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TechPowerUp GPU-Z v2.35.0 Released

TechPowerUp today released the latest version of TechPowerUp GPU-Z, the popular graphics sub-system information and diagnostic utility. Version 2.35.0 adds support for new GPUs, and fixes a number of bugs. To begin with, GPU-Z adds support for AMD Radeon RX 6000 series GPUs based on the "Navi 21" silicon. Support is also added for Intel DG1 GPU. BIOS extraction and upload for NVIDIA's RTX 30-series "Ampere" GPUs has finally been introduced. Memory size reporting on the RTX 3090 has been fixed. The latest Windows 10 Insider Build (20231.1000) made some changes to DirectML, which caused GPU-Z to report it as unavailable, this has been fixed.

TechPowerUp GPU-Z 2.35.0 also makes various improvements to fake GPU detection for cards based on NVIDIA GT216 and GT218 ASICs. Hardware detection for AMD Radeon Pro 5600M based on "Navi 12" has been fixed. Among the other GPUs for which support was added with this release are NVIDIA A100 Tensor Core PCIe, Intel UHD Gen9.5 graphics on the i5-10200H, and Radeon HD 8210E and Barco MXRT-6700. Grab GPU-Z from the link below.

DOWNLOAD: TechPowerUp GPU-Z 2.35.0
The change-log follows.

Intel Confirms Q1-2021 Launch of 11th Gen Core "Rocket Lake"

Intel VP and GM of Client Computing Group Desktop, Workstations and Gaming, John Bonini, in a Medium blog post renewed the company's commitment to gaming, by announcing the tentative launch timeline of the company's next-generation Core desktop processors. The 11th Gen Intel Core "Rocket Lake" processors will launch in Q1-2021. "I'm also happy to confirm that the next generation 11th Gen Intel Core desktop processors (codenamed "Rocket Lake") is coming in the first quarter of 2021 and will provide support for PCIe 4.0. It'll be another fantastic processor for gaming, and we're excited to disclose more details in the near future," he said.

It's important to note the timing of this post. AMD later today (8th October) will announce its next-generation Ryzen processors based on the "Zen 3" microarchitecture, and is widely expected to push the IPC envelope even further. This would mean that from the near-parity AMD enjoys with Intel's "Skylake" based "Comet Lake" processor, AMD would begin to achieve a clear IPC lead over Intel for the first time in over 15 years. An alleged Intel 500-series chipset motherboard launch-related slide leaked earlier this week pins the chipset's launch in mid-March 2021. Given that Intel tends to launch new processors and chipsets in tandem, this would possibly put the launch of "Rocket Lake" toward the very end of Q1-2021. "Rocket Lake" is expected to introduce Intel's first IPC gains in the desktop segment since 2015. The chips use new "Cypress Cove" CPU cores, which are a 14 nm backport of "Willow Cove."

Portwell Builds Intel Xeon Motherboard with 20 USB Ports

Have you ever felt the need that your motherboard needs more ports? Different peripherals can occupy quite a lot of USB ports and almost fill up all of them quickly. That is where the Portwell PEB-9783G2AR motherboard comes into play. Being built on Intel's latest W480E/Q470E chipset designed to accommodate any 10th generation 10 core CPU with a TDP of up to 80 W, the board can run either a Xeon W CPU or regular Comet Lake-S Core CPU. However, what makes this board unique is not its chipset or anything, it is the number of USB ports present.

