NVIDIA Studio is debuting at CES powerful new software and hardware upgrades to elevate content creation. It brings the release of powerful NVIDIA Studio laptops and desktops from Acer, ASUS, Dell, HP, Lenovo, MSI and Samsung, as well as the launch of the new GeForce RTX 40 SUPER Series GPUs—including the GeForce RTX 4080 SUPER, GeForce RTX 4070 Ti SUPER and GeForce RTX 4070 SUPER—to supercharge creating, gaming and AI tasks.

Generative AI by iStock from Getty Images is a new generative AI tool trained by NVIDIA Picasso that uses licensed artwork and the NVIDIA Edify architecture model to ensure that generated assets are commercially safe. RTX Video HDR coming Jan. 24 transforms standard dynamic range video playing in internet browsers into stunning high dynamic range (HDR). By pairing it with RTX Video Super Resolution, NVIDIA RTX and GeForce RTX GPU owners can achieve dramatic video quality improvements on their HDR10 displays.

AMD is reported to be reissuing its old Zen+ (12 nm) tech in order to meet demand for cheaper, lower-end systems in China, according to information released by Board Channels this week. The insider source claims that a new production order has been placed for Ryzen 3000G series APUs (requesting up to 30,000 units) and these processors are likely to be sold as part of hardware bundles with (similar vintage) low-end AM4-based motherboards - for example the B450 and A320 series, these older boards are still popular budget choices in China and readily available. The leak does not mention whether AMD is choosing to issue completely new hardware or if it is simply reproducing its 2019-era SKUs.

AMD released two Ryzen 3000G models back in 2019 - the 3400G and 3200G, both are quad-core Picasso APUs although the latter is lacking in simultaneous multithreading. It is not clear whether the super low budget AMD Athlon 3000G model will be included as part of the alleged 30K unit order. The 3000G series' onboard iGPUs (based on AMD's first generation Vega architecture) are likely preferred by the budget-conscious buyer since a discrete graphics card is not an essential part of builds intended for an office setting or a simple/functional home computer setup.

AMD today announced its entry-level A520 desktop chipset for 3rd Gen Ryzen "Matisse" processors, and possible readiness for Athlon and Ryzen 4000G processors based on the "Renoir" silicon. Much like the B550, it lacks support for Ryzen 3 3200G and Ryzen 5 3400G processors based on the "Picasso" silicon, as well as older 2nd- and 1st Gen Ryzen processors. The A520 succeeds the A320 chipset, and enables motherboards priced deep under the $100-mark, close to the $50 magic figure. The ASMedia-sourced chipset has quite a few similarities with the B550, but one big segmentation - complete lack of PCIe Gen 4.

Motherboards based on the AMD A520 completely lack PCIe Gen 4 support, even with a Ryzen 3000 "Matisse" processor. Even the PCI-Express x16 and M.2 NVMe slots wired to the AM4 SoC are limited to PCIe Gen 3. On the B550, these two slots run at Gen 4 speeds when paired with a capable processor. Much like the B550, the downstream (general purpose) PCIe lanes from the chipset run at PCIe Gen 3 speeds, although unlike the B550, the chipset only puts out 6 lanes. Other platform I/O includes up to five 10 Gbps USB 3.2 ports (includes two from the AM4 SoC), two 5 Gbps USB 3.1 ports, four SATA 6 Gb/s (AHCI-only) ports, and six USB 2.0 ports. At launch, A520 motherboards only support Ryzen 3000 "Matisse" processors, with support planned for 4000G "Renoir" processors when they launch in the retail channel, and future "Zen 3" processors, through firmware updates.

ASRock Rack today unveiled a pair of Socket AM4 motherboards targeted at SFF workstation and compact server builds. Both boards are based on the AMD X570 chipset, and include the X570D4U-2L2T, and the X570D4I-2T. The larger X570D4U-2L2T is built in the Micro-ATX form-factor, and comes with support for 3rd Gen Ryzen "Matisse" and "Picasso" processors (for now). The board is designed with its components and heatsinks aligned for server rack airflow. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors, conditioning it for the CPU with a 6+2 phase VRM. The AM4 socket is wired to four DDR4 DIMM slots that supports both ECC and non-ECC UDIMMs. Expansion includes one PCI-Express 4.0 x16, a gen 4.0 x8, and a gen 4.0 x1.

