Tuxedo Computers has just announced its Nano Pro Gen15, a new mini PC powered by Intel's Panther Lake Core Ultra X7 358H CPU and its capable Arc B390 iGPU. The mini PC is a workstation targeting developers and home lab enthusiasts who want to run "local, secure, sovereign" LLMs, but Tuxedo also fully acknowledges that it can be used as a no-fuss mini gaming PC, thanks to Intel's graphics integrated into the Linux kernel of the pre-installed TuxedoOS. Physically, the Nano Pro Gen15 measures in at just 110 × 117.5 × 49 mm, and it features a plastic chassis, although Tuxedo has maintained a repair-friendly design, with just four screws required to access the internals, where the upgradeable RAM, storage, and wireless cards are easily accessible.

Tuxedo supplies a 120 W external power supply that connects via a barrel adaptor, but it makes no claims about the actual maximum TDP of the Intel CPU inside. Connectivity on the Nano Pro Gen15 is reasonable, if not stellar, with Wi-Fi 7 and dual 2.5 GbE for networking, alongside Bluetooth 6 for peripheral connectivity. On the back of the mini PC, there is a DC-in power port, the aforementioned 2.5 GbE ports, 2× USB 3.2 Gen 2 Type-A ports, 2× HDMI ports with HDMI 2.1 support on Windows and 2.0b support on Linux (for now). On the front of the mini PC, there is a USB4 port, 1× USB 3.2 Gen 2×2 Type-C port with DP 1.4a Alt Mode, and a USB 3.2 Gen 2 Type-A port alongside a 3.5 mm audio combo jack. Tuxedo says that, between the USB Type-C ports and the dedicated HDMI ports, the Nano Pro Gen15 can support up to four simultaneous displays.

Innodisk, a leading global AI solution provider, today announced the Innodisk GMSL2 Camera Starter Kit, an all-in-one vision solution that bundles four 3MP GMSL2 camera modules, a capture card, FAKRA cables, and other necessary accessories.

A milestone in Innodisk's edge AI vision strategy, the kit lets customers set up a multi-camera system and begin validation right out of the box, shortening the path from proof of concept (PoC) to deployment. Full camera source code is included, giving customers flexibility throughout development and maintenance.

As AI vision moves toward multi-camera perception in robotics and intelligent vehicles, integrating cameras, capture cards, drivers, and host platforms has become increasingly complex, often taking six months or more before validation. The starter kit's pre-integrated hardware and software driver enable system integrators to speed up time-to-market.

Microsoft has announced the Xbox Nano Controller, a pocket-sized gamepad priced at $49.99 (£44.99) that it calls its smallest controller yet. It measures just over five inches long and weighs a tiny 3.5 ounces, yet still packs all 18 standard gameplay inputs, plus a programmable Action Button for screenshots and gameplay capture. It connects over Xbox Wireless and Bluetooth, runs on a built-in rechargeable battery, and works with Xbox consoles, Windows PCs, iOS and Android devices, and select smart TVs. Microsoft hasn't shared battery life or color options yet, and there's no word on rumble or impulse triggers either. Pre-orders are open now, with the controller launching on November 4 across 36 markets, including the US, UK, Japan, and much of Europe.

Xbox is also lining up US holiday bundles, with select Samsung TVs and Meta Quest headsets coming with a Nano Controller and two months of Game Pass Ultimate for new members. A compact controller for TVs and VR headsets makes the most sense for cloud gaming, though the timing isn't great. Starting in November, Xbox Cloud Gaming gets monthly time limits, with Ultimate subscribers capped at 15 hours, Premium at 10, and Essential at 5, and extra hours costing more. At $49.99, the Nano also costs noticeably more than other compact controllers, such as CRKD's Atom+ at $29.99 and 8BitDo's Lite 2 at $34.99. Native Xbox Wireless support might justify some of that premium, but battery life will probably decide whether it's worth it.

Today, IBM (NYSE: IBM), in collaboration with Siemens, announced new research aimed at advancing IBM's nanostack architecture, a new transistor architecture unveiled by IBM earlier this year. The collaboration will bring together IBM's leadership in semiconductor device innovation and Siemens' expertise in electronic design automation (EDA), process simulation, lithography optimization, and advanced manufacturing software to accelerate the development of nanostack.