Portwell has put an astonishing 20 (you read that right) USB 3.1 Gen1 ports on the board, which you can run at a full 5 Gbit/s data signaling rate at the same time. The board doesn't use any splitting technology so you are getting the full bandwidth. To get that many ports to run at full capacity, Portwell has presumably re-routed chipset lanes for SATA 3 connectors and used them for USB ports, leaving only two SATA 3 ports. The board is built for the FlexATX form factor and features a sideways PCIe 3.0 port. Being built for Xeon, the board also features support for ECC memory and up to 128 GB of it. While the pricing is not yet available, you can get a quote on Portwell's website.
Portwell PEB-9783G2AR Motherboard Portwell PEB-9783G2AR Motherboard

Intel 8-core "Tiger Lake-H" Coming in 2021: Leaked Compal Document

Intel is preparing to launch an 8-core mobile processor based on its 10 nm "Tiger Lake" microarchitecture, according to a corporate memo by leading notebook OEM Compal, which serves major notebook brands such as Acer. The memo was drafted in May, but unearthed by momomo_us. Compal expects Intel to launch the 8-core "Tiger Lake-H" processor in Q1 2021. This is big, as it would be the first large 10 nm client-segment silicon that goes beyond 4 cores. The company's first 10 nm client silicon, "Ice Lake," as well as the "Tiger Lake-U" silicon that's right around the corner, feature up to 4 cores. As an H-segment part, the new 8-core processor could target TDPs in the range of 35-45 W, and notebooks in the "conventional thickness" form-factor, as well as premium gaming notebooks and mobile workstations.

The 8-core "Tiger Lake-H" silicon is the first real sign of Intel's 10 nm yields improving. Up until now, Intel confined 10 nm to the U- and Y-segments (15 W and below), addressing only ultra-portable form-factors. Even here, Intel launched U-segment 14 nm "Comet Lake" parts at competitive prices, to take the market demand off "Ice Lake-U." The H-segment has been exclusively held by "Comet Lake-H." Intel is planning to launch "Ice Lake-SP" Xeon processors later this year, but like all server parts, these are high-margin + low-volume parts. Compal says Intel will refresh the H-segment with a newer 8-core "Comet Lake-H" part in the second half of 2020, possibly to bolster the high-end against the likes of AMD's Ryzen 9 4900H. Later in 2021, Intel is expected to introduce its 10 nm "Alder Lake" processor, including a mobile variant. These processors will feature Hybrid technology, combining "Golden Cove" big CPU cores with "Gracemont" small ones.

Intel Core i9-10850K Coming to Retail Channel After All, New Celeron Parts Listed

Intel's upcoming Core i9-10850K desktop processor, which was earlier believed to be an OEM-exclusive, is coming to the DIY retail channel after all. The 10-core Socket LGA1200 processor surfaced on retailers Cyclotron and LambdaTek as pre-orders, priced at 472€ and £459, including taxes, which aligns with its rumored USD $449 pre-tax price Stateside. At these prices, the i9-10850K is closer in price to the locked i9-10900 than to the top i9-10900K part.

Based on the 14 nm "Comet Lake-S" silicon, the Core i9-10850K is a 10-core/20-thread processor clocked up to 5.20 GHz, with 20 MB of L3 cache. Where it differs from the i9-109xx series is the lack of the Thermal Velocity Boost (TVB) feature. You still get an unlocked multiplier. The i9-10850K is hence provides a roughly $50 saving over the i9-10900K to give up the 100 MHz higher clock speed enabled by TVB. In the retail channel, the chip goes by the SKU "BX8070110850K."

ECS Rolls Out SF110 Q470 Mini PC Barebones for 10th Gen Core "Comet Lake" Processors

ECS today rolled out the SF110 Q470 line of mini-PC barebones designed for 10th Gen Core "Comet Lake-S" desktop processors. The SF110 Q470 comes in two variants based maximum processor TDP supported - a 35-Watt model, and a 65-Watt model. The former includes a 90 W power brick, while the latter comes with a 120 W power brick and a meatier CPU cooling solution inside. Both barebones are based in the Intel Q470 chipset.

