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Axiomtek Unveils MANO540 Mini-ITX SBC

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is proud to announce the MANO540, a Mini-ITX motherboard powered by the FCLGA1200 10th Gen Intel Core i9/i7/i5/i3 processor (codename: Comet Lake) with the Intel H410 chipset. It also supports two 260-pin DDR4-2933/2666/2400 SO-DIMM sockets for up to 64 GB of memory. With a small form factor of 17 x 17 cm, this industrial motherboard is an excellent choice for space-constrained environments. The advanced MANO540 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and edge computing capabilities.

"Axiomtek's MANO540 supports ubiquitous high-speed data transfer interfaces, including PCIe 3.0, USB 3.2 Gen1 and SATA-600. It also features one M.2 Key B slot for USB 3.2 interface 5G module. The expansion is provided by one PCIe x16, one M.2 Key E slot and one full-size PCI Express Mini Card slot for wireless devices such as Wi-Fi and Bluetooth," said Kenny Lin, the product manager of the Product Planning Division at Axiomtek. "This industrial motherboard is integrated with Intel integrated Gfx graphics engine with UHD 4K resolution and provides rapid video acceleration and dual-view capability through the DisplayPort, HDMI 2.0 and VGA. Axiomtek also offers the ECM500, an industrial chassis designed for the MANO540 to help shorten the time to market."

XMG Announces NEO 15 and NEO 17 with Intel Core i7-11800H and GeForce RTX 3080 with 165 Watts

XMG introduces an additional configuration variant to the high-end NEO range of gaming laptops with Intel's new Tiger Lake H45 processors. The eight-core CPUs from the 11th Core generation not only offer higher performance compared to their predecessors, but also boast the advantages of a completely updated platform. These includes support for PCI Express 4.0 and Thunderbolt 4 - features that the AMD version of the XMG NEO cannot offer. In addition, the models utilising the new Intel processor also benefit from a slight performance increase on the graphics card side. The GPU in the XMG NEO 15 and NEO 17 (M21) now operates with a TGP of up to 165 instead of 150 watts.

AAEON Unveils GENE-CML5 3.5-inch LGA1200 Motherboard

AAEON, an industry leader in embedded solutions, announces the GENE-CML5 3.5" subcompact board featuring the 10th Generation Intel Core processors (formerly Comet Lake). The GENE-CML5 brings the latest in computing technology and flexibility, enabling developers to deploy their next generation industrial and AI Edge applications.

The GENE-CML5 brings the LGA1200 socket 10th Generation Intel Core i3/i5/i7 processors, as well as Intel Pentium and Celeron processors to the 3.5" subcompact form factor. Supporting processors up to 4.4 GHz CPU frequency, the GENE-CML5 leverages the socket-type chipset to allow developers and end users to easily maintain, scale, and upgrade the platform to suit their processing requirements. Combined with 64 GB DDR4 memory, the GENE-CML5 delivers fast processing speeds on par with desktop systems. Additionally, the chipset allows the compact board to take advantage of Intel vPro and Intel Active Management Technology (iAMT), enabling remote system monitoring and management.

Intel Rocket Lake-S Processors European Pricing Leaked

Pricing for Intel's upcoming Rocket Lake-S series of desktop processors has recently been leaked by a Dutch computer store. The 11th Generation Intel Core i5, i7, and i9 processors will feature the new Comet Lake CPU architecture while the lower-end Intel Core i3, and Intel Pentium processors will retain the older Cypress Cove CPU architecture. The new Intel Core i9 processors have returned to an 8 core 16 thread design down from the 10 core 20 thread design found in 10th generation processors.

The Intel 11th Generation Core i9 series will be approximately 6.6% cheaper than their predecessors but with 2 fewer cores and 4 fewer threads. The other new processors all see price increases from their 10th generation versions with an average increase of 6.5%. The new Comet Lake CPU architecture is expected to bring significant IPC improvements which may allow them to regain the title of best gaming CPU.

