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AMD's RX Vega to Feature 4 GB and 8 GB Memory

It looks like AMD is confident enough on its HBC (High-Bandwidth Cache) and HBCC (High-Bandwidth Cache Controller) technology, and other assorted improvements to overall Vega memory management, to consider 4 GB as enough memory for high-performance gaming and applications. On a Beijing tech summit, AMD announced that its RX Vega cards (the highest performers in their next generation product stack, which features rebrands of their RX 400 line series of cards to th new RX 500) will come in at 4 GB and 8 GB HBM 2 (512 GB/s) memory amounts. The HBCC looks to ensure that we don't see a repeat of AMD's Fury X video card, which featured first generation HBM (High-Bandwidth memory), at the time limited to 4 GB stacks. But lacking extensive memory management improvements meant that the Fury X sometimes struggled on memory-heavy workloads.

If the company's Vega architecture deep dive is anything to go by, they may be right: remember that AMD put out a graph showing how the memory allocation is almost twice as big as the actual amount of memory used - and its here, with smarter, improved memory management and allocation, that AMD is looking to make do with only 4 GB of video memory (which is still more than enough for most games, mind you). This could be a turn of the screw moment for all that "more is always better" philosophy.

AMD's Radeon Pro Duo Deeply Discounted on Expected Vega Onslaught

Inventory clearing is as much a part of business as breathing is part of life; as such, various retailers have apparently started to offer deep, deep discounts on AMD's past technology in the form of their Radeon Pro Duo - the once and still king of the hill in the red camp, where performance and technology is concerned.

But as the "out with the old, in with the new" adage still stands, retailers are now clearing inventory of their Radeon Pro Duo graphics cards, sometimes offering almost 50% off from the original launch price of $1499. Newegg, for example, has the card for $799 on both their North American and Asia Pacific online stores.

Third-Generation HBM Could Enable Graphics Cards with 64GB Memory

One of the first drafts of the HBM3 specification reveals that the standard could enable graphics cards with up to 64 GB of video memory. The HBM2 memory, which is yet to make its consumer graphics debut, caps out at 32 GB, and the first-generation HBM, which released with the AMD Radeon Fury series, at just 4 GB.

What's more, HBM3 doubles bandwidth over HBM2, pushing up to 512 GB/s per stack. A 4096-bit HBM3 equipped GPU could have up to 2 TB/s (yes, terabytes per second) of memory bandwidth at its disposal. SK Hynix, one of the key proponents of the HBM standard, even claims that HBM3 will be both more energy-efficient and cost-effective than existing memory standards, for the performance on offer. Some of the first HBM3 implementations could come from the HPC industry, with consumer implementations including game consoles, graphics cards, TVs, etc., following later.

Source: TweakTown

AMD Provides Sneak Peek of Full Line of Radeon RX Series GPUs at E3

Today at Electronic Entertainment Expo (E3) AMD (NASDAQ: AMD) CEO Lisa Su delivered a pre-launch showcase of the full line of forthcoming Radeon RX Series graphics cards set to transform PC gaming this summer by delivering enthusiast class performance and features for gamers at mainstream price points. AMD previously showcased the Radeon RX 480 graphics card, designed for incredibly smooth AAA gaming at 1440p resolution and set to be the most affordable solution for premium VR experiences starting at just $199 SEP for the 4GB version. Joining the Radeon RX family are the newly announced Radeon RX 470 graphics card delivering refined, power-efficient HD gaming, and the Radeon RX 460, a cool and efficient solution for the ultimate e-sports gaming experience.

AMD's GPU Roadmap for 2016-18 Detailed

AMD finalized the GPU architecture roadmap running between 2016 and 2018. The company first detailed this at its Capsaicin Event in mid-March 2016. It sees the company's upcoming "Polaris" architecture, while making major architectural leaps over the current-generation, such as a 2.5-times performance/Watt uplift and driving the company's first 14 nanometer GPUs; being limited in its high-end graphics space presence. Polaris is rumored to drive graphics for Sony's upcoming 4K Ultra HD PlayStation, and as discrete GPUs, it will feature in only two chips - Polaris 10 "Ellesmere" and Polaris 11 "Baffin."

