As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

The earliest reports on AMD's next-generation "Cezanne" APU silicon pointed at the possibility of the chip combining "Zen 3" CPU cores with a next-generation iGPU solution based on RDNA2 ("Navi 2#"). AMD plans to launch "Cezanne" in 2021, which makes it the immediate successor to "Renoir." A report by Igor's Lab has fresh details on "Cezanne." Apparently the chip sticks with the "Vega" graphics architecture on its iGPU. This doesn't necessarily mean that it's the same exact iGPU as the 8 CU version on "Renoir."

On the other hand, the "Van Gogh" silicon slated for 2021 is expected to receive RDNA2 graphics. It's important to note here that "Van Gogh" and "Cezanne" sit in the same product stack, and "Van Gogh" does not succeed "Cezanne." Rather, it's the codename for an entry-level APU, succeeding "Dali" (Athlon 3000G), which also means the RDNA2-based iGPU will be a lot slimmer than the "Vega" based one on "Cezanne." It's only by 2022 that AMD will have a performance-segment APU with RDNA2-based iGPU, with "Rembrandt." Find our older article getting into AMD's roadmaps here.

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

The "Zen 2" based Ryzen 4000-series mobile processors and Threadripper 3990X HEDT chip dominated headlines throughout AMD's CES 2020 event, but an important product announcement slipped past us: the mobile Athlon 3000 Gold and 3000 Silver families of entry-level mobile SoCs. These are 15-Watt SoCs targeting low-cost ultraportables, convertibles, and straight up Windows x64 tablets, competing against Intel's Pentium Gold 5000U "Whiskey Lake" and Pentium Silver "Gemini Lake Refresh" series. The family currently only consists of two SKUs, the Athlon Gold 3150U and Athlon Silver 3050U.

The two chips are based on the "Dali" silicon, and feature "Zen" CPU cores. The Athlon Gold 3150U features a 2-core/4-thread "Zen" CPU clocked at 2.40 GHz with 3.30 GHz boost. The Athlon Silver 3050U, on the other hand, is configured with a 2-core/2-thread CPU clocked at 2.30 GHz with 3.20 GHz boost. The CPUs on both models is configured with 4 MB of L3 cache, which takes their "total cache" (L2 + L3) figure up to 5 MB. The iGPU on the 3150U is a Radeon Vega 3 with 192 stream processors, clocked at 1.00 GHz. The one on the 3050U, is AMD's smallest, with just 2 compute units, working up to 128 stream processors, but the engine clock is set at 1.10 GHz.

AMD is expected to bring back its low-power APU family in 2020 with the new "Dali" silicon. Updated company roadmap slides see the inclusion of "Dali" as a "value mobile APU," positioned under "Renoir," a performance APU targeting both the mainstream notebook and desktop (socket AM4) platforms. AMD looks keen to branch out its APU business in two directions.

"Renoir" is expected to be a "Zen 2" based APU with CPU performance matching at least the Ryzen 5 3600 or 3700X, and a faster "Vega" based iGPU. It wouldn't surprise us if "Dali" is a monolithic 7 nm die with two "Zen 2" CPU cores and a tiny iGPU with 3-4 compute units. "Renoir," on the other hand, could be an MCM with an 8-core "Zen 2" chiplet and an enlarged I/O controller die that has the iGPU. "Dali" could see the light of the day only in 2020, by which time TSMC could substantially increase its 7 nm volumes and clear the decks for its new 7 nm EUV mass-production.