to become a popular memory solution across many industries. Despite its growing prominence, 3D NAND has had two major deficiencies, namely the ability to operate in extreme temperatures and achieve higher endurance ratings. To fill this gap, ADATA has upgraded its industrial-grade 3D TLC SSDs to an endurance rating of 3K P/E cycles, which makes them comparable to 2D MLC SSDs. At the same, ADATA 3D TLC SSDs are also designed to operate in a wide temperature range (-40° C to 85° C), delivering a memory solution that is long-lasting, robust, and reliable.

A report from DigiTimes pits NAND manufacturers as accelerating their 120/128 layer 3D NAND technologies, aiming for volume production as early as 2020. Even as SK Hynix has begun sampling its 96-layer 4D NAND flash in March, Toshiba and Western Digital already had plans to introduce 128-layer technology, built on a TLC (Triple Level Cell) process technology so as to increase density while avoiding yield issues present with current QLC (Quad Level Cell) implementations.

The decision to accelerate deployment of the next generation of NAND comes from the fact that the market still faces an oversupply of NAND flash, mostly driven by the mature process of 64-layer NAND technology. With new technologies, higher ASPs and lower production scales are sustainable, which should enable supply to reduce enough so as to increase pricing of NAND-based technologies - and allow manufacturers to somewhat reset asking prices for new NAND chips.

With its IMFlash Technology joint-venture with Micron coming to an end, Intel is finding itself with manufacturing challenges for its memory businesses. The company holds IP to both 3D NAND flash and its own invention 3D XPoint memory, which it believes will succeed NAND flash in performance and endurance. The company is now mulling to move manufacturing of 3D XPoint to a foundry in China. Intel currently manufactures this exotic new memory at an IMFlash Technology facility in Utah. Intel's $1.3 billion stake-sale to Micron pushes it out of this facility.

Under the terms of the stake-sale, Micron allows Intel to continue to manufacture 3D XPoint at IMFlash for a year, after which it must manufacture it elsewhere. The transfer of stake is scheduled for October 31st, which means Intel's manufacturing in Utah will continue till October 2020. In the meantime, Intel is planning to move manufacturing to its Fab 68, located in Dalian, China. Intel is now manufacturing 1st and 2nd generation 3D Xpoint, while its 3rd generation is under development, and was earlier slated for initial manufacturing at Intel's Fab 11X in New Mexico, USA. It's not known if Intel has changed these plans. 3rd generation 3D XPoint hits mass-production in 2021.

Western Digital Corp. is addressing the automotive industry's increasing need for storage by equipping vehicle manufacturers and system solution providers with the technology and capacity to support both current and future applications including e-cockpits, Artificial Intelligence (AI) databases, ADAS, advanced infotainment systems, and autonomous computers. As the first 256GB e.MMC using 64-Layer 3D NAND TLC flash technology in the automotive market, the new Western Digital iNAND AT EM132 EFD extends the life of e.MMC beyond 2D NAND to meet evolving application needs and growing capacity requirements.

According to Neil Shah, partner and research director, Counterpoint Research, "Storage is one of the fastest growing semiconductor applications in a connected autonomous car. The advanced in-vehicle infotainment (IVI), AI and sensor-driven autonomous driving systems generate large amounts of data that needs to be processed and stored locally at the edge. The average capacity of storage required per vehicle is expected to balloon beyond 2TB by 2022."

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., (NASDAQ: SGH), and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced a new addition to its SMART RUGGED product offering, the HRS-T5E 2.5" SATA SSD. Powered by a flexible, custom flash controller, the HRS-T5E SSD provides read/write performance ideal for high throughput applications such as flight data recorders and sensor data capture. It is also well suited for high-reliability telemetry, surveillance, and other mission critical storage applications.

Available in capacities up to 4TB, SMART's new 3D TLC NAND Flash storage solution offers more reliability, superior performance, and requires less power and cooling in applications where traditional hard disk drives (HDDs) are typically used. Recent improvements in 3D NAND, endurance-enhancing data placement and error correction technology, make the T5E perfectly suitable as a cost effective replacement for 2D planar based SSDs for read-intensive applications.

Today Team Group releases three new products from the T-FORCE gaming series: T-FORCE T1 gaming memory, T-FORCE VULCAN Z gaming memory and T-FORCE VULCAN high speed gaming solid state drive. T-FORCE T1 gaming memory's unique look is specially designed for entry gamers. T-FORCE VULCAN Z gaming memory's cooling performance has fully evolved to perfectly protect the memory. T-FORCE VULCAN high speed gaming solid state drive has focused on overall details and offering large capacity and high speed read/write performance at the same time. All three products have inherited the unique and classic design of T-FORCE gaming series, which makes building your own pc cooler than ever.