Storage options on the X570D4U-2L2T include seven SATA 6 Gbps, from which one is high-powered to support DOMs; and two M.2-2280 slots with PCIe 4.0 x4 wiring, one of which even has SATA 6 Gbps wiring. Enterprise-relevant features include two 10 GbE networking interfaces driven by an Intel X550-AT2 controller, two 1 GbE interfaces handles by Intel i210-series controllers; an ASPEED IPMI+iKVM management chip that also puts out basic display; and various server-relevant legacy connectivity.

HKEPC's retail market scouts discovered that some AMD Ryzen 5 3600 desktop processors are shipping in paperboard boxes meant for the company's Ryzen 3000G series "Picasso" desktop APUs. Depending on factors such as iGPU, or the size of the included cooling solution, AMD uses common box sizes among various processor models. The largest cube-shaped boxes hold SKUs with the largest Wraith Prism RGB coolers, a slightly smaller, through still cube-shaped box is meant for SKUs with the Wraith Spire. Smaller cuboid boxes are meant for SKUs that either have the smaller Wraith Stealth coolers, or completely exclude a cooling solution.

Much of the SKU differentiation comes from a prominent brand extension (3/5/7/9) motif on the front-face, besides the top label that lists out the model name, OPN, serial number, and doubles up as a security seal. Boxes for the company's APUs (processors with integrated graphics), however, have a prominent "processor with AMD Radeon graphics" chrome insert on the front- and top faces. The 3600 shipping in such a box could confuse some buyers, particularly those shopping in brick-and-mortar stores, as they'd expect an iGPU where none exists. It's only the SKU sticker on the top-face that has the cautionary note "discrete graphics required." Other retail boxes (meant for non-APU products) have this note prominently printed on the box.

The AMD B550 chipset isn't supposed to run 1st- and 2nd-generation AMD Ryzen processors, or even Ryzen 5 3400G and 3200G APUs based on the older "Zen+" microarchitecture. AMD specifically made a packaging badge that reflects this. The B550 chipset only supports 3rd gen Ryzen "Matisse," and is ready for upcoming "Renoir" and "Zen 3" based "Vermeer" processors, when they do come out.

Given this, imagine our surprise when someone with access to a B550 motherboard was able to run older processors on it. PC enthusiast 188 "momomo_us" posted screenshots of an ASUS TUF Gaming B550M-Plus motherboard running "Zen+" based Ryzen 5 3400G APU based on the "Picasso" silicon, and Ryzen 5 2600X processor based on the "Pinnacle Ridge" silicon, complete with CPU-Z validations. The board is shown running BIOS version 0608 (dated 15/06/2020). There's nothing in the official change-log to indicate Zen+ support, nor in its CPU support list, and the CPU-Z screenshots don't reveal AGESA version in the BIOS version string. An impressive feat nonetheless. We still can't recommend taking the risk of buying B550 motherboards with older processors. Find the CPU-Z validation for the 3400G+B550 and 2600X+B550.

VLSI engineer Fritzchens Fritz, famous for high-detail EM photography of silicon dies and annotations of them, recently published his work on AMD's 7 nm "Renoir" APU silicon. His die-shots were annotated by Nemez aka GPUsAreMagic. The floor-plan of the silicon shows that the CPU component finally dwarfs the iGPU component, thanks to double the CPU cores over the previous-gen "Picasso" silicon, spread over two CCXs (compute complexes). The CCX on "Renoir" is visibly smaller than the one on the "Zen 2" CCDs found in "Matisse" and "Rome" MCMs, as the L3 cache is smaller, at 4 MB compared to 16 MB. Being MCMs with disintegrated memory controllers, it makes more sense for CCDs to have more last-level cache per CCX.

We also see that the iGPU features no more than 8 "Vega" NGCUs, so there's no scope for "Renoir" based desktop APUs to feature >512 stream processors. AMD attempted to compensate for the NGCU deficit by dialing up engine clocks of the iGPU by over 40% compared to those on "Picasso." What caught our eye in the annotation is the PCI-Express physical layer. Apparently the die indeed has 20 PCI-Express lanes besides an additional 4 lanes that can be configured as two SATA 6 Gbps ports thanks to SerDes flexibility.