GIGABYTE Z590 AORUS Xtreme Pictured

Here's the first picture of GIGABYTE's next-generation flagship Socket LGA1200 motherboard based on Intel Z590 chipset, with out-of-the-box support for 11th Gen Core "Rocket Lake" desktop processors, the Z590 AORUS Xtreme. Featuring the company's most premium component selection, the board pulls power from a combination of 24-pin ATX and two 8-pin EPS power connectors, conditioning it for the CPU using a massive 21-phase VRM. The only expansion slots on this board are three PCI-Express x16, from which at least two are wired to the CPU (Gen 4.0 x16 or Gen 4.0 x8/x8 with Rocket Lake, Gen 3.0 with Comet Lake); with the third slot being wired to the PCH. Underneath the cladding are three M.2 NVMe slots, from which one is Gen 4.0 x4, and wired to the CPU, while the others are wired to the PCH.

The GIGABYTE Z590 AORUS Xtreme reportedly one-ups the current generation with new connectivity that includes Wi-Fi 6E (802.11ax over 6 GHz radio band), and Thunderbolt 4. The board also features 20 Gbps USB 3.2x2 ports, and wired networking options that include 10 GbE and 2.5 GbE. The board will also be among the first to feature the latest Realtek ALC4080 audio CODEC that replaces the ALC1220 as the company's most premium CODEC. The main stereo channel on the board will still be pulled by an ESS Sabre Reference DAC. We should learn more about this board around mid-January, when Intel is expected to allow its motherboard partners to announce their Intel 500-series chipset products.

Intel Rocket Lake-S CPU Benchmarked: Up to 22% Faster Compared to the Previous Generation

Just a few days ago, Intel has decided to surprise us and give out information about its upcoming Rocket Lake-S platform designed for desktop users. Arriving early next year (Q1) the Rocket Lake-S platform is yet another iteration of the company's 14 nm node. However, this time we are getting some real system changes with a new architecture design. Backporting its Golden Cove core to 14 nm, Intel has named this new core type Cypress Cove. What used to be the heart of Ice Lake CPUs, is now powering the Rocket Lake-S platform. Besides the new core, there are other features of the platform like PCIe 4.0, new Xe graphics, and updated media codecs. You can check that out here.

Today, we have gotten the first benchmarks of the Intel Rocket Lake-S system. In the Userbenchmark bench, an unknown eight-core Rocket Lake CPU has been compared to Intel's 10th generation Comet Lake-S processors. The Rocket Lake engineering sample ran at 4.2 GHz while scoring a single-core score of 179. Compared to the Core i9-10900K that runs at 5.3 GHz, which scored 152 points, the Cypress Cove design is 18% faster. And if the new design is compared to the equivalent 8C/16T Compet Lake CPU like Core i7-10700K clocked at 5.1 GHz and scoring 148 points, the new CPU uarch is up to 22% faster. This represents massive single-threaded performance increases, however, please take the information with a grain of salt, as we wait for the official reviews.

TechPowerUp GPU-Z v2.35.0 Released

TechPowerUp today released the latest version of TechPowerUp GPU-Z, the popular graphics sub-system information and diagnostic utility. Version 2.35.0 adds support for new GPUs, and fixes a number of bugs. To begin with, GPU-Z adds support for AMD Radeon RX 6000 series GPUs based on the "Navi 21" silicon. Support is also added for Intel DG1 GPU. BIOS extraction and upload for NVIDIA's RTX 30-series "Ampere" GPUs has finally been introduced. Memory size reporting on the RTX 3090 has been fixed. The latest Windows 10 Insider Build (20231.1000) made some changes to DirectML, which caused GPU-Z to report it as unavailable, this has been fixed.

TechPowerUp GPU-Z 2.35.0 also makes various improvements to fake GPU detection for cards based on NVIDIA GT216 and GT218 ASICs. Hardware detection for AMD Radeon Pro 5600M based on "Navi 12" has been fixed. Among the other GPUs for which support was added with this release are NVIDIA A100 Tensor Core PCIe, Intel UHD Gen9.5 graphics on the i5-10200H, and Radeon HD 8210E and Barco MXRT-6700. Grab GPU-Z from the link below.

DOWNLOAD: TechPowerUp GPU-Z 2.35.0
The change-log follows.

Intel Confirms Q1-2021 Launch of 11th Gen Core "Rocket Lake"

Intel VP and GM of Client Computing Group Desktop, Workstations and Gaming, John Bonini, in a Medium blog post renewed the company's commitment to gaming, by announcing the tentative launch timeline of the company's next-generation Core desktop processors. The 11th Gen Intel Core "Rocket Lake" processors will launch in Q1-2021. "I'm also happy to confirm that the next generation 11th Gen Intel Core desktop processors (codenamed "Rocket Lake") is coming in the first quarter of 2021 and will provide support for PCIe 4.0. It'll be another fantastic processor for gaming, and we're excited to disclose more details in the near future," he said.