Inside, you'll get two DDR4 SODIMM slots supporting up to 64 GB of dual-channel DDR4-2933 memory, an M.2-2280 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring, and a 2.5-inch drive bay with a SATA 6 Gbps backplane. USB connectivity includes two 10 Gbps USB 3.2 gen 2 ports on the front panel, one 10 Gbps USB 3.2 gen 2 type-C port, and four 5 Gbps USB 3.2 gen 1 type-A ports on the rear panel. Networking includes a 1 GbE connection driven by an Intel i219-V controller, and 802.11ac + Bluetooth 4.2 WLAN card (you can opt for a newer AX201 card with 802.11ax + Bluetooth 5). Both the 35 W and 65 W variants physically measure 205 mm x 176 mm x 33 mm (HxDxW). Display outputs include an HDMI 2.0, two DisplayPorts, and a D-Sub. A COM port covers legacy connectivity. The company didn't reveal pricing.

ASRock Rack Intros W480M WS Motherboard

ASRock Rack today introduced the W480M WS socket LGA1200 motherboard targeted at workstation builds, in the Micro-ATX form-factor. This board should appeal greatly to those wanting a very conservative-looking motherboard with a green PCB and conventional-finned aluminium heatsinks cooling the CPU VRM and PCH. Based on the Intel W480 chipset, the board not only supports all 10th Gen Core "Comet Lake" processors, but also Xeon W-1200 series processors based on the silicon, including support for ECC memory when paired with Xeon processors. The board draws power from a combination of a 24-pin ATX and 8-pin+4-pin EPS connectors; conditioning it for the CPU with a 6+2 phase VRM.

Expansion slots on the ASRock Rack W480M WS include a PCI-Express 3.0 x16, an open-ended PCI-Express 3.0 x8 (which splits lanes from the x16 slot), and an open-ended PCI-Express 3.0 x4 slot that's wired to the PCH. Storage connectivity includes two M.2-2280 slots with PCI-Express 3.0 x4 wiring, each, and eight SATA 6 Gbps ports, one of which has reinforced power delivery for SATA DOMs. The onboard audio solution is simple ALC892 fare, but the networking on offer consists of two 1 GbE ports driven by Intel i210 series controllers. There's quite some legacy connectivity, including COM and SGPIO. The board offers a large number of 4-pin PWM fan headers so it could be used in 2U rack chassis with server ventilation. The company didn't reveal pricing.

Intel Readies Core i9-10850K 10-core/20-thread Processor

Intel is giving final touches to a mysterious Core i9-10850K processor that was unearthed from the Geekbench database by TUM_APISAK. This would be the second new 10-core "Comet Lake-S" desktop processor SKU discovered in the past week, since the Apple-exclusive i9-10910. The i9-10850K is fascinating, in that it features an unlocked multiplier, 100 MHz lower nominal clocks than the i9-10900K, at 3.60 GHz, the same 5.20 GHz Turbo Boost Max 3.0 frequency; but an unknown Thermal Velocity Boost frequency.

It wouldn't surprise us if the processor lacked TVB altogether. It's likely that the i9-10850K is an OEM-exclusive targeted at pre-built designers that don't want to deal with the steep cooling requirements of the i9-10900K to give end-users visible boosting to its TVB Max frequencies of 5.30 GHz. The i9-10850K offers nearly identical Geekbench performance to the i9-10900K.

Current be quiet! Cooler Line-up Fully Compatible with Intel LGA1200

be quiet!, market leader for PC power supplies in Germany since 2007, is ready for Intel's latest CPU socket, LGA 1200. All LGA 115x-compatible coolers can also be mounted on the new socket, ensuring that owners of a be quiet! cooler can easily switch to the LGA 1200-platform and ensure that 10th generation Intel processors (codename "Comet Lake") are optimally cooled.

In short, all CPU coolers currently available from be quiet! (with the exception of Dark Rock Pro TR4, which was specifically designed for AMD's Threadripper platform) are compatible with Intel's LGA 1200 without the need for additional mounting kits. The installation instructions are identical to those of sockets LGA 1150, 1151 and 1155.