AMD's 4th generation Ryzen "Renoir" desktop APUs, based on the "Zen 2" microarchitecture, could lack PCI-Express gen 4.0, hints the product page of an upcoming AMD B550 chipset motherboard by BIOSTAR. AMD already declared that the B550 lacks support for "Picasso," which means the "Ryzen with Radeon Vega Graphics" processors referenced in the BIOSTAR product page have to be "Renoir." On the mobile platform, Ryzen 4000H and 4000U series processors do lack PCIe gen 4.0, but it was expected that AMD will enable gen 4.0 for the desktop socket AM4 platform.

The lack of gen 4.0 support has implications for "Renoir." For starters, the APU, like its predecessors, spares only 8 PCIe lanes toward PEG (PCI-Express discrete graphics, or the main x16 slot you typically use for graphics cards). If these lanes are gen 3.0, then even the newer graphics cards, such as AMD's "Navi" RX 5700 XT, or next-gen GeForce "Ampere," would have to make do with a PCI-Express 3.0 x8 interface, despite being gen 4.0 x16-capable. We will test just how much of a bottleneck this poses, when the next-gen graphics cards come out.

Here is the first picture of the AMD Ryzen 7 4700G, the company's upcoming socket AM4 APU based on the 7 nm "Renoir" silicon, courtesy of VideoCardz. The picture reveals a standard-looking socket AM4 chip with commercial name and OPN markings (100-000000146), matching the Igor's Lab OPN code leak from earlier this week. The Ryzen 7 4700G offers an 8-core/16-thread CPU based on the "Zen 2" microarchitecture, and an integrated graphics solution that combines the SIMD machinery of the "Vega" graphics architecture, with the updated display- and media engines of "Navi." The iGPU is configured with 8 CUs (512 stream processors), which on the 4700G has an impressive maximum engine boost clock of 2.10 GHz, according to the Igor's Lab story.

The 8-core/16-thread CPU of the Ryzen 7 4700G has a nominal clock speed of 3.60 GHz, and a maximum boost frequency of 4.45 GHz, with several Precision Boost power-states in both directions of the nominal clock. The CPU features 512 KB of L2 cache per core, and 8 MB of shared L3 cache (4 MB per CCX). The iGPU engine clock goes all the way up to 2.10 GHz, which could help it overcome some of the CU deficit vs. "Picasso," which has 11 CUs (704 stream processors), but clocked only up to 1.40 GHz. Since the Ryzen 5 3400G has an unlocked multiplier, it stands to reason that even the 4700G could. If the platform I/O of "Renoir" in its mobile avatar is anything to go by, then the 4700G could feature a limited PCI-Express x8 lane setup for its PEG port. AMD is rating the TDP of the 4700G at 65 W.

AMD's 4th generation Ryzen desktop processors are expected to launch around September 2020, sources in the motherboard industry tell DigiTimes. Codenamed "Vermeer," successor to "Matisse," these processors will be socket AM4 multi-chip modules of up to two CPU complex dies based on the "Zen 3" microarchitecture, combined with an I/O controller die. The "Zen 3" chiplets are expected to be fabricated on a newer 7 nm-class process by TSMC, either N7P or N7+. The biggest design change with "Zen 3" is the doing away of CCX arrangement of CPU cores, with each chiplet holding a common block of cores sharing a last-level cache. This, along with clock speed headroom gains from the new node are expected to yield generational price-performance increases.

The "Zen 2" based 8-core "Renoir" die is also expected to make its socket AM4 debut within 2020, succeeding the "Picasso" based quad-core Ryzen 3000-series APUs. This is a particularly important product for AMD, as it is expected to compete with Intel's 10th generation Core i5 6-core/12-thread processors in terms of pricing, while offering more cores (8-core/16-thread) and a faster iGPU. The 4th gen Ryzen socket AM4 processor lineup will launch alongside AMD's 600-series motherboard chipset, with forwards- and backwards-compatibility (i.e., "Vermeer" and "Renoir" working with older chipsets, and older AM4 processors working on 600-series chipset motherboards). AMD was originally expected to unveil these processors at the 2020 Computex trade-show in June, but Computex itself is rescheduled to late-September.