T-FORCE T1 gaming memory's impressive racing style is specially designed for entry gamers. Created using exclusive patented color printing and special ink, the racing design enhances the overall style of the DIY PC. The selected high-quality IC chips are exceptional in durability, stability and compatibility, allowing gamers to have excellent combat status on the battlefield of eSports. T-FORCE T1 gaming memory supports both Intel & AMD platform. Plug & play allows gamers to be ready for battles at any time.

SK Hynix Inc. today announced financial results for its first quarter 2019 ended on March 31, 2019. The consolidated first quarter revenue was 6.77 trillion won while the operating profit amounted to 1.37 trillion won and the net income 1.1 trillion won. Operating margin for the quarter was 20% and net margin was 16%.

Because of a faster-than-expected price decline and lower shipments due to slowing memory demand, the revenue and the operating profit in the first quarter fell by 32% and 69%, respectively, quarter-over-quarter (QoQ). Due to seasonal slowdown and conservative server purchases, DRAM bit shipments decreased by 8% QoQ. The average selling price dropped by 27%. For NAND Flash, the average selling price decreased by 32% due to high inventory levels and intensifying competition among suppliers. The bit shipments declined by 6% QoQ.

Intel today revealed details about Intel Optane memory H10 with solid-state storage - an innovative device that combines the superior responsiveness of Intel Optane technology with the storage capacity of Intel Quad Level Cell (QLC) 3D NAND technology in a single space-saver M.2 form factor. "Intel Optane memory H10 with solid-state storage features the unique combination of Intel Optane technology and Intel QLC 3D NAND - exemplifying our disruptive approach to memory and storage that unleashes the full power of Intel-connected platforms in a way no else can provide," said Rob Crooke, Intel senior vice president and general manager of the Non-Volatile Memory Solutions Group.

Combining Intel Optane technology with Intel QLC 3D NAND technology on a single M.2 module enables Intel Optane memory expansion into thin and light notebooks and certain space-constrained desktop form factors - such as all-in-one PCs and mini PCs. The new product also offers a higher level of performance not met by traditional Triple Level Cell (TLC) 3D NAND SSDs today and eliminates the need for a secondary storage device.

Western Digital Corp. today unveiled the new Western Digital WD Purple SC QD312 Extreme Endurance microSD card for designers and manufacturers of AI-enabled security cameras, smart video surveillance and advanced edge devices that capture and store video at higher bit rates than mainstream cameras. According to IHS Markit, global shipments of professional video surveillance cameras are expected to grow from 127 million to over 200 million between 2017 and 2022, and those with on-board storage are expected to grow by an average of approximately 19 percent per year.

With the migration to 4K and higher video resolutions, and the introduction of more smart cameras with built-in AI and improved local processing capabilities, surveillance cameras need to be able to store both video and raw data to facilitate these AI capabilities. As a result, storage with higher capacity, more intelligence and greater durability is increasingly required.

If you aim for the top, don't skimp on your SSD drives! Check out Apacer's brand-new AS2880P4 M.2 PCIe Gen3 x4 SSD, which boasts stronger-than-ever performance at reasonable price. This SSD now brings reading/writing speeds of 3,200/2,000MB/sec and 360,000 operations per second (IOPS) within easy reach of eSports players! NVMe1.3-compliant, the AS2880P4 uses the latest 3D NAND TLC technology to make it an ultra-compact, high-capacity that frees up space for you to further modify and expand your gaming devices. Its max capacity of 480GB makes it perfect for hardcore eSports players, post-production CAD 3D modeling designers, and users demanding high speed and high capacity.

The M.2 PCIe Gen3 x4 is definitely the top choice for high performance demands in ultra-thin notebooks, high-power computers, e-sports consoles, mini-PCs, and embedded devices. As a trend-defining SSD brand, Apacer has led the global market with its groundbreaking PCIe Gen3 x4 NVMe 1.3 SSD and is now writing history again with its successor, the brand-new AS2280P4.

Intel Tuesday unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel's latest data center solutions target a wide range of use cases within cloud computing, network infrastructure and intelligent edge applications, and support high-growth workloads, including AI and 5G.

