AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today revealed its new edge server appliance powered by 4th Gen AMD EPYC processors (codename Genoa). The new server, EB202-CP, is designed to deliver superior performance in a compact size while offering excellent cost efficiency. Combined with the 4th Gen AMD EPYC processors, EB202-CP is expected to drive the innovations in AI, training simulation, autonomous vehicles and edge applications. AIC will showcase EB202-CP at SC22 expo from November 14th to 17th, 2022.

AIC EB202-CP is a 2U rackmount server with 22 inches in depth. It supports eight E1.S/ E3.S or U.2 SSDs which are front-serviceable and hot-swappable. The E1.S/ E3.S drives are Enterprise and Datacenter SSD Form Factor (EDSFF) that enables EB202-CP to provide high-density all-flash NVMe for half petabyte storage capabilities and enhance IOPS and space utilization. EB202-CP has great expansion functionality and supports up to two double-stack GPU or accelerator cards, two FHHL/HHHL PCIe 5.0 cards and an OCP 3.0 card. Based on AIC server board Capella, EB202-CP supports single 4th Gen AMD EPYC processor and eight DDR5 DIMMs. The 4th Gen AMD EPYC processors, built on "Zen 4" architecture, are optimized for general-purpose workloads across enterprise, cloud and edge. This new generation of AMD EPYC features the world's highest-performing x86 processor, PCIe 5.0 ready, and enables low TCO. It also delivers leadership energy efficiency as well as state-of-the-art security features.

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. "Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's new server platforms powered by 4th Gen AMD EPYC processors efficiently enable data centers by doing more tasks with the same number of servers."

"We designed 4th Gen AMD EPYC processors to give our customers exactly what they said they needed, high performance, exceptional energy efficiency and low total cost of ownership," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "With the latest "Zen 4" architecture that incorporates modern security by design, 4th Gen AMD EPYC processors are an outstanding choice for IT professionals looking to optimize their data centers for leadership performance while helping address environmental goals."

SK hynix announced that its DRAM, and CXL solutions have been validated with the new AMD EPYC 9004 Series processors, which were unveiled during the company's "together we advance_data centers" event on November 10. SK hynix has worked closely with AMD to provide fully compatible memory solutions for the 4th Gen AMD EPYC processors.

4th Gen AMD EPYC processors are built on an all-new SP5 socket and offer innovative technologies and features including support for advanced DDR5 and CXL 1.1+ memory expansion. SK hynix 1ynm, 1a nm 16 Gb DDR5 and 1a nm 24Gb DDR5 DRAM support 4800 Mbps on 4th Gen AMD EPYC processors, which deliver up to 50% more memory bandwidth than DDR4 product. SK hynix also provides CXL memory device that is a 96 GB product composed of 24 Gb DDR5 DRAMs based on 1a nm. The company expects high customer satisfaction of this product with flexible configuration of bandwidth and capacity expanded cost-efficiently.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced its portfolio of products ready to support the new AMD EPYC 9004 Series Processors in the first wave of GIGABYTE solutions that will target a wide range of demanding workloads that include GPU-centric, high-density, edge, and general computing. A new x86 platform, a new socket, and a wealth of highly performant technologies provided new opportunities for GIGABYTE to tailor products for leading data centers. So far, GIGABYTE has released twenty-two new servers and motherboards to support the new AMD "Zen 4" architecture. Both single-socket and dual-socket options are available to handle big data and digital transformation. The ongoing collaboration between GIGABYTE and AMD has allowed for a comprehensive portfolio of computing solutions that are ready for the market.

The new 4th Gen AMD EPYC processors feature substantial compute performance and scalability by combing high core counts with impressive PCIe and memory throughput. In terms of out of the box performance, AMD estimates found that 4th Gen AMD EPYC CPUs are the highest performing server processors in the worldi. With the advancement to 5 nm technology and other performant innovations, the new AMD EPYC 9004 series processors move to a new SP5 socket. The new architecture leads the way to faster data insights with high performance and built-in security features, and this platform targets HPC, AI, cloud, big data, and general enterprise IT.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

ASUS, a global technology leader renowned for continuously reimagining today's technologies for tomorrow, today announced ExpertBook B6 Flip (B6602F)—the first Expert-series flippable mobile workstation.

This high-performance mobile workstation with its versatile 360° hinge is designed specifically to help architecture, engineering and construction (AEC) companies running industry-leading software solutions like 3ds Max, MicroStation, and Vectorworks. With immense power packed in a slim and flippable form, ExpertBook B6 Flip handles complex workloads seamlessly across AEC disciplines. It helps users bring design concepts to life through BIM software like ArchiCAD, effortlessly transition from 2D sketches to 3D modelling and printing via tools like Creo and Solidworks, and handle data-intensive applications for deeper insights and better decision-making—delivering the edge that AEC companies need in today's competitive market.

