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GLOBALFOUNDRIES and GlobalWafers Partnering to Expand Semiconductor Wafer Supply

GLOBALFOUNDRIES (GF ), the global leader in feature-rich semiconductor manufacturing, and GlobalWafers Co., Ltd. (GWC), one of the top silicon wafer manufacturers in the world, today announced an $800 million agreement to add 300 mm silicon-on-insulator (SOI) wafer manufacturing and expand existing 200 mm SOI wafer production at GWC's MEMC facility in O'Fallon, Missouri.

The silicon wafers produced by GWC are key input materials for semiconductors and an integral part of GF's supply chain. The wafers are used in GF's multi-billion dollar manufacturing facilities, or fabs, where they are used to manufacture the computer chips that are pervasive and vital to the global economy. Today's announcement expands GF's domestic silicon wafer supply from the United States.

Raytheon Technologies and GLOBALFOUNDRIES Partner to Accelerate 5G Wireless Connectivity Using Gallium Nitride on Silicon (GaN-on-Si)

Raytheon Technologies (NYSE: RTX), a leading aerospace and defense technology company, and GLOBALFOUNDRIES (GF ), the global leader in feature-rich semiconductor manufacturing, will collaborate to develop and commercialize a new gallium nitride on silicon (GaN-on-Si) semiconductor that will enable game-changing radio frequency performance for 5G and 6G mobile and wireless infrastructure applications.

Under the agreement, Raytheon Technologies will license its proprietary gallium nitride on silicon technology and technical expertise to GF, which will develop the new semiconductor at its Fab 9 facility in Burlington, Vermont. Gallium nitride is a unique material used to build high-performance semiconductors that can handle significant heat and power levels. This makes it ideal to handle 5G and 6G wireless signals, which require higher performance levels than legacy wireless systems.

AMD and GlobalFoundries Wafer Supply Agreement Now Non-Exclusive, Paves Way for 7nm sIOD

AMD in a filing with the U.S. Securities and Exchange Commission (SEC), revealed that its wafer supply agreement with GlobalFoundries has been amended. Under the new terms, AMD places orders for wafers from GlobalFoundries up to 2024, with purchase targets set for each year leading up to 2024. Beyond meeting these targets, AMD is free from all other exclusivity commitments. The agreement was previously amended in January 2019, setting annual purchase targets for 2019, 2020, and 2021, while beginning a de-coupling between AMD and GlobalFoundries. This enabled the company to source 7 nm (or smaller) chips, such as CCDs and GPUs, from other foundries, such as TSMC, while keeping GlobalFoundries exclusive for 12 nm (or larger) nodes.

The updated wafer supply agreement unlocks many possibilities for AMD. For starters, it can finally build a next-generation sIOD (server I/O die) on a more efficient node than GlobalFoundries 12LP, such as TSMC 7 nm. This transition to 7 nm will be needed as the next-gen "Genoa" EPYC processor could feature future I/O standards such as DDR5 memory and PCI-Express Gen 5, and the switching fabric for these could be too power-hungry on 12 nm. The "Zen 4" CPU core complex dies (CCDs) of "Genoa" are expected to be built on TSMC 5 nm.

PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer

PsiQuantum, the leading quantum computing company focused on delivering a 1 million-plus qubit quantum computer, and GLOBALFOUNDRIES (GF ), the global leader in feature-rich semiconductor manufacturing, today announced a major breakthrough in their partnership to build the world's first full-scale commercial quantum computer. The two companies are now manufacturing the silicon photonic and electronic chips that form the foundation of the Q1 system, the first system milestone in PsiQuantum's roadmap to deliver a commercially viable quantum computer with one million qubits (the basic unit of quantum information) and beyond.

PsiQuantum and GF have now demonstrated a world-first ability to manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using the standard manufacturing processes of GF's world-leading semiconductor fab. The companies have also installed proprietary production and manufacturing equipment in two of GF's 300 mm fabs to produce thousands of Q1 silicon photonic chips at its facility in upstate New York, and state-of-the-art electronic control chips at its Fab 1 facility in Dresden, Germany.