Building on more than 20 years of world-class data center platforms and deep customer collaboration, Intel's data center solutions target server, network, storage, internet of things (IoT) applications and workstations. The portfolio of products advances Intel's data-centric strategy to pursue a massive $300 billion data-driven market opportunity.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the SD600Q external solid state drive (SSD). The SD600Q offer excellent read/write speeds of up to 440 MB per second, four times the speed of external hard drives. It does this with 3D NAND Flash, offering excellent performance, reliability, and shorter loading times. What's more, the SD600Q features a shock-resistance construction, heat dissipation capabilities, silent operation, and is power efficient.

Users will fall in love with the SD600Q at first use. Delivering read/write of up to 440 MB per second, the SD600Q will allow users to transfer a 5 GB Full HD movie in a mere 26 seconds. Packing 3D NAND Flash, or stacked memory, the SD600Q offers greater reliability, durability, and ample storage capacities of up to 960 GB.

Western Digital Corp., a global data infrastructure leader, is accelerating the NVMe transition of value-PC storage by adding an NVMe model to its award-winning WD Blue solid state drive (SSD) portfolio, the WD Blue SN500 NVMe SSD. The new SSD delivers three times the performance of its SATA counterpart while maintaining the reliability the WD Blue product line is known for. For content creators and PC enthusiasts, the WD Blue SN500 NVMe SSD is optimized for multitasking and resource-heavy applications, providing near-instant access to files and programs.

Leveraging the scalable in-house SSD architecture of the highly acclaimed WD Black SN750 NVMe SSD, the new WD Blue SN500 NVMe SSD is also built on Western Digital's own 3D NAND technology, firmware and controller, and delivers sequential read and write speeds up to 1,700 MB/s and 1,450 MB/s respectively (for 500 GB model) with efficient power consumption as low as 2.7W. Demands on storage are continuing to grow and client workloads are evolving, the WD Blue SN500 NVMe SSD features high sustained write performance over SATA as well as other emerging technologies on the market today to give that performance edge.

Toshiba and its strategic ally Western Digital are readying a high-density 128-layer 3D NAND flash memory. In Toshiba's nomenclature, the chip will be named BiCS-5. Interestingly, despite the spatial density, the chip will implement TLC (3 bits per cell), and not the newer QLC (4 bits per cell). This is probably because NAND flash makers are still spooked about the low yields of QLC chips. Regardless, the chip has a data density of 512 Gb. With 33% more capacity than 96-layer chips, the new 128-layer chips could hit commercial production in 2020-21.

The BiCS-5 chip reportedly features a 4-plane design. Its die is divided into four sections, or planes, which can each be independently accessed; as opposed to BiCS-4 chips that use a 2-plane layout. This reportedly doubles the write performance per unit-channel to 132 MB/s from 66 MB/s. The die also reportedly uses CuA (circuitry under array), a design innovation in which logic circuitry is located in the bottom-most "layer," with data layers stacked above, resulting in 15 percent die-size savings. Aaron Rakers, a high-technology industry market analyst with Wells Fargo, estimates that Toshiba-WD's yields per 300 mm wafer could be as high as 85 percent.

Micron Technology, Inc. today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio. The Micron 1300 SSD makes flash storage accessible to more users, enabling its adoption in a broader set of personal computing devices for a better mobile computing experience. Consumers who are eager to move from rotating media to solid state drives value fast performance, quick startup, and reliability - whether for desktop, mobile or workstation PCs. SSDs address these needs better than power-hungry hard disk drives (HDDs), yet their higher prices have kept users from shifting to SSDs. Micron redesigned the 1300 SSD series to close the price gap.

"The deployment of advanced 3D NAND technologies has led the client SSD market to branch into value and higher-performance storage segments," said Gregory Wong, president of Forward Insights. "Micron's latest client SSD solutions provide a coherent migration path from HDD to value-oriented SSDs."

Western Digital Corp. today announced two new additions to its broad portfolio of NVMe-based systems, platforms, SSDs, and memory drives for data center and cloud customers. With a full portfolio covering applications from edge-to-core, these additions are the Western Digital Ultrastar DC SN630 NVMe SSD and the Western Digital CL SN720 NVMe SSD. Each leverages the power of Western Digital's vertical integration capabilities, including internally developed controller and firmware architectures, and 64-layer 3D NAND technology. As a replacement for lower-performing SATA SSDs, these new NVMe drives meet the insatiable need for performance, scalability, endurance and low total cost of ownership (TCO) for public and private cloud deployments, hyperscale cloud environments, and next-generation workloads at the edge.