Nanostack is the industry's first known three-dimensional, nanosheet-based design, vertically stacking and staggering transistors to pack more transistors onto a chip, with nearly 100 billion transistors in a space the size of a fingernail at its current 7 angstrom node. The design also unlocks the use of different material combinations within each stacked layer to optimize performance and power efficiency of each transistor independent of the other. These innovations power substantial leaps in energy efficiency, performance, and SRAM scaling.

MSI IPC introduces the MS-C9ZA, a compact fanless Edge AI Box PC powered by NVIDIA Jetson Orin Nano 8 GB for machine vision, robotics, and embedded edge AI applications. It integrates local AI inference, industrial I/O, dual Gigabit Ethernet, M.2 expansion, and 12-24 V DC input.

Powered by a 6-core Arm Cortex -A78AE CPU, NVIDIA Ampere GPU, and 8 GB LPDDR5 memory, the MS-C9ZA enables AI inference and computer vision processing at the edge, helping reduce cloud dependency, bandwidth usage, and network latency.

Fosi Audio announces four new products making their debut at IFA 2026, taking place September 4-8 at Messe Berlin: the Carbon12 In-Ear Monitor, ZH1 Desktop DAC & Headphone Amp, DISC Nano Portable CD Player, and S3 Lite Streaming Digital Transport. Visitors can experience the products in Hall 10.2, Booth 101.

IFA brings consumer technology brands, retailers, and media from around the globe to Berlin each September to introduce the products shaping the next cycle. For Fosi Audio, this is an opportunity to introduce a lineup that moves beyond its traditional amplifier and DAC offerings, from an IEM and portable CD player to a desktop DAC/headphone amp and streaming transport. Together, the four products extend the company's approach to Hi-fi across more of the ways people listen at home and on the go.

NVIDIA today announced NVIDIA Jetson Orin Nano 2, a new robotics computer set to redefine entry-level edge AI—putting frontier-class generative AI performance in the hands of millions of developers.

As AI models grow smaller and more efficient, more edge devices can become autonomous systems that understand context, interpret language and images, and act in real time. To bring these capabilities into physical machines like robots, delivery and inspection drones, and vision AI systems, developers need compact, energy-efficient robotics computers built for edge AI.

IBM (NYSE: IBM) today unveiled a major semiconductor breakthrough with the introduction of the world's first sub-1 nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom node. The achievement marks a landmark moment for an industry facing the physical limits of traditional chip scaling. Semiconductors play critical roles in everything from computing, to appliances, to communication devices, transportation systems, and critical infrastructure.

IBM's new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM's 2 nm chip, unveiled in 2021. Enabled by a series of structural and material innovations, including IBM's groundbreaking three-dimensional nanostack architecture, the technology demonstrates how continued gains in performance and efficiency remain possible even as chip features approach atomic dimensions.

Google Chrome is reportedly downloading a 4 GB AI model onto user PCs without consent, prior information, or any way for less technical users to discover it independently. According to Alexander Hanff, who publishes a blog called "That Privacy Guy," Google Chrome is installing a 4 GB Gemini Nano model locally without user consent. The researcher discovered that Google Chrome downloads and installs the local AI model automatically, without any user input. Google Chrome initiates this process by creating an "OptGuideOnDeviceModel" folder, which contains a "weights.bin" file that is exactly 4 GB. This file is used for Google's Gemini Nano model, which handles on-device scam detection, AI-assisted writing, and other tasks. The entire process takes about 15 minutes to complete, all without the user's knowledge.

Why does this happen? Google Chrome automatically scans your device to assess whether it can run local AI models and only triggers the download when AI features are active. There is no specific checkbox in the browser settings indicating a 4 GB local AI model download. Interestingly, users who deleted this 4 GB model found that Google Chrome redownloaded it repeatedly, continuing the cycle. The only way to prevent or disable the download is by disabling Chrome's AI features through the "chrome://flags" settings, using enterprise policy settings in your organization, or simply uninstalling Chrome to stop the automatic downloads.

Samsung Electronics and POSTECH have published a research paper titled "Switchable 2D-3D display through a metasurface lenticular lens" in the prestigious journal Nature, marking notable progress in next-generation display technology through industry-academia collaboration.