It's important to note the timing of this post. AMD later today (8th October) will announce its next-generation Ryzen processors based on the "Zen 3" microarchitecture, and is widely expected to push the IPC envelope even further. This would mean that from the near-parity AMD enjoys with Intel's "Skylake" based "Comet Lake" processor, AMD would begin to achieve a clear IPC lead over Intel for the first time in over 15 years. An alleged Intel 500-series chipset motherboard launch-related slide leaked earlier this week pins the chipset's launch in mid-March 2021. Given that Intel tends to launch new processors and chipsets in tandem, this would possibly put the launch of "Rocket Lake" toward the very end of Q1-2021. "Rocket Lake" is expected to introduce Intel's first IPC gains in the desktop segment since 2015. The chips use new "Cypress Cove" CPU cores, which are a 14 nm backport of "Willow Cove."

Portwell Builds Intel Xeon Motherboard with 20 USB Ports

Have you ever felt the need that your motherboard needs more ports? Different peripherals can occupy quite a lot of USB ports and almost fill up all of them quickly. That is where the Portwell PEB-9783G2AR motherboard comes into play. Being built on Intel's latest W480E/Q470E chipset designed to accommodate any 10th generation 10 core CPU with a TDP of up to 80 W, the board can run either a Xeon W CPU or regular Comet Lake-S Core CPU. However, what makes this board unique is not its chipset or anything, it is the number of USB ports present.

Portwell has put an astonishing 20 (you read that right) USB 3.1 Gen1 ports on the board, which you can run at a full 5 Gbit/s data signaling rate at the same time. The board doesn't use any splitting technology so you are getting the full bandwidth. To get that many ports to run at full capacity, Portwell has presumably re-routed chipset lanes for SATA 3 connectors and used them for USB ports, leaving only two SATA 3 ports. The board is built for the FlexATX form factor and features a sideways PCIe 3.0 port. Being built for Xeon, the board also features support for ECC memory and up to 128 GB of it. While the pricing is not yet available, you can get a quote on Portwell's website.
Portwell PEB-9783G2AR Motherboard Portwell PEB-9783G2AR Motherboard

Intel 8-core "Tiger Lake-H" Coming in 2021: Leaked Compal Document

Intel is preparing to launch an 8-core mobile processor based on its 10 nm "Tiger Lake" microarchitecture, according to a corporate memo by leading notebook OEM Compal, which serves major notebook brands such as Acer. The memo was drafted in May, but unearthed by momomo_us. Compal expects Intel to launch the 8-core "Tiger Lake-H" processor in Q1 2021. This is big, as it would be the first large 10 nm client-segment silicon that goes beyond 4 cores. The company's first 10 nm client silicon, "Ice Lake," as well as the "Tiger Lake-U" silicon that's right around the corner, feature up to 4 cores. As an H-segment part, the new 8-core processor could target TDPs in the range of 35-45 W, and notebooks in the "conventional thickness" form-factor, as well as premium gaming notebooks and mobile workstations.

The 8-core "Tiger Lake-H" silicon is the first real sign of Intel's 10 nm yields improving. Up until now, Intel confined 10 nm to the U- and Y-segments (15 W and below), addressing only ultra-portable form-factors. Even here, Intel launched U-segment 14 nm "Comet Lake" parts at competitive prices, to take the market demand off "Ice Lake-U." The H-segment has been exclusively held by "Comet Lake-H." Intel is planning to launch "Ice Lake-SP" Xeon processors later this year, but like all server parts, these are high-margin + low-volume parts. Compal says Intel will refresh the H-segment with a newer 8-core "Comet Lake-H" part in the second half of 2020, possibly to bolster the high-end against the likes of AMD's Ryzen 9 4900H. Later in 2021, Intel is expected to introduce its 10 nm "Alder Lake" processor, including a mobile variant. These processors will feature Hybrid technology, combining "Golden Cove" big CPU cores with "Gracemont" small ones.