Today, Intel launched the new Intel NUC 13 Extreme Kit (code-named Raptor Canyon) and Intel NUC 13 Extreme Compute Element, which combine to make the most powerful Intel NUC ever built. The NUC 13 Extreme features unlocked 13th Gen Intel Core desktop processors and space for new triple-slot, 12-inch graphics cards to unleash even more performance for enthusiast gamers and content creators.

"This year marks the 10-year anniversary for our impressive lineup of Intel NUC products, and the Intel NUC 13 Extreme (code named Raptor Canyon) is an excellent representation of how far we've come. Our first ever NUC demonstrated a breakthrough in the miniaturization of a small desktop PC into an ultra-small PC form factor. While much larger than our tiniest mini-PC, our latest Intel NUC 13 Extreme sets a new bar for how to pack stellar gaming performance in a form factor that is 70% smaller than a typical 50L gaming tower. Along with the epic performance you expect from an Intel NUC product, we also deliver exceptional product quality and feature density in a completely modular and customizable design," said Brian McCarson, Intel Vice President and General Manager of the Intel NUC Group.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the supreme performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the exclusive Low Latency and High Bandwidth technology, this achievement proves again that GIGABYTE motherboard is the ultimate choice to unleash memory performance, as well as the leading role of memory performance by the teamwork of GIGABYTE vs. Team Group.

It's always been challenging to constantly exceed the high-frequency record of memory, and stable motherboards and high-performance memories make a perfect team to accomplish this difficult task. To provide superior performance and user experience, GIGABYTE has been working closely with Team Group on the record-breaking performance from DDR5-7600, DDR-7800, to XMP DDR5 8000. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase extreme memory bandwidth performance of high-frequency DDR5-8000 32 GB (16 GB x2) & DDR5-7800 32 GB (2x 16 GB) overclocked memory kits on the latest Intel Core i9-13900K Processor and ASUS ROG MAXIMUS Z790 APEX motherboard. Working in close partnership with the ASUS motherboard team, a single G.SKILL memory module was overclocked to a staggering DDR5-10000 under air cooling.

Dedicated to developing the fastest possible DDR5 memory on the latest 13th Gen Intel Core processor and Intel Z790 chipset, G.SKILL showcases the high memory bandwidth performance of DDR5-8000 32 GB (2x16GB) memory kit on the ASUS ROG MAXIMUS Z790 APEX motherboard. The following screenshots show the DDR5-8000 CL40 32 GB (2x16GB) and DDR5-7800 CL38 32 GB (2x 16 GB) memory kits validated on an Intel Core i9-13900K processor and ASUS ROG MAXIMUS Z790 APEX motherboard (BIOS 0702) platform, with the DDR5-8000 CL40 32 GB (2x16GB) memory kit reaching memory bandwidth read speed of over 124 GB/s and write speed of over 120 GB/s on the AIDA64 memory benchmark.

Intel just finalized the launch date of its 4th Gen Xeon Scalable "Sapphire Rapids" server processors. The company plans to launch them on January 10, 2023. The new processors will be launched at a special event dedicated to the company's various new Data Center (group) innovations, which cover server processors, new networking innovations, possible launches from Intel's ecosystem partners, and more.

A lot is riding on the success of "Sapphire Rapids," as they see the introduction of Intel's new high-performance CPU core on in the enterprise segment at core-counts of up to 60-core/120-thread per socket; along with cutting-edge new I/O that includes DDR5 memory, PCI-Express Gen 5, next-gen CXL, and on-package HBM memory on certain variants.

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that Z790 AORUS TACHYON pushes the envelope of memory performance to XMP DDR5-8333 and DDR5-9300 O.C. with air cooling. On top of that, the phenomenal performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards proves the enhancements from hardware to firmware including top-quality components, new generation Shielded Memory Routing design, and High Bandwidth of BIOS setting greatly improve memory stability and performance.

Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, GIGABYTE Z790 AORUS TACHYON, Z790 AORUS XTREME, and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of memories.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announces the brand new Z790 VALKYRIE motherboard, built to run the all-powerful Intel 13th gen raptor-lake processors. Designed on the base of Intel Z790 single-chip architecture, the Z790 VALKYRIE is the latest addition to BIOSTAR's top-of-the-line flagship motherboard range.