ZOTAC isn't just a graphics card major, but over the years developed a thriving lineup of compact desktops, mini PCs, and compact gaming desktops. The big buzzword this CES is "creator," and the company unveiled its new Inspire Studio line of compact desktops targeting creators, which are physically similar to the ZBOX Magnus. These are 5.85-liter (volume) boxes that take up minimal space on your desk, but pack serious hardware: a 9th gen Core i7 processor, GeForce RTX 2060 Super graphics, M.2 NVMe storage, and modern networking that include 802.11ax WLAN and 2.5 GbE wired Ethernet.

Next up is the ZBOX Edge. ZOTAC has been pushing the limits of compact desktops, and the ZBOX Edge MI643 is their latest creation. With an ultra-thin design that involves a 2.85 cm tall body and the ability to tuck it away behind your monitor, the MI643 packs a Core i5-10210U quad-core "Comet Lake" processor, DDR4 SO-DIMM memory, M.2 NVMe SSD storage, 802.11ac WLAN, dual 1 GbE networking, and Bluetooth 5.0. A more economical variant of this is the CI341, with 3.21 cm height, Celeron N4100 SoC, M.2 SATA storage, and SO-DIMM memory slots.

AMD today announced four new desktop processors across three very diverse markets. To begin with, the company crowned its socket AM4 mainstream desktop platform with the mighty new Ryzen 9 3950X processor. Next up, it released its new baseline entry-level APU, the Athlon 3000G. Lastly, it detailed the 3rd generation Ryzen Threadripper HEDT processor family with two initial models, the Ryzen Threadripper 3960X and the flagship Ryzen Threadripper 3970X. The company also formally released its AGESA Combo PI 1.0.0.4B microcode, and with it, introduced a killer new feature for all "Zen 2" based Ryzen processors, called ECO Mode.

The Ryzen 9 3950X is a 16-core/32-thread processor in the AM4 package, compatible with all socket AM4 motherboards, provided they have the latest BIOS update with AGESA Combo PI 1.0.0.4B microcode. The processor comes with clock-speeds of 3.50 GHz base, with 4.70 GHz maximum boost frequency, and the same 105 W TDP as the 12-core Ryzen 9 3900X. With 512 KB of dedicated L2 cache per core, and 64 MB of shared L3 cache, the chip has a mammoth 72 MB of "total cache."

AMD "Renoir" is the company's next-generation APU that improves iGPU and CPU performance over the current 12 nm "Picasso" APU. An AMD "Renoir" APU engineering sample running on a "Celadon-RN" platform prototyping board, was allegedly put through 3DMark 11, and its performance numbers surfaced on Reddit, in three data-sets corresponding with three hardware configurations. In the first one, dubbed "config 1," the CPU is clocked at 1.70 GHz, the iGPU at 1.50 GHz, and the system memory at DDR4-2667. In "config 2," the CPU runs at 1.80 GHz, and the iGPU and memory frequencies are unknown. In "config 3," the CPU runs at 2.00 GHz, the iGPU at 1.10 GHz, and the memory at DDR4-2667. Raw benchmark output from 3DMark 11 Performance preset are pasted for each of the configs below (in that order). The three mention 3DMark database result IDs, but all three are private when we tried to look them up.

The "config 1" machine scores 3,547 points in the performance preset of 3DMark 11. It's interesting to note here that the iGPU clock is significantly higher than that of "Picasso." In "config 2," a 3DMark performance score of 3,143 points is yielded. The CPU clock is increased compared to "config 1," but the score is reduced slightly, which indicates a possible reduction in iGPU clocks or memory speed, or perhaps even the iGPU's core-configuration. In "config 3," we see the highest CPU clock speed at 2.00 GHz, but a reduced iGPU clock speed at 1.10 GHz. This setup scores 2,374 points in the 3DMark performance preset, a 33% drop from "config 1," indicating not just reduced iGPU clocks, but possibly also reduced CU count. "Renoir" is expected to combine "Zen 2" CPU cores with an iGPU that has the number-crunching machinery of "Vega," but with the display- and multimedia-engines of "Navi."