IT managers face challenges such as managing multiple workload types, scaling at optimal TCO, and controlling server sprawl. Due to its inherent scalability and performance benefits, NVMe is quickly becoming the de facto standard for everything from traditional scale-up database applications to emerging edge computing architectures.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today launched its ADATA Ultimate SU750 2.5" SATA 6Gb/s solid-state drives (SSD). With next-generation TLC (Triple-Level Cell) 3D NAND Flash and a host of other features, SU750 SSDs deliver terrific value, great performance, and superb reliability to offer users an excellent option for their next upgrade.

Implementing 3D NAND Flash, Ultimate SU750 SSDs features higher storage capacities of 256GB, 512GB, and 1TB. With SLC Caching, the drives can achieve read/write speeds of up to 550/520MB per second to accelerate PC performance. Users will revel in not having to wait around to access files and for programs to load. What's more, with no mechanical components, SU750 SSDs are more resilient than HDDs. They are more resistant to shock and vibration (1500G/0.5ms), therefore providing better protection of data. Also, SSDs also run silently and consume less power than HDDs.

1-Terabyte SSDs could become a new mainstream-desktop must-have in 2019, as prices of the drives have fallen by 50 percent year-over-year, according to DigiTimes. A 1 TB SATA SSD in the 2.5-inch form-factor can now be had for as little as $99, while faster NVMe drives in the M.2 form-factor start around $130. At the beginning of 2018, 1 TB SATA SSDs used to start around the $160-mark, and NVMe drives north of $200. The 1 TB category includes 960 GB, 1000 GB, and 1024 GB marketed capacities with varying amounts of overprovisioning set by manufacturers.

Falling SSD prices are accelerated by the entry of cost-effective 96-layer 3D NAND flash, higher-density QLC NAND flash, undigested inventories of drives based on older technologies such as 64-layer or TLC NAND flash; and a 15 percent sequential quarterly drop in NAND flash prices in the industry. Growth in speeds of client-segment SSDs have remained largely flat over the year, and not much is to be expected in performance growth other than perhaps the advent of PCIe gen 4.0 based enterprise SSDs towards the end of the year.

SMART Modular Technologies, a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced the introduction of its N200 line of SATA products. With burst speed and low power consumption, the N200 family is an ideal economic option for NAS/SAN storage systems, x86 server-storage appliances, distributed scale-out servers, telecom and networking routers and switches, industrial control, printers and more.

Built with Triple Level Cell (TLC) 3D NAND technology, the new N200 line of SATA products, consisting of the mSATA (MO-300), the M.2 2242 and 2280, the Slim SATA (MO-297), and the removable 2.5" solid state drive form factors, delivers the advantages of economical, industrial-grade non-volatile memory to embedded computing applications. The N200 SATA products are offered in capacities ranging from 32GB to 1TB, depending on form factor, and all are available in industrial and commercial temperatures.

Transcend Information Inc., a leading manufacturer of storage and multimedia products, is proud to announce the MTE220S PCIe M.2 Solid-State Drive. This SSD utilizes PCI Express Gen3 x4 interface and is compatible with NVM Express (NVMe) specifications. Utilizing this interface means never-before-seen transfer speeds of 3,500 MB/s read and 2,800 MB/s write are now a reality. Using 3D chips and packing into a M.2 2280 form factor, the MTE220S SSD is the must-have for gaming enthusiasts and high-end applications.

Transcend's MTE220S SSD comes equipped with DDR3 DRAM cache memory. This means that commonly used programs load much faster, and boot time is greatly reduced. Utilizing SLC caching, the MTE220S SSD can reach astonishing read/write speeds of 3,500 MB/s and 2,800 MB/s, respectively, and 4K Random performance is also significantly improved. In addition to speeds, reliability is also enhanced with the Low Density Parity Check code in place.

PLEXTOR, a leading developer of award-winning solid-state drives (SSDs) and other high-performance digital storage devices, today announced the introduction of its latest line of PCIe and SATA SSDs at this year's CES.

The new M10Pe PCIe SSD Series offers a new level of speed and performance targeted for all PC gamers and applications intensive users. The new series combines advanced 96-layer 3D NAND flash and industry leading controller to deliver awesome sequential read/write speeds up to 3,200/2,500 MB/s and random read/write speeds up to 410,000/320,000 IOPS.