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NVIDIA Faces Challenges: Qualcomm, Google, and Microsoft Protest Arm Acquisition

In September of last year, NVIDIA has officially announced that the current industry rumor about its big acquisition was true. The company has announced that it is acquiring Arm Limited from the Softbank Group. Paying as much as $40 billion for the purchase, NVIDIA is gaining access to the complete company, along with its extensive portfolio of IP and knowledge. That means that NVIDIA is not essentially a holder of the Arm ISA, which is the most dominant ISA within mobile processors. Such a deal, however, is a bit hard to process without some troubles popping up along the way. As Arm held a neutral position as IP provider, NVIDIA is expected to remain as such, and the company even promised to stay true to that.

However, not everything is going as planned. Before completing the acquisition process, NVIDIA must first comply with regulators from all around the world, including the US, UK, EU, and China. If any objections raise within those regions, they are to be interrogated. Today, Google, Microsoft, and Qualcomm have objected that NVIDIA's Arm acquisition is hurting the market and are urging antitrust officials to intervene. Mentioned companies believe that NVIDIA's move is hurting the market and the company could limit its competitors from accessing the IP, thus breaking Arm's neutral position as an IP provider. NVIDIA has made statements that Arm will remain in such a position, however, the skepticism of the mentioned companies is slowing the merger. Now all that remains is to see how the conflicted companies solve their worries.

Valve Ordered to Pay 4 Million USD in Damages to Corsair over Steam Controller Patent Infringement

Valve has recently been ordered to pay 4 million USD in damages after they knowingly infringed on patents owned by Ironburg Inventions with the Steam Controller rear grip button design. Ironburg Inventions is the IP-holding arm of controller manufacturer SCUF who was acquired by Corsair in late 2019. Valve was warned by Ironburg Inventions in 2014 that their Steam Controller infringed on their patent relating to rear-side control surfaces. Valve ignored the warning and went on to produce 1.6 million units before discontinuing the device in 2019. The Jury awarded Ironburg Inventions 4 million USD in damages and found that Valve willfully infringed on Ironberg's patents which opens them up to further litigation. Corsair has published a statement on the case which can be found below.

AMD Talks Zen 4 and RDNA 3, Promises to Offer Extremely Competitive Products

AMD is always in development mode and just when they launch a new product, the company is always gearing up for the next-generation of devices. Just a few months ago, back in November, AMD has launched its Zen 3 core, and today we get to hear about the next steps that the company is taking to stay competitive and grow its product portfolio. In the AnandTech interview with Dr. Lisa Su, and The Street interview with Rick Bergman, the EVP of AMD's Computing and Graphics Business Group, we have gathered information about AMD's plans for Zen 4 core development and RDNA 3 performance target.

Starting with Zen 4, AMD plans to migrate to the AM5 platform, bringing the new DDR5 and USB 4.0 protocols. The current aim of Zen 4 is to be extremely competitive among competing products and to bring many IPC improvements. Just like Zen 3 used many small advances in cache structures, branch prediction, and pipelines, Zen 4 is aiming to achieve a similar thing with its debut. The state of x86 architecture offers little room for improvement, however, when the advancement is done in many places it adds up quite well, as we could see with 19% IPC improvement of Zen 3 over the previous generation Zen 2 core. As the new core will use TSMC's advanced 5 nm process, there is a possibility to have even more cores found inside CCX/CCD complexes. We are expecting to see Zen 4 sometime close to the end of 2021.

Samsung x AMD: South Korean Giant Announces RDNA Integration in Next-Gen Exynos

Samsung today at its Exynos 2100 launch event announced that its labor with AMD to integrate the company's RDNA graphics architecture onto Exynos chips has born fruit. It's unclear today on which set of technology this integration is bound to - whether RDNA, RDNA 2, or a combination of both - and actual products will only hit shelves by the end of 2021 and beginning of 2022.

Samsung has announced that the design-in for AMD's RDNA platform into the company's flagship Exynos products for the 2021-2022 timeframe have been successful, and that the first iteration of the design will see the light of day on the upcoming Exynos 2100. The collaboration has reportedly resulted in very good performance values obtained from their IP merger in May 2020. It seems we have a few months to look towards to before we see a Galaxy phone with an RDNA-powered engraving, though.