Rethinking 3D Displays With Metasurfaces
A metasurface lenticular lens-based switchable 2D/3D display uses an ultra-thin metalens composed of nanoscale structures to transition seamlessly between flat (2D) and stereoscopic (3D) images. A metasurface is significantly thinner while enabling complex optical functions—making it key to next-generation displays and camera systems.

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1 nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High-NA EUV lithography processes to advance IBM's logic scaling roadmap.

IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7 nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1 nm node. The work will focus on developing new materials, advanced etch and deposition capabilities for increasingly complex device architectures, and new High-NA EUV lithography processes to enable next-generation interconnect and device patterning and accelerate industry adoption.

Today, the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2 nm, releases two first-of-a-kind advanced interconnect process design kits (PDKs): a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced packaging capabilities within reach of universities, start-ups, and industry innovators and mark an important step in enabling high-density, energy-efficient chip-to-chip connectivity.

As the semiconductor industry moves toward ever more complex and heterogeneous system architectures, advanced packaging has become a key enabler in supporting this progress. Instead of merely enclosing individual chips, today's packaging technologies bring multiple dies (chiplets) together into tightly integrated systems where performance, energy efficiency, and bandwidth hinge on how effectively those components can interact. By enabling chiplets to be interconnected at high density, advanced packaging provides the foundation for the next generation of high-performance computing, AI accelerators, and data-intensive applications.

ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges of next-generation AI and high-performance computing data centers.

ASUS Optimized Liquid-Cooling Solutions for next-generation AI compute density
As AI and HPC workloads push compute density and power consumption beyond the capabilities of traditional air cooling, optimized liquid-cooling solutions by ASUS will provide the critical thermal management required for the next-generation NVIDIA Vera Rubin NVL72 system based data centers. By efficiently dissipating heat from high-performance CPUs, GPUs, and accelerator-dense racks, ASUS significantly reduces energy consumption, lowers PUE, and optimizes TCO while supporting unprecedented rack density.

Imec - a world-leading R&D center in advanced semiconductor technologies - today inaugurated a 2,000 m² cleanroom expansion at its Leuven headquarters, marking a pivotal milestone in the deployment of Europe's NanoIC pilot line. The event was attended by European EVP Henna Virkkunen, Belgian Prime Minister Bart De Wever, Flemish Minister-President Matthias Diependaele, and ASML CEO Christophe Fouquet, alongside representatives from the European high-tech ecosystem - including industry and startups - the NanoIC pilot line consortium, and policymakers from the EU, Belgium, and Flanders. With a capacity of over 12,000 m², imec's cleanroom plays a crucial role in the European Chips Act's ambitions to position Europe at the forefront of next-generation semiconductor innovation and manufacturing; a strategy that will be instrumental in reinforcing the continent's industrial fabric in the AI era, while safeguarding a climate of sustained economic growth, security, and prosperity for decades to come.

"Since announcing in May 2024 that imec would host the NanoIC pilot line, we've moved at full speed - accelerating tool acquisition and launching a comprehensive recruitment program. Today, that effort culminates in the inauguration of a 2,000 m² cleanroom extension at the imec premises. It will house a best-in-class toolset, including ASML's next-generation High NA EUV scanner that is scheduled to arrive mid-March," said Luc Van den hove, CEO of imec.

Forge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, today announced a breakthrough that fundamentally redefines the economics and architecture of advanced semiconductor manufacturing. The company has demonstrated high-speed, defect-free atomic layer deposition (ALD) coatings in semiconductor features at a 1000:1 aspect ratio. Conformality is maintained at production-scale while providing coverage on features 2 orders of magnitude greater than line-of-sight techniques.

This breakthrough removes the primary constraint that has limited 3D semiconductor scaling and enables architectures previously considered uneconomic or impossible. The demonstration was performed on production-representative wafers supplied by C2MI, a leading semiconductor process development and manufacturing innovation center in Canada, with conformality, defectivity and electrical performance independently validated through the partner's internal metrology and reliability testing.

NuPhy, a next-generation keyboard and input device brand, is making its CES 2026 debut with a lineup of innovative keyboards designed to transform typing and gaming experiences. The debut highlights NuPhy's signature "Playfully Serious" philosophy, proving that professional work tools can be both functional and fun.

"Our philosophy is simple," says Reo, CEO of NuPhy, "Work doesn't have to be boring. Even serious tasks can be inspiring when your tools are designed to engage your focus, rhythm, and creativity." This "Playfully Serious" ethos drives NuPhy's expanding product lines, from office companions to high-performance gaming keyboards.