"Polaris" introduces several new features, such as HVEC (h.265) decode and encode hardware-acceleration, new display output standards such as DisplayPort 1.3 and HDMI 2.0; however, since neither Polaris 10 nor Polaris 11 are really "big" enthusiast chips that succeed the current "Fiji" silicon, will likely make do with current GDDR5/GDDR5X memory standards. That's not to say that Polaris 10 won't disrupt current performance-thru-enthusiast lineups, or even have the chops to take on NVIDIA's GP104. First-generation HBM limits the total memory amount to 4 GB over a 4096-bit path. Enthusiasts will have to wait until early-2017 for the introduction of the big-chip that succeeds "Fiji," which will not only leverage HBM2 to serve up vast amounts of super-fast memory; but also feature a slight architectural uplift. 2018 will see the introduction of its successor, codenamed "Navi," which features an even faster memory interface.

Source: VideoCardz

AMD FirePro S9300 x2 Server GPU Helps Create Largest Map of the Universe

AMD today announced that researchers at the Canadian Hydrogen Intensity Mapping Experiment (CHIME) will harness the AMD FirePro S9300 x2 Server GPU, the world's fastest single-precision GPU accelerator, to analyze extraordinary amounts of data to help create a new, very detailed 3D map of the largest volume of the Universe ever observed. Rather than using traditional dish-shaped telescopes, CHIME consists of four 100-metre-long cylindrical reflectors which cover an area larger than five professional hockey rinks and gathers signals for the critical computational analyses supplied by the AMD FirePro S9300 x2 GPU cluster.

The CHIME project was created to investigate the discovery that the expansion of the Universe is speeding up rather than slowing down. Using consumer technologies similar to those found in common radio receivers, the telescope collects radio waves that have travelled through space for up to 11 billion years and feeds them into a massive supercomputer powered by a series of AMD FirePro S9300 x2 GPUs. The intense number crunching required to map the Universe's expansion in this way was previously cost-prohibitive, but is now being enabled by AMD FirePro GPUs. The anticipated results will help create a highly-detailed map showing the intensity of the hydrogen radiation from billions of galaxies, which will help scientists understand the accelerating expansion of the Universe.

AMD Unveils the Radeon Pro Duo Graphics Card

AMD unveiled its latest flagship graphics card, the Radeon Pro Duo. The card is designed for "creators who game, and gamers who create," as the tagline goes. It is a dual-GPU graphics card based on a pair of 28 nm "Fiji" chips, the same ones which drive the R9 Fury X and the R9 Nano. AMD is positioning this card in the gray-area between consumer graphics cards, and FirePro workstation products, as a new "workstation-class" product. Perhaps this allows the company to get away with things such as three 8-pin PCIe power connectors.

The Radeon Pro Duo features two "Fiji" GPUs in their maximum core configuration - 4,096 stream processors, 256 TMUs, and 64 ROPs, each; with 4 GB of HBM memory, each. The card hence packs a total of 8 GB HBM memory, and 16 TFLOP/s total single-precision floating-point performance. The card features a liquid-cooling solution designed by Cooler Master, with a thick 120 mm x 120 mm radiator that's similar to the one that ships with the R9 Fury X. The card's display output configuration is similar to the R9 Fury X, too, with three DisplayPort 1.2a and one HDMI 1.4a connectors. AMD is going ahead and claiming the title of "World's Fastest Graphics Card." The Radeon R9 Pro Duo is expected to be priced at US $1,499.

SK Hynix to Ship 4GB HBM2 Stacks by Q3-2016

Korean DRAM and NAND flash giant SK Hynix will be ready to ship its 4 GB stacked second generation high-bandwidth memory (HBM2) chips from Q3, 2016. These packages will be made up of four 1 GB dies, with a bandwidth-per-pin of 1 Gbps, 1.6 Gbps, and 2 Gbps, working out to per-stack bandwidths of 128 GB/s, 204 GB/s, and 256 GB/s, respectively.

These chips will target applications such as graphics cards, network infrastructure, HPC, and servers. The company is also designing 8 GB stacks, made up of eight 1 GB dies. These stacks will be targeted at HPC and server applications. The company is also offering cost-effective 2 GB, 2-die stacks, for graphics cards. The cost-effective 2 GB, 2-die stacks could prove particularly important for the standard's competition against GDDR5X, particularly in mid-range and performance-segment graphics cards.

Source: Golem.de

JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution's success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235A is available for free download from the JEDEC website.