AMD Expands Senior Leadership Team

AMD today announced several senior leadership promotions in support of the company's long-term growth goals. "Our high-performance products and long-term roadmaps have placed AMD on a significant growth trajectory," said Dr. Lisa Su, AMD president and CEO. "Aligning and expanding our senior leadership team around our highest-priority growth opportunities will continue the momentum we have built across our business in 2021 and beyond."
AMD announced two executive vice president promotions:
  • Darren Grasby to executive vice president and Chief Sales Officer, responsible for driving adoption of AMD products and delivering a world-class customer experience.
  • Devinder Kumar to executive vice president and Chief Financial Officer, responsible for continued strengthening of the company's financial profile.

Hedge Fund Urges Intel to Outsource Chip Production: Reuters

Intel is familiar with chip manufacturing problems since the company started the development of a 10 nm silicon semiconductor node. The latest node is coming years late with many IPs getting held back thanks to the inability of the company to produce it. All of Intel's chip production was historically happening at Intel's facilities, however, given the fact that the demand for 14 nm products is exceeding production capability, the company was forced to turn to external foundries like TSMC to compensate for its lack of capacity. TSMC has a contract with Intel to produce silicon for things like chipsets, which is offloading a lot of capacity for the company. Today, thanks to the exclusive information obtained by Reuters, we have information that a certain New York hedge fund, Third Point LLC, is advising the company about the future of its manufacturing.

The hedge fund is reportedly accounting for about one billion USD worth of assets in Intel, thus making it a huge and one influencing shareholder. The Third Point Chief Executive Daniel Loeb wrote a letter to Intel Chairman Omar Ishrak to take immediate action to boost the company's state as a major provider of processors for PCs and data centers. The company has noted that Intel needs to outsource more of its chip production to satisfy the market needs, so it can stay competitive with the industry. The poor performance of Intel has reflected on the company shares, which have declined about 21% this year. This has awoken the shareholders and now we see that they are demanding more aggressiveness from the company and a plan to outsource more of the chip production to partner foundries like TSMC and Samsung. It remains to be seen how Intel responds and what changes are to take place.

Tachyum Prodigy Software Emulation Systems Now Available for Pre-Order

Tachyum Inc. today announced that it is signing early adopter customers for the software emulation system for its Prodigy Universal Processor, customers may begin the process of native software development (i.e. using Prodigy Instruction Set Architecture) and porting applications to run on Prodigy. Prodigy software emulation systems will be available at the end of January 2021.

Customers and partners can use Prodigy's software emulation for evaluation, development and debug, and with it, they can begin to transition existing applications that demand high performance and low power to run optimally on Prodigy processors. Pre-built systems include a Prodigy emulator, native Linux, toolchains, compilers, user mode applications, x86, ARM and RISC-V emulators. Software updates will be issued as needed.

QNAP Launches the QGD-3014-16PT Desktop Smart Edge PoE Switch

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today announced the desktop smart edge PoE Switch - QGD-3014-16PT. With sixteen 30-watt Gigabit PoE ports, two 2.5GbE host management ports, Intel Celeron J4125 quad-core 2.0 GHz processor, and four 3.5-inch SATA drive bays, the QGD-3014-16PT supports QVR Pro, HBS 3 and QuWAN SD-WAN to integrate surveillance deployment, video storage computing, and multi-site remote management to offer SMBs innovative intelligent IP surveillance infrastructure and remote backup solutions.
"Expanding multi-site surveillance networks can be costly and involve large amounts of equipment with low transmission efficiency between multiple remote devices - not to mention the complexities involved in deployment and management. " said Daniel Hsieh, QNAP Product Manager, adding, "the QGD-3014-16PT desktop Smart Edge PoE Switch integrates PoE, surveillance capabilities, and data backup management to simplify these requirements and increase the transmission and backup efficiency of surveillance videos."

AWS and Arm Demonstrate Production-Scale Electronic Design Automation in the Cloud

Today, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company, announced that Arm, a global leader in semiconductor design and silicon intellectual property development and licensing, will leverage AWS for its cloud use, including the vast majority of its electronic design automation (EDA) workloads. Arm is migrating EDA workloads to AWS, leveraging AWS Graviton2-based instances (powered by Arm Neoverse cores), and leading the way for transformation of the semiconductor industry, which has traditionally used on-premises data centers for the computationally intensive work of verifying semiconductor designs.