AMD is expected to bring back its low-power APU family in 2020 with the new "Dali" silicon. Updated company roadmap slides see the inclusion of "Dali" as a "value mobile APU," positioned under "Renoir," a performance APU targeting both the mainstream notebook and desktop (socket AM4) platforms. AMD looks keen to branch out its APU business in two directions.

"Renoir" is expected to be a "Zen 2" based APU with CPU performance matching at least the Ryzen 5 3600 or 3700X, and a faster "Vega" based iGPU. It wouldn't surprise us if "Dali" is a monolithic 7 nm die with two "Zen 2" CPU cores and a tiny iGPU with 3-4 compute units. "Renoir," on the other hand, could be an MCM with an 8-core "Zen 2" chiplet and an enlarged I/O controller die that has the iGPU. "Dali" could see the light of the day only in 2020, by which time TSMC could substantially increase its 7 nm volumes and clear the decks for its new 7 nm EUV mass-production.

AMD's next-generation "Renoir" APU, which succeeds the company's 12 nm "Picasso," will be the company's truly next-generation chip to feature an integrated graphics solution. It's unclear as of now, if the chip will be based on a monolithic die, or if it will be a multi-chip module of a 7 nm "Zen 2" chiplet paired with an enlarged I/O controller die that has the iGPU. We're getting confirmation on two key specs - one, that the iGPU will be based on the older "Vega" graphics architecture, albeit with an updated display engine to support the latest display standards; and two, that the processor's memory controller will support the latest LPDDR4X memory standard, at speeds of up to 4266 MHz DDR. In comparison, Intel's "Ice Lake-U" chip supports LPDDX4X up to 3733 MHz.

Code-lines pointing toward "Vega" graphics with an updated display controller mention the new DCN 2.1, found in AMD's new "Navi 10" GPU. This controller supports resolutions of up to 8K, DSC 1.2a, and new resolutions of 4K up to 240 Hz and 8K 60 Hz over a single cable, along with 30 bits per pixel color. The multimedia engine is also suitably updated to VCN 2.1 standard, and provides hardware-accelerated decoding for some of the newer video formats, such as VP9 and H.265 at up to 90 fps at 4K, and 8K up to 24 fps, and H.264 up to 150 fps at 4K. There's no word on when "Renoir" comes out, but a 2020 International CES unveil is likely.

Our Monday story chronicled how MSI inadvertently erred in giving many of its AMD 400-series chipset motherboards 128 Mbit (16-megabyte) SPI flash ROM chips instead of larger 256 Mbit (32-megabyte) ones, which nearly jeopardized the company's "Zen 2" support deployment, forcing it to greatly thin its motherboard firmware feature-set, and break SATA RAID support on many of its boards. To be fair to MSI, the company may not have anticipated the AGESA microcode growing tremendously in size with its latest ComboAM4 1.0.0.3-series. We are now hearing from Polish tech publication PurePC that MSI has scrambled to remedy this by re-releasing many of its AMD 400-series chipset motherboards with larger 256 Mbit SPI flash ROM chips.

The PurePC report states that MSI will brand the revised motherboards "MAX" in the product name (eg: B450 Gaming Pro Carbon AC MAX, B450M Bazooka MAX, etc.), although we don't know if the new model names will have the company's latest MEG/MPG/MAG prefixes. The 256 Mbit SPI flash ROM chip allows MSI to cram in AGESA 1.0.0.3a, which lets you use 3rd generation Ryzen processors to their full capabilities (barring PCIe gen 4.0 on these motherboards of course). More importantly, the larger ROM chip allows MSI to have AGESA 1.0.0.3a without sacrificing on its feature-rich Click BIOS 5 UEFI setup program, SATA RAID module, or losing support for any of the socket AM4 processors.