GLOBALFOUNDRIES Integrates its Corporate HQ with Fab 8 New York

GLOBALFOUNDRIES (GF), the global leader in feature-rich semiconductor manufacturing, announced today at an onsite event with Senate Majority Leader Chuck Schumer that it will relocate its headquarters to Malta, New York, the site of Fab 8, the company's most advanced semiconductor manufacturing facility—as the company positions itself for growth, strengthens partnerships with customers and recruits new talent. This change is effective today.

GF has invested more than $15 billion in its Fab 8 facility over the last decade to support innovation and manufacturing capacity. In 2021, the company is doubling its planned investment to expand global capacity, with $500 million targeted for Malta, NY alone.

The move from GF's previous headquarters to its state-of-the-art fab in New York is part of the company's commitment to address the soaring global chip demand, with a focus on semiconductor manufacturing innovation. GF will maintain a substantial presence in Santa Clara, California, in the heart of Silicon Valley, where many of GF's leading U.S. customers and ecosystem partners are based.

GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar

GLOBALFOUNDRIES (GF ), the global leader in specialty semiconductor manufacturing, and Bosch will partner to develop and manufacture next-generation automotive radar technology.

Bosch chose GF as its partner to develop a mmWave automotive radar system-on-chip (SoC) for Advanced Driver Assistance Systems (ADAS) applications, manufactured using GF's 22FDX RF solution. ADAS applications help drivers stay safe by keeping a vehicle in the correct lane, warning of collisions, initiating emergency braking, assisting with parking, and more.

Globalfoundries Investing $1.4 billion in Fabrication Capacity Expansion, Anticipate IPO

Globalfoundries has announced they are in the early stages of a massive $1.4 billion investment in their manufacturing capabilities, which aims to increase overall production of semiconductor chips. One third of this development investment will be pre-paid by Globalfoundries' customers, who by investing this way, are also pre-allocating Globalfoundries' future supply - it's a way for the company to receive funds for not-yet-produced wafers, enabling it to proceed with these expansion plans. The company usually reserves $700 million yearly for capacity expansions and technology improvements, so this $1.4 billion figure essentially doubles that.

That doubling comes at a time where existing capacity throughout the semiconductor industry is showing not to be sufficient for global demand. The plans will see Globalfoundries increase its wafer production capability by 13% this year, and 20% in 2022. The increased funding for developmental expenses will be allocated equally between the company's three manufacturing plants already installed in Dresden, Malta (New York) and Singapore. Globalfoundries' 2020 revenue ended up at $5.7 billion, a cutback from 2017's $6.176 billion. The company, however, projects its revenue to increase 9-10% in 2021 due to the current unprecedented demand for its fabrication technologies. The company is also looking to capitalize on this demand in another way: by bringing its IPO forward. Where before the company planned to go public in 2022 or even 2023, the increased current demand and prospective YoY growth places the company in a good place for such a move.

U.S. DoD Partners with GlobalFoundries to Manufacture Chips at Fab 8, Upstate NY

GLOBALFOUNDRIES (GF), the world's leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF's Fab 8 in Malta, New York—the company's most advanced semiconductor manufacturing facility. These semiconductor chips will be used in some of the DoD's most sensitive applications for land, air, sea, and space systems.

Under the agreement, GF will provide a supply of chips built at Fab 8 on its differentiated 45 nm SOI platform. The agreement is made possible by Fab 8's compliance with U.S. International Traffic in Arms Regulations (ITAR) and highly restrictive Export Control Classification Numbers under the Export Administration Regulations (EAR).

The new supply agreement builds upon the longstanding partnership between the DoD and GF to provide chips for defense, aerospace, and other sensitive applications. GF currently supplies the DoD with chips manufactured at GF's other on-shore facilities, Fab 10 in East Fishkill, New York, and Fab 9 in Burlington, Vermont.

Dialog Semiconductor Licenses its Non-Volatile ReRAM Technology to GLOBALFOUNDRIES for 22FDX Platform

DIALOG SEMICONDUCTOR, a leading provider of battery and power management, Wi-Fi and Bluetooth low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog's CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX platform, with the plan to extend to other platforms.

Dialog's proprietary and production proven CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to artificial intelligence (AI). Low power consumption, high read/write speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM particularly suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables cost-effective embedded NVM for advanced technology nodes required for products in these markets.

GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility

GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF's industry-leading 22FDX (22 nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

GF's new 22FDX+ builds on the company's 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities for the newest generation of designs. The differentiated offering will further empower customers to create chips that are specifically optimized for Internet of Things (IoT), 5G, automotive, and satellite communications applications.