To carry out verification more efficiently, Arm uses the cloud to run simulations of real-world compute scenarios, taking advantage of AWS's virtually unlimited storage and high-performance computing infrastructure to scale the number of simulations it can run in parallel. Since beginning its AWS cloud migration, Arm has realized a 6x improvement in performance time for EDA workflows on AWS. In addition, by running telemetry (the collection and integration of data from remote sources) and analysis on AWS, Arm is generating more powerful engineering, business, and operational insights that help increase workflow efficiency and optimize costs and resources across the company. Arm ultimately plans to reduce its global datacenter footprint by at least 45% and its on-premises compute by 80% as it completes its migration to AWS.

RISC-V Processor Achieves 5 GHz Frequency at Just 1 Watt of Power

Researchers at the University of California, Berkeley in 2010 have started an interesting project. They created a goal to develop a new RISC-like Instruction Set Architecture that is simple and efficient while being open-source and royalty-free. Born out of that research was RISC-V ISA, the fifth iteration of Reduced Instruction Set Computing (RISC) ideology. Over the years, the RISC-V ISA has become more common, and today, many companies are using it to design their processors and release new designs every day. One of those companies is Micro Magic Inc., a provider of silicon design tools, IP, and design services. The company has developed a RISC-V processor that is rather interesting.

Apart from the RISC-V ISA, the processor has an interesting feature. It runs at the whopping 5 GHz frequency, a clock speed unseen on the RISC-V chips before, at the power consumption of a mere one (yes that is 1) Watt. The chip ran at just 1.1 Volts, which means that a very low current needs to be supplied to the chip so it can achieve the 5 GHz mark. If you are wondering about performance, well the numbers show that at 5 GHz, the CPU can produce a score of 13000 CoreMarks. However, that is not the company's highest-performance RISC-V core. In yesterday's PR, Micro Magic published that their top-end design can achieve 110000 CoreMarks/Watt, so we are waiting to hear more details about it.

Samsung's 5 nm Node in Production, First SoCs to Arrive Soon

During its Q3 earnings call, Samsung Electronics has provided everyone with an update on its foundry and node production development. In the past year or so, Samsung's foundry has been a producer of a 7 nm LPP (Low Power Performance) node as its smallest node. That is now changed as Samsung has started the production of the 5 nm LPE (Low Power Early) semiconductor manufacturing node. In the past, we have reported that the company struggled with yields of its 5 nm process, however, that seems to be ironed out and now the node is in full production. To contribute to the statement that the new node is doing well, we also recently reported that Samsung will be the sole manufacturer of Qualcomm Snapdragon 875 5G SoC.

The new 5 nm semiconductor node is a marginal improvement over the past 7 nm node. It features a 10% performance improvement that is taking the same power and chip complexity or a 20% power reduction of the same processor clocks and design. When it comes to density, the company advertises the node with x1.33 times increase in transistor density compared to the previous node. The 5LPE node is manufactured using the Extreme Ultra-Violet (EUV) methodology and its FinFET transistors feature new characteristics like Smart Difusion Break isolation, flexible contact placement, and single-fin devices for low power applications. The node is design-rule compatible with the previous 7 nm LPP node, so the existing IP can be used and manufactured on this new process. That means that this is not a brand new process but rather an enhancement. First products are set to arrive with the next generation of smartphone SoCs, like the aforementioned Qualcomm Snapdragon 875.

IP Theft: UMC Pleads Guilty to US Court Charges of Trade Secret Theft, Faces $60 Million Fine

Taiwanese corporation United Micro Electronics (UMC) has pled guilty on charges of trade theft. The charges, originally pressed in November 2018 by US authorities, placed UMC and China's Fujian Jinhua in hot waters under suspicion of stealing trade secrets from US-based Micron technologies, one of the world's foremost players in memory semiconductor technologies. UMC's guilty plea serves as a way for the company to avoid heavier penalties, and includes a provision for the company's assistance in investigating Fujian Jinhua's actions in regards to this IP theft.