JESD235A leverages Wide I/O and TSV technologies to support up to 8 GB per device at speeds up to 256 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard supports 2-high, 4-high and 8-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB - 8 GB per stack.

Sapphire Unveils TriXX with "Fiji" Voltage Control and HBM Overclocking

Sapphire announced its latest version of the TriXX overclocking utility, which it bundles with its graphics cards. Version 5.2.1 is one of the first pieces of software to support voltage control on AMD "Fiji" GPU graphics cards (R9 Fury, R9 Fury X, and R9 Nano), and HBM overclocking. The utility comes with a new "dashboard" themed user interface that gives you an analog readout of your card's main sensors - clocks, voltage, and temperatures; and a simpler layout. In addition, it also supports voltage control on other Radeon R9 300 series GPUs.
DOWNLOAD: Sapphire TriXX 5.2.1

AMD "Fiji" GPU Die-shot Revealed by Chipworks

VLSI technical publication Chipworks posted the first clear die-shot of AMD's "Fiji" silicon, revealing intricate details of the most technically advanced GPU. What makes Fiji the most advanced graphics chip is its silicon interposer and stacked HBM chips making up a multi-chip module. It's the die in the center of all that, which went under Chipworks' microscope.

The die-shot reveals a component layout that's more or less an upscale of "Tonga." Some of the components, such as the front-end appear to be entirely identical to "Tahiti" or "Tonga." The shot reveals the 64 GCN compute units arranged in four rows, on either side of the central portion with the dispatch and primitive setup pipelines. The pad-area of the on-die memory controllers appear to be less than the large memory I/O pads that made up the 384-bit interface of "Tahiti." The first picture below is the die-shot of "Fiji," followed by a color-coded die-shot of "Tahiti."
Sources: 3DCenter.org, ChipWorks

AMD Radeon R9 Nano Core Configuration Detailed

AMD's upcoming mini-ITX friendly graphics card, the Radeon R9 Nano, which boasts of a typical board power of just 175W, is not a heavily stripped-down R9 Fury X, as was expected. The card will feature the full complement of GCN compute units physically present on the "Fiji" silicon, and in terms of specifications, is better loaded than even the R9 Fury. Specifications sheet of the R9 Nano leaked to the web, revealing that the card will feature all 4,096 stream processors physically present on the chip, along with 256 TMUs, and 64 ROPs. It will feature 4 GB of memory across the chip's 4096-bit HBM interface.

In terms of clock speeds, the R9 Nano isn't too far behind the R9 Fury X on paper - its core is clocked up to 1000 MHz, with its memory ticking at 500 MHz (512 GB/s). So how does it get down to 175W typical board power, from the 275W of the R9 Fury X? It's theorized that AMD could be using an aggressive power/temperature based clock-speed throttle. The resulting performance is 5-10% higher than the Radeon R9 290X, while never breaching a power target. Korean tech blog DGLee posted pictures of an R9 Nano taken apart. Its PCB is smaller than even that of the R9 Fury X, and makes do with a slimmer 4+2 phase VRM, than the 6+2 phase VRM found on the R9 Fury X.
Sources: VideoCardz, IYD.kr

AMD Showcases Graphics, Energy Efficient Computing and Die-Stacking Innovation

Top technologists from AMD are detailing the engineering accomplishments behind the performance and energy efficiency of the new high-performance Accelerated Processing Unit (APU), codenamed "Carrizo," and the new AMD Radeon R9 Fury family of GPUs, codenamed "Fiji," at the prestigious annual Hot Chips symposium starting today. The presentations will focus on new details of the high-definition video and graphics processing engines on the 6th Generation AMD A-Series APU ("Carrizo"), and the eight year journey leading to die-stacking technology and all-new memory architecture included on the latest top-of-the-line AMD Radeon Fury Series GPUs ("Fiji") for 4K gaming and VR. Using a true System-on-Chip (SoC) design, 6th Generation AMD A-Series processors are designed to reduce the power consumed by the x86 cores alone by 40 percent, while providing substantial gains in CPU, graphics, and multimedia performance versus the prior generation APU. The new AMD Radeon R9 Fury X GPU achieves up to 1.5x the performance-per-watt of the previous high-end GPU from AMD.