Intel Core i9-10850K Coming to Retail Channel After All, New Celeron Parts Listed

Intel's upcoming Core i9-10850K desktop processor, which was earlier believed to be an OEM-exclusive, is coming to the DIY retail channel after all. The 10-core Socket LGA1200 processor surfaced on retailers Cyclotron and LambdaTek as pre-orders, priced at 472€ and £459, including taxes, which aligns with its rumored USD $449 pre-tax price Stateside. At these prices, the i9-10850K is closer in price to the locked i9-10900 than to the top i9-10900K part.

Based on the 14 nm "Comet Lake-S" silicon, the Core i9-10850K is a 10-core/20-thread processor clocked up to 5.20 GHz, with 20 MB of L3 cache. Where it differs from the i9-109xx series is the lack of the Thermal Velocity Boost (TVB) feature. You still get an unlocked multiplier. The i9-10850K is hence provides a roughly $50 saving over the i9-10900K to give up the 100 MHz higher clock speed enabled by TVB. In the retail channel, the chip goes by the SKU "BX8070110850K."

ECS Rolls Out SF110 Q470 Mini PC Barebones for 10th Gen Core "Comet Lake" Processors

ECS today rolled out the SF110 Q470 line of mini-PC barebones designed for 10th Gen Core "Comet Lake-S" desktop processors. The SF110 Q470 comes in two variants based maximum processor TDP supported - a 35-Watt model, and a 65-Watt model. The former includes a 90 W power brick, while the latter comes with a 120 W power brick and a meatier CPU cooling solution inside. Both barebones are based in the Intel Q470 chipset.

Inside, you'll get two DDR4 SODIMM slots supporting up to 64 GB of dual-channel DDR4-2933 memory, an M.2-2280 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring, and a 2.5-inch drive bay with a SATA 6 Gbps backplane. USB connectivity includes two 10 Gbps USB 3.2 gen 2 ports on the front panel, one 10 Gbps USB 3.2 gen 2 type-C port, and four 5 Gbps USB 3.2 gen 1 type-A ports on the rear panel. Networking includes a 1 GbE connection driven by an Intel i219-V controller, and 802.11ac + Bluetooth 4.2 WLAN card (you can opt for a newer AX201 card with 802.11ax + Bluetooth 5). Both the 35 W and 65 W variants physically measure 205 mm x 176 mm x 33 mm (HxDxW). Display outputs include an HDMI 2.0, two DisplayPorts, and a D-Sub. A COM port covers legacy connectivity. The company didn't reveal pricing.

ASRock Rack Intros W480M WS Motherboard

ASRock Rack today introduced the W480M WS socket LGA1200 motherboard targeted at workstation builds, in the Micro-ATX form-factor. This board should appeal greatly to those wanting a very conservative-looking motherboard with a green PCB and conventional-finned aluminium heatsinks cooling the CPU VRM and PCH. Based on the Intel W480 chipset, the board not only supports all 10th Gen Core "Comet Lake" processors, but also Xeon W-1200 series processors based on the silicon, including support for ECC memory when paired with Xeon processors. The board draws power from a combination of a 24-pin ATX and 8-pin+4-pin EPS connectors; conditioning it for the CPU with a 6+2 phase VRM.

Expansion slots on the ASRock Rack W480M WS include a PCI-Express 3.0 x16, an open-ended PCI-Express 3.0 x8 (which splits lanes from the x16 slot), and an open-ended PCI-Express 3.0 x4 slot that's wired to the PCH. Storage connectivity includes two M.2-2280 slots with PCI-Express 3.0 x4 wiring, each, and eight SATA 6 Gbps ports, one of which has reinforced power delivery for SATA DOMs. The onboard audio solution is simple ALC892 fare, but the networking on offer consists of two 1 GbE ports driven by Intel i210 series controllers. There's quite some legacy connectivity, including COM and SGPIO. The board offers a large number of 4-pin PWM fan headers so it could be used in 2U rack chassis with server ventilation. The company didn't reveal pricing.

Intel Readies Core i9-10850K 10-core/20-thread Processor

Intel is giving final touches to a mysterious Core i9-10850K processor that was unearthed from the Geekbench database by TUM_APISAK. This would be the second new 10-core "Comet Lake-S" desktop processor SKU discovered in the past week, since the Apple-exclusive i9-10910. The i9-10850K is fascinating, in that it features an unlocked multiplier, 100 MHz lower nominal clocks than the i9-10900K, at 3.60 GHz, the same 5.20 GHz Turbo Boost Max 3.0 frequency; but an unknown Thermal Velocity Boost frequency.