ASRock Intros W480 Creator Motherboard

ASRock introduced the W480 Creator premium motherboard for creators, which supports 10th Gen Core and Xeon W-1200 series processors in the LGA1200 package, based on the "Comet Lake" microarchitecture. Built in the ATX form-factor, the board draws power from a 24-pin ATX and two 8-pin EPS power connectors, conditioning it for the CPU with a 16-phase VRM cooled by large aluminium fan-heatsinks. The LGA1200 socket is wired to four reinforced DDR4 DIMM slots supporting up to 128 GB of dual-channel DDR4-4800 (OC) memory, including ECC unbuffered DIMM support when paired with Xeon W-1200 processors; and two PCI-Express 3.0 x16 slots (x8/x8 with both populated, else x16). These slots are gen 4.0 capable with future processors that offer PCIe gen 4.0 support. Storage connectivity includes three M.2 NVMe slots with PCIe gen 3.0 x4 wiring, each; and six SATA 6 Gbps ports.

Much of this board's serious "creator" USP begins with its connectivity. It offers two Thunderbolt 40 Gbps ports via type-C connectors, each with its own mini-DisplayPort 1.4 passthrough input that you connect to your graphics card. Networking connectivity includes a 10 GbE wired network connection powered by an AQuantia AQC107 controller; a second 2.5 GbE connection driven by Intel i225-LM controller, and an 802.11ax WLAN connection by an Intel AX201 adapter that also provides Bluetooth 5. The onboard audio solution packs some serious hardware, with an ESS Sabre 9218 DAC handling the front-panel headphones out (130 dBA SNR), a Realtek ALC1220 HDA codec handling the other channels (120 dBA SNR), WIMA capacitors for the front outputs, and the right and left audio channel wiring being routed through distant PCB layers to minimize crosstalk. The company didn't reveal pricing.

Intel NUC Roadmap Peeking Into 2021: Tiger Lake NUC by 2020 End

Intel is planning to introduce its first NUC (next unit of computing) device based on the 11th generation Core "Tiger Lake" processor by the end of 2020, according to leaked company roadmaps covering NUCs. These point to Intel refreshing its "Hades Canyon" performance-segment NUC mini-PC with a "Tiger Lake-U" processor, a 3rd party discrete GPU, and slightly bigger device size (1.35 L vs. 1.2 L of the original "Hades Canyon"). At the very top, the "Ghost Canyon" NUC 9 Extreme with "Coffee Lake-HR" processors will continue to hold the fort into 2021.

The mainstream NUC mini-PC lineup will continue to be "Frost Canyon," powered by "Comet Lake-U" 10th generation Core processors. Q2-Q3 2020 will see Intel launch significant updates to its NUC Compute Element lineup, with "West Cove," "Ghost Canyon," and "Quartz Canyon" holding the mainstream, performance-segment, and professional segment, respectively; while are likely based on "Comet Lake-H" processors; and "Austin Beach" low-power compute element based on "Comet Lake-U."

ASUS Intros ROG Strix B460-H Gaming Motherboard

ASUS introduced the ROG Strix B460-H Gaming motherboard, expanding its ROG Strix family of motherboards based on Intel's mid-range B460 chipset for 10th generation Core "Comet Lake" processors in the LGA1200 package. The board joins Strix-F and Micro-ATX Strix-G SKUs based on this chipset. The Strix-H covers all platform essentials, but tops them with Intel Ethernet and a premium SupremeFX onboard audio solution. The Strix-H uses a simple 8-phase CPU VRM that pulls power from a single 8-pin EPS connector. The board offers a rear I/O shroud that has the latest generation ROG Strix design language, and a single-color (red) ROG illuminated logo. It also comes with an integrated rear I/O shield.