"With our new generation of APU and GPU technology, our engineering teams left no stone unturned for performance and energy efficiency," said Mark Papermaster, chief technology officer at AMD. "Using innovative design for our APUs, we've vastly increased the number of transistors on-chip to increase functionality and performance, implemented advanced power management, and completed the hardware implementation of Heterogeneous System Architecture. For our latest GPUs, AMD is the first to introduce breakthrough technology in the form of die-stacking and High-Bandwidth Memory. The results are great products with very large generational performance-per-watt gains."

EK Radeon R9 Fury X Water Blocks Now Available

EK Water Blocks, Ljubljana based premium computer liquid cooling gear manufacturer, is excited to launch the true single-slot liquid cooling solution for AMD Radeon reference design R9 FURY X graphics card. EK-FC R9 Fury X directly cools the GPU, HBM as well as VRM (voltage regulation module) as water flows directly over these critical areas, thus allowing the graphics card and it's VRM to remain stable under high overclocks.

EK-FC R9 Fury X water block features EK unique central inlet split-flow cooling engine design for best possible cooling performance. Such system also works flawlessly with the reversed water flow without adversely affecting the cooling performance. Moreover, such design offers great hydraulic performance, allowing this product to be used in liquid cooling systems using weaker water pumps. Unlike the original AIO cooling solution that comes with AMD Radeon R9 FURY X and takes up two slots, EK-FC R9 Fury X water block will transform the FURY X into a single-slot graphics card.

Sapphire Radeon R9 Fury Pictured, Specs Confirmed

Here are some of the first pictures of Sapphire's custom-design Radeon R9 Fury graphics card. The card features a triple-slot (or 2.2-slot) Tri-X cooling solution. Its PCB appears to be AMD reference-design (identical in design to the R9 Fury X), but cooled by a long triple-fan dual-stack heatsink, with over one-third of it being overhung. Quite a few GTX 970, GTX 670, and GTX 760 cards are known to have similar overhangs of coolers that are longer than the PCB.

The pics also come with leaked specs-sheets, which confirm its core configuration of 56 out of 64 compute units being enabled, yielding 3,584 stream processors; while leaving the 4 GB 4096-bit HBM memory untouched. The core clock speed is lower, at 1000 MHz, while the memory clock is left untouched at 500 MHz, compared to the R9 Fury X. Sapphire is also selling a factory-overclocked card with 1040 MHz core. The Radeon R9 Fury is expected to launch in mid-July (next week).

Source: VideoCardz

AMD Radeon R9 Fury Specifications Leaked

AMD's second graphics card based on its 28 nm "Fiji" silicon, the Radeon R9 Fury, will be an important SKU for the company. Ahead of its rumored mid-July launch, TweakTown got a whiff of its specifications from its sources. According to them, AMD will create the R9 Fury by enabling 56 of the 64 compute units on the silicon, yielding 3,584 stream processors. This sets the TMU count at 224. We doubt AMD will tinker with the render back-ends, and so the ROP count could remain at 64. The memory configuration could remain untouched, at 4 GB of 4096-bit HBM.

The clocks speeds on the R9 Fury will be the same as the R9 Fury X, at 1050 MHz core, and 500 MHz (512 GB/s) memory. One should expect temperatures of the R9 Fury to be higher, since it's being designed for air-cooled cards, although it's not expected to cross 75°C in typical gaming scenarios. Looking at the 12.5% drop in stream processors, one could expect the performance gap between the two Fury SKUs to be around 10-12%. This makes the R9 Fury a competitor to NVIDIA's GeForce GTX 980, if it's priced in its neighborhood (± $50).

Source: TweakTown

Micron Begins Shipping its First 20 nm-class GDDR5 DRAM Chips

Micron Technology announced during its Q3 FY-2015 earnings call, that it began shipping GDDR5 memory chips based on its 20 nm-class node. The company is reportedly shipping 8 Gb (1 gigabyte) GDDR5 memory chips. The company was last reported to be acquiring Japanese DRAM major Elpida, which also supplies GDDR5 chips to graphics cards, notebooks, and game console makers. The GDDR5 memory space has been saturated by companies such as Samsung and SK Hynix. The memory standard itself is on the brink of becoming obsolete; with AMD implementing HBM on its new high-end GPU, and NVIDIA expected to implement HBM with its upcoming "Pascal" GPU family. There is still quite a few GDDR5-equipped graphics cards to be sold, before HBM takes over GPUs of all market segments.