It wouldn't surprise us if the processor lacked TVB altogether. It's likely that the i9-10850K is an OEM-exclusive targeted at pre-built designers that don't want to deal with the steep cooling requirements of the i9-10900K to give end-users visible boosting to its TVB Max frequencies of 5.30 GHz. The i9-10850K offers nearly identical Geekbench performance to the i9-10900K.

Current be quiet! Cooler Line-up Fully Compatible with Intel LGA1200

be quiet!, market leader for PC power supplies in Germany since 2007, is ready for Intel's latest CPU socket, LGA 1200. All LGA 115x-compatible coolers can also be mounted on the new socket, ensuring that owners of a be quiet! cooler can easily switch to the LGA 1200-platform and ensure that 10th generation Intel processors (codename "Comet Lake") are optimally cooled.

In short, all CPU coolers currently available from be quiet! (with the exception of Dark Rock Pro TR4, which was specifically designed for AMD's Threadripper platform) are compatible with Intel's LGA 1200 without the need for additional mounting kits. The installation instructions are identical to those of sockets LGA 1150, 1151 and 1155.

ASRock Intros W480 Creator Motherboard

ASRock introduced the W480 Creator premium motherboard for creators, which supports 10th Gen Core and Xeon W-1200 series processors in the LGA1200 package, based on the "Comet Lake" microarchitecture. Built in the ATX form-factor, the board draws power from a 24-pin ATX and two 8-pin EPS power connectors, conditioning it for the CPU with a 16-phase VRM cooled by large aluminium fan-heatsinks. The LGA1200 socket is wired to four reinforced DDR4 DIMM slots supporting up to 128 GB of dual-channel DDR4-4800 (OC) memory, including ECC unbuffered DIMM support when paired with Xeon W-1200 processors; and two PCI-Express 3.0 x16 slots (x8/x8 with both populated, else x16). These slots are gen 4.0 capable with future processors that offer PCIe gen 4.0 support. Storage connectivity includes three M.2 NVMe slots with PCIe gen 3.0 x4 wiring, each; and six SATA 6 Gbps ports.

Much of this board's serious "creator" USP begins with its connectivity. It offers two Thunderbolt 40 Gbps ports via type-C connectors, each with its own mini-DisplayPort 1.4 passthrough input that you connect to your graphics card. Networking connectivity includes a 10 GbE wired network connection powered by an AQuantia AQC107 controller; a second 2.5 GbE connection driven by Intel i225-LM controller, and an 802.11ax WLAN connection by an Intel AX201 adapter that also provides Bluetooth 5. The onboard audio solution packs some serious hardware, with an ESS Sabre 9218 DAC handling the front-panel headphones out (130 dBA SNR), a Realtek ALC1220 HDA codec handling the other channels (120 dBA SNR), WIMA capacitors for the front outputs, and the right and left audio channel wiring being routed through distant PCB layers to minimize crosstalk. The company didn't reveal pricing.

Intel NUC Roadmap Peeking Into 2021: Tiger Lake NUC by 2020 End

Intel is planning to introduce its first NUC (next unit of computing) device based on the 11th generation Core "Tiger Lake" processor by the end of 2020, according to leaked company roadmaps covering NUCs. These point to Intel refreshing its "Hades Canyon" performance-segment NUC mini-PC with a "Tiger Lake-U" processor, a 3rd party discrete GPU, and slightly bigger device size (1.35 L vs. 1.2 L of the original "Hades Canyon"). At the very top, the "Ghost Canyon" NUC 9 Extreme with "Coffee Lake-HR" processors will continue to hold the fort into 2021.

The mainstream NUC mini-PC lineup will continue to be "Frost Canyon," powered by "Comet Lake-U" 10th generation Core processors. Q2-Q3 2020 will see Intel launch significant updates to its NUC Compute Element lineup, with "West Cove," "Ghost Canyon," and "Quartz Canyon" holding the mainstream, performance-segment, and professional segment, respectively; while are likely based on "Comet Lake-H" processors; and "Austin Beach" low-power compute element based on "Comet Lake-U."

