Wednesday, June 9th 2010

VIA Announces EITX-3001 Slim-line Em-ITX Board Featuring VIA Nano Processor

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EITX-3001, its latest Em-ITX form factor board and the ideal solution for a range of durable and fanless next generation devices in kiosk, HMI, POI and POS embedded applications.

Combining the latest VIA Nano E-Series processor and the VIA VX855 media system processor, the VIA EITX-3001 offers a full featured I/O specification on a specially developed slim-line board. Fanless devices based on the VIA EITX-3001 can enjoy absolute stability within a wide temperature range in a low profile system of less than 35mm high.
"With the VIA EITX-3001 we're offering a full-featured board that is the ideal starting point for much slimmer, fanless and rugged devices," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA EITX-3001 combines versatility with ruthless stability at extreme temperatures in a form factor that is ideal for space constrained industrial and commercial environments."

The VIA EITX-3001: Slim, Stable and Fanless
The VIA EITX-3001 is powered by a 1.3GHz VIA Nano E-Series processor, bringing a performance optimized, 64-bit architecture to today's modern embedded applications. The VIA EITX-3001 also takes advantage of the VIA VX855 media system processor, a feature packed all-in-one digital media chipset that brings excellent hardware acceleration for the latest HD video formats including MPEG-2, H.264, VC-1 and WMV9.

The VIA EITX-3001 is based on the unique Em-ITX form factor, placing both the VIA Nano E-Series processor and VIA VX855 MSP on the reverse side of the board, optimizing available board real estate and facilitating simple fanless chassis designs. The VIA EITX-3001 is guaranteed to be stable in passive cooling configurations at temperatures ranging from -10°C to 60°C.

The VIA EITX-3001 includes an onboard DC-to-DC converter that has both AT and ATX power modes, supporting a wide range of power input voltage from DC 7V to DC 36V, configurable through an onboard switch. An on board built-in 5-wire/4-wire USB Touch interface makes the EITX-3001 ideally suited for high-end interactive touch screen multimedia applications.

Dual I/O coastlines allow for a wealth of I/O ports including a HMDI port, VGA port, Gigabit Ethernet, dual COM ports, four USB ports, a USB device port, audio jacks and power and HDD activity LEDs. LVDS is supported through on board pin headers allowing for a range of multi-display options including CRT/LVDS, CRT/HDMI and LVDS/HDMI configurations.

The VIA EITX-3001 supports all 32-bit and 64-bit Microsoft Windows operating systems including the latest Windows Embedded Standard 7. The VIA EMITX-30001 is available to customers now.
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3 Comments on VIA Announces EITX-3001 Slim-line Em-ITX Board Featuring VIA Nano Processor

#1
HillBeast
Looks nifty. Might be a nice media centre board. Strange that they included two serial ports. I'd say there would be someone out there who will use one of them but I can't see two being used.

Also typo in second last paragraph. You wrote HMDI port.
Posted on Reply
#2
Cuzza
I suppose it might be, but these things really are not designed for regular consumer applications but for embedded applications. That's why it has the serial ports- embedded devices need serial ports to communicate with a raft of things in the machines that they are controlling.

It has serious drawbacks as a consumer product, one being the chips on the underside of the board. What a pain! You can't mount the board in any regular fashion because of the heatsinks. But with a special case for an embedded application this is fine.
Posted on Reply
#3
HillBeast
CuzzaIt has serious drawbacks as a consumer product, one being the chips on the underside of the board. What a pain! You can't mount the board in any regular fashion because of the heatsinks. But with a special case for an embedded application this is fine.
Yeah but they could just use the casing as a heatsink.
Posted on Reply
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