The whole story revolves around UMC's hiring of three Micron employees from Micron's subsidiary in Taiwan, Micron Memory Taiwan (MMT), back around September 2015. At least two of these employees migrated Micron trade secrets to UMC, which then inked a deal with china's Fujian Jinhua for the development of 32nm DRAM and "32Snm" DRAM technologies that Fujian Jinhua could then deploy for the manufacture of memory products - a deal which had Fujian Jinhua paying $300 million for equipment purchase plus $400 million for technology development to UMC. This all fell in line with the Chinese government's Made in China 2025 plan, which aims to bring the country to semiconductor independence from the western world. UMC says that the company itself didn't partake in the underhanded IP delivery to Fujian Jinhua, claiming instead that rogue employees did so of their own volition. The company further states that it only pleads guilty because according to the US Trade Secrets Act, the company still bears legal responsibilities for employee acts, whether or not top management is involved.

Intel Confirms Rocket Lake-S Features Cypress Cove with Double-Digit IPC Increase

Today, Intel has decided to surprise us and give an update to its upcoming CPU lineup for desktop. With the 11th generation, Core CPUs codenamed Rocket Lake-S, Intel is preparing to launch the new lineup in the first quarter of 2021. This means that we are just a few months away from this launch. When it comes to the architecture of these new processors, they are going to be based on a special Cypress Cove design. Gone are the days of Skylake-based designs that were present from the 6th to 10th generation processors. The Cypress Cove, as Intel calls it, is an Ice Lake adaptation. Contrary to the previous rumors, it is not an adaptation of Tiger Lake Willow Cove, but rather Ice Lake Sunny Cove.

The CPU instruction per cycle (IPC) is said to grow in double-digits, meaning that the desktop users are finally going to see an improvement that is not only frequency-based. While we do not know the numbers yet, we can expect them to be better than the current 10th gen parts. For the first time on the Intel platform for desktops, we will see the adoption of PCIe 4.0 chipset, which will allow for much faster SSD speeds and support the latest GPUs, specifically, there will be 20 PCIe 4.0 lanes coming from the CPU only. The CPU will be paired with 12th generation Xe graphics, like the one found in Tiger Lake CPUs. Other technologies such as Deep Learning Boost and VNNI, Quick Sync Video, and better overclocking tuning will be present as well. Interesting thing to note here is that the 10C/20T Core i9-10900K has a PL1 headroom of 125 W, and 250 W in PL2. However, the 8C/16T Rocket Lake-S CPU also features 125 W headroom in PL1, and 250 W in PL2. This indicates that the new Cypress Cove design runs hotter than the previous generation.

Apple A14 SoC Put Under the Microscope; Die Size, and Transistor Density Calculated

Apple has established itself as a master of silicon integrated circuit design and has proven over the years that its processors deliver the best results, generation after generation. If we take a look at the performance numbers of the latest A14 Bionic, you can conclude that its performance is now rivaling some of the x86_64 chips. So you would wonder, what is inside this SoC that makes it so fast? That is exactly what ICmasters, a semiconductor reverse engineering and IP services company, has questioned and decided to find out. For starters, we know that Apple manufactures the new SoCs on TSMC's N5 5 nm node. The Taiwanese company promises to pack 171.3 million transistors per square millimeter, so how does it compare to an actual product?

ICmasters have used electron microscopy to see what the chip is made out of and to measure the transistor density. According to this source, Apple has a chip with a die size of 88 mm², which packs 11.8 billion N5 transistors. The density metric, however, doesn't correspond to that of TSMC. Instead of 171.3 million transistors per mm², the ICmasters measured 134.09 million transistors per mm². This is quite a difference, however, it is worth noting that each design will have it different due to different logic and cache layout.
Apple A14 SoC Die Apple A14 SoC

AMD Ryzen 5 5600X Takes the Crown of the Fastest CPU in Passmark Single-Thread Results

AMD has been improving its Zen core design, and with the latest Zen 3 IP found in Ryzen 5000 series CPUs, it seems like the company struck gold. Thanks to the reporting of VideoCardz, we come to know that AMD's upcoming Ryzen 5 5600X CPU has been benchmarked and compared to other competing offerings. In the CPU benchmark called PassMark, which rates all of the CPUs by multi-threaded and single-threaded performance, AMD's Ryzen 5 5600X CPU has taken the crown of the fastest CPU in the single-threaded results chart. Scoring an amazing 3495 points, it is now the fastest CPU for 1T workloads. That puts the CPU above Intel's current best—Core i9-10900K—which scores 3177 points. This puts the Zen 3 core about 10% ahead of the competition.

