Tuesday, February 7th 2017
Rambus Introduces High Bandwidth Memory PHY on GlobalFoundries FX-14
Rambus Inc. today announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES high-performance FX-14 ASIC Platform. Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at networking and data center applications and designed for systems that require low latency and high bandwidth memory. This PHY is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, enabling a total bandwidth of 256 GB/s to meet the needs of today's most data-intensive tasks.
"Data center needs are continuously changing and we are at the forefront of delivering memory interface technology designed to meet today's most demanding workloads," said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces division. "Through our collaboration with GLOBALFOUNDRIES, we are delivering a comprehensive and robust solution for high-performance data center and networking applications. Our HBM offering will allow data center solution developers to bring high performance memory closer to the CPU, thus reducing latency and improving the system throughput."
"With the rise of cloud computing and the growing needs of Big Data, the computing power of data centers is burdened more than ever and hardware manufacturers are being called upon to deliver new solutions that can meet these challenges," said Kevin O'Buckley, vice president product development GLOBALFOUNDRIES. "Working together with Rambus enables us to provide ASIC solutions to our customers with increased memory capacity and bandwidth, with improved power efficiency. This HBM innovation complements other advanced chip to chip interfaces in our ASIC platform, including our industry leading 56G Long Reach SerDes technology."
The Rambus HBM PHY delivers high performance with lower power consumption when compared to other memory solutions. It combines 2.5D packaging with a wider interface (1024 bits) at a lower clock speed, which results in a higher overall throughput while remaining energy efficient for even the most high-performance computing applications. Rambus experts perform complete signal and power integrity analysis on the entire 2.5D systems to ensure all signal and thermal requirements are met.
The HBM PHY is another key component in Rambus' memory and SerDes high-speed interface IP portfolio for networking and data center applications.
"Data center needs are continuously changing and we are at the forefront of delivering memory interface technology designed to meet today's most demanding workloads," said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces division. "Through our collaboration with GLOBALFOUNDRIES, we are delivering a comprehensive and robust solution for high-performance data center and networking applications. Our HBM offering will allow data center solution developers to bring high performance memory closer to the CPU, thus reducing latency and improving the system throughput."
"With the rise of cloud computing and the growing needs of Big Data, the computing power of data centers is burdened more than ever and hardware manufacturers are being called upon to deliver new solutions that can meet these challenges," said Kevin O'Buckley, vice president product development GLOBALFOUNDRIES. "Working together with Rambus enables us to provide ASIC solutions to our customers with increased memory capacity and bandwidth, with improved power efficiency. This HBM innovation complements other advanced chip to chip interfaces in our ASIC platform, including our industry leading 56G Long Reach SerDes technology."
The Rambus HBM PHY delivers high performance with lower power consumption when compared to other memory solutions. It combines 2.5D packaging with a wider interface (1024 bits) at a lower clock speed, which results in a higher overall throughput while remaining energy efficient for even the most high-performance computing applications. Rambus experts perform complete signal and power integrity analysis on the entire 2.5D systems to ensure all signal and thermal requirements are met.
The HBM PHY is another key component in Rambus' memory and SerDes high-speed interface IP portfolio for networking and data center applications.
15 Comments on Rambus Introduces High Bandwidth Memory PHY on GlobalFoundries FX-14
This is actually same as the spec. of HBM2 which is 256GB/s per package ( HBM1 was 128GB/s per package )... remember that next gen. GPU's expected to have 512GB/s because of the use of two packages.
The announcement is just that any customer of Glofo HP FX-14nm process can be assured to have the PHY design ready, he will not have to invest on designing it from scratch... this means lower cost for adaptation and also make customers take a second look at Glofo as the maker if he's targeting HP 14nm process...
Same goes for other ASIC's, for example Fab's companies are working with ARM to ensure a ready design for any customer who want their services, so the customer does not need to pay for scratch designing, but the main design cost is shared between multi clients to save cost.. the client will only pay for his customization ( if any ).
It's just like buying a ready made template at much lower cost than designing from scratch, it's more appealing to customers ( lower cost and faster development ) and also a way for the Fab companies to attract more customer duo to lower cost and faster adaptation
"The design of many common Rambus memory controllers dictated that memory modules be installed in sets of two. Any remaining open memory slots must be filled with continuity RIMMs (CRIMMs.) These sticks provide no extra memory, and only served to propagate the signal to termination resistors on the motherboard instead of providing a dead end where signals would reflect. CRIMMs appear physically similar to regular RIMMs, except they lack integrated circuits (and their heat-spreaders)."
Long dead, and good riddance!