The LGA1200 socket is wired to four DDR4 DIMM slots supporting up to 128 GB of dual-channel DDR4-2933 memory (the maximum memory clock for the B460 platform is 2933 MHz); and a metal-reinforced PCI-Express 3.0 x16 slot. The board offers two M.2 NVMe slots, both with PCIe gen 3.0 x4 wiring; and an M.2 E-key slot for WLAN cards. Other storage connectivity includes six SATA 6 Gbps ports. The board's sole networking interface is a 1 GbE connection driven by an Intel i219-V controller. The company didn't reveal pricing.
ASUS ROG Strix B460-H Gaming

Intel Core i9-10900K der8auer De-Lidding Reveals Accurate Die-Size Measurements

Professional overclocker and extreme cooling products developer der8auer de-lidded a Core i9-10900K 10-core processor to study the processor's behavior with various kinds of custom cooling setups. It was discovered that the 10-core "Comet Lake" die measures 206.1 mm² in die-area. It is 9.2 mm wide like its predecessors, "Coffee Lake" 8-core, 6-core, and 4-core, but is 22.4 mm long, with the outer edges of its packaging material barely within a couple of millimeters of the adhesion point of the integrated heatspreader (IHS). Given what we know about how much each pair of cores adds to these dies, we predict that Intel cannot elongate this die to 12 cores, without having to remove the iGPU. der8auer discovered that using liquid metal TIMs and running the processor de-lidded shaves up to 7 °C off temperatures. Find more technical commentary in the der8auer video presentation.

GELID CPU Coolers Fully Compatible with Intel LGA1200

The 10th generation Intel Core desktop processor family was launched recently along with its companion motherboards based on the Intel 400-series chipsets. The new processors (codename "Comet Lake-S") utilize the LGA 1200 socket which shares the same mechanicals and has the identical 75x75mm spacing of mounting holes as the older LGA 1151 and other 115x sockets. All current GELID CPU coolers that support LGA 115x are also compatible with the new LGA 1200 socket, no additional mounting kits or accessory upgrades are required.

And especially, our latest Phantom, Phantom Black and Sirocco CPU Coolers also fully support overclocking capabilities of the top unlocked Core i9-10900K, Core i7-10700K and Core i5-10600K processors enabling boosted performance and enhanced cooling for your power-hungry gaming rigs.

ASRock Industrial Announces a Broad Range of 10th Gen Intel Core Motherboards

ASRock Industrial Computer Corporation, the world's leader in Industrial PC motherboards, unveils a broad range of industrial motherboards powered by the Intel 10th Generation Core Processors (Comet Lake-S) with up to 10 Cores and supporting Intel 400-series Q470E, H420E, and W480E chipsets. Featuring improved multi-threaded computing performance and rich I/O functionality, ASRock Industrial's new series of product lineup covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards, are ideal for diverse applications, such as industrial automation, retail kiosks, digital signage, and AIoT solutions.

ASRock Industrial introduces the industry's first Intel 10th Gen Core Processors Industrial Motherboards with Q470E chipset, including the IMB-1220-L/IMB-1220-D and IMB-1222/IMB-1222-WV Mini-ITX motherboards, the IMB-1313 Micro-ATX motherboard and the IMB-1711 ATX motherboard. For value and cost-effective options, there are also new Mini-ITX motherboards with H420E chipset, the IMB-1221-L/IMB-1221-D comes with high-rise IO and the IMB-1223/IMB-1223-WV with thin IO.

Dell Announces its Flagship XPS 15 and XPS 17 (Spring 2020 Update)

Dell today updated its premium XPS line of performance notebooks with the XPS 15 (9500) and XPS 17 (9700), as part of the company's Spring 2020 launch sequence. The two are primarily differentiated by screen size (15.6-inch vs. 17-inch). The XPS 15 comes with 16:10 resolutions of 4K UHD+ (3840 x 2400 pixels) InfinityEdge Touch, and WUXGA (1920 x 1200 pixels) InfinityEdge. Both offer Dolby Vision, and adjustable viewing angles. 10th gen Core "Comet Lake-H" processors power both.

