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GlobalFoundries and ON Semi Partner to Transfer Ownership of East Fishkill NY 300mm Fab

ON Semiconductor Corporation and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300 mm fab located in East Fishkill, New York. The total consideration for the acquisition is $430 million, of which $100 million has been paid at signing of the definitive agreement, and $330 million will be paid at the end of 2022, after which ON Semiconductor will gain full operational control of the fab, and the site's employees will transition to ON Semiconductor. Completion of the transaction is subject to regulatory approval and other customary closing conditions.

The agreement allows ON Semiconductor to increase its 300 mm production at the East Fishkill fab over several years, and allows for GLOBALFOUNDRIES to transition its numerous technologies to the company's three other at-scale 300 mm sites. Under the terms of the agreement, GLOBALFOUNDRIES will manufacture 300 mm wafers for ON Semiconductor until the end of 2022. First production of 300 mm wafers for ON Semiconductor is expected to start in 2020.

GlobalFoundries to Sell its Singapore-based Fab 3E to Vanguard

GlobalFoundries has decided to exit the MEMS (microelectromechanical systems) manufacturing business by selling off its Fab 3E, located in Singapore. The foundry will be acquired lock stock and barrel by Vanguard International Semiconductor (VIS). GlobalFoundries earns USD $236 million from this sale. The transfer of operations is scheduled to take place on 31st December, 2019. Fab 3E has an installed capacity of producing 35,000 200-mm wafers per month, and specializes in MEMS and analog/mixed signal chips. Under the terms of sale, Vanguard also stands to obtain GlobalFoundries' MEMS-related IP and workforce for this facility, which continues its employment after transition. Vanguard also inherits GloFo's clientele for products made at this facility.

AMD Updates Wafer Supply Agreement with GlobalFoundries to Free Itself of "7nm Tax"

AMD in its Q4-2018 Earnings Report disclosed that it has amended its Wafer Supply Agreement (WSA) with GlobalFoundries that frees it from paying a "7 nanometer tax." Under the older version of WSA, AMD would have had to pay a penalty to GlobalFoundries if it sourced processors from any other semiconductor foundry. The company got preferential pricing in return for the exclusivity. With GlobalFoundries discontinuing development of cutting-edge processes such as 7 nm and 5 nm, it makes sense for AMD to seek out other foundry partners, such as TSMC, and an amendment to the WSA was needed. With this amendment in place, AMD can go ahead and source 7 nm dies from TSMC without paying penalties to GlobalFoundries (GloFo).

With its "Zen 2" microarchitecture, AMD is going big on multi-chip modules, in which only those components that can tangibly benefit from the switch to the 7 nm node, namely the CPU cores, would be built on 7 nm dies, called "CPU chiplets," while components that don't need the miniaturization just yet, such as the processor's memory controller, PCIe root-complex, etc., will be built on separate dies called "I/O controllers." These dies will continue to be 14 nm, and likely supplied by GloFo. Final packaging of 7 nm CPU chiplets from TSMC, and 14 nm I/O controllers from GloFo, will happen at GloFo's facilities in China or Malaysia. AMD in its amendment committed to purchasing 14 nm and 12 nm chips from GloFo between 2019 and 2021, which means the MCM approach to processors is here to stay.

GLOBALFOUNDRIES Introduces Avera Semi

GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary dedicated to providing custom silicon solutions for a broad range of applications. Avera Semi will leverage deep ties with GF to deliver ASIC offerings on 14/12nm and more mature technologies while providing clients new capabilities and access to alternate foundry processes at 7nm and beyond.

Avera Semi is built upon an unrivaled legacy of ASIC expertise, tapping into a world-class team that has executed more than 2,000 complex designs in its 25-year history. With more than 850 employees, annual revenues in excess of $500 million, and over $3 billion in 14nm designs in execution, Avera Semi is well positioned to serve clients developing products across a wide range of markets, including wired and wireless networking, data centers and storage, artificial intelligence and machine learning, and aerospace and defense.

GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy

GLOBALFOUNDRIES and the Chengdu municipality signed an amendment to their investment and cooperation agreement today. Based on market condition changes, GF's recently announced renewed focus on differentiated offerings, and discussions with potential clients, the partners have decided to bypass the original phase one investment in mainstream process technology (180/130nm). It is also agreed that the project timeline will be adapted to better align capacity to meet China-based demand for differentiated offerings including GF's industry leading 22FDX technology.

With more than $2 billion of design wins and more than 50 client designs, GF's 22FDX technology is demonstrating traction as the industry's leading platform for power-optimized chips across a broad range of high-growth applications such as automotive, 5G connectivity and the Internet of Things (IoT). GF's Chinese clients are beginning to adopt the technology at GF's advanced manufacturing site in Dresden, Germany, including seven customers and more than nine products in various stages of manufacturing ramp.

"We have a long-term relationship with GF and the 22FDX with its low power is very suitable for our various products, including AI and security," said Min Li, CEO of Rockchip. "Once we achieve the right level of readiness, we look forward to ramping our production closer to home in China."

Analyst Firm Susquehanna: "Intel Lost its Manufacturing Leadership"

Intel was once the shining star in the semiconductor manufacturing industry, with a perfectly integrated, vertical product design and manufacturing scheme. Intel was one of the few companies in the world to be able to both develop its architectures and gear their manufacturing facilities to their design characteristics, ensuring a perfect marriage of design and manufacturing. However, not all is rosy on that field, as we've seen; AMD itself also was a fully integrated company, but decided to spin-off its manufacturing arm so as to survive - thus creating GLOBALFOUNDRIES.But Intel was seen as many as the leader in semiconductor manufacturing, always at the cutting edge of - well - Moore's Law, named after Intel's founding father Gordon Moore. Now, Mehdi Hosseini, an analyst with Susquehanna, has gone on to say that the blue giant has effectively lost its semiconductor leadership. And it has, in a way, even if its 10 nm (which is in development hell, so to speak) is technically more advanced than some 7 nm implementations waiting to be delivered to market by its competitors. However, there's one area where Intel will stop being able to claim leadership: manufacturing techniques involving EUV (Extreme UltraViolet).

AMD Fast-tracks 7nm "Navi" GPU to Late-2018 Alongside "Zen 2" CPU

AMD is unique in the world of computing as the only company with both high-performance CPU and GPU products. For the past several years we have been executing our multi-generational leadership product and architectural roadmap. Just in the last 18 months, we successfully introduced and ramped our strongest set of products in more than a decade and our business has grown dramatically as we gained market share across the PC, gaming and datacenter markets.

The industry is at a significant inflection point as the pace of Moore's Law slows while the demand for computing and graphics performance continues to grow. This trend is fueling significant shifts throughout the industry and creating new opportunities for companies that can successfully bring together architectural, packaging, system and software innovations with leading-edge process technologies. That is why at AMD we have invested heavily in our architecture and product roadmaps, while also making the strategic decision to bet big on the 7nm process node. While it is still too early to provide more details on the architectural and product advances we have in store with our next wave of products, it is the right time to provide more detail on the flexible foundry sourcing strategy we put in place several years ago.

AMD Chip Manufacturing to Lay Solely With TSMC On, After 7 nm - And Why It's not a Decision, but a Necessity

It's been a tumultuous few days for AMD, as the company has seen Jim Anderson, Computing and Graphics Group leader after the departure of Raja Koduri, leave the company, at a time of soaring share value for the company (hitting $25.26 and leaving short positions well, short, by $2.67 billion.) However, there's one particular piece of news that is most relevant for the company: Globalfoundries' announcement to stop all ongoing development on the 7 nm node.