Source: Kitguru

GIGABYTE Announces its Radeon R9 Fury X Graphics Card

GIGABYTE announced availability of its AMD Radeon R9 Fury X graphics card. Based entirely on AMD's reference design, the card features reference clocks of 1050 MHz core, and 500 MHz (512 GB/s) HBM clocks. Since the card lacks DVI connectors, GIGABYTE is including a DP-DVI adapter in its package. Based on the 28 nm "Fiji" silicon, the R9 Fury X offers 4,096 stream processors, 256 TMUs, 64 ROPs, and a 4096-bit wide HBM interface, holding 4 GB of memory. The compact card is cooled by a factory-fitted closed-loop liquid cooling solution. The card is generally available at US $649.99.

MSI Unleashes the Radeon R9 Fury X Graphics Card

As the world's No.1 in GAMING graphics cards, MSI is pleased to announce the availability of the revolutionary AMD Radeon R9 Fury X. With the MSI R9 Fury X 4G, MSI adds a new high-end graphics card to its recently introduced and already heavily awarded AMD R9 and R7 300 series range. The MSI R9 Fury X 4G is equipped with 4GB of the groundbreaking High Bandwidth Memory, which is engineered directly onto AMD's Fiji XT GPU for unprecedented performance. The AMD Fury X is built for the future of ultra-high resolution gaming and Virtual Reality, which is available for enthusiasts to explore.

The card is housed in a much smaller form factor than we are used to from a top-level graphics card, which means that it fits into nearly any case. It is cooled by a closed loop liquid cooling solution which is included in the box which keeps the GPU around 50 degree Celsius during typical gaming sessions. The radiator can be mounted on the inside of the case to blow the heat directly outwards, it uses a single high quality 120mm fan for quiet performance.

VisionTek Announces Radeon R9 Fury X, Alongside R9 300 and R7 300 Series

VisionTek Products LLC, a leading manufacturer of award-winning, high-performance upgrades and accessories for PCs and Macs, today announced the Radeon Fury X, alongside five other new Radeon R9 300 and R7 300 graphics cards designed with Advance Micro Devices (AMD) GPUs. The new VisionTek Radeon graphics cards will feature a new extreme look and are available starting June 24th, 2015.

The VisionTek Radeon Fury X opens a whole new dimension of gaming, for an unbelievable alternate reality. It is the world's first graphics card with AMD-pioneered High Bandwidth Memory (HBM) integrated on-chip, delivering 60% more memory bandwidth over GDDR5. The VisionTek Radeon R9 Fury X features black-nickel aluminum exoskeleton, maintenance-free AIO closed-loop liquid cooling, GPU Tach activity indicator, and red LED "RADEON" illumination along the spine of this wicked beast. The compact 7.5-inch card packs a performance punch, leading the way to create small and powerful PCs by condensing the HBM memory into 94% less space than GDDR5. The VisionTek Fury X was built to enable the next generation of 4K and VR gaming. With this card, PC users won't just upgrade, they will revolutionize.

PowerColor Announces its Radeon R9 Fury X Graphics Card

TUL Corporation, a leading and innovative manufacturer of AMD graphic cards since 1997, has released a new graphics card with the High Bandwidth Memory (HBM) from AMD's latest invention. HBM is a new type of memory chip with low power consumption, ultra-wide communication lanes, and a revolutionary new stacked configuration. HBM's vertical stacking and fast information transfer open the door for truly exciting performance in innovative form factors, not to mention that GPU applications are just the start - look for HBM's superior power efficiency and space savings to spark industry-wide innovation. PowerColor R9 Fury X easily handles the most graphically intense games today due to its advanced and innovative GPU to ever create for the beloved PC gaming community. This power comes from AMD-pioneered High Bandwidth Memory (HBM) integrated on-chip that delivers more than 3 times the bandwidth per watt than GDDR5 along with a 4096-bit memory interface for incredible new advances in power and efficiency.

Spiff-up your gaming rig with sleek, envy-inducing design and make a powerful statement. It is packed with unique features, such as industrial styling including black-nickel aluminum exoskeleton and soft-touch aluminum plates, maintenance-free closed-loop liquid cooling, premium 120mm fan, GPU Tach activity indicator, and LED illumination highlight designs that details for that finished luxurious look. Pack that all in a slim and compact 7.5-inch card and you have yourself a stylish yet powerful graphics processing power that you can hold with your hands.