As a reminder, the AMD Ryzen 5 5600X CPU is a six-core, twelve threaded design that has a base clock of 3.7 GHz and boosts the frequency of the cores to 4.6 GHz, all within the TDP of 65 Watts. The CPU has 32 MB of level-3 (L3) cache and 3 MB of L2 cache.

Dialog Semiconductor Licenses its Non-Volatile ReRAM Technology to GLOBALFOUNDRIES for 22FDX Platform

DIALOG SEMICONDUCTOR, a leading provider of battery and power management, Wi-Fi and Bluetooth low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog's CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX platform, with the plan to extend to other platforms.

Dialog's proprietary and production proven CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to artificial intelligence (AI). Low power consumption, high read/write speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM particularly suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables cost-effective embedded NVM for advanced technology nodes required for products in these markets.

Intel Introduces new Security Technologies for 3rd Generation Intel Xeon Scalable Platform, Code-named "Ice Lake"

Intel today unveiled the suite of new security features for the upcoming 3rd generation Intel Xeon Scalable platform, code-named "Ice Lake." Intel is doubling down on its Security First Pledge, bringing its pioneering and proven Intel Software Guard Extension (Intel SGX) to the full spectrum of Ice Lake platforms, along with new features that include Intel Total Memory Encryption (Intel TME), Intel Platform Firmware Resilience (Intel PFR) and new cryptographic accelerators to strengthen the platform and improve the overall confidentiality and integrity of data.

Data is a critical asset both in terms of the business value it may yield and the personal information that must be protected, so cybersecurity is a top concern. The security features in Ice Lake enable Intel's customers to develop solutions that help improve their security posture and reduce risks related to privacy and compliance, such as regulated data in financial services and healthcare.

Imagination Launches IMG B-Series: Doing More with Multi-Core, up to 6 TeraFLOPs of Compute

Imagination Technologies announces IMG B-Series, a new expanded range of GPU IP. With its advanced multi-core architecture, B-Series enables Imagination customers to reduce power while reaching higher levels of performance than any other GPU IP on the market. It delivers up to 6 TFLOPS of compute, with an up to 30% reduction in power and 25% area reduction over previous generations and up to 2.5x higher fill rate than competing IP cores.

With IMG A-Series Imagination made an exceptional leap over previous generations, resulting in an industry-leading position for performance and power characteristics. B-Series is a further evolution delivering the highest performance per mm² for GPU IP and offering new configurations for lower power and up to 35% lower bandwidth for a given performance target, making it a compelling solution for top-tier designs.

Arm Highlights its Next Two Generations of CPUs, codenamed Matterhorn and Makalu, with up to a 30% Performance Uplift

Editor's Note: This is written by Arm vice president and general manager Paul Williamson.

Over the last year, I have been inspired by the innovators who are dreaming up solutions to improve and enrich our daily lives. Tomorrow's mobile applications will be even more imaginative, immersive, and intelligent. To that point, the industry has come such a long way in making this happen. Take app stores for instance - we had the choice of roughly 500 apps when smartphones first began shipping in volume in 2007 and today there are 8.9 million apps available to choose from.

Mobile has transformed from a simple utility to the most powerful, pervasive device we engage with daily, much like Arm-based chips have progressed to more powerful but still energy-efficient SoCs. Although the chip-level innovation has already evolved significantly, more is still required as use cases become more complex, with more AI and ML workloads being processed locally on our devices.

Intel 10 nm Ice Lake-SP Server Processors Reportedly Delayed

Intel 10 nm products have seen massive delays over the years, and Intel has built many IPs on the new node, however, not many of them have seen the light of the day due to problems the company has experienced with the manufacturing of the new node. That has caused delays in product shipments in the past, meaning that the time for 10 nm is just ahead. According to the latest DigiTimes Taiwan report, we have information that Intel is going to delay its Ice Lake-SP server processors manufactured on a 10 nm node. And it is going to be a whole quarter late according to the report. Instead of launching in Q4 this year, we can expect to see new processors in Q1 of 2021. It is yet unknown whatever the launch will happen at the beginning of Q1 or its end, however, we will report on it as we hear more information.