This is particularly important for a variety of reasons. The most important one is this: Globalfoundries' inability to execute on the 7 nm node leaves AMD fully free to procure chips and technology from competing foundries. If you remember, AMD's spin-off of GlobalFoundries left the former with the short end of the stick, having to cater to GlobalFoundries' special pricing, and paying for the privilege of accessing other foundries' inventories. Of course, the Wafer Supply Agreement (WSA) that is in place will have to be amended - again - but the fact is this: AMD wants 7 nm products, and GlobalFoundries can't provide.
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GlobalFoundries Puts its 7 nm Program on Hold Indefinitely

GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

GF is realigning its leading-edge FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm FinFET program on hold indefinitely and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology

GLOBALFOUNDRIES today announced that the company's 22nm FD-SOI (22FDX ) technology has delivered more than two billion dollars of client design win revenue. With more than 50 total client designs, 22FDX is proving to be the industry's leading platform for power-optimized chips across a broad range of high-growth applications such as automotive, 5G connectivity and the Internet of Things (IoT).

For clients who need significant reductions in power and die size relative to a traditional bulk CMOS process, 22FDX offers the industry's lowest operating voltage, delivering up to 500MHz frequencies at only 0.4 volts. The technology also delivers efficient single-chip integration of RF, transceiver, baseband, processor, and power management components, providing an unparalleled combination of high performance RF and mmWave functionality with low-power, high density logic for devices that require long-lasting battery life, increased processing capability, and connectivity.

"At Synaptics, as we expand upon our industry-leading mobile and PC businesses to include delivering new and innovative products that address the booming IoT market, we require the best available technologies to enable us to deliver top-notch solutions including voice and multimedia processing capabilities for our customers," said Rick Bergman, President and CEO at Synaptics. "GF's 22FDX technology delivers a potent mix of low static and dynamic power along with excellent performance to give us a great platform for our world-class products."

Challenges With 7 nm, 5 nm EUV Technologies Could Lead to Delays In Process' TTM

Semiconductor manufacturers have been historically bullish when it comes to the introduction of new manufacturing technologies. Intel, AMD (and then Globalfoundries), TSMC, all are companies who thrive in investors' confidence: they want to paint the prettiest picture they can in terms of advancements and research leadership, because that's what attracts investment, and increased share value, and thus, increased funds to actually reach those optimistic goals.

However, we've seen in recent years how mighty Intel itself has fallen prey to unforeseen complications when it comes to advancements of its manufacturing processes, which saw us go from a "tick-tock" cadence of new architecture - new manufacturing process, to the introduction of 14 nm ++ processes. And as Intel, Globalfoundries and TSMC race towards sub 7-nm manufacturing processes with 250 mm wafers and EUV usage, things aren't getting as rosy as the ultraviolet moniker would make us believe.

GLOBALFOUNDRIES Appoints Industry Veteran Tom Caulfield as New CEO

After more than four years as chief executive officer of GLOBALFOUNDRIES, Sanjay Jha will hand over the company's top position to Dr. Thomas Caulfield, senior vice president and general manager and a highly-respected industry veteran.

Caulfield joined GF in 2014 following a successful career with an impressive track record of results spanning engineering, management, operational leadership and global executive experience with leading technology companies including 17 years at IBM in a variety of senior leadership roles. During his tenure at GF, he successfully built and ramped the company's new 14nm production facility in upstate New York, the most advanced foundry facility and one of the largest public-private partnerships in the United States.

Globalfoundries: 7 nm to Enable up to 2.7x Smaller Dies, 5 GHz CPUs

Globalfoundries' Chief Technical Officer, Gary Patton, talked about the future he believes can be possible in future manufacturing processes, calling for particular attention towards the next step in the ladder at 7 nm. Apparently, the 7 nm process at Globalfoundries has received a shot in the arm from the integration of ex IBM engineering specialists (remember that IBM practically paid Globalfoundries to take its manufacturing division of its hands), and the company now expects better than foreseen technical specs and achievements of its 7 nm process.