Club3D Announces its Radeon R9 Fury X Graphics Card

The future starts today. Get ready for a giant leap forward when it comes to the pinnacle of GPU engineering. Get ready for the revolutionary Club 3D Radeon R9 Fury X. The world's first graphics card featuring AMD-pioneered High Bandwidth Memory (HBM) for extreme performance in the highest resolutions. Benefit from an improved Graphics Core Next architecture, more advanced PowerTune management, improved connection flexibility enabling a 6K gaming setup with multiple monitors and a world class, whisper quiet Closed Loop Liquid Cooling Solution. The Club 3D Radeon R9 Fury X is the fastest GPU in the world and it's here to take your gaming performance to a completely new dimension.

Take the lead with the awesome gaming power of the most advanced and innovative GPU ever created for PC gaming. The Club 3D Radeon R9 Fury X is the world's first graphics card to feature AMD-pioneered High Bandwidth Memory (HBM) integrated on-chip, delivering 60% more memory bandwidth over GDDR5 memory. With 4K Stream Processors, 4K MB High Bandwidth Memory, 4K Bit memory interface aimed at providing the best 4K gaming experience, Fury X marks the beginning of a new era in PC Gaming.

AMD Officially Launches the Radeon R9 Fury X Graphics Card

AMD officially launched its latest flagship graphics card, the Radeon R9 Fury X. Designed to compete with NVIDIA's high-end products, including the GTX TITAN X, and the recently launched GTX 980 Ti, this card implements a breakthrough new memory design, with HBM (high bandwidth memory), silicon interposer, and the memory being relocated to the GPU package, to reduce the chip's overall PCB footprint, allowing for an extremely compact main PCB.

The Radeon R9 Fury X comes with a factory-fitted liquid cooling solution, much like the R9 295X2, which promises gaming temperatures in the in the fifties (°C), and load noise output of 32 dB. Based on the new 28 nm "Fiji" silicon, the R9 Fury X offers 4,096 stream processors, 256 TMUs, 64 ROPs, and a 4096-bit wide HBM interface, holding 4 GB of standard memory amount, with a staggering 512 GB/s of memory bandwidth. The core is clocked at 1050 MHz, and the memory at 500 MHz. The card has the same typical board power figure as the R9 290X, at 275W, despite a 40 percent increase in number crunching muscle. Available now in some parts of the world, the card will be widely available in the following few weeks, priced at US $649.99.

Read the TechPowerUp Review of the R9 Fury X right here.

AMD "Fiji" Block Diagram Revealed, Runs Cool and Quiet

AMD's upcoming flagship GPU silicon, codenamed "Fiji," which is breaking ground on new technologies, such as HBM, memory-on-package, a specialized substrate layer that connects the GPU with it, called Interposer; features a hefty feature-set. More on the "Fiji" package and its memory implementation, in our older article. Its block diagram (manufacturer-drawn graphic showing the GPU's component hierarchy), reveals a scaling up, of the company's high-end GPU launches over the past few years.

"Fiji" retains the quad Shader Engine layout of "Hawaii," but packs 16 GCN Compute Units (CUs), per Shader Engine (compared to 11 CUs per engine on Hawaii). This works out to a stream processor count of 4,096. Fiji is expected to feature a newer version of the Graphics CoreNext architecture than "Hawaii." The TMU count is proportionately increased, to 256 (compared to 176 on "Hawaii"). AMD doesn't appear to have increased the ROP count, which is still at 64. The most significant change, however, is its 4096-bit HBM memory interface, compared to 512-bit GDDR5 on "Hawaii."

AMD Announces Five New Products Based on the Fiji Silicon

AMD announced no less than five new products based on its swanky new 28 nm "Fiji" silicon, the company's most powerful GPU, packing over 8 TFLOP/s of raw compute power, and the first GPU to feature stacked HBM (high-bandwidth memory), moved to the GPU package, and communicating with the GPU die over a special silicon substrate called the interposer. The "Fiji" silicon will enable AMD to target NVIDIA's entire high-end GPU lineup.

The first product is Project Quantum. This is a console-sized SFF gaming desktop designed by AMD, which will be sold by the company's add-in board partners. Despite its diminutive size, the desktop packs two "Fiji" GPUs in AMD CrossFireX, and an AMD 64-bit x86 machine driving the rest. All main components (the CPU, the chipset, and the two GPUs), are liquid-cooled. This desktop will enable smooth 4K/5K gaming in the living room.
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