AMD X570 is the company's first in-house design desktop motherboard chipset for the AM4 platform. The company sourced earlier generations of chipset from ASMedia. A chipset in context of the AM4 platform only serves to expand I/O connectivity, since an AM4 processor is a full-fledged SoC, with an integrated southbridge that puts out SATA and USB ports directly from the CPU socket, in addition to LPCIO (ISA), HD audio bus, and SPI to interface with the firmware ROM chip. The X470 "Promontory Low Power" chipset runs really cool, with a maximum TDP of 5 Watts, and the ability to lower power to get its TDP down to 3W. The X570, on the other hand, has a TDP of "at least 15 Watts." A majority of the X570 motherboards we've seen at Computex 2019 had active fan-heatsinks over the chipset. We may now have a possible explanation for this - there are just too many things on the chipset.

According to AMD, the X570 chipset by itself can be made to put out a staggering twelve SATA 6 Gbps ports (not counting the two ports put out by the AM4 SoC). A possible rationale behind this may have been to enable motherboard designers to equip every M.2 slot on the motherboard with SATA wiring in addition to PCIe, without needing switches that reroute SATA connection from one of the physical ports. It's also possible that AMD encouraged motherboard designers to not wire out SATA ports from the AM4 SoC as physical ports to save costs on switches, and dedicate one of them to the M.2 slot wired to the SoC. With the two SATA ports from the SoC out of the equation, and every other M.2 slot getting a direct SATA connection from the chipset, motherboard designers can wire out the remaining SATA ports as physical ports, without spending money on switches, or worrying about customer complaints on one of their drives not working due to automatic switching. This is an extreme solution to a rather simple problem.

At the bottom end of AMD's rather tall new Ryzen 3000 desktop processor product-stack are the Ryzen 3 3200G and Ryzen 5 3400G APUs. Unlike the rest of the Ryzen 3000 series, these two are based on the monolithic 12 nm "Picasso" silicon, which is essentially "Raven Ridge" redesigned for 12 nm with the "Zen+" microarchitecture. For the quad-core CPU, this means an improved Precision Boost algorithm that scales better across multiple cores, and faster on-die caches. For the iGPU based on the "Vega" architecture, this is a minor speed-bump.

The 3200G is configured with a 4-core/4-thread CPU and 8 out of 11 NGCUs of the iGPU enabled, yielding 512 stream processors. The maximum CPU clock speeds have been dialed up by 300 MHz over that of the 2200G, to now attain 4.00 GHz boost frequency, while the iGPU engine frequency is increased by 150 MHz, to 1250 MHz. The 3400G maxes out the silicon with a 4-core/8-thread CPU, and all 11 NGCUs enabled on the iGPU (704 stream processors). The CPU spools up to 4.20 GHz, and the iGPU up to 1400 MHz. AMD is including a bigger Wraith Spire cooling solution with the 3400G. Prices remain unchanged over the previous generation, with the 3200G being priced at USD $99, and the 3400G at $149, when the processors likely go on sale this July.

ECS at its Computex 2019 booth showed off its next generation of LIVA branded mini PCs and a new AMD platform SFF desktop. We begin with the retro-looking SF110-A320, an SFF desktop measuring 205 mm x 176 mm x 33 mm (WxDxH), with an AM4 socket, and the ability to power 35W TDP APUs. Its mainboard is driven by an AMD A320 chipset. We know that the A320 supports 12 nm Ryzen 3000-series "Picasso" APUs. It's quite possible that these desktops could ship with them, particularly their low-TDP variants. The iGPU of these chips are wired out to two DisplayPorts, an HDMI, and a D-sub (VGA) output. You drop in your own DDR4 SO-DIMM modules, an M.2-2280 SSD, or 2.5-inch SATA drive. Networking options include 802.11ac WLAN, Bluetooth 4.2, and 1 GbE wired networking. ECS includes a 90W power-brick.

The company also showed off its latest LIVA Z3 Plus series mini PCs that appear to be ready for 10th generation Core "Ice Lake-U" SoCs, although the company won't mention it. There are two physical variants of the Z3 Plus, a shorter one that lacks a 2.5-inch drive bay, making you rely entirely on an M.2-2280 slot for internal storage (PCIe + SATA); and a taller variant with an additional 2.5-inch drive bay with SATA 6 Gbps. The shorter variant measures 117 mm x 128 mm x 37 mm (WxDxH), and the taller one about 47 mm in height. Both variants ship with 120W power bricks, take in two DDR4 SO-DIMM modules, one M.2-2280 SSD, and put out connectivity that includes HDMI and mDP display outputs, dual 1 GbE wired + 802.11ac + Bluetooth 4.2 networking, and four USB 3.1 gen 2 ports, from which one is a type-C.