Update: DigiTimes has also released another report regarding server shipments. It is reported that server vendors are decelerating the shipments as they are making fewer orders in Q4 to wait for the new Intel CPUs. Judging by this move, the demand for these new processors is going to be rather high and the supply chain is preparing slowly for it.

Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology

Today Arm announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation.

As part of the spin-out, Arm will transfer its full CeRAM IP portfolio of more than 150 patent families to Cerfe Labs that will be the foundation for a roadmap of related CeRAM technologies. Cerfe Labs initial focus will be on producing meaningful prototypes which will be licensed to partners with a goal of accelerating timing of enabling these novel non-volatile materials for systems.

New Arm Technologies Enable Safety-capable Computing Solutions for an Autonomous Future

Today, Arm unveiled new computing solutions to accelerate autonomous decision-making with safety capability across automotive and industrial applications. The new suite of IP includes the Arm Cortex -A78AE CPU, Arm Mali -G78AE GPU, and Arm Mali-C71AE ISP, engineered to work together in combination with supporting software, tools and system IP to enable silicon providers and OEMs to design for autonomous workloads. These products will be deployed in a range of applications, from enabling more intelligence and configurability in smart manufacturing to enhancing ADAS and digital cockpit applications in automotive.

"Autonomy has the potential to improve every aspect of our lives, but only if built on a safe and secure computing foundation," said Chet Babla, vice president, Automotive and IoT Line of Business at Arm. "As autonomous decision-making becomes more pervasive, Arm has designed a unique suite of technology that prioritizes safety while delivering highly scalable, power efficient compute to enable autonomous decision-making across new automotive and industrial opportunities."

Arm Announces Next-Generation Neoverse V1 and N2 Cores

Ten years ago, Arm set its sights on deploying its compute-efficient technology in the data center with a vision towards a changing landscape that would require a new approach to infrastructure compute.

That decade-long effort to lay the groundwork for a more efficient infrastructure was realized when we announced Arm Neoverse, a new compute platform that would deliver 30% year-over-year performance improvements through 2021. The unveiling of our first two platforms, Neoverse N1 and E1, was significant and important. Not only because Neoverse N1 shattered our performance target by nearly 2x to deliver 60% more performance when compared to Arm's Cortex-A72 CPU, but because we were beginning to see real demand for more choice and flexibility in this rapidly evolving space.

Microsoft Announces Acquisition of Bethesda Parent Company ZeniMax Media

Microsoft today dropped a giant bomb on the balance of game development: the company announced the acquisition of ZeniMax Media, parent company of Bethesda Softworks, and all its related IP. The purchase, which is expected to close for a tidy $7.5 billion, will carry over all ZeniMax Media subsidiaries. This includes Bethesda (The Elder Scrolls, Fallout), id Software (DOOM), Arkane Studios (Prey, Dishonored, upcoming Deathloop), MachineGames (Wolfenstein), among others.

The deal is the costliest acquisition for Microsoft (to date) in its push to increase the number of in-house development studios (up to 23 from 15 prior to this deal). Microsoft has announced that as part of the deal, games published by ZeniMax Media and subsidiaries (and in the future, by Microsoft) will be available on its Xbox Games Pass subscription service for Xbox and PC gaming. Microsoft is acquiring some of the most iconic gaming franchises ever with this deal, including all in-development IP. It's a huge boon for the company; it remains to be seen exactly how will this evolve over the years. But one thing is for certain: Microsoft isn't slowing down on its doubling down on game development.

NVIDIA to Acquire Arm for $40 Billion, Creating World's Premier Computing Company for the Age of AI

NVIDIA and SoftBank Group Corp. (SBG) today announced a definitive agreement under which NVIDIA will acquire Arm Limited from SBG and the SoftBank Vision Fund (together, "SoftBank") in a transaction valued at $40 billion. The transaction is expected to be immediately accretive to NVIDIA's non-GAAP gross margin and non-GAAP earnings per share.

The combination brings together NVIDIA's leading AI computing platform with Arm's vast ecosystem to create the premier computing company for the age of artificial intelligence, accelerating innovation while expanding into large, high-growth markets. SoftBank will remain committed to Arm's long-term success through its ownership stake in NVIDIA, expected to be under 10 percent.
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