GLOBALFOUNDRIES Appoints David Reeder as Chief Financial Officer

GLOBALFOUNDRIES (GF ) today announced the appointment of David Reeder as Chief Financial Officer (CFO). David will draw on his more than 20 years of global financial and executive management experience with public and private companies to support GF's growth and continued success as the world's leading specialty foundry as well as accelerate the company's journey to IPO.

Reeder brings with him an extensive background including experience in corporate finance, strategic planning, operations, investor relations, and risk management along with CEO and CFO experience at four different companies, both private and publicly-held.

Reeder has served in senior finance and operations positions in global high technology companies including Texas Instruments, Broadcom, Cisco and Electronics for Imaging (EFI). Most recently, Reeder served as CFO and as CEO of Lexmark International, a $4 billion publicly-traded company listed on the New York Stock Exchange (NYSE), and as CEO of Tower Hill Insurance Group. As a global citizen, David has spent time in leadership roles in Malaysia, Singapore, France, the United Kingdom and the United States.

GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit

GLOBALFOUNDRIES (GF ) today announced the release and distribution of OpenAccess iPDK libraries optimized for its 22FDX (22nm FD-SOI) platform. With its best-in-class performance, power consumption, and broad feature integration capability, GF's differentiated 22FDX platform is the solution of choice for designers and innovators working in 5G mmWave, edge AI, Internet of Things (IoT), automotive, satellite communications, security, and other applications.

The open-standard based iPDK offers the same level of functionality and performance as PDKs designed for specific vendor tools, while helping enable interoperability and compatibility among different design tool suites. Tools including: the Custom Compiler solution from Synopsys; TannerTM software solutions from Mentor, a Siemens business; PathWave Advanced Design System (ADS) from Keysight Technologies; and any other tool supporting OpenAccess will now be able to use GF iPDK libraries for its 22FDX platform. GF's iPDK will consist of OpenAccess technology files, symbols, component description format (CDF), TCL callbacks, netlisting information, and PyCells.

The 22FDX iPDK is released and available alongside other EDA-specific 22FDX PDK bundles.

Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip on IoT Edge Devices

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced a hardware demonstration of a new artificial intelligence chip. Based on imec's Analog in Memory Computing (AiMC) architecture utilizing GF's 22FDX solution, the new chip is optimized to perform deep neural network calculations on in-memory computing hardware in the analog domain. Achieving record-high energy efficiency up to 2,900 TOPS/W, the accelerator is a key enabler for inference-on-the-edge for low-power devices. The privacy, security and latency benefits of this new technology will have an impact on AI applications in a wide range of edge devices, from smart speakers to self-driving vehicles.

GLOBALFOUNDRIES Acquires Land in Malta, New York for Expansion

GLOBALFOUNDRIES (GF), the world's leading specialty foundry and the leading U.S. pure-play manufacturer of semiconductors, today announced it has secured a purchase option agreement for approximately 66 acres of undeveloped land adjacent to its most advanced manufacturing facility, Fab 8, in Malta, N.Y., near the Luther Forest Technology Campus (LFTC).

The land parcel is located at the southeast end of the New York State Energy Research and Development Authority (NYSERDA) Saratoga Technology + Energy Park (STEP) campus, adjacent to Stonebreak Road Extension, between GF's Fab 8 facility and Hermes Road. Exercising the option to purchase the land and commencement of development to expand GF's Fab 8 facility will be subject to zoning regulations and client demand. The parcel is being sold at Fair Market Value, with a purchase price determined by an independent appraiser.

GLOBALFOUNDRIES Announces 12LP+ Enhanced 12nm Silicon Fabrication Node

GLOBALFOUNDRIES (GF), the world's leading specialty foundry, today announced its most advanced FinFET solution, 12LP+, has completed technology qualification and is ready for production. GF's differentiated 12LP+ solution is optimized for artificial intelligence (AI) training and inference applications. Built on a proven platform with a robust production ecosystem, 12LP+ offers chip designers an efficient development experience and a fast time-to-market.

Contributing to its best-in-class combination of performance, power and area, 12LP+ introduces new features including an updated standard cell library, an interposer for 2.5D packaging, and a low-power 0.5 V Vmin SRAM bitcell that supports the low latency and power-efficient shuttling of data between the AI processors and memory. The result is a semiconductor solution engineered to meet the specific needs of the fast-growing AI market.