AMD is giving finishing touches to its Ryzen 3000 "Picasso" family of APUs, and Thai PC enthusiast TUM_APISAK has details on their CPU clock speeds. The Ryzen 3 3200G comes with 3.60 GHz nominal clock-speed and 4.00 GHz maximum Precision Boost frequency; while the Ryzen 5(?) 3400G ships with 3.70 GHz clock speeds along with 4.20 GHz max Precision Boost. The "Picasso" silicon is an optical shrink of the 14 nm "Raven Ridge" silicon to the 12 nm FinFET process at GlobalFoundries, the same one on which AMD builds "Pinnacle Ridge" and "Polaris 30."

Besides the shrink to 12 nm, "Picasso" features upgraded "Zen+" CPU cores that have improved Precision Boost algorithm and faster on-die caches, which contribute to a roughly 3% increase in IPC on "Pinnacle Ridge," but significantly improved multi-threaded performance compared to 1st generation Ryzen. Clock speeds of both the CPU cores and the integrated "Vega" iGPU are expected to increase. Both the 3200G and 3400G see a 100 MHz increase in nominal clock-speed, and 300 MHz increase in boost clocks, over the chips they succeed, the 2200G and 2400G, respectively. The iGPU is rumored to receive a similar 100-200 MHz increase in engine clock.

One of our readers discovered an interesting entry in the INF file of AMD's Adrenalin 19.4.3 graphics drivers. It includes two instances of "Radeon RX 640," and has the same device ID as the Radeon RX 550X from the current generation. The branding flies in the face of reports suggesting that with its next-generation "Navi" GPUs, AMD could refresh its client-segment nomenclature to follow the "Radeon RX 3000" series, but it's possible that the RX 600 series was carved out to re-brand the existing "Polaris" based low-end chips one step-down (i.e. RX 550X re-branding as RX 640, RX 560 possibly as RX 650, etc.).

The move to create the RX 600 series could also be driven by AMD's need to contain all "Navi" based SKUs in the RX 3000 series, and re-branded "Polaris" based ones in the RX 600, so that, at least initially, consumers aren't led to believe they're buying a re-branded "Polaris" SKU opting for an RX 3000-series graphics card. It's also possible that AMD may not create low-end chips based on "Navi" initially, and focus on the performance-segment with the highest sale volumes among serious gamers, the $200-400 price-range. Based on the 14 nm "Lexa" silicon, the RX 550X is equipped with 640 stream processors, 32 TMUs, 16 ROPs, and 2 GB of GDDR5 memory across a 128-bit wide memory bus. Given the performance gains expected from Intel's Gen11 "Ice Lake" iGPU and AMD's own refreshed "Picasso" APU, the RX 640 could at best be a cheap iGPU replacement for systems that lack it.Image Credit: Just Some Noise (TechPowerUp Forums)

TechPowerUp today released the latest version of GPU-Z, the definitive graphics subsystem information and diagnostic utility. Version 2.19.0 adds support for several new GPUs, improves user experience, and fixes bugs. To begin with, support is added for AMD Ryzen 3000-series "Picasso" iGPUs, besides NVIDIA GeForce GTX 1650, GTX 1650 Mobile, GTX 1660 Mobile, GTX 1660 Ti Mobile, GeForce MX250, and the TU117-B revision. Transistor counts were added for GeForce MX230 and GP108 chips. AMD Radeon Pro series graphics cards get a proper logo display.