Carrying the latest technology in a sleek, highly refined platform, the stylish design of VALKYRIE exhuberates the pinnacle of BIOSTAR product design and technical prowess. Enter any battle with confidence backed by the unwavering performance and reliability of BIOSTAR's latest Z790 VALKYRIE motherboard. Built to support the latest DDR5 memory, Z790 VALKYRIE holds 4 DIMMs of high-speed DDR 5 memory up to 128Gb with boosted clock speeds exceeding 7200+(OC) MHz.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the new Battle-AX memory kits with support for the latest Intel platform, available in DDR4 and DDR5 memory modules. COLORFUL also launches two new CN Series NVMe SSDs in PCIe Gen4 and PCIe Gen3 interfaces. The new memory and storage products aim to provide builders upgrading to the newer mainstream system platforms as well as older generation systems with DDR4 memory and PCIe Gen 3 M.2 SSD slots.

The COLORFUL Battle-AX DDR5 and DDR4 memory is perfect for mainstream users that plan to upgrade to the latest Intel platforms. The Battle-AX DDR5 memory sports a black heatspreader while the Battle-AX DDR4 sports a white heatspreader. The Battle-AX DDR5 memory is available in 8 GB and 16 GB modules and frequencies of DDR5-4800 and DDR5-5200. The Battle-AX DDR4 memory is also available in 8 GB and 16 GB modules and frequencies of DDR4-3200 and DDR4-3600. The Battle-AX DDR5 memory supports Intel XMP 3.0 for quick and easy memory overclocking via the BIOS. The COLORFUL Battle-AX Series memory is covered with 3-year warranty.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the phenomenal performance of XMP DDR5-7800 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the new generation Shielded Memory Routing design, exclusive BIOS setting, top-quality components, and advanced design from hardware to firmware on motherboards, this achievement of memory stability and performance proves again GIGABYTE's strong leading role in high-performance motherboards in the market.

When it comes to pushing the memory frequency to the limits, a stable platform with top-quality materials always plays a key role in addition to high-performance memories. Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, Z790 AORUS XTREME and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7800 with T-FORCE DELTA RGB DDR5. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the overclocking world record of Cinebench R23 56783 pts, verified by HWBOT and chalked up by the latest Z790 AORUS TACHYON with Core i9-13900K all-core O.C 7584 MHz and DDR5-8300 O.C. Instead of high-frequency on single core but fail to all benchmarks, Z790 AORUS TACHYON showcases the unbridled performance with all-core O.C. Designed by world-famous overclocker, GIGABYTE Z790 AORUS TACHYON packs overclocker-exclusive features with top-quality components to become the dreaming motherboard for overclockers, which delivers more user-friendly and stable O.C. operation along with unparalleled performance.

"We are very proud of this amazing O.C. world record of Cinebench R23 set by Z790 AORUS TACHYON, verified by HWBOT and proves GIGABYTE's strong R&D on overclocking. With optimal components, ultimate design, and friendly interfaces, Z790 AORUS TACHYON is the most formidable O.C motherboard in the market, and the best choice for refreshing overclocking world record." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

SK hynix Inc. reported today revenues of 10.98 trillion won, operating profit of 1.66 trillion won (with OP margin of 15%), and net income of 1.1 trillion won (with net income margin 10%) in the third quarter of 2022. Sales and operating profits decreased 20.5%, 60.5% respectively QoQ. SK hynix analyzed that revenues fell QoQ as both sales volume and price decreased due to sluggish demand for DRAM and NAND products amid worsening macroeconomic environment worldwide. In addition, SK hynix explained that despite the company improved cost competitiveness by increasing the sales proportion and yield of the latest 1anm DRAM and 176-layer 4D NAND, operating profit also decreased due to greater price drop than cost reduction.

SK hynix diagnosed that the semiconductor memory industry is facing an unprecedented deterioration in market conditions as uncertainties in the business environment continued. The deterioration occurred as the shipments of PCs and smartphone manufacturers, which are major buyers of memory chips, have decreased.

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will exhibit at Infocomm SEA 2022, the Professional Audio Visual event in Southeast Asia at Bangkok, Thailand, Booth no. Z12 from Nov. 2 to 4 to showcase the latest LEET gaming series, the comprehensive LIVA Mini PC family and the All-in-One PC to apply for wide range of applications.