GLOBALFOUNDRIES Ceases Operations in its Chengdu Fab

GLOBALFOUNDRIES ceased all operations in its joint-venture fab in Chengdu, China. The fab opened its doors in 2018, and was supposed to mass-produce 300 mm wafers on the 22FDX technology in a 65,000 square meter facility. The company's Chinese partner, the Chengdu Municipality, had at the time boasted of investments into the fab peaking at $10 billion. The two had also announced $2 billion in initial design wins.

GloFo's announcement to cease operations and possibly withdraw from Chengdu comes hot on the heals of a separate announcement bolstering its mainland US based facilities up to US-DoD specs for secure manufacturing, a sign that the company will scale up investment into US-based facilities. GloFo's foreshadowed withdrawal from manufacturing in China is part of the ongoing "tech war" between the US and China, with the US getting American (and West-aligned) tech companies to pull manufacturing out of China, the biggest casualties of which is Huawei.

Did GlobalFoundries Give Up 7nm to Chase Silicon Photonics Manufacturing?

A Forbes report provides a fascinating peek into something that could explain GlobalFoundries stalling its 7 nm-class silicon fabrication plans, and shedding much of its offshore foundry bulk, other than just fiscal prudence. Apparently, the company has been making moves in silicon photonics, benefiting from few of the 16,000+ patents and other forms of IP it inherited from the IBM Microelectronics business acquisition from 2015. In particular, GlobalFoundries appears interested in high-bandwidth networking physical-layer applications that involve photonics and fiber-optics.

GlobalFoundries has reportedly been engaging with customers in the telecom- and data-center industries since 2016 in offering medium-range networking physical-layer solution, providing 40 Gbps bandwidths over distances of up to 10 km (without repeaters in the middle). In 2017, it partnered with Ayar Labs to develop an optical I/O chip. This solution combines Ayar's optical CMOS I/O tech with GloFo's 45 nm CMOS process to 10x the bandwidth at 1/5th the power of a copper-based I/O. By 2018, the combine qualified a platform that can push up to 100 Gbps per wavelength, and up to 800 Gbps on the client-side. By 2019, the combine developed a supercomputing chiplet co-packed with an Intel silicon as part of DARPA's PIPES (Photonics in Package for Extreme Scalability) project. With network bandwidth demand on an exponential rise with the advent of 5G, I guess you can say that the future for GloFo's silicon photonics business looks bright.

Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm

Everspin Technologies, Inc., the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES (GF ), the world's leading specialty foundry. Everspin and GF have been partners on 40 nm, 28 nm, and 22 nm STT-MRAM development and manufacturing processes and have now updated their agreement to set the terms for a future project on an advanced 12 nm FinFET MRAM solution. Everspin is in production of discrete STT-MRAM solutions on 40 and 28 nm, including its award winning 1 Gb DDR4 device. GF recently announced it has achieved initial production of embedded MRAM (eMRAM) on its 22FDX platform.

GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers

GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, and GlobalWafers Co., Ltd. (GWC), one of the top three silicon wafer manufacturers in the world, today announced they have signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300 mm silicon-on-insulator (SOI) wafers.

GWC is one of the world's leading manufacturers of 200 mm SOI wafers, and has a long and ongoing relationship with GF for supplying 200 mm SOI wafers. GWC also manufactures 300 mm SOI wafers, and under the anticipated supply agreement, GWC and GF will collaborate closely to significantly expand GWC's 300 mm SOI wafer manufacturing capacity.

Intel Rumored to be Courting GlobalFoundries for Some CPU Manufacturing

With its own silicon fabrication facilities pushed to their capacity limits, Intel is looking for third-party semiconductor foundries to share some of its supply load, and according to a WCCFTech report, its latest partner could be GlobalFoundries, which has a 14 nm-class fab in Upstate New York. If it goes through, the possible Intel-GloFo deal could see contract manufacturing commence within 2020.