TechPowerUp GPU-Z 2.19.0 also improves support for EVGA iCX technology with better detection of support, and improved accuracy. We've added the ability to detect support for DirectX Raytracing (DXR), Variable-rate shading, WDDM 2.6 (requires Windows 10 1903), and Shader Model 6.5, and Tiled Resources Tier 4 in the Advanced panel. The tab now also lists out new DirectX 12 capabilities incrementally rolled out through Windows 10 1803 and 1809. The ASIC Quality readout will now only display on GPUs that support the read-out. Among the fixes include faster startup on devices with AMD PowerXpress, a crash when no known cards are detected and driver info is sought by a mouse-hover, a startup crash on Windows XP machines, and the correct silicon display of GK210 for Tesla K80.DOWNLOAD: TechPowerUp GPU-Z 2.19.0

The change-log follows.

AMD is putting final touches on its Ryzen 3000U series APUs for ultra-portable notebooks and 2-in-1 devices. Thai PC enthusiast Tum Apisak shared links to Geekbench scores of at least three SKUs, the Ryzen 3 3200U, the Ryzen 3300U, and the Ryzen 5 3500U. The Ryzen 3 3200U combines a 2-core/4-thread CPU component, while the Ryzen 3 3300U packs a 4-core/4-thread CPU, and the Ryzen 5 3500U a better equipped 4-core/8-thread CPU. While the 3200U's CPU is clocked high at 2.60 GHz, the 3300U and 3500U are both clocked at 2.10 GHz. The iGPU specs are still under the wraps as Geekbench only tested the single- and multi-threaded CPU performance. The 3200U scores 3428 points single-threaded owing to its higher nominal clocks, and around 6500 points multi-threaded. The 3300U scores 9686 points in multi-threaded owing to its additional cores (sans SMT). The 3500U increases the multi-threaded score to over 11280 points multi-threaded, on account of being quad-core with SMT.

There's no clarity on the underlying micro-architecture. While the source mentions the codename of these chips as Picasso, the silicon still appears to be 14 nm "Raven Ridge." Over generation, AMD only appears to have pushed its current parts lower down the product stack. For example, the Ryzen 3 3300U appears to share the same CPU configuration (albeit with 5% higher clock-speeds) as the Ryzen 5 2500U from the current-generation. The Ryzen 5 3500U, on the other hand, appears to have essentially the same (again, marginally speed-bumped) CPU as the Ryzen 7 2700U. HP is ready with notebook and 2-in-1 products based on all three chips, although they're unlikely to launch before year-end. Perhaps CES could be a nice launchpad.

AMD's low-power Ryzen 3700U APU has been leaked. Codenamed ZM370SC4T4MFG_38/22_Y, this latest AMD processor features 4 cores and 8 threads with a base clock of 2.2 GHz and a boost clock of 3.8 GHz, making it very similar to the current generation 2700U. The GPU, which is recognized as Picasso by UserBenchmark, is like just another codename for now, as other applications are listing it as a Radeon RX Vega 10 GPU. Considering the 3000U Series is supposed to be similar to the 2000U offerings it could very well feature the same Vega 10 GPU and still be based on the Zen+ or the Zen 2 architectures. That said, nothing is confirmed, but some slides leaked from Informatica Cero suggest that the Ryzen 7 3700U could indeed feature the Zen 2 architecture. That would be fairly interesting given that the Ryzen family for laptops/convertibles have been a step behind the desktop solutions for a quite some time.

Picasso which we've been hearing about since the codename first appeared in September of 2017, looks to be nothing more than Raven Ridge manufactured on the 12nm node. This is of course based on the information that is available. Some people suggest this new APU could be on the 7 nm node, but this is difficult to believe as AMD is likely to devote 7 nm manufacturing to their EPYC server solutions and Ryzen desktop products first. Therefore Zen 2 APUs for notebooks are likely still far off.

AMD appears to have begun testing of its third APU for the socket AM4 platform, codenamed "Picasso." The code-name saw first light some 10 months ago, when it was described as AMD's APU product for 2019. The integrated graphics core of "Picasso" made its way to UserBenchmark database under the device ID "15D8." There are no benchmark results associated with this chip, yet. OIder slides described "Picasso" as being a slightly improved variant of "Raven Ridge," with improvements to out of the box performance and performance/Watt. It's likely that the chip is essentially "Raven Ridge" fabricated on the 12 nm node, with tweaks to the chip's on-die software. 2019 will also see AMD introduce its first chips based on the "Zen 2" architecture.