NVIDIA today announced the NVIDIA Nemotron 3 family of open models, data and libraries designed to power transparent, efficient and specialized agentic AI development across industries. The Nemotron 3 models—with Nano, Super and Ultra sizes—introduce a breakthrough hybrid latent mixture-of-experts (MoE) architecture that helps developers build and deploy reliable multi-agent systems at scale.

As organizations shift from single-model chatbots to collaborative multi-agent AI systems, developers face mounting challenges, including communication overhead, context drift and high inference costs. In addition, developers require transparency to trust the models that will automate their complex workflows. Nemotron 3 directly addresses these challenges, delivering the performance and openness customers need to build specialized, agentic AI.

Dai Nippon Printing Co., Ltd. (DNP) today announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4 nm generation and meets the miniaturization needs of cutting-edge logic semiconductors used in devices such as smartphones, data centers, and NAND flash memory.

Background and Aims
In line with the shift to more sophisticated devices seen in recent years, demands have emerged for even greater miniaturization in cutting-edge semiconductors, leading to advances in Extreme Ultra-Violet (EUV) lithography-based production. EUV lithography, however, requires substantial capital investment, energy consumption, and operating costs in building production lines and the exposure process. This has fed into the pressing need to balance a reduction in manufacturing costs with a lowering in the environmental burden.

At the Open Innovation Platform Ecosystem Forum, TSMC outlined its near-term roadmap, highlighting how increasing AI workloads are intensifying the node development and balance between performance and efficiency. The company announced that N2 is now in volume production and expects N2P to ramp up in early 2026. TSMC aims to deliver initial A16 parts, which combine nanosheet transistors with a rear-side Super Power Rail (SPR), by the end of 2026. The progression of nodes moves from N3 to nanosheet-based N2, then to A16 with SPR, and eventually to the more advanced A14 node.

TSMC provided data showing a performance increase of about 1.8x when transitioning from N7 to A14 at constant power, along with an overall efficiency improvement of approximately 4.2x over the same period. For A16, the company predicts clock speeds 8-10% higher than N2P at the same voltage, while reducing energy consumption by 15-20% for similar throughput. For those wanting to remain on FinFET, enhanced FinFET options like N3C and N4C are still available, with N4C already in use by customers. TSMC also highlighted NanoFlex, a cell-level tuning method introduced with N2, which allows design teams to balance speed and efficiency. This approach can achieve 15% frequency gains or energy reductions of up to 30% in suitable designs.

At Computex 2025, Palit showed off its latest Pandora NXNano mini PC, bringing the power of NVIDIA Jetson Orin NX Super to a truly pocket-sized AI platform. At its heart sits an eight-core Arm Cortex-A78AE CPU paired with a 1,024-core Ampere-architecture GPU (32 Tensor Cores), delivering up to 157 TOPS of sparse AI throughput and 78 TOPS dense performance. Up to 16 GB of LPDDR5 memory (102.4 GB/s bandwidth) and a pre-installed 128 GB PCIe Gen 4 SSD ensure both data-intensive models and large datasets run smoothly. Connectivity is generous: dual 10/100/1000 Mb Ethernet, two USB 3.2 Gen 2 Type-A ports, a USB 3.2 Gen 2 Type-C OTG port, plus USB 2.0 and HDMI 2.0 outputs. Four M.2 slots (for storage, Wi-Fi, 5G/LTE or video-capture cards), an 8-lane MIPI CSI-2 camera interface, and headers for I²C, SPI, UART, GPIO, and CAN Bus round out a very flexible I/O package.

Housed in a sleek 145×123 ×66 mm chassis, the NXNano balances performance and thermals with "superior thermal design" that includes two 50 mm high-efficiency fans, ensuring sustained workloads remain cool even under heavy AI inference. Removable base and side panels allow easy customization, whether adding 3D-printed shells or extra modules. The rugged aluminium frame accommodates DC input from 12 to 36 V. At just 470 g, this DIY-friendly unit is ideal for edge deployments in retail, digital signage, robotics, and education, putting enterprise-grade AI in a truly compact form factor.

TSMC today unveiled its next cutting-edge logic process technology, A14, at the Company's North America Technology Symposium. Representing a significant advancement from TSMC's industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.

Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Leveraging the Company's experience in design-technology co-optimization for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency and design flexibility.

This week, IBM and Tokyo Electron (TEL) announced an extension of their agreement for the joint research and development of advanced semiconductor technologies. The new 5-year agreement will focus on the continued advancement of technology for next-generation semiconductor nodes and architectures to power the age of generative AI. This agreement builds on a more than two-decade partnership between IBM and TEL for joint research and development. Previously, the two companies have achieved several breakthroughs, including the development of a new laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology.

Now, bringing together IBM's expertise in semiconductor process integration and TEL's leading-edge equipment, they will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI. "The work IBM and TEL have done together over the last 20 years has helped to push the semiconductor technology innovation to provide many generations of chip performance and energy efficiency to the semiconductor industry," said Mukesh Khare, GM of IBM Semiconductors and VP of Hybrid Cloud, IBM. "We are thrilled to be continuing our work together at this critical time to accelerate chip innovations that can fuel the era of generative AI."

The future of AI at the edge has arrived, and ASRock Industrial is leading the way. With Super Mode support for the iEP-6010E Series and iEP-6010E Series Dev Kit, powered by NIVIDIA Jetson Orin NX and Jetson Orin Nano modules and optimized with NVIDIA JetPack 6.2 SDK, this upgrade supercharges AI acceleration, unlocking up to 2X faster generative AI performance. Delivering unprecedented inference speeds, real-time decision-making, and superior power efficiency, Super Mode is redefining edge AI computing - Powering everything from predictive maintenance and anomaly detection to AI-driven medical imaging, intelligent surveillance, and autonomous mobility - pushing performance beyond limits, faster, smarter, and more efficient than ever before. Whether driving Edge AI computing, real-time vision processing, intelligent autonomous vehicles, advanced robotics, industrial automation, or smart city infrastructure, ASRock Industrial's latest innovation empowers industries with cutting-edge AI capabilities that drive real-world transformation.

A Quantum Leap in Edge AI Performance
The iEP-6010E Series and iEP-6010E Series Dev Kit, now optimized with Super Mode, provides:

• Up to 2X Faster Gen AI Processing - Up to 157 TOPS (Sparse) on Orin NX 16 GB (Super) and 67 TOPS (Sparse) on Orin Nano 8 GB (Super), delivering blazing-fast generative AI performance for automation, robotics, and real-time vision systems.
• Optimized Power Boost and Efficiency - Supports power modes up to 40 W / MAXN Super on Orin NX and 25 W / MAXN Super on Orin Nano, while maintaining high-performance AI workloads in power-sensitive environments, making it ideal for industrial automation and smart city infrastructure.
• NVIDIA JetPack 6.2 Support - Fully compatible with the latest NVIDIA JetPack 6.2 SDK, offering enhanced libraries, frameworks, and tools to accelerate advanced AI development.

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products - is thrilled to unveil an electrifying upgrade that its AIE100, AIE110, and AIE900 series edge AI systems are going to gear up to support NVIDIA's game-changing Super Mode for NVIDIA Jetson Orin Nano and Orin NX series modules, launching this year with the NVIDIA JetPack 6.2 software development kit release.

This enhancement catapults performance to new heights, supercharging groundbreaking applications like local AI chatbots, real-time computer vision, and advanced robotics. Axiomtek's commitment to pioneering edge AI solutions just got even stronger, marking another milestone in its strategic collaboration with NVIDIA, as a Preferred member of the NVIDIA Partner Network with an Embedded Compute competency.

ASUS IoT, a global leader in AIoT solutions, today announced that ASUS IoT edge AI computers powered by the NVIDIA Jetson Orin platform have been upgraded to enable the new Super mode. This upgrade increases AI TOPS by up to 1.7X, memory bandwidth by up to 1.5X, and Gen AI model performance by up to 2X.

Up to 1.7X AI TOPS and extensive compatibility with Super mode
Since it enhances AI TOPS by up to 1.7X, Super mode enables a wide range of Gen AI models, including large language models (LLMs), visual language models (VLMs), and vision transformers (ViTs). Jetson Orin modules support popular machine learning frameworks such as Hugging Face Transformers, Ollama, llama.cpp, vLLM, MLC, NVIDIA TensorRT-LLM, and more. This makes them excellent options for edge applications, robotics, and multimodal systems.