While a move from 14 nm to 7 nm was expected to provide, at the very best, a halving in the actual size of a chip manufactured in 7 nm compared to 14 nm, Gary Patton is now saying that the are should actually be reduced by up to 2.7 times the original size. To put that into perspective, AMD's 1000 series processors on the Zeppelin die and 14 nm process, which come in at 213 mm² for the full, 8-core design, could be brought down to just 80 mm² instead. AMD could potentially use up that extra die space to either build in some overprovisioning, should the process still be in its infancy and yields need a small boost; or cram it with double the amount of cores and other architectural improvements, and still have chips that are smaller than the original Zen dies.

AMD To Change Suppliers for Vega 20 GPUs on 7nm, HBM2 Packaging for Vega 11

AMD's RX Vega supply has seen exceedingly limited quantities available since launch. This has been due to a number of reasons, though the two foremost that have been reported are: increased demand from cryptocurrency miners, who are looking towards maximizing their single node hashrate density through Vega's promising mining capabilities; and yield issues with AMD's Vega 10 HBM2 packaging partner, Advanced Semiconductor Engineering (ASE). It's expected that chip yield for Vega 10 is also lower per se, due to it having a 484 mm² die, which is more prone to defects than a smaller one, thus reducing the amount of fully-enabled GPUs.

AMD's production partner, GlobalFoundries, has historically been at the center of considerations on AMD's yield problems. That GlobalFoundries is seemingly doing a good job with Ryzen may not be much to say: those chips have incredibly small die sizes (192 mm²) for their number of cores. It seems that Global Foundries only hits problems with increased die sizes and complexity (which is, unfortunately for AMD, where it matters most).

GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology

GLOBALFOUNDRIES today announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost to meet the needs of applications such as premium mobile processors, cloud servers and networking infrastructure. Design kits are available now, and the first customer products based on 7LP are expected to launch in the first half of 2018, with volume production ramping in the second half of 2018.

In September 2016, GF announced plans to develop its own 7nm FinFET technology leveraging the company's unmatched heritage of manufacturing high-performance chips. Thanks to additional improvements at both the transistor and process levels, the 7LP technology is exceeding initial performance targets and expected to deliver greater than 40 percent more processing power and twice the area scaling than the previous 14nm FinFET technology. The technology is now ready for customer designs at the company's leading-edge Fab 8 facility in Saratoga County, N.Y.

"Our 7nm FinFET technology development is on track and we are seeing strong customer traction, with multiple product tapeouts planned in 2018," said Gregg Bartlett, senior vice president of the CMOS Business Unit at GF. "And, while driving to commercialize 7nm, we are actively developing next-generation technologies at 5nm and beyond to ensure our customers have access to a world-class roadmap at the leading edge."

IBM Research Alliance Builds New Transistor for 5 nm Technology

IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips. The details of the process will be presented at the 2017 Symposia on VLSI Technology and Circuits conference in Kyoto, Japan. In less than two years since developing a 7 nm test node chip with 20 billion transistors, scientists have paved the way for 30 billion switches on a fingernail-sized chip.

The resulting increase in performance will help accelerate cognitive computing, the Internet of Things (IoT), and other data-intensive applications delivered in the cloud. The power savings could also mean that the batteries in smartphones and other mobile products could last two to three times longer than today's devices, before needing to be charged.

AMD to Continue Working With TSMC, GLOBALFOUNDRIES on 7 nm Ryzen

In the Q&A section of their 2017 Financial Analyst Day, AMD CEO Lisa Su answered an enquiry from a Deutsche-bank questioner regarding the company's aggressive 7 nm plan for their roadmap, on which AMD seems to be balancing its process shrinkage outlook for the foreseeable future. AMD will be developing their next Zen architecture revisions on 7 nm, alongside a push for 7 nm on their next-generation (or is that next-next generation?) Navi architecture. This means al of AMD's products, consumer, enterprise, and graphics, will be eventually built on this node. This is particularly interesting considering AMD's position with GLOBALFOUNDRIES, with which AMD has already had many amendments to their Wafer Supply Agreement, a remain of AMD's silicon production division spin-off, the latest of which runs from 2016 to 2020.