Processor options include the Core i5-10300H, i7-10750H, i7-10875H, and i9-10885H. Memory options range between 8 GB single-channel thru 64 GB dual-channel. Graphics options start with GTX 1650 Ti for the XPS 15, and go up to RTX 2060 (mobile) for the XPS 17. Storage options only include NVMe SSDs, starting with 256 GB, and going all the way up to 1 TB. A star attraction with both is Thunderbolt 3 connectivity. The XPS 15 offers two Thunderbolt 3 ports; while the XPS 17 offers four. Killer AX1650 WLAN is standard issue.

Intel Announces Xeon W-1200 Processor Line, Comet Lake Wears a Suit

Intel today announced the Xeon W-1200 line of socket LGA1200 processors aimed at enterprises, workstations, and small-scale server builds. These processors are based on the 14 nm "Comet Lake-W" microarchitecture, and are differentiated from the 10th generation Core "Comet Lake-S" processor family in featuring ECC memory support, vPro support on select SKUs, and the UHD P630 integrated graphics solution. These processors will be supported on motherboards based on the Intel W480, W470, and possibly Q470 chipsets. The processors also introduce Turbo Boost Max 3.0 to this segment with select GPUs. Thermal Velocity Boost is available on only the top SKU.

The lineup is led by the 10-core/20-thread Xeon W-1290P, clocked at 3.70 GHz, with 5.20 GHz max boost frequency, and 20 MB of L3 cache. This SKU also features 5.30 GHz TVB and 4.90 GHz all-core TVB. This is followed closely by the Xeon W-1270P, an 8-core/16-thread part with 3.80 GHz nominal and 5.10 GHz boost frequency, and 16 MB of L3 cache. The W-1250P 6-core/12-thread chip is next in line, with its 4.10 GHz nominal, 4.50 GHz boost, and 12 MB L3 cache. All P-extension SKUs feature generally high clock speeds, and 125 W TDP. Positioned right below these are the non-P SKUs, with their 80 W TDP, and lower clock-speeds.

Intel Core i9-10885H is an i9-10980HK that Trades OC Capability for vPro

Intel is reportedly giving finishing touches to a new performance-segment notebook processor positioned between the Core i7-10875H and the flagship Core i9-10980HK, called the Core i9-10885H. Based on the "Comet Lake-H" silicon, this 8-core/16-thread processor has identical clock speeds to the i9-10980HK, but lacks overclocking capabilities. With its default 45 W TDP configured, the processor ticks at 2.40 GHz nominal, with up to 5.30 GHz boost - a 200 MHz speed-bump over the i7-10875H.

Apparently, the chip also features vPro capability, making it fit for commercial-segment notebooks such as the Dell Latitude and Lenovo ThinkPad T-series. Among the other Intel mobile processors with vPro capability are the new Xeon W-10855M 6-core/12-thread and W-10885M 8-core/16-thread processors; and the 15 W category i7-10810U 6-core/12-thread; and i7-10610U i5-10310U 4-core/8-thread processors. These processors are likely to formally launch on May 13.

MSI Shares Fascinating Insights Into "Comet Lake" Binning

MSI in its weekly "MSI Insider" livestream shared fascinating insights into the way Intel appears to be sorting out its "Comet Lake" silicon across the various brand extensions of its 10th generation Core desktop processors. Its tech leads Eric Van Beurden and Michiel Berkhout spoke at length about MSI's own evaluation of the trays of Core i5-10600K/KF, i7-10700K/KF, and i9-10900K/KF chips it received (the only unlocked chips across the lineup), which they used as empirical evidence to suggest a model for Intel's binning.