ECS will first launch the new LEET Gaming series, LEET Gaming Motherboard Z790H7-A and LEET Gaming Barebone PC B660 during Infocomm SEA 2022. To offer users exceptional PC performance, LEET Z790H7-A designs with the next-generation technology to support the latest Intel 12th & 13th Gen Processors for LGA 1700 socket, dual channel DDR5 RAM up to 128 GB, PCIe 5.0 slot, 2.5 Gb LAN and the latest wireless networking. Besides, LEET Gaming series also provides a gaming PC system, LEET B660, for user to build their own PC more easily. LEET B660 includes a B660H7-M20 Motherboard supported by the Intel 12th Gen Processor for LGA1700 socket, an NVIDIA GeForce RTX 30 series Graphic Card or AMD Radeon RX 6000 series Graphic Card and a power supply up to 650-watt into a 26-liter system case.

Intel Core i9-13900K processor has just been launched, and overclockers worldwide got their hand on a few samples to make history. According to the HWBot submission, a Swedish overclocker named "elmor" has pushed Intel's top-end consumer SKU to a fantastic 8.812 GHz. For more than eight years, the record for the single-highest overclocking speed was held by AMD FX-8370, from the now-bygone era of AMD Black Edition processors. The overclocking attempt was performed using liquid nitrogen (LN2) that cools the chip using its −195.8 °C temperature. Pushing core voltage to 1.850 Volts and VCCIN to 2 Volts, multiplier set to x88, and a bus speed of 100.15 MHz. In addition to the Core i9-13900K CPU, elmor used ASUS ROG Maximus Z790 APEX motherboard and 32 GB DDR5 GSKILL memory running at 4808 MT/s.

As a reminder, the FX-8370 CPU was holding the number one sport for eight years with a speed of 8.722 GHz. Beating the FX-8370 by just 90 MHz, it will be interesting to see if any of the upcoming CPU SKUs can match this overclocking record, and we are curious if any contender will come to beat elmor's current record.

ASUS today announced the availability of new Intel Z790 motherboards, including the ROG Maximus Z790 Apex, TUF Gaming Z790-PLUS WiFi and ProArt Z790-Creator WiFi - all of which provide DDR5 memory module support and PCIe 5.0 slots for video cards and storage.ASUS Z790 motherboards offer tremendous value to anyone assembling an Intel 13th Gen machine that includes AEMP II, AI Overclocking, AI Cooling II, PCIe 5.0 M.2 slots, Thunderbolt 4, WiFi 6E, Quick Charge 4+ technology and comprehensive connectivity. Overall, new ASUS Z790 motherboards are ideal solutions for any user who wants to build a next-gen machine or upgrade their existing system.

First up is the ROG Maximus Z790 Apex. The ultimate option for memory overclocking enthusiasts, this motherboard boasts a cutting-edge feature set. Then, for creative professionals of all kinds, ASUS offers the ProArt Z790-Creator WiFi. This motherboard offers premium connectivity and bespoke style, and it's fully ready for next-gen graphics cards and ultra-fast PCIe 5.0 storage. Finally, ASUS is bolstering its TUF Gaming lineup with the TUF Gaming Z790-Plus WiFi, which brings DDR5 support to the family.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, proudly announced that their air coolers, AIOs, and custom liquid-cooling parts, would be fully compatible with the upcoming 13th Gen Intel Core processors; that is to say, you can upgrade to the brand new 13th Gen Intel Core processors while keeping the cooler you're running at the moment.

Whichever Intel 13th Gen Core processor you choose for your new PC; Thermaltake's cooler can be suitable for your build and free of any compatibility issues when upgrading to your new CPUs. However, you may need extra mounting kits for certain models to transition to the LGA1700 platform; therefore, please contact your local Thermaltake representative office or resellers for more details. To release the full potential of the 13th Gen Intel Core processors, you can also go with Thermaltake's new series of ultra-fast DDR5 memory and utilize the new chips to their maximum.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today excited to announce the partnership with leading memory brand Team Group to release the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop memory. The new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop RAMs are the collaborative effort of two leading tech brands, Team Group and BIOSTAR. Carrying the legendary DNA of BIOSTAR's flagship VALKYRIE design language and T-FORCE DELTA RGB DDR5 desktop memory technology, the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition RAMs bring superior design, technology, and next-level engineering with jaw-dropping performance unparalleled in its class.

Its stealth fighter-influenced look features the signature wide-angled heatspreader with mesmerizing RGB lightning, unlike any other RAM on the market. Powered by a next-generation intelligent RGB control chip, it allows users full reign over limitless lighting customization using BIOSTAR's Advanced VIVID LED DJ software to create a highly personalized ambiance inside the system. Furthermore, the signature golden wings logo of BIOSTAR's VALKYRIE, together with T-FORCE's iconic wings logo, signify the Norse warriors' majestic wings and stands as a symbol of power and authority with its sleek streamlined design elements.