As it is, AMD has to pay GLOBALFOUNDRIES for its wafer orders that go to other silicon producers (in this case, TSMC), in a quarterly basis since the beginning of 2017, based on the volume of certain wafers purchased from another wafer foundry. In addition, AMD has annual wafer purchase targets from 2016 through the end of 2020, fixed wafer prices for 2016, and a framework for yearly wafer pricing in this amendment, so the company is still bleeding money to GLOBALFOUNDRIES. However, AMD is making the correct decision in this instance, I'd wager, considering GLOBALFOUNDRIES' known difficulties in delivering their process nodes absent of quirks.

GLOBALFOUNDRIES Cutting Staff Through Earlier Retirements

It would seem business is not as usual for GLOBALFOUNDRIES, which started as the spin-off from AMD's manufacturing arm way back on March 2, 2009. Blaming the capricious chip market's fluctuations, the company is looking to divest longtime employees in all three of its U.S. semiconductor manufacturing plants, including Essex Junction, which it acquired from IBM in 2015 by... receiving a $1.5 billion payment from the company. And as part of the deal, GLOBALFOUNDRIES agreed to be IBM's exclusive provider of semiconductor chips through 2025.

"We go through these ebbs and flows," Spokesman Jim Keller said Wednesday. "Right now we're at a point where some customers delayed their orders. We're in a period where we don't have as much business." The "voluntary separation" program is part of a larger cost cutting initiative that will look for other efficiency savings as well, though "layoffs are also a possibility". Keller would not say how many of GLOBALFOUNDRIES' 2,800 employees at Essex Junction are eligible for the early retirement program. Most of the workers eligible are in "support roles," such as administrative, sales or finance.

Rambus Introduces High Bandwidth Memory PHY on GlobalFoundries FX-14

Rambus Inc. today announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES high-performance FX-14 ASIC Platform. Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at networking and data center applications and designed for systems that require low latency and high bandwidth memory. This PHY is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, enabling a total bandwidth of 256 GB/s to meet the needs of today's most data-intensive tasks.

"Data center needs are continuously changing and we are at the forefront of delivering memory interface technology designed to meet today's most demanding workloads," said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces division. "Through our collaboration with GLOBALFOUNDRIES, we are delivering a comprehensive and robust solution for high-performance data center and networking applications. Our HBM offering will allow data center solution developers to bring high performance memory closer to the CPU, thus reducing latency and improving the system throughput."

AMD Reports Fourth Quarter and Annual 2016 Financial Results

AMD (NASDAQ: AMD) today announced revenue for the fourth quarter of 2016 of $1.11 billion, operating loss of $3 million and net loss of $51 million, or $0.06 per share. Non-GAAP(1) operating income was $26 million, non-GAAP(1) net loss was $8 million and non-GAAP(1) loss per share was $0.01.

"We met our strategic objectives in 2016, successfully executing our product roadmaps, regaining share in key markets, strengthening our financial foundation, and delivering annual revenue growth," said Dr. Lisa Su, AMD president and CEO. "As we enter 2017, we are well positioned and on-track to deliver our strongest set of high-performance computing and graphics products in more than a decade."

AMD's Q3 2016 Earnings Call - Revenue is Up, Debt is Down

AMD today released their earnings call for 3Q 2016, giving us some interesting tidbits in regards to their financial robustness. The balance of AMD's economics seems to be pending towards better execution, and, coeteris paribus, a much better outlook for the coming quarters, after the monumental missteps in the past that almost threw AMD under the proverbial bus. Reception for the results seems to be a tangled mess, however, with some sides claiming that AMD beat expectations, while others prefer to draw attention to AMD's 2% stock decline since the report was outed.