ASUS Intros ROG Strix B460-H Gaming Motherboard

ASUS introduced the ROG Strix B460-H Gaming motherboard, expanding its ROG Strix family of motherboards based on Intel's mid-range B460 chipset for 10th generation Core "Comet Lake" processors in the LGA1200 package. The board joins Strix-F and Micro-ATX Strix-G SKUs based on this chipset. The Strix-H covers all platform essentials, but tops them with Intel Ethernet and a premium SupremeFX onboard audio solution. The Strix-H uses a simple 8-phase CPU VRM that pulls power from a single 8-pin EPS connector. The board offers a rear I/O shroud that has the latest generation ROG Strix design language, and a single-color (red) ROG illuminated logo. It also comes with an integrated rear I/O shield.

The LGA1200 socket is wired to four DDR4 DIMM slots supporting up to 128 GB of dual-channel DDR4-2933 memory (the maximum memory clock for the B460 platform is 2933 MHz); and a metal-reinforced PCI-Express 3.0 x16 slot. The board offers two M.2 NVMe slots, both with PCIe gen 3.0 x4 wiring; and an M.2 E-key slot for WLAN cards. Other storage connectivity includes six SATA 6 Gbps ports. The board's sole networking interface is a 1 GbE connection driven by an Intel i219-V controller. The company didn't reveal pricing.
ASUS ROG Strix B460-H Gaming

Intel Core i9-10900K der8auer De-Lidding Reveals Accurate Die-Size Measurements

Professional overclocker and extreme cooling products developer der8auer de-lidded a Core i9-10900K 10-core processor to study the processor's behavior with various kinds of custom cooling setups. It was discovered that the 10-core "Comet Lake" die measures 206.1 mm² in die-area. It is 9.2 mm wide like its predecessors, "Coffee Lake" 8-core, 6-core, and 4-core, but is 22.4 mm long, with the outer edges of its packaging material barely within a couple of millimeters of the adhesion point of the integrated heatspreader (IHS). Given what we know about how much each pair of cores adds to these dies, we predict that Intel cannot elongate this die to 12 cores, without having to remove the iGPU. der8auer discovered that using liquid metal TIMs and running the processor de-lidded shaves up to 7 °C off temperatures. Find more technical commentary in the der8auer video presentation.

GELID CPU Coolers Fully Compatible with Intel LGA1200

The 10th generation Intel Core desktop processor family was launched recently along with its companion motherboards based on the Intel 400-series chipsets. The new processors (codename "Comet Lake-S") utilize the LGA 1200 socket which shares the same mechanicals and has the identical 75x75mm spacing of mounting holes as the older LGA 1151 and other 115x sockets. All current GELID CPU coolers that support LGA 115x are also compatible with the new LGA 1200 socket, no additional mounting kits or accessory upgrades are required.

And especially, our latest Phantom, Phantom Black and Sirocco CPU Coolers also fully support overclocking capabilities of the top unlocked Core i9-10900K, Core i7-10700K and Core i5-10600K processors enabling boosted performance and enhanced cooling for your power-hungry gaming rigs.

ASRock Industrial Announces a Broad Range of 10th Gen Intel Core Motherboards

ASRock Industrial Computer Corporation, the world's leader in Industrial PC motherboards, unveils a broad range of industrial motherboards powered by the Intel 10th Generation Core Processors (Comet Lake-S) with up to 10 Cores and supporting Intel 400-series Q470E, H420E, and W480E chipsets. Featuring improved multi-threaded computing performance and rich I/O functionality, ASRock Industrial's new series of product lineup covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards, are ideal for diverse applications, such as industrial automation, retail kiosks, digital signage, and AIoT solutions.

ASRock Industrial introduces the industry's first Intel 10th Gen Core Processors Industrial Motherboards with Q470E chipset, including the IMB-1220-L/IMB-1220-D and IMB-1222/IMB-1222-WV Mini-ITX motherboards, the IMB-1313 Micro-ATX motherboard and the IMB-1711 ATX motherboard. For value and cost-effective options, there are also new Mini-ITX motherboards with H420E chipset, the IMB-1221-L/IMB-1221-D comes with high-rise IO and the IMB-1223/IMB-1223-WV with thin IO.

Dell Announces its Flagship XPS 15 and XPS 17 (Spring 2020 Update)

Dell today updated its premium XPS line of performance notebooks with the XPS 15 (9500) and XPS 17 (9700), as part of the company's Spring 2020 launch sequence. The two are primarily differentiated by screen size (15.6-inch vs. 17-inch). The XPS 15 comes with 16:10 resolutions of 4K UHD+ (3840 x 2400 pixels) InfinityEdge Touch, and WUXGA (1920 x 1200 pixels) InfinityEdge. Both offer Dolby Vision, and adjustable viewing angles. 10th gen Core "Comet Lake-H" processors power both.