MSI segregated the chips it received into three categories. Level A consists of chips that overclock higher than Intel's specifications (overclocking headroom higher than expected). Level B consists of those that overclock within Intel's specifications. Level C, on the other hand, have their overclocking headroom fall below Intel's specifications. It's important to note here that "Intel specification" doesn't mean "stock frequencies," it refers to the overclocking headroom Intel communicates to motherboard manufacturers, to give them an idea of the minimum board design requirements needed to guarantee overclocking within these specifications, for their Z490 motherboards. These are more of a guideline in nature, all three levels will overclock above stock frequencies.

Intel Comet Lake Review Kit Unboxed, Core i9-10900K and Core i5-10600K Pictured

It seems that today Intel lifted an embargo on the preview of its reviewer kit, and thanks to a few websites we have pictures of what the packaging looks like. And it is one fancy packaging for sure with lots of plastic this time around. Intel has decided to switch up its packaging game and now it is very different. Now Intel seems to target aesthetics very similar to AMD Threadripper packaging, with a plastic window that reveals the CPU box that has big words distinguishing whatever the model in question is a Core i5 or Core i9.

The reviewers have gotten two CPU models - Core i9-10900K and Core i5-10600K which are pictured below. Just as a reminder, reviews of these CPUs should go live on May 20th. If you want to get a Z490 motherboard for one of these CPUs, you can pre-order motherboard from your favorite vendor starting from today.

More pictures follow.

Samsung Unveils Galaxy Book Flex and Ion with Smartphone Wireless Charging Capability

Samsung unveiled the Galaxy Book Flex and Galaxy Book Ion ultraportable notebooks with a unique mobility enhancement - the ability to recharge your smartphone that has Qi-compatible wireless charging capability. The Galaxy Book Flex implements an "Ice Lake" Core i7-1065G7 processor with 8 GB LPDDR4 memory, a 13.3-inch Full HD QLED display, a 512 GB NVMe SSD, and a pair of Thunderbolt 3 ports.

The Galaxy Book Ion, on the other hand, features a slightly thicker form-factor, with a "Comet Lake" Core i7-10510U processor at the helm, 13.3-inch and 15.6-inch QLED Full HD display options, 8 GB of conventional DDR4 memory, and Thunderbolt 3. The wireless charging surface is part of the track pad, so you can either use the notebook or recharge your smartphone or smart watch. Don't have time for both, or your smartphone lacks wireless charging? Get a small 15 cm USB cable from Amazon Basics for like $4.

Intel Bringing the Xeon W Brand to LGA1200 Socket?

Intel is bringing its Xeon W brand extension of processors meant for workstations, to the LGA1200 socket. The Xeon W brand were typically associated with enterprise variants of HEDT platforms, with those of mainstream desktop sockets reserved for the Xeon E brand. At least 7 SKUs are in the works, beginning with the Xeon W-1290P, W-1290, and W-1290T, which are 10-core/20-thread parts based on the "Comet Lake" silicon, with TDP ratings of 125 W, 65 W, and 35 W, respectively; and nominal clock speeds of 3.70 GHz, 3.20 GHz, and 1.90 GHz, respectively.

The Xeon W-1270P and W-1270 are 8-core/16-thread parts, likely with 125 W, and 65 W TDP ratings, respectively, and clock speeds of 3.80 GHz and 3.40 GHz, respectively. Lastly, there are the 6-core/12-thread Xeon W-1260P and W-1260, clocked at 4.10 GHz and 3.60 GHz, respectively. It's likely that the processors are either compatible with the W480/W480E chipsets, or have a C-series enterprise chipset with a similar feature-set to it. The W-1290P is priced at $620.62, the W-1290 at $568.91, the W-1290T at $568.80; the W-1270P at $492.57, the W-1270 at $416.21; the W-1260P at $358.41, and the W-1260 at $293.12. All prices are per-unit in 1,000-unit tray quantities.