GloFo's fab offers 14 nm FinFET and 12LPP, a refinement that's marketed as 12 nm. According to the report, Intel could use GloFo for manufacturing CPU dies, specifically its entry-level chips such as Core i3, Pentium, and Celeron. Intel is also known to shed its own manufacturing workload by contracting foundries for 14 nm core-logic (chipsets). In a bid to maximize 14 nm fab allocation for its CPUs, Intel also started making some of its 300-series chipsets on the older 22 nm process, which goes to show the company's appetite for 14 nm.

GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP

GLOBALFOUNDRIES (GF ) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF's recently announced 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) applications.

In order to achieve the capacity and bandwidth for data-intensive AI training applications, system designers are challenged with squeezing more bandwidth into a smaller area while maintaining a reasonable power profile. SiFive's customizable high bandwidth memory interface on GF's 12LP platform and 12LP+ solution will enable easy integration of high bandwidth memory into a single System-on-Chip (SoC) solutions to deliver fast, power-efficient data processing for AI applications in the computing and wired infrastructure markets.

GLOBALFOUNDRIES and TSMC Announce Resolution of Global Disputes Through Patent Cross-Licensing

GLOBALFOUNDRIES (GF) and TSMC today announced they are dismissing all litigation between them as well as those that involve any of their customers. The companies have agreed to a broad life-of-patents cross-license to each other's worldwide existing semiconductor patents as well as those patents that will be filed during the next ten years as both companies continue to invest significantly in semiconductor research and development. This resolution guarantees GF and TSMC freedom to operate and ensures that their respective customers will continue to have access to each foundry's complete array of technologies and services.

"We are pleased to have quickly reached this settlement that acknowledges the strength of our respective intellectual property. Today's announcement enables both of our companies to focus on innovation and to better serve our clients around the world," said Thomas Caulfield, CEO of GF. "This agreement between GF and TSMC secures GF's ability to grow and is a win for the entire semiconductor industry which is at the core of today's global economy."

GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications

GLOBALFOUNDRIES (GF), the world's leading specialty foundry, announced today at its Global Technology Conference the availability of 12LP+, an innovative new solution for AI training and inference applications. 12LP+ offers chip designers a best-in-class combination of performance, power and area, along with a set of key new features, a mature design and production ecosystem, cost-efficient development and fast time-to-market for high-growth cloud and edge AI applications.

Derived from GF's existing 12nm Leading Performance (12LP) platform, GF's new 12LP+ provides either a 20% increase in performance or a 40% reduction in power requirements over the base 12LP platform, plus a 15% improvement in logic area scaling. A key feature is a high-speed, low-power 0.5 V SRAM bit cell that supports the fast, power-efficient shuttling of data between processors and memory, an important requirement for AI applications in the computing and wired infrastructure markets.

Globalfoundries Files Patent-infringement Lawsuits Against TSMC in the U.S. and Germany

GLOBALFOUNDRIES (GF), the world's leading specialty foundry based in the United States, today filed multiple lawsuits in the U.S. and Germany alleging that semiconductor manufacturing technologies used by Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) infringe 16 GF patents. The lawsuits were filed today in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germany.

In filing the lawsuits, GF seeks orders that will prevent semiconductors produced with the infringing technology by Taiwan-based TSMC, the dominant semiconductor manufacturer, from being imported into the U.S. and Germany. These lawsuits require GF to name certain major customers of TSMC and downstream electronics companies, who, in most cases, are the actual importers of the products that incorporate the infringing TSMC technology. GF also seeks significant damages from TSMC based on TSMC's unlawful use of GF's proprietary technology in its tens of billions of dollars of sales.

GlobalFoundries and ON Semi Partner to Transfer Ownership of East Fishkill NY 300mm Fab

ON Semiconductor Corporation and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300 mm fab located in East Fishkill, New York. The total consideration for the acquisition is $430 million, of which $100 million has been paid at signing of the definitive agreement, and $330 million will be paid at the end of 2022, after which ON Semiconductor will gain full operational control of the fab, and the site's employees will transition to ON Semiconductor. Completion of the transaction is subject to regulatory approval and other customary closing conditions.

The agreement allows ON Semiconductor to increase its 300 mm production at the East Fishkill fab over several years, and allows for GLOBALFOUNDRIES to transition its numerous technologies to the company's three other at-scale 300 mm sites. Under the terms of the agreement, GLOBALFOUNDRIES will manufacture 300 mm wafers for ON Semiconductor until the end of 2022. First production of 300 mm wafers for ON Semiconductor is expected to start in 2020.
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