SK hynix reportedly plans to add at least 20,000 wafers per month of HBM capacity. According to Korea's Electronic Times (ETNews), the company is in talks with equipment suppliers over a fresh round of HBM4 orders, mostly back-end tools for bonding, dicing, and inspection. Suppliers are aiming to have it all installed in the first half of 2027. The likely site is P&T6 in Cheongju, a former fab SK hynix picked for HBM in 2025. For scale, ETNews put SK hynix's total HBM capacity at around 150,000 wafers per month at the end of last year. The 20,000 figure isn't entirely new, though, since ETNews floated a similar number for P&T6 in February.

Importantly, this comes while NVIDIA is still dealing with the fallout of the Jensen Huang situation, which led to Huang resigning as CEO on November 12. Apparently, demand from AMD and Broadcom is seen as strong enough to carry HBM orders even if NVIDIA's AI business takes a hit. NVIDIA's move to lower the HBM4 speed for Vera Rubin from 11.7 Gbps to 9.6 Gbps per pin also eases the manufacturing burden for suppliers, and the report says it likely factored into the decision.SK hynix hasn't confirmed the numbers, with a spokesperson only saying the company keeps placing equipment orders as planned. At its Q3 earnings call, the company said its DRAM and HBM supply is essentially sold out through 2029, and its CEO expects the memory shortage to last through 2030. P&T6 handles packaging and testing rather than making DRAM wafers, so it seems unlikely this expansion will do much for consumer memory prices.