Intel Xeon vPro and Core E "Comet Lake" Lineup Surfaces

Remember DFI? Those guys are into industrial PCs and embedded systems these days, and put out data sheets of upcoming products implementing the new Intel W480 chipset. A possible step-up from Intel Qx70 series chipset family, the W480 is positioned between the Q470 and Z490, and enables certain quasi-workstation features relevant to client desktops in very big organizations. The chipset enables vPro, and certain other features that helps with remote management.

The DFI specs, without taking model numbers, names several kinds of upcoming Xeon vPro and 10th generation Core E-SKUs. Among these are Xeon vPro processors in core-counts of 10, 8, and 6; and TDP levels of 80 W, and 35 W. It's not known if the 10th gen Xeon vPro succeed the workstation-segment Xeon E-series, which typically don't work on client-segment chipsets. We also see an assortment of Core i9, Core i7, Core i5, Core i3, Pentium and Celeron processors with the "E" brand extension, across a variety of TDP options. Unless we're horribly mistaken, the "E" brand extension could denote ECC memory support, at least in the case of the W480E and Q470E chipset variants.

ASRock Enables Overclocking on Non-Z Motherboards for 10th Generation Non-K Comet Lake CPUs

Historically, Intel has separated its processors and chipsets that accompany them to overclockable and non-overclockable ones. That means that only the "K" CPUs can be overclocked. With the latest generation, only some parts of the lineup are K CPUs, like the Core i9-10900K, i7-10700K, i5-10600K, etc. Those processors could only be overclocked one put in motherboards based on "Z" chipset, like Z390 and Z490. However, it seems like ASRock has developed a new technology that will overclock non-K CPUs on non-Z motherboards, which is quite impressive.

Called the Base Frequency Boost (BFB) technology, it will allow for overclocking the non-K processors on chipsets like B460 and H470. How will that work you might wonder? Well, ASRock will take the TDP of the CPUs and make it run in the PL1 mode, which increases the processor TDP form 65 W and turns it into a 125 W TDP beast. This will, of course, be user selective and case dependent, meaning that if your cooling system can not handle that much heat coming out from the overclocked processors, it is unlikely that they will reach the peak clocks ASRock can target. You can check out the slide below:
ASRock Base Frequency Boost Technology

Intel 10th Generation Comet Lake Desktop Processors and 400-Series Chipsets Announced, Here's what's New

Intel today launched its 10th generation Core desktop processor family and its companion Intel 400-series chipsets. Based on the 14 nm++ silicon fabrication process and built in the new LGA1200 package, the processors are based on the "Comet Lake" microarchitecture. The core design of "Comet Lake" and its IPC are identical to those of "Skylake," however Intel brought significant enhancements to the processor's clock-speed boosting algorithm, increased core- or thread counts across the board, and introduced new features that could interest enthusiasts and overclockers. The uncore component remains largely unchanged from the previous-generation, with support for DDR4 memory and PCI-Express gen 3.0. Use of these processors requires a new socket LGA1200 motherboard, they won't work on older LGA1151 motherboards. You can install any LGA115x-compatible cooler on LGA1200, provided it meets the thermal requirements of the processor you're using.

At the heart of the 10th generation Core processor family is a new 10-core monolithic processor die, which retains the same basic structure as the previous-generation 8-core "Coffee Lake Refresh" die, and 4-core "Skylake." The cores are arranged in two rows, sandwiched by the processor's uncore and iGPU blocks. A ring-bus interconnect binds the various components. The cache hierarchy is unchanged from previous generations as well, with 32 KB each of L1I and L1D caches; 256 KB of dedicated L2 cache per core, and 20 MB of shared L3 cache. The iGPU is the same Gen 9.5 based UHD 630 graphics. As we mentioned earlier, much of Intel's innovation for the 10th generation is with the processor's microcode (boosting algorithms).
Intel Core i9-10900K 10th Gen Intel Core Desktop Comet Lake Lineup 10th Gen Intel Core Desktop Comet Lake Lineup 10th Gen Intel Core Desktop Comet Lake Lineup
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