Processor options include the Core i5-10300H, i7-10750H, i7-10875H, and i9-10885H. Memory options range between 8 GB single-channel thru 64 GB dual-channel. Graphics options start with GTX 1650 Ti for the XPS 15, and go up to RTX 2060 (mobile) for the XPS 17. Storage options only include NVMe SSDs, starting with 256 GB, and going all the way up to 1 TB. A star attraction with both is Thunderbolt 3 connectivity. The XPS 15 offers two Thunderbolt 3 ports; while the XPS 17 offers four. Killer AX1650 WLAN is standard issue.

Intel Announces Xeon W-1200 Processor Line, Comet Lake Wears a Suit

Intel today announced the Xeon W-1200 line of socket LGA1200 processors aimed at enterprises, workstations, and small-scale server builds. These processors are based on the 14 nm "Comet Lake-W" microarchitecture, and are differentiated from the 10th generation Core "Comet Lake-S" processor family in featuring ECC memory support, vPro support on select SKUs, and the UHD P630 integrated graphics solution. These processors will be supported on motherboards based on the Intel W480, W470, and possibly Q470 chipsets. The processors also introduce Turbo Boost Max 3.0 to this segment with select GPUs. Thermal Velocity Boost is available on only the top SKU.

The lineup is led by the 10-core/20-thread Xeon W-1290P, clocked at 3.70 GHz, with 5.20 GHz max boost frequency, and 20 MB of L3 cache. This SKU also features 5.30 GHz TVB and 4.90 GHz all-core TVB. This is followed closely by the Xeon W-1270P, an 8-core/16-thread part with 3.80 GHz nominal and 5.10 GHz boost frequency, and 16 MB of L3 cache. The W-1250P 6-core/12-thread chip is next in line, with its 4.10 GHz nominal, 4.50 GHz boost, and 12 MB L3 cache. All P-extension SKUs feature generally high clock speeds, and 125 W TDP. Positioned right below these are the non-P SKUs, with their 80 W TDP, and lower clock-speeds.

Intel Core i9-10885H is an i9-10980HK that Trades OC Capability for vPro

Intel is reportedly giving finishing touches to a new performance-segment notebook processor positioned between the Core i7-10875H and the flagship Core i9-10980HK, called the Core i9-10885H. Based on the "Comet Lake-H" silicon, this 8-core/16-thread processor has identical clock speeds to the i9-10980HK, but lacks overclocking capabilities. With its default 45 W TDP configured, the processor ticks at 2.40 GHz nominal, with up to 5.30 GHz boost - a 200 MHz speed-bump over the i7-10875H.

Apparently, the chip also features vPro capability, making it fit for commercial-segment notebooks such as the Dell Latitude and Lenovo ThinkPad T-series. Among the other Intel mobile processors with vPro capability are the new Xeon W-10855M 6-core/12-thread and W-10885M 8-core/16-thread processors; and the 15 W category i7-10810U 6-core/12-thread; and i7-10610U i5-10310U 4-core/8-thread processors. These processors are likely to formally launch on May 13.

MSI Shares Fascinating Insights Into "Comet Lake" Binning

MSI in its weekly "MSI Insider" livestream shared fascinating insights into the way Intel appears to be sorting out its "Comet Lake" silicon across the various brand extensions of its 10th generation Core desktop processors. Its tech leads Eric Van Beurden and Michiel Berkhout spoke at length about MSI's own evaluation of the trays of Core i5-10600K/KF, i7-10700K/KF, and i9-10900K/KF chips it received (the only unlocked chips across the lineup), which they used as empirical evidence to suggest a model for Intel's binning.

MSI segregated the chips it received into three categories. Level A consists of chips that overclock higher than Intel's specifications (overclocking headroom higher than expected). Level B consists of those that overclock within Intel's specifications. Level C, on the other hand, have their overclocking headroom fall below Intel's specifications. It's important to note here that "Intel specification" doesn't mean "stock frequencies," it refers to the overclocking headroom Intel communicates to motherboard manufacturers, to give them an idea of the minimum board design requirements needed to guarantee overclocking within these specifications, for their Z490 motherboards. These are more of a guideline in nature, all three levels will overclock above stock frequencies.
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