AMD posted revenue of $1,307 million, up 27% sequentially and 23% year-over-year. This revenue was distributed unevenly through AMD's divisions, though. "Computing and Graphics" segment revenue was $472 million, up 9% from Q2 2016, primarily due to increased GPU sales (where Polaris picked up the grunt of the work, being responsible for 50% of AMD's GPU revenue), offset by lower sales of client desktop processors and chipsets; whereas "Enterprise, Embedded and Semi-Custom" segment revenue was $835 million, up 41% sequentially, primarily due to record semi-custom SoC sales (such as those found in Microsoft's XBOX One and Sony's PS4 and upcoming PS4 Pro).

GLOBALFOUNDRIES Announces its 7 nm FinFET Technology

GLOBALFOUNDRIES today announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology that will offer the ultimate in performance for the next era of computing applications. This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

GLOBALFOUNDRIES' new 7nm FinFET technology is expected to deliver more than twice the logic density and a 30 percent performance boost compared to today's 16/14nm foundry FinFET offerings. The platform is based on an industry-standard FinFET transistor architecture and optical lithography, with EUV compatibility at key levels. This approach will accelerate the production ramp through significant re-use of tools and processes from the company's 14nm FinFET technology, which is currently in volume production at its Fab 8 campus in Saratoga County, N.Y. GLOBALFOUNDRIES plans to make an additional mutli-billion dollar investment in Fab 8 to enable development and production for 7nm FinFET.

"The industry is converging on 7nm FinFET as the next long-lived node, which represents a unique opportunity for GLOBALFOUNDRIES to compete at the leading edge," said GLOBALFOUNDRIES CEO Sanjay Jha. "We are well positioned to deliver a differentiated 7nm FinFET technology by tapping our years of experience manufacturing high-performance chips, the talent and know-how of our former IBM Microelectronics colleagues and the world-class R&D pipeline from our research alliance. No other foundry can match this legacy of manufacturing high-performance chips."

GlobalFoundries Announces its 12 nm FD-SOI Silicon Fabrication Node

GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry's first multi-node FD-SOI roadmap. Building on the success of its 22FDXTM offering, the company's next-generation 12FDXTM platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles.

As the world becomes more and more integrated through billions of connected devices, many emerging applications demand a new approach to semiconductor innovation. The chips that make these applications possible are evolving into mini-systems, with increased integration of intelligent components including wireless connectivity, non-volatile memory, and power management-all while driving ultra-low power consumption. GLOBALFOUNDRIES' new 12FDX technology is specifically architected to deliver these unprecedented levels of system integration, design flexibility, and power scaling.

AMD Announces Amendment to Wafer Supply Agreement With GLOBALFOUNDRIES

AMD announced that it has entered into a long-term amendment to its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. (GF) for the period from Jan. 1, 2016 to Dec. 31, 2020. "The five-year amendment further strengthens our strategic manufacturing relationship with GLOBALFOUNDRIES while providing AMD with increased flexibility to build our high-performance product roadmap with additional foundries in the 14 nm and 7 nm technology nodes," said Dr. Lisa Su, AMD president and CEO. "Our goal is for AMD to have continued access to leading-edge foundry process technologies enabling us to build multiple generations of great products for years to come."

GLOBALFOUNDRIES' Fab 8 in Malta, N.Y. is playing a significant role in providing leading-edge capacity for AMD's graphics and processor products, including the recently launched AMD Radeon Polaris GPUs and upcoming "Zen"-based processors.

GlobalFoundries to Skip 10 nm and Jump Straight to 7 nm

Silicon fabrication company GlobalFoundries is reportedly planning to skip development of the 10 nanometer (nm) process, and is aiming to jump straight to 7 nm. The company currently operates a 14 nm FinFET node. In 2015 the company acquired semiconductor manufacturing assets from IBM, and is using them to fast-track its development. When it's ready, the 7 nm node will offer both optical and EUV (extreme ultra-violet) lithography. Driving the EUV product is an IBM 3300 EUV fabricator at the company's advanced patterning center, in its Albany, New York fab.
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